Displays, Memory and Storage
1H 2013
PRODUCT SELECTION GUIDE
Samsung Semiconductor, Inc.
samsung.com/us/oem-solutions
Mobile/Wireless
Notebook PCs/
Ultrabooks
Desktop PCs/
Workstations
Servers
Networking/
Communications
Consumer
Electronics
Markets DRAM SSD FLASH ASIC LOGIC TFT/LCD ODD
Samsung continues to lead the industry with the broadest portfolio of memory products and
technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from
ultra-mobile notebooks to powerful servers—and in a wide range of handheld devices such as
smartphones and tablets. Samsung also delivers the industry’s widest line of storage products from
the consumer to the enterprise level. These include optical disk drives as well as flash storage, such
as Solid State Drives, and a range of embedded and removable flash storage products.
N/A
N/A
N/A
samsung.com/dram 31H 2013
• DDR4 SDRAM
• DDR3 SDRAM
• DDR2 SDRAM
• DDR SDRAM
• Mobile DRAM
• Graphics SDRAM
• DRAM Ordering
Information
• SLC Flash
• MLC Flash
• SD and microSD Cards
• eMMC
• Solid State Drives (SSD)
• Flash Product Ordering
Information
• Industrial Cards
• eMMC + LPDDR2
• eMMC + LPDDR3
• eMMC + MDDR
Pages 4–12
Pages 13–15
Page 16–17
Pages 20–22
Page 23
DRAM
FLASH - SSD
MULTI-CHIP PACKAGE
DISPLAYS
CONTACTS
samsung.com/dram
samsung.com/flash
samsungdisplay.com
samsung.com/mcp
• Sales Representatives
and Distributors
samsung.com/us/oem-solutions
• Exclusive Digital
Information Display (E-DID)
• Performance Digital
Information Display (P-DID)
• Basic Digital Information
Display (B-DID)
• Tablets
• Ultrabooks/PCs
• Monitors
Pages 18–19
STORAGE
• Solid State Drives
• Optical Disc Drives
samsung.com/flash-ssd
samsungodd.com
DRAM
• To access our online sales portal, visit:
https://smarttools.ssi.samsung.com
samsung.com/dram
41H 2013DDR4 & DDR3 SDRAM
DDR3 SDRAM REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
1GB 1.5V 128Mx72 M393B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now
2GB 1.5V 256Mx72
M393B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now
M393B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now
M393B5773CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M393B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
4GB 1.5V 512Mx72
M393B5170GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now
M393B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M393B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M393B5270CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now
M393B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
8GB 1.5V 1Gx72
M393B1K73CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B1K73DH0-C(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B1K70CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now
M393B1K70DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
16GB 1.5V 2Gx72 M393B2K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B2K70DM0-C(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
8GB 1.5V 1Gx72 M393B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now
M393B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
16GB 1.5V 2Gx72 M393B2G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M393B2G73BH0-C(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
32GB 1.5V 4Gx72 M393B4G70BM0-C(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
2GB 1.35V 256Mx72 M393B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M393B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now
4GB 1.35V 512Mx72
M393B5173GB0-Y(F8/H9)(08/09) 1Gb (128M x8) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333 4 Now
M393B5170GB0-Y(F8/H9/K0)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 2 Now
M393B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M393B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
M393B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now
M393B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now
8GB 1.35V 1Gx72
M393B1K73CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B1K73DH0-Y(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B1K70CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now
M393B1K70DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now
16GB 1.35V 2Gx72 M393B2K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
M393B2K70DM0-Y(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
8GB 1.35V 1Gx72 M393B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now
M393B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
16GB 1.35V 2Gx72 M393B2G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now
M393B2G73BH0-Y(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now
32GB 1.35V 4Gx72 M393B4G70BM0-Y(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now
NOTES: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register H9 = DDR3-1333 (9-9-9) 08 = IDT A1 K0 = DDR3-1600 (11-11-11)
09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13)
* K0 (1600Mbps) available in ES only
samsung.com/dram
DDR4 SDRAM REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.2V 1Gx 72 M393A1G40DB0-C(NA/QB) 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip 1866/2133 1 3Q'13
16GB 1.2V 2Gx72 M393A2G40DB0-C(NA/QB) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1866/2133 23Q'13
NOTES: Register is not fixed yet NA = DDR4-1866 (14-14-14), QB = DDR4-2133(16-16-16)
DDR4 SDRAM LOAD REDUCED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
32GB 1.2V 4Gx 72 M386A4GDP0-C(NA/QB) 4Gb MDP (2Gx4) * 36 Lead Free & Halogen Free 1866/2133 44Q'13
NOTES: Register is not fixed yet NA = DDR4-1866 (14-14-14), QB = DDR4-2133(16-16-16)
samsung.com/dram 5
DRAM
1H 2013 DDR3 SDRAM
DDR3 SDRAM LOAD REDUCED REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
16GB 1.35V 2Gx72 M386B2K70DM0-YH90 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1333 4 Now
32GB 1.35V/1.5V 4Gx72 M386B4G70BM0-YK0(3/4)/
CMA(3/4) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1333/1600/1866 4 2Q'13
64GB 1.35V/1,5V 8Gx72 M386B8G70BO0-YH94/CK04 4Gb QDP (4G x4) * 36 Lead Free & Halogen Free 1333/1600 8 2Q'13
NOTES: 0 = Inphi iMB GS02A
3 = Inphi iMB GS02B
4 = Montage C1
DDR3 SDRAM VLP REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
1GB 1.5V 128Mx72 M392B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now
2GB 1.5V 256Mx72
M392B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now
M392B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now
M392B5773CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M392B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
4GB 1.5V 512Mx72
