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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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©2008 Fairchild Semiconductor Corporation 1www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
tm
October 2008
FPF2000-FPF2007
IntelliMAX™ Advanced Load Management Products
Features
1.8 to 5.5V Input Voltage Range
Controlled Turn-On
50mA and 100mA Current Limit Options
Undervoltage Lockout
Thermal Shutdown
<1µA Shutdown Current
Auto restart
Fast Current limit Response Time
3µs to Moderate Over Currents
20ns to Hard Shorts
Fault Blanking
RoHS Compliant
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
General Description
The FPF2000 through FPF2007 is a family of load switches which
provide full protection to systems and loads which may encounter
large current conditions. These devices contain a 0.7Ω current-
limited P-channel MOSFET which can operate over an input
voltage range of 1.8-5.5V. Switch control is by a logic input (ON)
capable of interfacing directly with low voltage control signals. Each
part contains thermal shutdown protection which shuts off the
switch to prevent damage to the part when a continuous over-
current condition causes excessive heating.
When the switch current reaches the current limit, the part
operates in a constant current mode to prohibit excessive currents
from causing damage. For the FPF2000-FPF2002 and FPF2004-
FPF2006, if the constant current condition still persists after 10ms,
these parts will shut off the switch and pull the fault signal pin
(FLAGB) low. The FPF2000, FPF2001, FPF2004 and FPF2005,
have an auto-restart feature which will turn the switch on again
after 80ms if the ON pin is still active. The FPF2002 and FPF2006
do not have this auto-restart feature so the switch will remain off
until the ON pin is cycled. For the FPF2003 and FPF2007, a
current limit condition will immediately pull the fault signal pin low
and the part will remain in the constant-current mode until the
switch current falls below the current limit. For the FPF2000
through FPF2003, the minimum current limit is 50mA while that for
the FPF2004 through FPF2007 is 100mA.
These parts are available in a space-saving 5 pin SC-70 package.
Ordering Information
Part Current Limit
[mA]
Current Limit
Blanking Time
[ms]
Auto-Restart
Time
[ms]
ON Pin
Activity Top Mark
FPF2000 50 10 80 Active HI 200
FPF2001 50 10 80 Active LO 201
FPF2002 50 10 NA Active HI 202
FPF2003 50 0 NA Active HI 203
FPF2004 100 10 80 Active HI 204
FPF2005 100 10 80 Active LO 205
FPF2006 100 10 NA Active HI 206
FPF2007 100 0 NA Active HI 207
2www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Typical Application Circuit
Functional Block Diagram
Pin Configuration
Pin Description
Pin Name Function
1V
OUT Switch Output: Output of the power switch
2 GND Ground
3FLAGB
Fault Output: Active LO, open drain output which indicates an over current, supply under
voltage or over temperature state.
4 ON On Control Input
5V
IN Supply Input: Input to the power switch and the supply voltage for the IC
OFF ON ON
VIN
GND
FPF2000 - FPF2007
FLAGB
VOUT
TO LOAD
UVLO
THERMAL
SHUTDOWN
CURRENT
LIMIT
CONTROL
LOGIC
VIN
ON
VOUT
FLAGB
GND
VOUT
GND
FLAGB ON
VIN
SC70-5
1
2
34
5
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FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Absolute Maximum Ratings
Recommended Operating Range
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter Min Max Unit
VIN, VOUT
, ON, FLAGB to GND -0.3 6 V
Power Dissipation @ TA = 25°C (note 1) 250 mW
Operating Junction Temperature -40 125 °C
Storage Temperature -65 150 °C
Thermal Resistance, Junction to Ambient 400 °C/W
Electrostatic Discharge Protection HBM 4000 V
MM 400 V
Parameter Min Max Unit
VIN 1.8 5.5 V
Ambient Operating Temperature, TA-40 85 °C
Parameter Symbol Conditions Min Typ Max Units
Basic Operation
Operating Voltage VIN 1.8 5.5 V
Quiescent Current IQ
IOUT = 0mA VIN = 1.8 to 3.3V 60 µA
VON active VIN = 3.3 to 5.5V 100
Shutdown Current ISHDN 1µA
Latch-Off Current (note 2) ILATCHOFF VON = VIN, after an overcurrent fault 40 µA
On-Resistance RON
VIN = 3.3V, IOUT = 20mA, TA = 25°C 0.7 1
ΩVIN = 3.3V, IOUT = 20mA, TA = 85°C 0.85 1.2
VIN = 3.3V, IOUT = 20mA, TA = -40°C to +85°C 0.27 1.2
ON Input Logic High Voltage VIH
VIN = 1.8V 0.8 V
VIN = 5.5V 1.5
ON Input Logic Low Voltage VIL
VIN = 1.8V 0.5 V
VIN = 5.5V 0.9
ON Input Leakage VON = VIN or GND 1 µA
Off Switch Leakage ISWOFF
VON = 0V, VOUT = 0V
@ VIN = 5.5V, TA = 85°C 1µA
VON = 0V, VOUT = 0V
@ VIN = 3.3V, TA = 25°C 10 100 nA
FLAGB Output Logic Low Voltage VIN = 5V, ISINK = 10mA 0.1 0.2 V
VIN = 1.8V, ISINK = 10mA 0.1 0.3
FLAGB Output High Leakage Current VIN = 5V, Switch on 1 µA
Protections
Current Limit ILIM
VIN = 3.3V,
VOUT = 3.0V
FPF2000, FPF2001,
FPF2002, FPF2003 50 75 100
mA
FPF2004, FPF2005,
FPF2006, FPF2007 100 150 200
Thermal Shutdown
Shutdown Threshold 140
°CReturn from Shutdown 130
Hysteresis 10
4www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Electrical Characteristics Cont.
