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vPolyTanTM Polymer Surface-Mount Chip Capacitors,
Low ESR, Leadframeless Molded Type
LINKS TO ADDITIONAL RESOURCES
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
Operating Temperature: -55 °C to +105 °C
Capacitance Range: 15 μF to 470 μF
Capacitance Tolerance: ± 10 %, ± 20 % standard
Voltage Rating: 16 VDC to 75 VDC
FEATURES
• Ultra low ESR
• 100 % surge current tested
• Accelerated voltage conditioning
• High ripple current capability
• Stable capacitance in operating temperature
range
• Better capacitance stability vs. frequency
• No wear out effect
• Molded case 7343 EIA size
• Terminations: wraparound
• 12 mm tape and 7" (178 mm) reel packaging
per EIA-481 standard
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
APPLICATIONS
• Decoupling, smoothing, filtering
• Bulk energy storage in Solid State Drives (SSD)
• Infrastructure equipment
• Storage and networking
• Computer motherboards
• Smartphones and tablets
Note
• We reserve the right to supply better series with more extensive screening
3
3
3
D
D
D
3
D
3D Models
Models
Calculators
Available
Available
Available
Available
ORDERING INFORMATION
T59 EE 337 M 016 C 0025
TYPE CASE CAPACITANCE CAPACITANCE DC VOLTAGE TERMINATION / ESR
CODE TOLERANCE RATING PACKAGING
See
Ratings
and
Case
Codes
table.
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros
to follow.
K = ± 10 %
M = ± 20 %
This is expressed
in volts. To
complete the
three-digit block,
zeros precede the
voltage rating.
A decimal point is
indicated by an “R”
(6R3 = 6.3 V)
E = Sn / Pb solder /
7" (178 mm) reel
C = 100 % tin /
7" (178 mm) reel
Maximum
100 kHz ESR
in m
DIMENSIONS in inches [millimeters]
CASE CODE EIA SIZE H (MAX.) L W P1 P2 (REF.)
EE 7343-43 0.169
[4.3]
0.287 ± 0.012
[7.3 ± 0.3]
0.169 ± 0.012
[4.3 ± 0.3]
0.051 ± 0.012
[1.3 ± 0.3]
0.191
[4.85]
L
Anode polarity mark
Anode termination
P1
WH
P2P1
Cathode termination
T59
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Note
(1) Rating in development, contact factory for availability
Note
• Capacitors may bear T54 marking scheme if parts are substituted with high rel COTS performance grade product.
Call the factory for further explanation
RATINGS AND CASE CODES (ESR m)
μF 16 V 30 V 35 V 50 V 63 V 75 V
15 EE (100) EE (100)
22 EE (100) EE (100) EE (100) (1)
47 EE (70, 55) EE (100)
150 EE (150, 75)
220 EE (25)
330 EE (25)
470 EE (25, 20)
MARKING
STANDARD RATINGS
CAPACITANCE
(μF)
CASE
CODE PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
120 Hz
(%)
MAX. ESR
AT +25 °C
100 kHz
(m)
MAX.