M392B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M392B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M392B5270CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now
M392B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
8GB 1.5V 1Gx72
M392B1K73CM0-C(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
M392B1K73DM0-C(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
M392B1K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M392B1K70DM0-C(F8/H9/K0/MA)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M392B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
M392B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
16GB 1.5V 2Gx72
M392B2G70BM0-C(F8/H9/K0/MA)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M392B2G73BM0-C(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
2GB 1.35V 256Mx72
M392B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M392B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now
4GB 1.35V 512Mx72
M392B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M392B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
M392B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now
M392B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now
8GB 1.35V 1Gx72
M392B1K73CM0-Y(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
M392B1K73DM0-Y(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
M392B1K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M392B1K70DM0-Y(F8/H9/K0)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
M392B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
M392B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now
16GB 1.35V 2Gx72 M392B2G70BM0-Y(F8/H9/K0)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
M392B2G70BM0-Y(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now
32GB 1.35V 4Gx72 M392B4G70BE0-Y(F8/H9)(08) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free 1066/1333 4 Now
NOTES: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7)
05 = Inphi C0 register H9 = DDR3-1333 (9-9-9)
08 = IDT A1 K0 = DDR3-1600 (11-11-11)
09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13)
samsung.com/dram
61H 2013DDR3 SDRAM
DDR3 SDRAM UNBUFFERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
0.0625
in 1.5V 128Mx64 M378B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 1 Now
2GB 1.5V 256Mx64
M378B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 2 Now
M378B5773CH0-C(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now
M378B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
4GB 1.5V 512Mx64
M378B5273CH0-C(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now
M378B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
8GB 1.5V 1024Mx64 M378B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
DDR3 SDRAM UNBUFFERED MODULES (ECC)
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
0.0625
in 1.5V 128Mx72 M391B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 1 Now
2GB 1.5V 256Mx72
M391B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 18 Lead Free & Halogen Free,Flip
Chip 1066/1333/1600/1866 2 Now
M391B5773CH0-C(F8/H9) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M391B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
4GB 1.5V 512Mx72
M391B5273CH0-C(F8/H9) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M391B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
8GB 1.5V 1024Mx72 M391B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
1GB 1.35V 128Mx72 M391B2873GB0-Y(F8/H9/K0) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600 1 Now
2GB 1.35V 256Mx72
M391B5673GB0-Y(F8/H9/K0) 1Gb (128M x8) * 18 Lead Free & Halogen Free,Flip
Chip 1066/1333/1600 2 Now
M391B5773CH0-Y(F8/H9) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now
M391B5773DH0-Y(F8/H9/K0) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now
4GB 1.35V 512Mx72
M391B5273CH0-Y(F8/H9) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now
M391B5273DH0-Y(F8/H9/K0) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
8GB 1.35V 1024Mx72 M391B1G73BH0-Y(F8/H9/K0) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now
NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
samsung.com/dram 7
DRAM
1H 2013 DDR3 & DDR2 SDRAM
DDR3 SDRAM SODIMM MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
1GB 1.5V 128Mx64 M471B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 1 Now
2GB 1.5V 256Mx64
M471B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 2 Now
M471B5773CHS-C(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now
M471B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
4GB 1.5V 512Mx64
M471B5273CH0-C(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now
M471B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
M471B5173BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now
8GB 1.5V 1024Mx64 M471B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now
1GB 1.35V 128Mx64 M471B2873GB0-Y(F8/H9/K0) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600/1866 1 Now
2GB 1.35V 256Mx64
M471B5673GB0-Y(F8/H9/K0) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip
Chip 1066/1333/1600 2 Now
M471B5773CHS-Y(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now
M471B5773DH0-Y(F8/H9/K0) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600 1 Now
4GB 1.35V 512Mx64
M471B5273CH0-Y(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now
M471B5273DH0-Y(F8/H9/K0) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600 2 Now
M471B5173BH0-Y(F8/H9/K0) 4Gb (512M x8) * 8 Lead Free & Halogen Free 1066/1333/1600 1 Now
8GB 1.35V 1024Mx64 M471B1G73BH0-Y(F8/H9/K0) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600 2 Now
NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
DDR3 SDRAM ECC SODIMM MODULES
Density Organization Part Number Composition Compliance Speed (Mbps) Register Rank Production
2GB 1.35V 256Mx64 M474B5773DH0-YH9/K0 2Gb x8*9 Lead Free & Halogen Free 1333/1600 1 Now
4GB 1.35V
512Mx64 M474B5273DH0-YH9/K0 2Gb x8*18 Lead Free & Halogen Free 1333/1600 2 Now
M474B5173BH0-YH9/K0 4Gb x8*9 Lead Free & Halogen Free 1333/1600 1 Now
8GB 1.35V 1024Mx64 M474B1G73BH0-YH9/K0 4Gb x8*18 Lead Free & Halogen Free 1333/1600 2 Now
NOTES: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) E7 = PC2-6400 (DDR2-800 @ CL=5) Voltage = 1.8V
samsung.com/dram
81H 2013DDR2, DDR & SDRAM COMPONENTS
DDR SDRAM COMPONENTS
Density Organization Part Number # Pins - Package Speed (Mbps)
512Mb
128Mx4 K4H510438J-LCB3/B0 66-TSOP 266/333
K4H510438J-BCCC/B3 60-FBGA 333/400
64Mx8 K4H510838J-LCCC/B3 66-TSOP 333/400
K4H510838J-BCCC/B3 60-FBGA 333/400