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board.
Note 2: Applicable only to FPF2002 and FPF2006. Latchoff current does not include current flowing into FLAGB.
Parameter Symbol Conditions Min Typ Max Units
Protections
Under Voltage Shutdown UVLO VIN Increasing 1.5 1.6 1.7 V
Under Voltage Shutdown Hysteresis 50 mV
Dynamic
Turn On Time tON RL = 500Ω, CL = 0.1µF 50 µs
Turn Off Time tOFF RL = 500Ω, CL = 0.1µF 0.5 µs
VOUT Rise Time tRRL = 500Ω, CL = 0.1µF 10 µs
VOUT Fall Time tFRL = 500Ω, CL = 0.1µF 0.1 µs
Over Current Blanking Time tBLANK
FPF2000, FPF2001, FPF2002, FPF2004,
FPF2005, FPF2006 51020ms
Auto-Restart Time tRSTRT FPF2000, FPF2001, FPF2004, FPF2005 40 80 160 ms
Short Circuit Response Time
VIN = VON = 3.3V. Moderate
Over-Current Condition. 3µs
VIN = VON = 3.3V. Hard Short. 20 ns
5www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Typical Characteristics
Figure 1. Quiescent Current vs. Input Voltage Figure 2. Quiescent Current vs. Temperature
Figure 3. ISHUTDOWN Current vs. Temperature Figure 4. ISWITCH-OFF Current vs. Temperature
Figure 5. ILATCHOFF vs. Temperature Figure 6. VIH vs. VIN
50
55
60
65
70
75
11.522.533.544.555.5
6
SUPPLY VOLTAGE (V)
QUIESCENT CURRENT (uA)
VON = VIN
40
45
50
55
60
65
70
75
80
85
90
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
QUIESCENT CURRENT (uA)
V
ON
= V
IN
V
IN
= 5.5V
V
IN
= 3.3V
V
IN
= 1.8V
0
5
10
15
20
25
30
35
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
SHUTDOWN CURRENT (nA)
I_SHDN
V
IN
= 5V
V
IN
= 3.3V
0
5
10
15
20
25
30
35
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
SWITCH-OFF CURRENT (nA)
V
IN
= 5V
V
IN
= 3.3V
28
32
36
40
44
48
52
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
LATCH-OFF CURRENT (uA)
V
IN
= 3.3V
0
0.25
0.5
0.75
1
1.25
1.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
V
IN
, INPUT VOLTAGE (V)
ON THRESHOLD (V)
FPF2000, 2002, 2003, 2004, 2006, 2007
FPF2001, 2005
6www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Typical Characteristics
Figure 7. Current Limit vs. Output Voltage Figure 8. Current Limit vs. Temperature
Figure 9. RON vs. VIN Figure 10. RON vs. Temperature
Figure 11. TON/TOFF vs. Temperature Figure 12. TRISE/TFALL vs. Temperature
0
20
40
60
80
100
120
140
160
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3
V
IN
- V
OUT
(V)
OUTPUT CURRENT (mA)
FPF2000, 2001, 2002, 2003
FPF2004, 2005, 2006, 2007
0
20
40
60
80
100
120
140
160
180
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
CURRENT LIMIT (mA)
I_LIMIT
FPF2004, 2005, 2006, 2007
FPF2000, 2001, 2002, 2003
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
IN
, INPUT VOLTAGE (V)
R
ON
(Ohms)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
-40 -15 10 35 60 85
T
J
, JUNCTION TEMPERATURE (
o
C)
R
ON
(Ohms)
V
IN
= 1.8V
V
IN
= 3.6V
V
IN
= 5V
0.1
1
10
100
-40 -15 10 35 60 85
T
J
, JUNCTION TEMPERATURE (
o
C)
TURN ON/OFF TIME (uS)
I
LOAD
= 10mA
V
CC
= 3.3V T
ON
T
OFF
0.01
0.1
1
10
100
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
RISE / FALL TIME (uS)
I
LOAD
= 10mA
V
CC
= 3.3V
T
Rise
T
Fall
7www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Typical Characteristics
Figure 13. TBLANK vs. Temperature Figure 14. TRESTART vs. Temperature
Figure 15. TBLANK Response Figure 16. TRESTART Response
Figure 17. TON Response Figure 18. TOFF Response
8
9
10
11
12
-40 -15 10 35 60 8
