PRODUCT SELECTION GUIDE Displays, Memory and Storage 1H 2013 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers--from ultra-mobile notebooks to powerful servers--and in a wide range of handheld devices such as smartphones and tablets. Samsung also delivers the industry's widest line of storage products from the consumer to the enterprise level. These include optical disk drives as well as flash storage, such as Solid State Drives, and a range of embedded and removable flash storage products. Markets DRAM Mobile/Wireless SSD FLASH ASIC LOGIC TFT/LCD N/A Notebook PCs/ Ultrabooks Desktop PCs/ Workstations Servers Networking/ Communications Consumer Electronics samsung.com/us/oem-solutions N/A N/A ODD DRAM Pages 4-12 * * * * DDR4 SDRAM DDR3 SDRAM DDR2 SDRAM DDR SDRAM DRAM samsung.com/dram * Mobile DRAM * Graphics SDRAM * DRAM Ordering Information FLASH - SSD Pages 13-15 samsung.com/flash * * * * SLC Flash MLC Flash SD and microSD Cards eMMC * Solid State Drives (SSD) * Flash Product Ordering Information * Industrial Cards MULTI-CHIP PACKAGE Page 16-17 samsung.com/mcp * eMMC + LPDDR2 * eMMC + LPDDR3 * eMMC + MDDR storage Pages 18-19 samsung.com/flash-ssd * Solid State Drives samsungodd.com * Optical Disc Drives Displays Pages 20-22 samsungdisplay.com * Exclusive Digital Information Display (E-DID) * Performance Digital Information Display (P-DID) * Basic Digital Information Display (B-DID) * Tablets * Ultrabooks/PCs * Monitors CONTACTs Page 23 samsung.com/us/oem-solutions * Sales Representatives and Distributors samsung.com/dram 1H 2013 * To access our online sales portal, visit: https://smarttools.ssi.samsung.com 3 DDR4 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 8GB 16GB 1.2V 1.2V 1Gx 72 2Gx72 M393A1G40DB0-C(NA/QB) 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip 1866/2133 3Q'13 M393A2G40DB0-C(NA/QB) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1866/2133 1 2 Notes: 3Q'13 Register is not fixed yet NA = DDR4-1866 (14-14-14), QB = DDR4-2133(16-16-16) DDR4 SDRAM LOAD REDUCED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 32GB 1.2V 4Gx 72 M386A4GDP0-C(NA/QB) 4Gb MDP (2Gx4) * 36 Lead Free & Halogen Free 1866/2133 4 4Q'13 Notes: Register is not fixed yet NA = DDR4-1866 (14-14-14), QB = DDR4-2133(16-16-16) DDR3 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance 1GB M393B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M393B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now 2GB 4GB 1.5V 1.5V 1.5V 128Mx72 256Mx72 512Mx72 1.5V 1Gx72 16GB 1.5V 2Gx72 8GB 1.5V 1Gx72 16GB 1.5V 2Gx72 32GB 1.5V 4Gx72 2GB 4GB 8GB 16GB 8GB 1.35V 1.35V 1.35V 1.35V 1.35V 256Mx72 512Mx72 1Gx72 2Gx72 1Gx72 M393B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M393B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B5170GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M393B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M393B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B1K73CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-C(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-C(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G73BH0-C(F8/H9)(08/09) Lead Free & Halogen Free 1066/1333 4 Now 4Gb (512M x8) * 36 M393B4G70BM0-C(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333 1 Now 1066/1333/1600 M393B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x4) * 9 Lead Free & Halogen Free M393B5173GB0-Y(F8/H9)(08/09) 1Gb (128M x8) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333 1 Now 4 Now M393B5170GB0-Y(F8/H9/K0)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 2 Now M393B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 2 Now 1066/1333 