32Mx16 K4H511638J-LCCC/B3 66-TSOP 333/400
NOTES: B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3)
DDR2 SDRAM COMPONENTS
Density Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production
256Mb 16Mx16 K4T56163QN-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now
512Mb
128M x4 K4T51043QJ-HC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now
64M x8 K4T51083QJ-HC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now
32M x16 K4T51163QJ-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now
1Gb
256M x4 K4T1G044QF-BC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now
128M x8 K4T1G084QF-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now
64M x16 K4T1G164QF-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now
DDR3 SDRAM COMPONENTS
Density Voltage Organization Part Number # Pins-Package Compliance Speed (Mbps) Dimensions Production
1Gb 1.5V
256M x4
K4B1G0446F-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B1G0446G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 7.5x11mm Now
128M x8 K4B1G0846G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 7.5x11mm Now
128M x16 K4B1G1646G-BC(F8/H9/K0/
MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866/2133 7.5x13.3mm Now
2Gb 1.5V
512M x4
K4B2G0446C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B2G0446D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now
256M x8
K4B2G0846C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B2G0846D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now
128M x16
K4B2G1646C-HC(F8/H9/K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x13.3mm Now
K4B2G1646E-BC(F8/H9/K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x13.3mm Now
4Gb 1.5V
1G x4 K4B4G0446B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now
512M x8 K4B4G0846B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now
1Gb
1.35V 256M x4
K4B1G0446F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B1G0446G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now
1.35V 128M x8
K4B1G0846F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B1G0846G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now
2Gb 1.35V
512M x4
K4B2G0446C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B2G0446D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
256M x8
K4B2G0846C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
K4B2G0846D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now
4Gb 1.35V 1G x4 K4B4G0446B-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x11mm Now
NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) NB = DDR3-2133 (14-14-14)
* MA, and NB are available in ES only
samsung.com/dram 9
DRAM
1H 2013 Mobile & Graphics DRAM Components
GRAPHICS DRAM COMPONENTS
Type Density Organization Part Number Package VDD/VDDQ Speed Bin (MHz) Production
GDDR5
2Gb 64Mx32 K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 1250/1500/1750 Now
K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 1000/1250 Now
1Gb 32Mx32
K4G10325FG-HC03 170-FBGA 1.6V/1.6V 1500 Now
K4G10325FG-HC(05/04) 170-FBGA 1.5V/1.5V 1000/1250 Now
K4G10325FG-HC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now
GDDR3 1Gb 32Mx32 K4J10324KG-HC(14/1A) 136-FBGA 1.8V/1.8V 700/1000 Now
gDDR3
4Gb 256Mx16 K4W4G1646B-HC(12/11/1A) 96-FBGA 1.5V/1.5V 800/933/1066 Now
2Gb 128Mx16 K4W2G1646E-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now
1Gb 64Mx16 K4W1G1646G-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now
NOTES: Package
H: FBGA (Halogen Free & Lead Free)
B: FBGA (Halogen Free & Lead Free)
(1) Speeds (clock cycle - speed bin)
03: 0.3ns (3000MHz)
04: 0.4ns (2500MHz)
05: 0.5ns (2000MHz)
5C: 0.555 (1800MHz)
08: 0.83ns (1200MHz)
1A: 1ns (1000MHz GDDR3)
1A: 1ns (1066MHz gDDR3)
11: 1.1ns (933MHz)
12: 1.25ns (800MHz)
14: 1.429ns (700MHz)
20: 2.0ns (500MHz)
25: 2.5ns (400MHz)
MOBILE DRAM COMPONENTS
Density Type Organization Part Number Package Power Production
512Mb
MDDR
32Mx16 K4X51163PK-FGD8 60-FBGA, 200MHz 1.8V Now
16Mx32 K4X51323PK-8GD8 90-FBGA, 200MHz 1.8V Now
1Gb 32Mx32 K4X1G323PF-8GD8 90-FBGA, 200MHz 1.8V Now
2Gb 64Mx32 K4X2G323PD-8GD8 90-FBGA, 200MHz 1.8V Now
4Gb x32 (2CS, 2CKE) K4X4G303PD-AGD8 168-FBGA, 12x12 PoP, DDP, 200MHz 1.8V Now
2Gb
LPDDR2
1CH x32 K4P2G324ED-AGC1 168-FBGA, 12x12 PoP, MONO, 800Mbps 1.2V Now
4Gb
1CH x32 K4P4G324EB-AGC2 168-FBGA, 12x12 PoP, MONO, 1066Mbps 1.2V Now
2CH x32 K3PE4E400P-XGC2 216FBGA,12x12 PoP, DDP, 1066Mbps 1.2V Now
2CH x32 K3PE4E400D-XGC2 220FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now
2CH x32 K3PE4E400K-XGC2 240-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now
8Gb
1CH x32 K4P8G304EB-FGC2 134-FBGA, 11x11.5 , DDP, 1066Mbps 1.2V Now
1CH x32 K4P8G304EB-AGC1 168-FBGA, 12x12 PoP, DDP, 800Mbps 1.2V Now
2CH x32 K4P8G304EB-GGC2 216FBGA, 12x12 PoP, DDP, 1066Mbps 1.2V Now
2CH x32 K3PE7E700M-XGC2 216-FBGA, 12x12 PoP, DDP, 1066Mbps 1.2V Now
2CH x32 K3PE7E700D-XGC2 220-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now
2CH x32 K3PE7E700A-XGC2 240-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now
16Gb
1CH x32 K4PAG304EB-FGC2 134-FBGA, 11x11.5 , QDP, 1066Mbps 1.2V Now
2CH x32 K3PE0E000M-XGC2 216-FBGA, 12x12 PoP, QDP, 1066Mbps 1.2V Now
2CH x32 K3PE0E000A-XGC2 220-FBGA, 14x14 PoP, QDP, 1066Mbps 1.2V Now
2CH x32 K3PE0E000B-XGC2 240-FBGA, 14x14 PoP, QDP, 1066Mbps 1.2V Now
4Gb
LPDDR3
1CH x32 K4E4E324EB-EGCE 178-FBGA, 11x11.5 , MONO , 1600Mbps 1.2V CS
8Gb
1CH x32 K4E8E304EB-EGCE 178-FBGA, 11x11.5 , DDP, 1600Mbps 1.2V CS
2CH x32 K3QF1F100B-PGCE 253-FBGA, 11x11.5 , DDP, 1600Mbps 1.2V CS
2CH x32 K3QF1F100G-XGCE 216-FBGA, 15x15 PoP , DDP, 1600Mbps 1.2V CS
16Gb
1CH x32 K4E6E304EB-EGCE 178-FBGA, 11x11.5 , QDP, 1600Mbps 1.2V CS
2CH x32 K3QF2F200A-XGCE 253-FBGA, 11x11.5 , QDP, 1600Mbps 1.2V CS
2CH x32 K3QF2F200B-XGCE 216-FBGA, 15x15 PoP , QDP, 1600Mbps 1.2V CS
samsung.com/dram
10 1H 2013DRAM Ordering Information
1. Memory (K)
2. DRAM: 4
3. DRAM Type
B: DDR3 SDRAM
D: GDDR SDRAM
G: GDDR5 SDRAM
H: DDR SDRAM
J: GDDR3 SDRAM
M: Mobile SDRAM
N: SDDR2 SDRAM
S: SDRAM
T: DDR SDRAM
U: GDDR4 SDRAM
V: Mobile DDR SDRAM Power Efficient Address
W: SDDR3 SDRAM
X: Mobile DDR SDRAM
Y: XDR DRAM
Z: Value Added DRAM
4. Density
10: 1G, 8K/32ms
16: 16M, 4K/64ms
26: 128M, 4K/32ms
28: 128M, 4K/64ms
32: 32M, 2K/32ms
50: 512M, 32K/16ms
51: 512M, 8K/64ms
52: 512M, 8K/32ms
54: 256M, 16K/16ms
55: 256M, 4K/32ms
56: 256M, 8K/64ms
62: 64M, 2K/16ms
64: 64M, 4K/64ms
68: 768M, 8K/64ms
1G: 1G, 8K/64ms
2G: 2G, 8K/64ms
4G: 4G, 8K/64ms
5. Bit Organization
02: x2
04: x4
06: x4 Stack (Flexframe)
07: x8 Stack (Flexframe)
08: x8
15: x16 (2CS)
16: x16