RIPPLE,
100 kHz
IRMS
(A)
HI TEMPERATURE
LOAD
MSL
TEMPERATURE
(°C)
TIME
(h)
16 VDC AT +105 °C
220 EE T59EE227(1)016(2)0025 352 10 25 3.143 105 2000 3
330 EE T59EE337M016(2)0025 528 10 25 3.143 105 2000 3
470 EE T59EE477M016(2)0025 752 10 25 3.143 105 2000 3
470 EE T59EE477M016(2)0020 752 10 20 3.514 105 2000 3
30 VDC AT +105 °C
150 EE T59EE157M030(2)0150 450 10 150 1.283 105 2000 3
150 EE T59EE157M030(2)0075 450 10 75 1.815 105 2000 3
35 VDC AT +105 °C
47 EE T59EE476M035(2)0070 165 10 70 1.878 105 2000 3
47 EE T59EE476M035(2)0055 165 10 55 2.119 105 2000 3
50 VDC AT +105 °C
22 EE T59EE226M050(2)0100 110 10 100 1.572 105 2000 3
47 EE T59EE476M050(2)0100 235 10 100 1.572 105 2000 3
63 VDC AT +105 °C
15 EE T59EE156M063(2)0100 95 10 100 1.572 105 2000 3
22 EE T59EE226M063(2)0100 139 10 100 1.572 105 2000 3
75 VDC AT +105 °C
15 EE T59EE156M075(2)0100 113 10 100 1.572 105 2000 3
22 EE (1) T59EE226M075(2)0100 165 10 100 1.572 105 2000 3
Notes
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, C
(1) Rating in development, contact factory for availability
330 16V
Polarity mark
Vishay logo
+ + +
T59 2
VoltageCapacitance
Family
T59
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RECOMMENDED TEMPERATURE DERATING
RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperature below +105 °C)
CAPACITOR VOLTAGE RATING OPERATING VOLTAGE
16 12.8
25 20.0
30 24.0
35 28.0
50 40.0
63 50.4
75 60.0
10
1000
10000
50
55
60
65
70
75
80
85
90
95
100
-55 25 45 85 105
Axis Title
1st line
2nd line
2nd line
Rated Voltage (%)
Temperature (°C)
100
Recommended maximum
application voltage VR≥16 V
Rated voltage
Recommended maximum
application voltage VR≤10 V
CAPACITANCE VS. FREQUENCY
10
100
1000
10000
100
1000
10 000
100 1000 10 000 100 000 1 000 000
T59EE337M016E0025
1st line
2nd line
2nd line
Capacitance (μF)
Frequency (Hz)
Capacitance
IMPEDANCE AND ESR VS. FREQUENCY
10
100
1000
10000
0.001
0.01
0.1
1
10
1000 100 000 10 000 000
T59EE337M016E0025
1st line
2nd line
2nd line
Impedance / ESR (Ω)
Frequency (Hz)
Impedance
ESR
POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
EE 0.247
STANDARD PACKAGING QUANTITY
CASE CODE UNITS PER 7" REEL
EE 400
T59
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PERFORMANCE CHARACTERISTICS
ITEM CONDITION POST TEST PERFORMANCE
Life test at +105 °C 2000 h application of rated voltage at 105 °C,
MIL-STD-202 method 108
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limits
Leakage current Shall not exceed 300 % of initial limit
Shelf life test
at +105 °C
2000 h no voltage applied at 105 °C,
MIL-STD-202 method 108
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limits
Leakage current Shall not exceed 300 % of initial limit
Humidity tests At 60 °C / 90 % RH 500 h, no voltage applied Capacitance change -20 % to +40 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 300 % of initial limit
Stability at low and
high temperatures
-55 °C Capacitance change Within -20 % to 0 % of initial value
Dissipation factor Shall not exceed 150 % of initial limit
Leakage current n/a
25 °C Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limit
Leakage current Within initial limit
85 °C Capacitance change Within -0 % to +50 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 1000 % of initial value
105 °C Capacitance change Within -0 % to +50 % of initial value
Dissipation factor Within initial limits
Leakage current Shall not exceed 1000 % of initial limits
Surge voltage 85 °C, 1000 successive test cycles at 1.3 of
rated voltage in series with a 33 resistor at