M393B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1K73CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-Y(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-Y(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now 16GB 1.35V 2Gx72 32GB 1.35V 4Gx72 Notes: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register 09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13) * K0 (1600Mbps) available in ES only 4 Ranks Production M393B5773CH0-C(F8/H9)(04/05) M393B5270CH0-C(F8/H9)(04/05) 8GB Speed (Mbps) M393B2G73BH0-Y(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70BM0-Y(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now DDR4 & DDR3 SDRAM H9 = DDR3-1333 (9-9-9) 1H 2013 08 = IDT A1 K0 = DDR3-1600 (11-11-11) samsung.com/dram samsung.com/dram Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 16GB 1.35V 2Gx72 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1333 4 Now 32GB 1.35V/1.5V 4Gx72 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1333/1600/1866 4 2Q'13 64GB 1.35V/1,5V 8Gx72 M386B2K70DM0-YH90 M386B4G70BM0-YK0(3/4)/ CMA(3/4) M386B8G70BO0-YH94/CK04 4Gb QDP (4G x4) * 36 Lead Free & Halogen Free 1333/1600 8 2Q'13 Notes: 0 = Inphi iMB GS02A 3 = Inphi iMB GS02B 4 = Montage C1 DDR3 SDRAM VLP REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance 1GB 1.5V M392B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M392B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5773CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B5270CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1K73CM0-C(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K73DM0-C(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-C(F8/H9)(04/05) 2GB 4GB 8GB 1.5V 1.5V 1.5V 128Mx72 256Mx72 512Mx72 1Gx72 16GB 1.5V 2Gx72 2GB 1.35V 256Mx72 4GB 8GB 16GB 1.35V 1.35V 512Mx72 1Gx72 1.35V 2Gx72 32GB 1.35V 4Gx72 Notes: 04 = IDT B0 register 05 = Inphi C0 register 08 = IDT A1 09 = Inphi UV GS02 samsung.com/dram Speed (Mbps) Ranks Production 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-C(F8/H9/K0/MA)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B2G70BM0-C(F8/H9/K0/MA)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B2G73BM0-C(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B1K73CM0-Y(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K73DM0-Y(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-Y(F8/H9/K0)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B2G70BM0-Y(F8/H9/K0)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B2G70BM0-Y(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B4G70BE0-Y(F8/H9)(08) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free 1066/1333 4 Now F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) 1H 2013 DDR3 SDRAM 5 DRAM DDR3 SDRAM Load Reduced REGISTERED MODULES DDR3 SDRAM UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 0.0625 in 1.5V 128Mx64 M378B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M378B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M378B5773CH0-C(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now M378B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M378B5273CH0-C(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now M378B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M378B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 8GB 1.5V 1024Mx64 DDR3 SDRAM UNBUFFERED MODULES (ECC) Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 0.0625 in 1.5V 128Mx72 M391B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M391B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 18 Lead Free & Halogen Free,Flip Chip 1066/1333/1600/1866 2 Now M391B5773CH0-C(F8/H9) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M391B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M391B5273CH0-C(F8/H9) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M391B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M391B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M391B2873GB0-Y(F8/H9/K0) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 