26: x4 Stack (JEDEC Standard)
27: x8 Stack (JEDEC Standard)
30: x32 (2CS, 2CKE)
31: x32 (2CS)
32: x32
6. # of Internal Banks
2: 2 Banks
3: 4 Banks
4: 8 Banks
5: 16 Banks
7. Interface ( VDD, VDDQ)
2: LVTTL, 3.3V, 3.3V
4: LVTTL, 2.5V, 2.5V
5: SSTL-2 1.8V, 1.8V
6: SSTL-15 1.5V, 1.5V
8: SSTL-2, 2.5V, 2.5V
A: SSTL, 2.5V, 1.8V
F: POD-15 (1.5V,1.5V)
H: SSTL_2 DLL, 3.3V, 2.5V
M: LVTTL, 1.8V, 1.5V
N: LVTTL, 1.5V, 1.5V
P: LVTTL, 1.8V, 1.8V
Q: SSTL-2 1.8V, 1.8V
R: SSTL-2, 2.8V, 2.8V
U: DRSL, 1.8V, 1.2V
8. Revision
A: 2nd Generation
B: 3rd Generation
C: 4th Generation
D: 5th Generation
E: 6th Generation
F: 7th Generation
G: 8th Generation
H: 9th Generation
I: 10th Generation
J: 11th Generation
K: 12th Generation
M: 1st Generation
N: 14th Generation
Q: 17th Generation
9. Package Type
DDR2 DRAM
L: TSOP II (Lead-free & Halogen-free)
H: FBGA (Lead-free & Halogen-free)
F: FBGA for 64Mb DDR (Lead-free & Halogen-free)
6: sTSOP II (Lead-free & Halogen-free)
T: TSOP II
N: sTSOP II
G: FBGA
U: TSOP II (Lead-free)
V: sTSOP II (Lead-free)
Z: FBGA (Lead-free)
DDR2 SDRAM
Z: FBGA (Lead-free)
J: FBGA DDP (Lead-free)
Q: FBGA QDP (Lead-free)
H: FBGA (Lead-free & Halogen-free)
M: FBGA DDP (Lead-free & Halogen-free)
E: FBGA QDP (Lead-free & Halogen-free)
T: FBGA DSP (Lead-free & Halogen-free, Thin)
DDR3 SDRAM
Z: FBGA (Lead-free)
H: FBGA (Halogen-free & Lead-free)
Graphics Memory
Q: TQFP
U: TQFP (Lead Free)
G: 84/144 FBGA
V: 144 FBGA (Lead Free)
Z: 84 FBGA (Lead Free)
T: TSOP
L: TSOP (Lead Free)
A: 136 FBGA
B: 136 FBGA (Lead Free)
H: FBGA (Hologen Free & Lead Free)
E: 100 FBGA (Hologen Free & Lead Free)
SDRAM
L TSOP II (Lead-free & Halogen-free)
N: STSOP II
T: TSOP II
U: TSOP II (Lead-free)
V: sTSOP II (Lead-free)
COMPONENT DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11
K 4 T XX XX X X X X X XX
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (VDD, VDDQ)
Number of Internal Banks
samsung.com/dram 11
DRAM
1H 2013 DRAM Ordering Information
XDR DRAM
J: BOC(LF) P: BOC
Mobile DRAM
Leaded/Lead Free
G/A: 52balls FBGA Mono
R/B: 54balls FBGA Mono
X/Z: 54balls BOC Mono
J/V: 60(72)balls FBGA Mono 0.5pitch
L /F: 60balls FBGA Mono 0.8pitch
S/D: 90balls FBGA
Monolithic (11mm x 13mm)
F/H: Smaller 90balls FBGA Mono
Y/P: 54balls CSP DDP
M/E: 90balls FBGA DDP
10. Temp & Power - COMMON
(Temp, Power)
C: Commercial, Normal (0’C – 95’C) & Normal
Power
C: (Mobile Only) Commercial (-25 ~ 70’C), Normal
Power
J: Commercial, Medium
L: Commercial, Low (0’C – 95’C) & Low Power
L: (Mobile Only) Commercial, Low, i-TCSR
F: Commercial, Low, i-TCSR & PASR & DS
E: Extended (-25~85’C), Normal
N: Extended, Low, i-TCSR
G: Extended, Low, i-TCSR & PASR & DS
I: Industrial, Normal (-40’C – 85’C) & Normal
Power
P: Industrial, Low (-40’C – 85’C) & Low Power
H: Industrial, Low, i-TCSR & PASR & DS
11. Speed (Wafer/Chip Biz/BGD: 00)
DDR SDRAM
CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3)
B3: DDR333 (166MHz @ CL=2.5, tRCD=3,
tRP=3) *1
A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3)
B0: DDR266 (133MHz @ CL=2.5, tRCD=3,
tRP=3)
Note 1: "B3" has compatibility with "A2" and "B0"
DDR2 SDRAM
CC: DDR2-400 (200MHz @ CL=3, tRCD=3,
tRP=3)
D5: DDR2-533 (266MHz @ CL=4, tRCD=4,
tRP=4)
E6: DDR2-667 (333MHz @ CL=5, tRCD=5,
tRP=5)
F7: DDR2-800 (400MHz @ CL=6, tRCD=6,
tRP=6)
E7: DDR2-800 (400MHz @ CL=5, tRCD=5,
tRP=5)
DDR3 SDRAM
F7: DDR3-800 (400MHz @ CL=6, tRCD=6,
tRP=6)
F8: DDR3-1066 (533MHz @ CL=7, tRCD=7,
tRP=7)
G8: DDR3-1066 (533MHz @ CL=8, tRCD=8,
tRP=8)
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9,
tRP=9)
K0: DDR3-1600 (800MHz @ CL=11, tRCD=11,
tRP=11)
MA: DDR3-1866 (933MHz @ CL=13, tRCD=13,
tRP=13)
NB: DDR3-2133 (1067MHz @ CL=14, tRCD=14,
tRP=14)
Graphics Memory
18: 1.8ns (550MHz)
04: 0.4ns (2500MHz)
20: 2.0ns (500MHz)
05: 0.5ns (2000MHz)
22: 2.2ns (450MHz)
5C: 0.56ns (1800MHz)
25: 2.5ns (400MHz)
06: 0.62ns (1600MHz)
2C: 2.66ns (375MHz)
6A: 0.66ns (1500MHz)
2A: 2.86ns (350MHz)
07: 0.71ns (1400MHz)
33: 3.3ns (300MHz)
7A: 0.77ns (1300MHz)
36: 3.6ns (275MHz)
08: 0.8ns (1200MHz)
40: 4.0ns (250MHz)
09: 0.9ns (1100MHz)
45: 4.5ns (222MHz)
1 : 1.0ns (1000MHz)
50/5A: 5.0ns (200MHz)
1 : 1.1ns (900MHz)
55: 5.5ns (183MHz)
12: 1.25ns (800MHz)
60: 6.0ns (166MHz)
14: 1.4ns (700MHz)
16: 1.6ns (600MHz)
SDRAM (Default CL=3)
50: 5.0ns (200MHz CL=3)
60: 6.0ns (166MHz CL=3)
67: 6.7ns
75: 7.5ns PC133 (133MHz CL=3)
XDR DRAM
A2: 2.4Gbps, 36ns, 16Cycles
B3: 3.2Gbps, 35ns, 20Cycles
C3: 3.2Gbps, 35ns, 24Cycles
C4: 4.0Gbps, 28ns, 24Cycles
DS: Daisychain Sample
Mobile-SDRAM
60: 166MHz, CL 3
75: 133MHz, CL 3
80: 125MHz, CL 3
1H: 105MHz, CL 2
1L: 105MHz, CL 3
15: 66MHz, CL 2 & 3
Mobile-DDR
C3: 133MHz, CL 3
C2: 100MHz, CL 3
C0: 66MHz, CL 3
Note: All of Lead-free or Halogen-free product are in
compliance with RoHS
COMPONENT DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11
K 4 T XX XX X X X X X XX
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (VDD, VDDQ)
Number of Internal Banks
samsung.com/dram
12 1H 2013DRAM Ordering Information
1. Memory Module: M
2. DIMM Type
3: DIMM
4: SODIMM
3. Data bits
12: x72 184pin Low Profile Registered DIMM
63: x63 PC100/PC133 SODIMM with SPD for
144pin
64: x64 PC100/PC133 SODIMM with SPD for
144pin (Intel/JEDEC)
66: x64 Unbuffered DIMM with SPD for
144pin/168pin (Intel/JEDEC)
68: x64 184pin Unbuffered DIMM
70: x64 200pin Unbuffered SODIMM
71: x64 204pin Unbuffered SODIMM
74: x72/ECC Unbuffered DIMM with SPD for 168pin
(Intel/JEDEC)
77: x72/ECC PLL + Register DIMM with SPD for
168pin (Intel PC100)
78: x64 240pin Unbuffered DIMM
81: x72 184pin ECC unbuffered DIMM
83: x72 184pin Registered DIMM
90: x72/ECC PLL + Register DIMM
91: x72 240pin ECC unbuffered DIMM
92: x72 240pin VLP Registered DIMM
93: x72 240pin Registered DIMM
95: x72 240pin Fully Buffered DIMM with SPD for
168pin (JEDEC PC133)
4. DRAM Component Type
B: DDR3 SDRAM (1.5V VDD)
L: DDR SDRAM (2.5V VDD)
S: SDRAM
T: DDR2 SDRAM (1.8V VDD)
5. Depth
09: 8M (for 128Mb/512Mb)
17: 16M (for 128Mb/512Mb)
16: 16M
28: 128M
29: 128M (for 128Mb/512Mb)
32: 32M
33: 32M (for 128Mb/512Mb)
51: 512M
52: 512M (for 512Mb/2Gb)
56: 256M
57: 256M (for 512Mb/2Gb)
59: 256M (for 128Mb/512Mb)
64: 64M
65: 64M (for 128Mb/512Mb)
1G: 1G
1K: 1G (for 2Gb)
6. # of Banks in Comp. & Interface
1: 4K/64mxRef., 4Banks & SSTL-2
2 : 8K/64ms Ref., 4Banks & SSTL-2
2: 4K/64ms Ref., 4Banks & LVTTL (SDR Only)
5: 8K/64ms Ref., 4Banks & LVTTL (SDR Only)
5: 4Banks & SSTL-1.8V
6: 8Banks & SSTL-1.8V
7. Bit Organization
0: x 4
3: x 8
4: x16
6: x 4 Stack (JEDEC Standard)
7: x 8 Stack (JEDEC Standard)
8: x 4 Stack
9: x 8 Stack
8. Component Revision
A: 2nd Gen.