5
T
J
, JUNCTION TEMPERATURE (
o
C)
FLAG-BLANKING TIME (mS)
40
60
80
100
-40 -15 10 35 60 85
T
J
, JUNCTION TEMPERATURE (
o
C)
RESTART TIME (mS)
VDRV3
2V/DIV
VOUT
2V/DIV
IOUT
50mA/DIV
VFLAGB
2V/DIV
VDRV3
2V/DIV
VOUT
2V/DIV
IOUT
50mA/DIV
VFLAGB
2V/DIV
5mS/DIV 10mS/DIV
VON
2V/DIV
IOUT
10mA/DIV
VON
2V/DIV
IOUT
10mA/DIV
50µS/DIV 100nS/DIV
RL = 500Ω, CL = 0.1µF
Active High Devices
RL = 500Ω, CL = 0.1µF
Active High Devices
8www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Typical Characteristics
Figure 19. Short Circuit Response Time Figure 20. Current Limit Response
(Output Shorted to GND) (Switch power up to hard short)
Figure 21. Current Limit Response Time
Note 3: VDRV signal forces the device to go into overcurrent condition.
VIN
2V / DIV
IOUT
2A/DIV
VOUT
2V/DIV
20µS/DIV 20µS/DIV
VIN/VON
2V/DIV
IOUT
200mA/DIV
VIN = VON
CIN = 10µF
COUT = 1µF
Active High Devices
CIN = 10µF
COUT = 1µF
Active High Devices
VIN
2V/DIV
VON
2V/DIV
IOUT
100mA/DIV
VOUT
(SHORTED
TO GND)
20µS/DIV
CIN = 10µF
COUT = 1µF
Active High Devices
9www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Description of Operation
The FPF2000-FPF2007 are current limited switches that protect
systems and loads which can be damaged or disrupted by the
application of high currents. The core of each device is a 0.7Ω
P-channel MOSFET and a controller capable of functioning over
a wide input operating range of 1.8-5.5V. The controller protects
against system malfunctions through current limiting, under-
voltage lockout and thermal shutdown. The current limit is
preset for either 50mA or 100mA.
On/Off Control
The ON pin controls the state of the switch. Active HI and LO
versions are available. Refer to the Ordering Information for
details. Activating ON continuously holds the switch in the on
state so long as there is no fault. For all versions, an under-
voltage on VIN or a junction temperature in excess of 150°C
overrides the ON control to turn off the switch. In addition,
excessive currents will cause the switch to turn off in FPF2000-
FPF2002 and FPF2004-FPF2007. The FPF2000, FPF2001,
FPF2004 and FPF2005 have an Auto-Restart feature which will
automatically turn the switch on again after 80ms. For the
FPF2002 and FPF2006, the ON pin must be toggled to turn-on
the switch again. The FPF2003 and FPF2007 do not turn off in
response to a over current condition but instead remain
operating in a constant current mode so long as ON is active
and the thermal shutdown or under-voltage lockout have not
activated.
Fault Reporting
Upon the detection of an over-current, an input under-voltage,
or an over-temperature condition, the FLAGB signals the fault
mode by activating LO. For the FPF2000-FPF2002 and
FPF2004-FPF2006, the FLAGB goes LO at the end of the
blanking time while FLAGB goes LO immediately for the
FPF2003 and FPF2007. FLAGB remains LO through the Auto-
Restart Time for the FPF2000, FPF2001 FPF2004 and
FPF2005. For the FPF2002 and FPF2006, FLAGB is latched
LO and ON must be toggled to release it. With the FPF2003 and
FPF2007, FLAGB is LO during the faults and immediately
returns HI at the end of the fault condition. FLAGB is an open-
drain MOSFET which requires a pull-up resistor between VIN
and FLAGB. During shutdown, the pull-down on FLAGB is
disabled to reduce current draw from the supply.
