MAG.LAYERS
MMD-05BZ-SERIES-M2
■ ELECTRICAL
REQUIREMENTS
E
EL
LE
EC
CT
TR
RI
IC
CA
AL
LR
RE
EQ
QU
UI
IR
RE
EM
ME
EN
NT
TS
S
Rdc
(mΩ)
PART NUMBER INDUCTANCE
Lo(μH)±20%
@0A Typ. Max
HEAT RATING
CURRENT(Idc)
DC AMPS1
SATURATION
CURRENT(Isat)
DC AMPS2
MMD-05BZ-R10M-M2 0.10 3.6 3.9 17 38.3
MMD-05BZ-R22M-M2 0.22 4.9 5.2 15 18.7
MMD-05BZ-R33M-M2 0.33 7.6 8.2 12 21.3
MMD-05BZ-R47M-M2 0.47 8.1 8.8 11.5 17.9
MMD-05BZ-R68M-M2 0.68 11.2 12.4 10 12.8
MMD-05BZ-1R0M-M2 1.0 18.9 20 7 13.7
MMD-05BZ-2R2M-M2 2.2 45.6 50.1 4.2 10.7
MMD-05BZ-3R3M-M2 3.3 79.2 85.5 3.3 7.3
MMD-05BZ-4R7M-M2 4.7 108 116.6 2.8 4.3
MMD-05BZ-5R6M-M2 5.6 113 122 2.5 3.9
MMD-05BZ-6R8M-M2 6.8 139 150 2.4 3.7
MMD-05BZ-100M-M2 10 184 199 2.3 3.4
TEST FREQUENCY: 100 KHz, 0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
dc :CH11025,GOM802 MICRO OHMMETER
NOTES:
1. DC current (Idc) that will cause an approximate △T of 40℃
2. DC current (Isat) that will cause Lo to drop approximately 30%
3. All test data is referenced to 25℃ ambient
4. Operating Temperature Range -55℃ to +125℃
5. The part temperature (ambient + temp rise) should not exceed 125℃
under the worst operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.