B: 3rd Gen.
C: 4th Gen.
D: 5th Gen.
E: 6th Gen.
F: 7th Gen.
G: 8th Gen.
M: 1st Gen.
Q: 17th Gen.
9. Package
E: FBGA QDP (Lead-free & Halogen-free)
G: FBGA
H: FBGA (Lead-free & Halogen-free)
J: FBGA DDP (Lead-free)
M: FBGA DDP (Lead-free & Halogen-free)
N: sTSOP
Q: FBGA QDP (Lead-free)
T: TSOP II (400mil)
U: TSOP II (Lead-Free)
V: sTSOP II (Lead-Free)
Z: FBGA (Lead-free)
10. PCB Revision
0: Mother PCB
1: 1st Rev
2: 2nd Rev.
3: 3rd Rev.
4: 4th Rev.
A: Parity DIMM
S: Reduced PCB
U: Low Profile DIMM
11. Temp & Power
C: Commercial Temp. (0°C ~ 95°C) & Normal
Power
L: Commercial Temp. (0°C ~ 95°C) & Low Power
12. Speed
CC: (200MHz @ CL=3, tRCD=3, tRP=3)
D5: (266MHz @ CL=4, tRCD=4, tRP=4)
E6: (333MHz @ CL=5, tRCD=5, tRP=5)
F7: (400MHz @ CL=6, tRCD=6, tRP=6)
E7: (400MHz @ CL=5, tRCD=5, tRP=5)
F8: (533MHz @ CL=7, tRCD=7, tRP=7)
G8: (533MHz @ CL=8, tRCD=8, tRP=8)
H9: (667MHz @ CL=9, tRCD=9, tRP=9)
K0: (800MHz @ CL=10, tRCD=10, tRP=10)
7A: (133MHz CL=3/PC100 CL2)
13. AMB Vendor for FBDIMM
0, 5: Intel
1, 6, 8: IDT
9: Montage
Note: All of Lead-free or Halogen-free product are in
compliance with RoHS
MODULE DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11 12 13
M X XX T XX X X X X X X XX X
SAMSUNG Memory
DIMM
Data bits
DRAM Component Type
Depth
Number of Banks
Bit Organization
AMB Vendor
Speed
Temp & Power
PCB Revision
Package
Component Revision
samsung.com/ash 131H 2013
FLASH - SSD
SLC AND MLC FLASH, SD/microSD FLASH
SLC FLASH
Density Technology Part Number Package Type Org. Vol(V) Status
0.0156 in 21nm DDR K9WDGY8S5M-CCK* 316FBGA x8 3.3/1.8 MP
256Gb ODP 21nm DDR K9QFGY8S7M-CCK* 316FBGA x8 3.3/1.8 MP
128Gb QDP 21nm DDR K9VHGY8SCM-CCK* 316FBGA x8 3.3/1.8 MP
16Gb QDP 42nm SDR K9WAG08U1D-SCB0* TSOP1 x8 3.3 MP
K9WAG08U1D-SIB0* TSOP1 x8 3.3 MP
8Gb DDP 42nm SDR K9K8G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP
K9K8G08U0D-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP
4Gb 42nm SDR K9F4G08U0D-SCB0* TSOP1 HF & LF x8 3.3 MP
K9F4G08U0D-SIB0* TSOP1 HF & LF, i-temp x8 3.3 MP
2Gb 42nm SDR K9F2G08U0C-SCB0* TSOP-LF/HF x8 3.3 MP
K9F2G08U0C-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP
1Gb 42nm SDR K9F1G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP
K9F1G08U0D-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP
Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free
MLC FLASH
Type Density Technology Part Number Package Type Org. Vol(V) Status
2bit
512Gb ODP 21nm DDR K9PHGY8S5A-HCK0000 132BGA x8 3.3/1.8 MP
256Gb QDP 21nm DDR K9HFGY8S5A-HCK0000 132BGA x8 3.3/1.8 MP
128Gb QDP 21nm SDR K9HDG08U1B-SCB0000 48TSOP x8 3.3 MP
21nm DDR K9HDGY8U5B-HCK0000 132BGA x8 3.3 MP
128Gb DDP 21nm DDR K9LDGY8S1A-HCK0000 132BGA x8 3.3/1.8 MP
64Gb DDP 21nm SDR K9LCG08U0B-SCB0000 48TSOP x8 3.3 MP
21nm SDR K9LCGY8U1B-HCK0000 132BGA x8 3.3 MP
64Gb mono 21nm DDR K9GCGY8S0A-HCK0000 132BGA x8 3.3/1.8 MP
21nm DDR K9GCGD8U0A-MCB0000 60LGA x8 3.3 MP
32Gb mono
21nm SDR K9GBG08U0B-SCB0000 48TSOP x8 3.3 MP
21nm DDR K9GBGY8U0B-HCK0000 132BGA x8 3.3/1.8 MP
21nm DDR K9GBGD8U0A-MCB0000 60LGA x8 3.3 MP
3bit
256Gb QDP 21nm DDR K9CFGD8U1A-SCB0000 48TSOP x8 3.3 MP
128Gb DDP 21nm DDR K9BDGD8U0A-SCB0000 48TSOP x8 3.3 MP
64Gb mono 21nm DDR K9ACGD8U0A-SCB0000 48TSOP x8 3.3 MP
32Gb mono 21nm DDR K9ABGD8U0C-SCB0000 48TSOP x8 3.3 MP
Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead-free & halogen-free
SD and microSD FLASH CARDS
Application Density Part Number Class Ultra High Speed (UHS)
SD Cards
2GB MMAUF02G4ACA-QMP00 CL4
4GB MMBTF04G3CCH-QMM00 CL4 UHS 104
8GB MMCTF08G3ACH-QMM00 CL4 UHS 104
16GB MMCTF16GWACJ-SAC00 CL10 UHS 104
32GB MMCTF32GWACJ-SAC00 CL10 UHS 104
64GB MMCTF64GWACJ-SAC00 CL10 UHS 104
uSD Cards
2GB MMAUR02G3ACA-QMP00 CL4
4GB MMBTR04G3CCA-QMP00 CL4 UHS 104
8GB MMCTR08G3ACH-QMM00 CL4 UHS 104
16GB MMCTR16GUACJ-SAC00 CL10 UHS 104
32GB MMCTR32GUACJ-SAC00 CL10 UHS 104
64GB MMCTR64GUACJ-SAC00 CL10 UHS 104
Please contact your local Samsung sales representative for part numbers and latest product offerings.