the rate of 30 s ON, 30 s OFF
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 300 % of initial limit
Shock
(specified pulse)
MIL-STD-202, method 213, condition E,
1000 g peak
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 300 % of initial limit
Vibration MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz 20 g peak
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 300 % of initial limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shear test Apply a pressure load of 17.7 N for 10 s ± 1 s
horizontally to the center of capacitor side body
Capacitance change Within ± 20 % of initial value
Dissipation factor Within initial limit
Leakage current Shall not exceed 300 % of initial limit
PRODUCT INFORMATION
Polymer Guide www.vishay.com/doc?40076
Moisture Sensitivity www.vishay.com/doc?40135
Infographic www.vishay.com/doc?48084
Sample Board www.vishay.com/doc?48073
FAQ
Frequently Asked Questions www.vishay.com/doc?42106
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Guide for Tantalum Solid Electrolyte Chip Capacitors
With Polymer Cathode
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum/tantalum oxide/manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance/volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance/volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC e
DIELECTRIC CONSTANT
Air or vacuum 1.0
Paper 2.0 to 6.0
Plastic 2.1 to 6.0
Mineral oil 2.2 to 2.3
Silicone oil 2.7 to 2.8
Quartz 3.8 to 4.4
Glass 4.8 to 8.0
Porcelain 5.1 to 5.9
Mica 5.4 to 8.7
Aluminum oxide 8.4
Tantalum pentoxide 26
Ceramic 12 to 400K
CeA
t
-------
=
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SOLID ELECTROLYTE POLYMER TANTALUM CAPACITORS
Solid electrolyte polymer capacitors utilize sintered tantalum pellets as anodes. Tantalum pentoxide dielectric layer is formed
on the entire surface of anode, which is further impregnated with highly conductive polymer as cathode system.
The conductive polymer layer is then coated with graphite, followed by a layer of metallic silver, which provides a conductive
surface between the capacitor element and the outer termination (lead frame or other).
Molded chip polymer tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for variety of
applications in electronic devices. Usage of conductive polymer cathode system provides very low equivalent series resistance
(ESR), which makes the capacitors particularly suitable for high frequency applications.
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T50 / T55 / T56
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T58
Silver adhesive
Solderable cathode termination
Polymer / carbon / silver coating
Sintered tantalum pellet
Epoxy encapsulation
Lead frame welded to Ta wire
Anode polarity bar
Solderable anode termination
Anode polarity bar
Side anode termination (+)
Side cathode termination (-) Encapsulation
Sintered tantalum pellet
Polymer / carbon / silver coating
Glass reinforced epoxy resin substrate
Bottom cathode termination (-)
Silver adhesive epoxy
Conductive strip
Rating / marking
Bottom anode termination (+)
Copper pad
Anode wire
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TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T52
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T54 / T59
Polarity bar
marking
Side anode termination (+)
Side cathode termination (-)
Bottom anode
termination (+)
Silver plated copper substrate
Bottom cathode
termination (-)
Silver adhesive epoxy
Conductive strip
T52 E5 case
Encapsulation
Polymer / carbon / silver coating
Sintered