1 Now M391B5673GB0-Y(F8/H9/K0) 1Gb (128M x8) * 18 Lead Free & Halogen Free,Flip Chip 1066/1333/1600 2 Now M391B5773CH0-Y(F8/H9) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M391B5773DH0-Y(F8/H9/K0) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M391B5273CH0-Y(F8/H9) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M391B5273DH0-Y(F8/H9/K0) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M391B1G73BH0-Y(F8/H9/K0) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now 2GB 1.5V 256Mx72 4GB 1.5V 512Mx72 8GB 1.5V 1024Mx72 1GB 2GB 1.35V 1.35V 128Mx72 256Mx72 4GB 1.35V 512Mx72 8GB 1.35V 1024Mx72 NOTES: 6 F8 = DDR3-1066 (7-7-7) DDR3 SDRAM H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) 1H 2013 samsung.com/dram Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx64 M471B2873GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M471B5673GB0-C(F8/H9/K0/MA) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M471B5773CHS-C(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now M471B5773DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M471B5273CH0-C(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now M471B5273DH0-C(F8/H9/K0/MA) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 M471B5173BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 8 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now 8GB 1.5V 1024Mx64 M471B1G73BH0-C(F8/H9/K0/MA) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 1GB 1.35V 128Mx64 M471B2873GB0-Y(F8/H9/K0) 1Gb (128M x8) * 8 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M471B5673GB0-Y(F8/H9/K0) 1Gb (128M x8) * 16 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 2 Now M471B5773CHS-Y(F8/H9) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333 1 Now M471B5773DH0-Y(F8/H9/K0) 2Gb (256M x8) * 8 Lead Free & Halogen Free 1066/1333/1600 1 Now M471B5273CH0-Y(F8/H9) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333 2 Now M471B5273DH0-Y(F8/H9/K0) 2Gb (256M x8) * 16 Lead Free & Halogen Free 1066/1333/1600 2 Now M471B5173BH0-Y(F8/H9/K0) 4Gb (512M x8) * 8 Lead Free & Halogen Free 1066/1333/1600 1 Now M471B1G73BH0-Y(F8/H9/K0) 4Gb (512M x8) * 16 Lead Free & Halogen Free 1066/1333/1600 2 Now 2GB 4GB 1.35V 1.35V 256Mx64 512Mx64 8GB 1.35V Notes: F8 = DDR3-1066 (7-7-7) 1024Mx64 H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM ECC SODIMM MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Register Rank Production 2GB 1.35V 256Mx64 M474B5773DH0-YH9/K0 2Gb x8*9 Lead Free & Halogen Free 1333/1600 1 Now 4GB 1.35V 512Mx64 M474B5273DH0-YH9/K0 2Gb x8*18 Lead Free & Halogen Free 1333/1600 2 Now M474B5173BH0-YH9/K0 4Gb x8*9 Lead Free & Halogen Free 1333/1600 1 Now M474B1G73BH0-YH9/K0 4Gb x8*18 Lead Free & Halogen Free 1333/1600 2 8GB 1.35V Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) samsung.com/dram 1024Mx64 F7 = PC2-6400 (DDR2-800 @ CL=6) 1H 2013 E7 = PC2-6400 (DDR2-800 @ CL=5) Now Voltage = 1.8V DDR3 & DDR2 SDRAM 7 DRAM DDR3 SDRAM SODIMM MODULES DDR3 SDRAM COMPONENTS Density Voltage Organization Part Number # Pins-Package Compliance Speed (Mbps) Dimensions Production K4B1G0446F-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0446G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 7.5x11mm Now 128M x8 K4B1G0846G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 7.5x11mm Now 128M x16 K4B1G1646G-BC(F8/H9/K0/ MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866/2133 7.5x13.3mm Now K4B2G0446C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0446D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now K4B2G0846C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now