samsung.com/ash
14 1H 2013Industrial Cards, eMMC & SSDs
SOLID STATE DRIVES (SSD)
Drive Type Drive Name Interface Form Factor Connector Component Power-loss
Protection Density Part Number Status
Client PC/
Embedded
PM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 3-bit MLC No
128GB MZMTD128HAFV-00000 MP
256GB MZMTD256HAGM-00000 MP
512GB MZMTD512HAGL-00000 MP
SM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 2-bit MLC No
128GB MZMPD128HAFV-00000 MP
256GB MZMPD256HAGM-00000 MP
512GB MZMPD512HAGL-00000 MP
Data Center
PM843 SATA III - 6Gb/s 2.5" 7mmT SF-8223 3-bit MLC No
120GB MZ7TD120HAFV-000DA MP
240GB MZ7TD240HAFV-000DA MP
480GB MZ7TD480HAGM-000DA MP
SM843 SATA III - 6Gb/s 2.5" 7mmT SF-8223 2-bit MLC No
120GB MZ7PD120HAFV-000DA MP
240GB MZ7PD240HAFV-000DA MP
480GB MZ7PD480HAGM-000DA MP
SM843T SATA III - 6Gb/s 2.5" 7mmT SF-8223 2-bit MLC Yes
120GB MZ7WD120HAFV-00003 MP
240GB MZ7WD240HAFV-00003 MP
480GB MZ7WD480HAGM-00003 MP
960GB MZ7WD960HAGP-00003 MP
Storage
Enclosure SM1625 SAS Gen 2.0 - 6Gb/s 2.5" 15mmT SFF-8482 2-bit E-MLC Yes
100GB MZ6ER100HAFV-00003 MP
200GB MZ6ER200HAGM-00003 MP
400GB MZ6ER400HAGL-00003 MP
800GB MZ6ER800HAGL-00003 MP
eMMC-PRO (HIGH PERFORMANCE)
Density Flash MMC Class Part Number Seq R/W
Perf (MB/s)
Random
R/W IOPS
Package Size
(mm) C/S
16GB 64Gb*2 4.5 1500 KLMAG2GE2A-A001 140/40 3500/1100 12x16x1.0 MP
32GB 64Gb*4 4.5 1500 KLMBG4GE2A-A001 140/50 3500/1500 12x16x1.0 MP
64GB 64Gb*8 4.5 1500 KLMCG8GE2A-A001 140/50 3500/1500 12x16x1.2 MP
128GB 64Gb*16 4.5 1500 KLMDGAGE2A-A001 140/50 3500/1500 12x16x1.6 MP
MAINSTREAM eMMC
Density Flash MMC Class Part Number Seq R/W
Perf (MB/s)
Random
R/W IOPS
Package Size
(mm) C/S
4GB 32Gb*1 4.41 100 KLM4G1YE4C-B001 60/6 2000/100 11.5x13x1.0 MP
8GB 64Gb*1 4.41 100 KLM8G1WE4A-A001 60/6 2000/100 12x16x1.0 MP
16GB 64Gb*2 4.41 400 KLMAG2WE4A-A001 80/10 2500/260 12x16x1.0 MP
32GB 64Gb*4 4.41 400 KLMBG4WE4A-A001 80/22 2500/400 12x16x1.0 MP
64GB 64Gb*8 4.41 400 KLMCG8WE4A-A001 80/22 2500/400 12x16x1.2 MP
INDUSTRIAL CARDS
Density Part Number Sequential Reads Sequential Writes
8GB MMCAF08G3ACA-QMWCV 24 MB/s 16MB/s
16GB MMCAF16GWACA-QMWCV 24 MB/s 21MB/s
Please contact your local Samsung sales representative for part numbers and latest product offerings.
samsung.com/ash 151H 2013
FLASH - SSD
1. Memory (K)
2. NAND Flash : 9
3. Small Classification
(SLC : Single Level Cell, MLC : Multi Level Cell)
7 : SLC eMMC
8 : MLC eMMC
F : SLC Normal
G : MLC Normal
H : MLC QDP
K : SLC DDP
L : MLC DDP
M : MLC DSP
N : SLC DSP
P : MLC 8 Die Stack
Q : SLC 8 Die Stack
S : SLC Single SM
T : SLC SINGLE (S/B)
U : 2 Stack MSP
W : SLC 4 Die Stack
4~5. Density
12 : 512M
56 : 256M
1G : 1G
2G : 2G
4G : 4G
8G : 8G
AG: 16G
BG: 32G
CG: 64G
DG : 128G
EG : 256G
LG : 24G
NG : 96G
ZG : 48G
00 : NONE
6~7. Organization
00 : NONE
08 : x8
16 : x16
8. Vcc
A : 1.65V~3.6V B : 2.7V (2.5V~2.9V)
C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V)
E : 2.3V~3.6V R : 1.8V (1.65V~1.95V)
Q : 1.8V (1.7V~1.95V) T : 2.4V~3.0V
U : 2.7V~3.6V V : 3.3V (3.0V~3.6V)
W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE
9. Mode
0 : Normal
1 : Dual nCE & Dual R/nB
3 : Tri/CE & Tri R/B
4 : Quad nCE & Single R/nB
5 : Quad nCE & Quad R/nB
9 : 1st block OTP
A : Mask Option 1
L : Low grade
10. Generation
M : 1st Generation
A : 2nd Generation
B : 3rd Generation
C : 4th Generation
D : 5th Generation
11. ----
12. Package
A : COB
B : FBGA (Halogen-Free, Lead-Free)
C : CHIP BIZ D : 63-TBGA
F : WSOP (Lead-Free) G : FBGA
H : TBGA (Lead-Free)
I : ULGA (Lead-Free) (12*17)
J : FBGA (Lead-Free)
L : ULGA (Lead-Free) (14*18)
M : TLGA N : TLGA2
P : TSOP1 (Lead-Free)
Q : TSOP2 (Lead-Free)
S : TSOP1 (Halogen-Free, Lead-Free)
T : TSOP2 U : COB (MMC)
V : WSOP W : Wafer
Y : TSOP1 Z : WELP (Lead-Free)
13. Temp
C : Commercial I : Industrial
0 : NONE (Containing Wafer, CHIP, BIZ, Exception
handling code)
14. Customer Bad Block
B : Include Bad Block
D : Daisychain Sample
L : 1~5 Bad Block
N : ini. 0 blk, add. 10 blk
S : All Good Block
0 : NONE (Containing Wafer, CHIP, BIZ, Exception
handling code)
15. Pre-Program Version
0 : None
Serial (1~9, A~Z)
FLASH PRODUCTS ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
K 9 X X X X X X X X - X X X X
SAMSUNG Memory
NAND Flash
Small Classication
Density
Density
Organization
Organization
Vcc
Pre-Program Version
Customer Bad Block
Temp
Package
---
Generation
Mode
samsung.com/mcp
16 1H 2013Multi-Chip Packages
Samsung has a vast portfolio of eMCP products for a variety of solutions, such as mobile phones,
PMPs, and tablet computers. The following illustration shows Samsung's lineup of eMCP memory
solutions, which can be deployed in almost any application.