tantalum pellet
T52 M1 case
Side anode termination (+)
Bottom anode termination (+)
Polarity bar marking
Side cathode termination (-)
Sintered
tantalum pellet
Polymer / carbon / silver coating
Silver plated
copper substrate
Bottom cathode termination (-)
Silver adhesive epoxy
Encapsulation
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POLYMER CAPACITORS - MOLDED CASE
SERIES T50, T55, T56
PRODUCT IMAGE
TYPE VPolyTanTM, molded case, high performance polymer
FEATURES High performance
TEMPERATURE RANGE -55 °C to +105 °C
CAPACITANCE RANGE 3.3 F to 1000 F
VOLTAGE RANGE 2.5 V to 63 V
CAPACITANCE TOLERANCE ± 20 %
LEAKAGE CURRENT 0.1 CV
DISSIPATION FACTOR 8 % to 10 %
ESR 6 mΩ to 500 mΩ
CASE SIZES J, P, A, T, B, Z, V, D, C
TERMINATION FINISH Cases J, P, C: 100 % tin
Case A, T, B, Z, V, D: Ni / Pd / Au
POLYMER CAPACITORS - LEADFRAMELESS MOLDED CASE
SERIES T52 T58 T59 T54
PRODUCT
IMAGE
TYPE
vPolyTanTM polymer
surface mount chip
capacitors, low profile,
leadframeless molded type
vPolyTanTM polymer surface
mount chip capacitors,
compact, leadframeless
molded type
vPolyTanTM polymer surface
mount chip capacitors,
low ESR, leadframeless
molded type
vPolyTanTM polymer
surface mount chip
capacitors, low ESR,
leadframeless molded type,
hi-rel commercial
off-the-shelf (COTS)
FEATURES Low profile Small case size Multianode Hi-rel COTS, multianode
TEMPERATURE
RANGE -55 °C to +105 °C -55 °C to +105 °C -55 °C to +105 °C -55 °C to +125 °C
CAPACITANCE
RANGE 47 µF to 1500 µF 1 µF to 330 µF 15 µF to 470 µF 15 µF to 470 µF
VOLTAGE
RANGE 10 V to 35 V 6.3 V to 35 V 16 V to 75 V 16 V to 75 V
CAPACITANCE
TOLERANCE ± 20 % ± 20 % ± 10 %, ± 20 % ± 20 %
LEAKAGE
CURRENT 0.1 CV
DISSIPATION
FACTOR 10 % 8 % to 14 % 10 % 10 %
ESR 25 mΩ to 55 mΩ50 mΩ to 500 mΩ25 mΩ to 150 mΩ25 mΩ to 150 mΩ
CASE SIZES E5, M1, M9 MM, M0, W0, W9,
A0, AA, B0, BB EE EE
TERMINATION 100 % tin 100 % tin / lead
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MOLDED CAPACITORS, T50 / T55 / T56 TYPES
Note
• A reel diameter of 330 mm is also applicable
Note
• A reel diameter of 330 mm is also applicable
PLASTIC TAPE AND REEL PACKAGING DIMENSIONS in millimeters
TAPE WIDTH 8 12
A + 0 / - 3 Ø 180
B + 1 / 0 Ø 60
C ± 0.2 Ø 13
D ± 0.5 Ø 21
E ± 0.5 2.0
W ± 0.3 9.0 13.0
PLASTIC TAPE SIZE DIMENSIONS in millimeters
CASE CODE A ± 0.2 B ± 0.2 W ± 0.3 F ± 0.1 E ± 0.1 P1 ± 0.1 tmax.
J 1.0 1.8 8.0 3.5 1.75 4.0 1.3
P 1.4 2.2 8.0 3.5 1.75 4.0 1.6
A 1.9 3.5 8.0 3.5 1.75 4.0 2.5
T 3.1 3.8 8.0 3.5 1.75 4.0 1.7
B 3.1 3.8 8.0 3.5 1.75 4.0 2.5
C 3.7 6.3 12.0 5.5 1.75 8.0 3.1
Z 4.8 7.7 12.0 5.5 1.75 8.0 2.6
V 4.8 7.7 12.0 5.5 1.75 8.0 2.6
D 4.8 7.7 12.0 5.5 1.75 8.0 3.4
Label
DE
W
B
A
C
Perforation
Direction of tape flow
Inserting direction
t
A
F
P1
W
B
E
Ø 1.5
Pocket
+ 0.1
0
4.0 ± 0.1
2.0 ± 0.1
Perforation
Symbol: R
Marking side (upper)
Mounting terminal side (lower)
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LEADFRAMELESS MOLDED CAPACITORS, ALL TYPES
Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only
(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location shall be applied independent of each other
(6) B1 dimension is a reference dimension tape feeder clearance only
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
Tape and Reel Specifications: all case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
0.004 [0.10]
max.
K0
Tape thickness
B1 (max.) (6)
0.014
[0.35]
max.
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
Embossment
0.069 ± 0.004
[1.75 ± 0.10]
D1 (min.) for components
0.079 x 0.047 [2.0 x 1.2] and larger (5)
.