K4B2G1646C-HC(F8/H9/K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x13.3mm Now K4B2G1646E-BC(F8/H9/K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x13.3mm Now 1G x4 K4B4G0446B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now 512M x8 K4B4G0846B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now K4B1G0446F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0446G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now K4B1G0846F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0846G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now K4B2G0446C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0446D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B4G0446B-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x11mm Now K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) NB = DDR3-2133 (14-14-14) 256M x4 1Gb 1.5V 512M x4 2Gb 1.5V 256M x8 128M x16 4Gb 1.5V 1.35V 256M x4 1Gb 1.35V 128M x8 512M x4 2Gb 1.35V 256M x8 4Gb 1.35V 1G x4 NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) * MA, and NB are available in ES only DDR2 SDRAM COMPONENTS Density 256Mb 512Mb 1Gb Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production 16Mx16 K4T56163QN-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 128M x4 K4T51043QJ-HC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 64M x8 K4T51083QJ-HC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 32M x16 K4T51163QJ-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 256M x4 K4T1G044QF-BC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 128M x8 K4T1G084QF-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 64M x16 K4T1G164QF-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now DDR SDRAM COMPONENTS Density Organization 128Mx4 512Mb 64Mx8 Part Number # Pins - Package Speed (Mbps) K4H510438J-LCB3/B0 66-TSOP 266/333 K4H510438J-BCCC/B3 60-FBGA 333/400 K4H510838J-LCCC/B3 66-TSOP 333/400 K4H510838J-BCCC/B3 60-FBGA 333/400 32Mx16 K4H511638J-LCCC/B3 66-TSOP 333/400 Notes: B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3) 8 DDR2, DDR & SDRAM COMPONENTS 1H 2013 samsung.com/dram Density Type Organization Part Number Package Power Production 32Mx16 K4X51163PK-FGD8 60-FBGA, 200MHz 1.8V Now 16Mx32 K4X51323PK-8GD8 90-FBGA, 200MHz 1.8V Now 32Mx32 K4X1G323PF-8GD8 90-FBGA, 200MHz 1.8V Now 2Gb 64Mx32 K4X2G323PD-8GD8 90-FBGA, 200MHz 1.8V Now 4Gb x32 (2CS, 2CKE) K4X4G303PD-AGD8 168-FBGA, 12x12 PoP, DDP, 200MHz 1.8V Now 2Gb 1CH x32 K4P2G324ED-AGC1 168-FBGA, 12x12 PoP, MONO, 800Mbps 1.2V Now 1CH x32 K4P4G324EB-AGC2 168-FBGA, 12x12 PoP, MONO, 1066Mbps 1.2V Now 2CH x32 K3PE4E400P-XGC2 216FBGA,12x12 PoP, DDP, 1066Mbps 1.2V Now 2CH x32 K3PE4E400D-XGC2 220FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now 2CH x32 K3PE4E400K-XGC2 240-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now 1CH x32 K4P8G304EB-FGC2 134-FBGA, 11x11.5 , DDP, 1066Mbps 1.2V Now 1CH x32 K4P8G304EB-AGC1 168-FBGA, 12x12 PoP, DDP, 800Mbps 1.2V Now 2CH x32 K4P8G304EB-GGC2 216FBGA, 12x12 PoP, DDP, 1066Mbps 1.2V Now 2CH x32 K3PE7E700M-XGC2 216-FBGA, 12x12 PoP, DDP, 1066Mbps 1.2V Now 2CH x32 K3PE7E700D-XGC2 220-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now 2CH x32 K3PE7E700A-XGC2 240-FBGA, 14x14 PoP, DDP, 1066Mbps 1.2V Now 1CH x32 K4PAG304EB-FGC2 134-FBGA, 11x11.5 , QDP, 1066Mbps 1.2V Now 2CH x32 K3PE0E000M-XGC2 216-FBGA, 12x12 PoP, QDP, 1066Mbps 1.2V Now 2CH x32 K3PE0E000A-XGC2 220-FBGA, 14x14 PoP, QDP, 1066Mbps 1.2V Now 2CH x32 K3PE0E000B-XGC2 240-FBGA, 14x14 PoP, QDP, 1066Mbps 1.2V Now 1CH x32 K4E4E324EB-EGCE 178-FBGA, 11x11.5 , MONO , 1600Mbps 1.2V CS 1CH x32 K4E8E304EB-EGCE 178-FBGA, 11x11.5 , DDP, 1600Mbps 1.2V CS 2CH x32 K3QF1F100B-PGCE 253-FBGA, 11x11.5 , DDP, 1600Mbps 1.2V CS 2CH x32 K3QF1F100G-XGCE 216-FBGA, 15x15 PoP , DDP, 1600Mbps 1.2V CS 1CH x32 