ROM
64GB
32GB
16GB
8GB
4GB
2GB
eMCP = eMMC + LPDDR1 or LPDDR2 or LPDDR3
256M 512M 1G 2G 4G 8G 12G 16G 20G RAM
Samsung eMCP product suite with different densities and types of
Mobile DRAM and eMMC
MCP
samsung.com/mcp 17
1H 2013 Multi-Chip Packages
eMCP: eMMC + LPDDR2
Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package
eMMC & MDRAM
4GB 4Gb 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
8GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
16GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
32GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
64GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 186FBGA 12x16mm
eMCP: eMMC + LPDDR3
Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package
eMMC & MDRAM
4GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
8GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
16GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
eMCP: eMMC + MDDR
Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package
eMMC & MDRAM
4GB 2Gb*2 (x32, 2CS/CKE) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm
8GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm
16GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm
32GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm
64GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA 12x16mm
18 1H 2013SSDs samsung.com/ash-ssd
SAMSUNG SOLID STATE DRIVES
STANDARD DATA
CENTER SERIES
Read-Intensive
Environments
PRO DATA
CENTER SERIES
High-Read and
Write Environments
DELUXE
ENTERPRISE SERIES
High-Write
Environments
Samsung PM843 Samsung SM843 Samsung SM1625
Form Factor 2.5 inches 2.5 inches 2.5 inches
Capacity (GB) 120/240/480 120/240/480 100/200/400/800
Host Interface Serial ATA 3 (6 Gb/s) Serial ATA 3 (6 Gb/s) SAS (6 Gb/s)
MTBF 1.5 Million Hours 2,000,000 hours 2,000,000 hours
Uncorrectable Bit
Error Rate (UBER) 1x1016 1x1017 1x1017
Power Consumption (Active) 4.2W 3.4W 9W
Power Consumption (Idle) 300 mW 300 mW 4W
Random Read Up to 60,000 IOPS Up to 70,000 IOPS Up to 101,000 IOPS
Random Write Up to 2,500 IOPS Up to 11,500 IOPS Up to 38,000 IOPS
Random Terabytes
Written (TBW) Up to 320 TBW Up to 1,060 TBW
Up to 1 WPD*
Up to 10,200 TBW
Up to 10 WPD*
Sequential Read Up to 520 MB/s Up to 530 MB/s Up to 925 MB/s
Sequential Writes Up to 330 MB/s Up to 420 MB/s Up to 595 MB/s
Sequential Terabytes
Written (TBW) Up to 1,280 TBW Up to 4,200 TBW
Up to 5 WPD*
Up to 26,500 TBW
Up to 18 WPD*
Physical Dimensions 100 x 70 x 7mm 100 x 70 x 7mm 100 x 70 x 15mm
Weight 60g 56g 169g
*WPD = Drive Writes Per Day for 5 Years
Which SSD is right for you?
For more information, email: SSD@ssi.samsung.com
19
1H 2013
STORAGE
SSDs & OPTICAL DISC DRIVES
DVD-W H/H
Interface Speed Type Loading Lightscribe Model
SATA DVD Write 24X H/H Tray X SH-224BB
DVD-W SLIM
Interface Speed Type Loading Lightscribe Model
SATA DVD Write 8X Slim Tray X SN-208BB
SN-208DB
DVD-W SLIM EXTERNAL
Interface Speed Type Loading Lightscribe Model
USB 2.0 DVD Write 8X Ultra Slim Tray X SE-218BB
Slim Tray X SE-208DB
BLU-RAY SLIM
Interface Speed Type Loading Lightscribe Model
SATA BD Combo 6X Slim Tray X SN-406AB
BD Writer 6X Slim Tray X SN-506BB
BLU-RAY WRITER SLIM EXTERNAL
Interface Speed Type Loading Lightscribe Model
USB 2.0 BD Writer 6X Slim Tray X SE-506AB
SE-506BB
SOLID STATE DRIVES (SSD)
Drive Type Drive Name Interface Form Factor Connector Component Power-loss
Protection Density Part Number Status
Client PC/
Embedded
PM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 3-bit MLC No
128GB MZMTD128HAFV-00000 MP
256GB MZMTD256HAGM-00000 MP
512GB MZMTD512HAGL-00000 MP
SM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 2-bit MLC No
128GB MZMPD128HAFV-00000 MP
256GB MZMPD256HAGM-00000 MP
512GB MZMPD512HAGL-00000 MP
Data Center
PM843 SATA III - 6Gb/s 2.5" 7mmT SF-8223 3-bit MLC No
120GB MZ7TD120HAFV-000DA MP
240GB MZ7TD240HAFV-000DA MP
480GB MZ7TD480HAGM-000DA MP
SM843 SATA III - 6Gb/s 2.5" 7mmT SF-8223 2-bit MLC No
120GB MZ7PD120HAFV-000DA MP
240GB MZ7PD240HAFV-000DA MP
480GB MZ7PD480HAGM-000DA MP
SM843T SATA III - 6Gb/s 2.5" 7mmT SF-8223 2-bit MLC Yes
120GB MZ7WD120HAFV-00003 MP
240GB MZ7WD240HAFV-00003 MP
480GB MZ7WD480HAGM-00003 MP
960GB MZ7WD960HAGP-00003 MP
Storage
Enclosure SM1625 SAS Gen 2.0 - 6Gb/s 2.5" 15mmT SFF-8482 2-bit E-MLC Yes
100GB MZ6ER100HADD-00003 MP
200GB MZ6ER200HAFV-00003 MP
400GB MZ6ER400HAGL-00003 MP
800GB MZ6ER800HAGL-00003 MP
samsung.com/ash-ssd samsungodd.com
samsungdisplay.com
20 1H 2013DID PRODUCT CLASSIFICATION
DID Product Classification
E-DID: Exclusive DID
NARROW
» Narrow
» Black Bezel
LANDSCAPE/PORTRAIT CONVERTIBLE
WALL-MOUNTED
» Thin/Light
» (Edge LED)
OUTDOOR: HIGH LUMINANCE
» 1500 – 2000nit
SUPER NARROW
LARGE FORMAT DISPLAY
» 70”/82”
P-DID: Performance DID
B-DID: Basic DID
Why DID Instead of TV?
Commercial (DID) Consumer (TV)
Warranty 18 months to 2 years 90 days to 1 year
Reliability
Designed for continuous use in different environments
Turned on for 20 hours +
Variety of temperatures & location
Designed for in-home use in controlled environment
Turned on for 6-8 hours
In-home living room
Picture Quality
Designed for PC signals
LCD backlight covers a wider color spectrum necessary for PC source
integration giving better picture quality
Designed for TV signals
Location Can be oriented in either portrait or landscape mode Can only be oriented in landscape mode
Product Segmentation
Type Abbr Warranty Bezel Suggested
Run Time Brightness Usage Applications Pricing
E-DID Exclusive 2 years Narrow and
Super Narrow 20 hours + 450 to 1500 nits Heavy Outdoor, Video Walls High-value commercial range
P-DID Performance 2 years Narrow 20 hours + 600/700 nits Medium Semi-Outdoor Mid-price range
B-DID Basic 18 months Normal 12 hours 450 nits Light Indoor, e-Board High-value commercial range
Product Segmentation
HEAVY USE
LIGHT USE
E-DID: Exclusive
» All features of P-DID plus
» Specialty: SNB,
High Brightness
» Robust design
P-DID: Performance
» All features of B-DID plus
» Narrow & Black Bezel
» Typ. Brightness: 700 (cd/m2)
B-DID: Basic
» Landscape/Portrait
» High reliability
» Pol. (Haze 44%)
» Long lifetime: more than 2 years
Professional Outdoor Events Billboard
• Control Room
• Simulation
• Scoreboard
• Sports Broadcasting
• Billboard
Entertainment Transportation Communication Rental
• Casino
• Theatre
• Poster
• Menu
• Airport
• Train/Bus Station
• Conference Room • Rental
• Staging
Commercial Education
• Kiosk
• Mart Board
• E-Board
DISPLAYS
samsungdisplay.com 21
1H 2013 DID PANEL LINEUP
SAMSUNG DIGITAL INFORMATION DISPLAY (DID) PANEL LINEUP
Type Current
Model Size Model
resolution Bezel Backlight Brightness
(typical)
Contrast
Ratio
Response
Time Frequency MP* Comment High TNI
85°C
E-DID
LTI216XM01 21.6" 960x960 Super
narrow D-LED 450 nits 4,000:1 8ms 60Hz Now Square panel Yes
LTI460HN03 46" FHD Narrow +
Black CCFL 1500 nits 3,000:1 8ms 60Hz Ltd
Avail.