Maximum
USER DIRECTION
OF FEED
Center lines
of cavity
A0
P1
FW
0.030 [0.75]
min. (3)
0.030 [0.75]
min. (4)
0.079 ± 0.002
[2.0 ± 0.05]
0.157 ± 0.004
[4.0 ± 0.10]
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
B0
Maximum
component
rotation
(Side or front sectional view)
20°
For tape feeder
reference only
including draft.
Concentric around B0
(5)
Deformation
between
embossments
Top
cover
tape
Top cover
tape
cavity size (1)
Cathode (-)
Anode (+)
DIRECTION OF FEED
20° maximum
component rotation
Typical
component
cavity
center line
Typical
component
center line
A0
B0
(Top view)
0.9843 [250.0]
Tape
3.937 [100.0]
0.039 [1.0]
max.
0.039 [1.0]
max.
Camber
Allowable camber to be 0.039/3.937 [1/100]
(Top view)
Non-cumulative over 9.843 [250.0]
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Notes
(1) For reference only
(2) Standard packaging of MM case is with paper tape. Plastic tape is available per request
Note
(1) A0, B0 are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation
of the component within the cavity of not more than 20°
CARRIER TAPE DIMENSIONS in inches [millimeters]
CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W
E5 12 mm 0.329 [8.35] 0.059 [1.5] 0.217 ± 0.002
[5.50 ± 0.05] 0.071 [1.8] 0.315 ± 0.004
[8.0 ± 0.10]
0.476 ± 0.008
[12.1 ± 0.20]
MM (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0]
M1, M9 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 ± 0.002
[5.5 ± 0.05] 0.094 [2.39] 0.315 ± 0.04
[8.0 ± 1.0]
0.472 + 0.012 / - 0.004
[12.0 + 0.3 / - 0.10]
W9 8 mm 0.126 [3.20] 0.030 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0]
W0 8 mm 0.126 [3.20] 0.030 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0]
A0 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0]
AA 8 mm 0.154 [3.90] 0.039 [1.0] 0.138 [3.5] 0.079 [2.00] 0.157 [4.0] 0.315 [8.0]
B0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0]
BB 8 mm 0.157 [4.0] 0.039 [1.0] 0.138 [3.5] 0.087 [2.22] 0.157 [4.0] 0.315 [8.0]
EE 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 ± 0.002
[5.5 ± 0.05] 0.175 [4.44] 0.315 ± 0.04
[8.0 ±1.0]
0.472 + 0.012 / - 0.004
[12.0 + 0.3 / - 0.10]
PAPER TAPE AND REEL PACKAGING DIMENSIONS in inches [millimeters]
CASE
SIZE
TAPE
SIZE A
0
B
0
D
0
P
0
P
1
P
2
EFWT
MM 8 mm 0.041 ± 0.002
[1.05 ± 0.05]
0.071 ± 0.002
[1.8 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.037 ± 0.002
[0.95 ± 0.05]
M0 8 mm 0.049 ± 0.002
[1.25 ± 0.05]
0.081 ± 0.002
[2.05 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.041 ± 0.002
[1.05 ± 0.05]
Ø D0
T
Bottom cover
tape
F
P1
A0
B0E2
P2
W
P0E1
Cavity size
(1)
Bottom cover tape
USER FEED DIRECTION
Cavity center lines
Top
cover tape
[10 pitches cumulative tolerance on tape ± 0.2 mm]
G
Anode
Polymer Guide
www.vishay.com Vishay
Revision: 14-Aug-2020 8Document Number: 40076
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKING AND STORAGE
Polymer capacitors meet moisture sensitivity level rating (MSL) of 3 or 4 as specified in IPC/JEDEC® J-STD-020 and are dry
packaged in moisture barrier bags (MBB) per J-STD-033. MSL for each particular family is defined in the datasheet - either in
“Features” section or “Standard Ratings” table. Level 3 specifies a floor life (out of bag) of 168 hours and level 4 specifies a floor
life of 72 hours at 30 °C maximum and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MBB with
fresh desiccant. A moisture strip (humidity indicator card) is included in the bag to assure dryness. To remove excess moisture,
capacitors can be dried at 40 °C (standard “dry box” conditions).