Current Limiting
The current limit ensures that the current through the switch
doesn’t exceed a maximum value while not limiting at less than
a minimum value. For the FPF2000-FPF2003 the minimum
current is 50mA and the maximum current is 100mA and for the
FPF2004-FPF2007 the minimum current is 100mA and the
maximum current is 200mA. The FPF2000-FPF2002 and the
FPF2004-FPF2006, have a blanking time of 10ms, nominally,
during which the switch will act as a constant current source. At
the end of the blanking time, the switch will be turned-off and
the FLAGB pin will activate to indicate that current limiting has
occurred. The FPF2003 and FPF2007 have no current limit
blanking period so immediately upon a current limit condition
FLAGB is activated. These parts will remain in a constant
current state until the ON pin is deactivated or the thermal
shutdown turns-off the switch.
Reverse Voltage
If the voltage at the VOUT pin is larger than the VIN pin, large
currents may flow and can cause permanent damage to the
device. FPF2000-FPF2007 is designed to control current flow
from VIN to VOUT
.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input
voltage drops below the under-voltage lockout threshold. With
the ON pin active the input voltage rising above the under-
voltage lockout threshold will cause a controlled turn-on of the
switch which limits current over-shoots.
Thermal Shutdown
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
10 www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Application Information
Typical Application
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or a short-circuit, a capacitor needs to be placed
between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be
placed close to the VIN pin. A higher value of CIN can be used to
further reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
Output Capacitor
A 0.1µF capacitor COUT
, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. For the
FPF2000-FPF2002 and the FPF2004-FPF2006, the total output
capacitance needs to be kept below a maximum value,
COUT(max), to prevent the part from registering an over-current
condition and turning-off the switch. The maximum output
capacitance can be determined from the following formula,
Due to the integral body diode in the PMOS switch, a CIN
greater than COUT is highly recommended. A COUT greater than
CIN can cause VOUT to exceed VIN when the system supply is
removed. This could result in current flow through the body
diode from VOUT to VIN.
Power Dissipation
During normal operation as a switch, the power dissipation is
small and has little effect on the operating temperature of the
part. The parts with the higher current limits will dissipate the
most power and that will only be,
If the part goes into current limit the maximum power dissipation
will occur when the output is shorted to ground. For the
FPF2000, FPF2001, FPF2004 and FPF2005, the power
dissipation will scale by the Auto-Restart Time, tRESTART
, and
the Over Current Blanking Time, tBLANK, so that the maximum
power dissipated is,
When using the FPF2002 and FPF2006 attention must be given
to the manual resetting of the part. Continuously resetting the
part at a high duty cycle when a short on the output is present
can cause the temperature of the part to increase. The junction
temperature will only be allowed to increase to the thermal
shutdown threshold. Once this temperature has been reached,
toggling ON will not turn-on the switch until the junction
temperature drops. For the FPF2003 and FPF2007, a short on
the output will cause the part to operate in a constant current
state dissipating a worst case power as calculated in (3) until
the thermal shutdown activates. It will then cycle in and out of
thermal shutdown so long as the ON pin is active and the short
is present.
Board Layout
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
OFF ON ON
VIN
GND
FPF2000 - FPF2007
FLAGB
VOUT
LOAD
1.8V-5.5V
C1 = 4.7µF
R1 = 100KΩ
C2 = 0.1µF
R2 = 500Ω
COUT
ILIM max()tBLANK min()×
VIN
--------------------------------------------------------------------
=(1)
PI
LIM
()
2RDS
×0.2()
20.7×28mW===(2)
Pmax() tBLANK
tRESTART tBLANK
+
---------------------------------------------------xVIN max()
()xILIM max()
==
10
80 10+
------------------- 5.5×0.2×1.22mW=(3)
=
11 www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Dimensional Outline and Pad Layout
12 www.fairchildsemi.com
FPF2000-FPF2007 Rev. H
FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is
not intended to be an exhaustive list of all such trademarks.
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™ *
™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FlashWriter® *
FPS™
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
Saving our world, 1mW/W/kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™ ®
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
™
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change
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Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
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distributors.
Rev. I37
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