High Bright, Hi Temp
LC, 1/4λ Pol. Yes
LTI460HN01 46" FHD Super
narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to
Active, LED Yes
LTI460HN07 46" FHD Super
narrow D-LED 450 nits 3,000:1 8ms 60Hz Now 5.7mm Active to
Active, LED Yes
LTI460AA05 46" HD Super
narrow CCFL 450 nits 4,000:1 8ms 60Hz Ltd
Avail.
7.3mm Active to
Active
LTI550HN01 55" FHD Super
narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to
Active, LED Yes
LTI550HN05 55" FHD Super
narrow D-LED 450 nits 3,000:1 8ms 60Hz Now 5.7mm Active to
Active, LED Yes
P-DID
LTI400HA08 40" FHD Narrow +
Black CCFL 700 nits 3,000:1 8ms 60Hz Now Yes
LTI400HA10 40" FHD Narrow E-LED 700 nits 3,000:1 8ms 60Hz Now LED Yes
LTI460HN05 46" FHD Narrow +
Black CCFL 700 nits 3,500:1 8ms 60Hz Now Yes
LTI460HN08 46" FHD Narrow E-LED 700 nits 4,000:1 8ms 60Hz Feb.
'13 LED Yes
LTI550HN03 55" FHD Narrow CCFL 700 nits 4,000:1 8ms 60Hz Now Yes
LTI550HN06 55" FHD Narrow E-LED 700 nits 4,000:1 8ms 60Hz Now Yes
LTI700HD01 70" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Ltd
Avail.
LTI820HT-L01 82" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Ltd
Avail.
B-DID
LTI460HN04-N 46" FHD Normal CCFL 450 nits 3,000:1 8ms 60Hz Ltd
Avail. Yes
LTI550HN02 55" FHD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now Yes
LTI700HA02 70" FHD Normal E-LED 400 nits 4,000:1 8ms 60Hz Now E-Board; Landscape
mode only
LTI820HD03 82" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape
mode only
Transparent
LTI460AP01 46" HD Narrow Transparent/
No BLU 4,500:1 8ms 60Hz Now
LTI220MT02 46" WSXGA+ Narrow Transparent/
No BLU 5,000:1 5ms 60Hz Now LVDS Input
samsungdisplay.com
22 1H 2013TABLETS & MONITORS
TABLETS
Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness
(nits) MP
7" LTN070AL01 PLS WXGA 1280 800 16:10 216 400 Now
10.1" LTL101AL02 PLS WXGA 1280 800 16:10 149 400 Now
MONITORS
Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness
(nits) MP
23"
LTM230HT10 TN FHD 1920 1080 16:9 96 300 Now
LTM230HL01 PLS FHD 1920 1080 16:9 96 300 Now
27"
LTM270HT03 TN FHD 1920 1080 16:09 82 300 Now
LTM270DL02 PLS QHD 2560 1440 16:09 109 300 Now
LTM270DL03 PLS FHD 1920 1080 16:09 82 350 Apr. '13
samsung.com/us/oem-solutions 23
1H 2013
CONTACTS
CONTACTS
Representatives
Name Location Phone
Adelsa Ciudad Juarez 52-656-613-3517
Adelsa Monterrey 52-818-214-0011
Adelsa Mexico City (HQ) 52-555-560-5002
Adelsa Guadalajara 52-333-122-3054
ATMI Washington 425-869-7636
ATMI Oregon 503-643-8307
Bear/VAI Ohio 440-526-1991
Bear/VAI Western PA 440-526-1991
Bear/VAI Indiana/Kentucky 440-832-7637
Bear/VAI Michigan 440-526-1991
Bestronics Vista 760-598-8500
Core Illinois 847-843-8888
Core Wisconsin 414-791-1666
Crestone Colorado 303-280-7202
Crestone Utah 303-280-7202
Customer 1st Iowa 319-393-1351
Customer 1st Kansas 913-390-9119
Customer 1st Minnesota 952-851-7909
Digit-Tech Sales Sao Paulo, Brazil 5511-3165-2218
Digit-Tech Sales Puerto Rico 787-892-4260
Digit-Tech Sales Miami (export) 305-591-2400
Name Location Phone
Infinity Sales Los Angeles 818-880-6480
Infinity Sales Orange County 714-669-8520
InTELaTECH Calgary 905-629-0082
InTELaTECH Montreal 905-629-0082
InTELaTECH Ottawa 905-629-0082
InTELaTECH Toronto 905-629-0082
I-Squared San Jose 408-988-3400
I-Squared Petaluma 707-773-3108
Neptune Electr. (NECCO) NY, PA, MD 631-234-2525
New Elpis (LCD) Ontario 905-275-3516
New Tech Solutions Massachusetts 781-229-8888
New Tech Solutions CT/NY 585-204-2183
Rep One Associates Alabama 256-539-7371
Rep One Associates Charlotte, NC 704-846-5744
Rep One Associates Georgia 770-209-9242
Rep One Associates Raleigh, NC 919-424-3804
Rep One Associates Florida 256-539-7371
Summit Sales Phoenix/El Paso 480-998-4850
West Associates Dallas 972-680-2800
West Associates Austin 512-343-1199
West Associates Houston 512-538-2810
Distributors
Company Name Location Contact
Edge Electronics, Inc.
Headquarters
75 Orville Dr., Unit 2
Bohemia, NY 11716
Phone: 800.647.EDGE (3343)
Fax: 631.471.3405
www.edgeelectronics.com
Email: edge@edgeelectronics.com
Avnet, Inc.
Phoenix, Arizona Headquarters
2211 South 47th Street
Phoenix, AZ 85034
www.avnet.com
For sales inquiries: (800) 332-8638 www.avnetexpress.com
WPG Americas Inc.
Corporate Office
5285 Hellyer Avenue Suite 150
San Jose, CA 95138
Tel 408-392-8100
Tel 888-WPG-8881
Fax 408-436-9551
www.wpgamericas.com
For sales inquiries: inquiry@wpgamericas.com
Arrow Electronics, Inc.
Corporate Headquarters
Corporate Headquarters
7459 S. Lima Street
Englewood, CO 80112-5816
Phone: (303) 824-4000
www.arrow.com
For sales inquiries:
www.arrownac.com/onlinesales@arrow.com/(800) 833-3557
For all product information please visit: samsung.com/us/oem-solutions
Feel free to contact your local distributor or sales representative with any Samsung sales inquiries.
CONTACTS
To access our online sales portal, visit: https://smarttools.ssi.samsung.com
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of
publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences
resulting from the use of the information contained herein. Samsung reserves the right to make changes in its
products or product specications with the intent to improve function or design at any time and without notice and is
not required to update this documentation to reect such changes. This publication does not convey to a purchaser of
semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes
no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does
Samsung assume any liability arising out of the application or use of any product or circuit and specically disclaims
any and all liability, including without limitation any consequential or incidental damages.
Samsung Semiconductor, Inc.
3655 North First Street
San Jose, CA 95134-1713
samsung.com/us/oem-solutions
Copyright 2013. Samsung and Samsung
Semiconductor, Inc. are registered trademarks
of Samsung Electronics, Co., Ltd. All other names
and brands may be claimed as the property of
others. The appearance of all products, dates,
gures, diagrams and tables are subject to change
at any time, without notice.
BR-13-ALL-001 | Printed 02/13
MEMORY
DRAM
Flash
SRAM
MCP
SYSTEM LSI
ASICs
APs
Display Drivers
Imaging ICs
Foundry
STORAGE
Solid State Drives
Optical Disc Drives
DISPLAYS
Monitors
Smartphones
Tablets
TVs