For detailed recommendations please refer to J-STD-033.
Notes
• T50, T52, T55, T56, and T58 capacitors are process sensitive.
PSL classification to JEDEC J-STD-075: R4G
• T54 and T59 capacitors with 100 % tin termination are process sensitive.
PSL classification to JEDEC J-STD-075: R6G
RECOMMENDED REFLOW PROFILES
Vishay recommends no more than 3 cycles of reflow in accordance with J-STD-020.
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
PREHEAT AND SOAK
Temperature min. (TSmin.) 100 °C 150 °C
Temperature max. (TSmax.) 150 °C 200 °C
Time (tS) from (TSmin. to TSmax.) 60 s to 120 s 60 s to 120 s
RAMP UP
Ramp-up rate (TL to Tp) 3 °C/s maximum
Liquidus temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL60 s to 150 s
Peak package body temperature (Tp) max. Depends on type and case - see table below
Time (tp) within 5 °C of the peak max. temperature 20 s 5 s
RAMP DOWN
Ramp-down rate (Tp to TL) 6 °C/s maximum
Time from 25 °C to peak temperature 6 min maximum 8 min maximum
PEAK PACKAGE BODY TEMPERATURE (Tp) MAXIMUM
TYPE CASE CODE PEAK PACKAGE BODY TEMPERATURE (TP) MAX.
SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
T55 J, P, A, T, B, C, Z, V, D
n/a
260 °C
T52 E5, M1, M9 260 °C
T58 MM, M0, W9, W0, A0, AA, B0, BB 260 °C
T50 D 260 °C
T56 D 250 °C
T59 EE 220 °C 250 °C
T54 EE 220 °C 250 °C
Time
Temperature
tS
Time 25 °C to peak
tp
TP
TL
TSmin.
25
tL
TSmax. Preheat area
Max. ramp up rate = 3 °C/s
Max. ramp down rate = 6 °C/s
Polymer Guide
www.vishay.com Vishay
Revision: 14-Aug-2020 9Document Number: 40076
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MOLDED CAPACITORS, T50 / T55 / T56 TYPES
LEADFRAMELESS MOLDED CAPACITORS, ALL TYPES
PAD DIMENSIONS in millimeters
CASE /
DIMENSIONS
CAPACITOR SIZE PAD DIMENSIONS
L W G (max.) Z (min.) X (min.) Y (Ref.)
J 1.6 0.8 0.7 2.5 1.0 0.9
P 2.0 1.25 0.5 2.6 1.2 1.05
A 3.2 1.6 1.1 3.8 1.5 1.35
T / B 3.5 2.8 1.4 4.1 2.7 1.35
C 5.8 3.2 2.9 6.9 2.7 2.0
Z / V / D 7.3 4.3 4.1 8.2 2.9 2.05
PAD DIMENSIONS in inches [millimeters]
FAMILY CASE CODE A (NOM.) B (MIN.) C (NOM.) D (MIN.)
T52
E5 0.094 [2.40] 0.073 [1.85] 0.187 [4.75] 0.333 [8.45]
M1, M9 0.161 [4.10] 0.073 [1.85] 0.187 [4.75] 0.333 [8.45]
T58
MM, M0 0.024 [0.61] 0.027 [0.70] 0.025 [0.64] 0.080 [2.03]
W0, W9 0.035 [0.89] 0.029 [0.74] 0.041 [1.05] 0.099 [2.52]
AA, A0, A2 0.047 [1.19] 0.042 [1.06] 0.065 [1.65] 0.148 [3.76]
BB, B0 0.094 [2.39] 0.044 [1.11] 0.072 [1.82] 0.159 [4.03]
T59 / T54 EE 0.209 [5.30] 0.098 [2.50] 0.169 [4.30] 0.366 [9.30]
Capacitor
Pattern
L
Y
Z
G
XW
A
BC
D
Polymer Guide
www.vishay.com Vishay
Revision: 14-Aug-2020 10 Document Number: 40076
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
where,
P = power dissipation in W at +45 °C as given in
the tables in the product datasheets.
RESR = the capacitor equivalent series resistance at
the specified frequency.
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = power dissipation in W at +45 °C as given in
the tables in the product datasheets.
RESR = The capacitor equivalent series resistance at
the specified frequency.
Z = The capacitor impedance at the specified
frequency.
2.1 The tantalum capacitors must be used in such a
condition that the sum of the working voltage and
ripple voltage peak values does not exceed the rated
voltage as shown in figure below.
3. Temperature Derating: power dissipation is
affected by the heat sinking capability of the
mounting surface. If these capacitors are to
be operated at temperatures above +45 °C, the
permissible ripple current (or voltage) shall be
calculated using the derating coefficient as shown in
the table below:
4. Reverse Voltage: the capacitors are not intended for
use with reverse voltage applied. However, they are
capable of withstanding momentary reverse voltage
peaks, which must not exceed the following values:
At 25 °C: 10 % of the rated voltage or 1 V, whichever
is smaller.
At 85 °C: 5 % of the rated voltage or 0.5 V, whichever
is smaller.
At 105 °C: 3 % of the rated voltage or 0.3 V,
whichever is smaller.
5. Mounting Precautions:
5.1 Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
For details see www.vishay.com/doc?40214.
5.2 Limit Pressure on Capacitor Installation with
Mounter: pressure must not exceed 4.9 N with a tool
end diameter of 1.5 mm when applied to the
capacitors using an absorber, centering tweezers, or
similar (maximum permitted pressurization time: 5 s).
An excessively low absorber setting position would
result in not only the application of undue force to the
capacitors but capacitor and other component
scattering, circuit board wiring breakage, and / or
cracking as well, particularly when the capacitors are
mounted together with other chips having a height of
1 mm or less.
5.3 Flux Selection
5.3.1 Select a flux that contains a minimum of chlorine and
amine.
5.3.2 After flux use, the chlorine and amine in the flux
remain must be removed.
5.4 Cleaning After Mounting: the following solvents are
usable when cleaning the capacitors after mounting.
Never use a highly active solvent.
• Halogen organic solvent (HCFC225, etc.)
• Alcoholic solvent (IPA, ethanol, etc.)
• Petroleum solvent, alkali saponifying agent, water,
etc.
Circuit board cleaning must be conducted at a
temperature of not higher than 50 °C and for an
immersion time of not longer than 30 minutes. When
an ultrasonic cleaning method is used, cleaning must
be conducted at a frequency of 48 kHz or lower, at
an vibrator output of 0.02 W/cm3, at a temperature of
not higher than 40 °C, and for a time of 5 minutes or
shorter.
Notes
• Care must be exercised in cleaning process so that the
mounted capacitor will not come into contact with any
cleaned object or the like or will not get rubbed by a stiff
brush or similar. If such precautions are not taken
particularly when the ultrasonic cleaning method is
employed, terminal breakage may occur
• When performing ultrasonic cleaning under conditions
other than stated above, conduct adequate advance
checkout
MAXIMUM RIPPLE CURRENT TEMPERATURE
DERATING FACTOR
≤ 45 °C 1.0
55 °C 0.8
85 °C 0.6
105 °C 0.4
125 °C 0.25
IRMS
P
RESR
------------=
VRMS ZP
RESR
------------=
VRMS IRMS x Z=
Voltage
Rated voltage
Ripple voltage
Operating
voltage
Working voltage
Time (s)
Legal Disclaimer Notice
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Revision: 01-Jan-2019 1Document Number: 91000
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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