K4E6E304EB-EGCE 178-FBGA, 11x11.5 , QDP, 1600Mbps 1.2V CS 2CH x32 K3QF2F200A-XGCE 253-FBGA, 11x11.5 , QDP, 1600Mbps 1.2V CS 2CH x32 K3QF2F200B-XGCE 216-FBGA, 15x15 PoP , QDP, 1600Mbps 1.2V CS 512Mb 1Gb MDDR 4Gb 8Gb LPDDR2 16Gb 4Gb 8Gb LPDDR3 16Gb DRAM MOBILE DRAM COMPONENTS GRAPHICS DRAM COMPONENTS Type Density Organization 2Gb 64Mx32 GDDR5 1Gb GDDR3 gDDR3 Notes: 32Mx32 Part Number Package VDD/VDDQ Speed Bin (MHz) Production K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 1250/1500/1750 Now K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 1000/1250 Now K4G10325FG-HC03 170-FBGA 1.6V/1.6V 1500 Now K4G10325FG-HC(05/04) 170-FBGA 1.5V/1.5V 1000/1250 Now K4G10325FG-HC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now 1Gb 32Mx32 K4J10324KG-HC(14/1A) 136-FBGA 1.8V/1.8V 700/1000 Now 4Gb 256Mx16 K4W4G1646B-HC(12/11/1A) 96-FBGA 1.5V/1.5V 800/933/1066 Now 2Gb 128Mx16 K4W2G1646E-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now 1Gb 64Mx16 K4W1G1646G-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now Package (1) Speeds (clock cycle - speed bin) H: FBGA (Halogen Free & Lead Free) B: FBGA (Halogen Free & Lead Free) 03: 0.3ns (3000MHz) 04: 0.4ns (2500MHz) 05: 0.5ns (2000MHz) 5C: 0.555 (1800MHz) samsung.com/dram 1H 2013 08: 0.83ns (1200MHz) 1A: 1ns (1000MHz GDDR3) 1A: 1ns (1066MHz gDDR3) 11: 1.1ns (933MHz) 12: 1.25ns (800MHz) 14: 1.429ns (700MHz) 20: 2.0ns (500MHz) 25: 2.5ns (400MHz) Mobile & Graphics DRAM Components 9 COMPONENT DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization 1. Memory (K) 2. DRAM: 4 3. DRAM Type B: DDR3 SDRAM D: GDDR SDRAM G: GDDR5 SDRAM H: DDR SDRAM J: GDDR3 SDRAM M: Mobile SDRAM N: SDDR2 SDRAM S: SDRAM T: DDR SDRAM U: GDDR4 SDRAM V: Mobile DDR SDRAM Power Efficient Address W: SDDR3 SDRAM X: Mobile DDR SDRAM Y: XDR DRAM Z: Value Added DRAM 4. Density 10: 1G, 8K/32ms 16: 16M, 4K/64ms 26: 128M, 4K/32ms 28: 128M, 4K/64ms 32: 32M, 2K/32ms 50: 512M, 32K/16ms 51: 512M, 8K/64ms 52: 512M, 8K/32ms 54: 256M, 16K/16ms 55: 256M, 4K/32ms 56: 256M, 8K/64ms 62: 64M, 2K/16ms 64: 64M, 4K/64ms 68: 768M, 8K/64ms 1G: 1G, 8K/64ms 2G: 2G, 8K/64ms 4G: 4G, 8K/64ms 5. Bit Organization 02: x2 04: x4 06: x4 Stack (Flexframe) 07: x8 Stack (Flexframe) 10 DRAM Ordering Information 08: x8 15: x16 (2CS) 16: x16 26: x4 Stack (JEDEC Standard) 27: x8 Stack (JEDEC Standard) 30: x32 (2CS, 2CKE) 31: x32 (2CS) 32: x32 6. # of Internal Banks 2: 2 Banks 3: 4 Banks 4: 8 Banks 5: 16 Banks 7. Interface ( VDD, VDDQ) 2: LVTTL, 3.3V, 3.3V 4: LVTTL, 2.5V, 2.5V 5: SSTL-2 1.8V, 1.8V 6: SSTL-15 1.5V, 1.5V 8: SSTL-2, 2.5V, 2.5V A: SSTL, 2.5V, 1.8V F: POD-15 (1.5V,1.5V) H: SSTL_2 DLL, 3.3V, 2.5V M: LVTTL, 1.8V, 1.5V N: LVTTL, 1.5V, 1.5V P: LVTTL, 1.8V, 1.8V Q: SSTL-2 1.8V, 1.8V R: SSTL-2, 2.8V, 2.8V U: DRSL, 1.8V, 1.2V 8. Revision A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation F: 7th Generation G: 8th Generation H: 9th Generation I: 10th Generation J: 11th Generation K: 12th Generation M: 1st Generation N: 14th Generation Q: 17th Generation 1H 2013 9. Package Type DDR2 DRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA (Lead-free) DDR2 SDRAM Z: FBGA (Lead-free) J: FBGA DDP (Lead-free) Q: FBGA QDP (Lead-free) H: FBGA (Lead-free & Halogen-free) M: FBGA DDP (Lead-free & Halogen-free) E: FBGA QDP (Lead-free & Halogen-free) T: FBGA DSP (Lead-free & Halogen-free, Thin) DDR3 SDRAM Z: FBGA (Lead-free) H: FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA (Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA (Lead Free) H: FBGA (Hologen Free & Lead Free) E: 100 FBGA (Hologen Free & Lead Free) SDRAM L TSOP II (Lead-free & Halogen-free) N: STSOP II T: TSOP II U: TSOP II (Lead-free) V: sTSOP II (Lead-free) samsung.com/dram 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization XDR DRAM J: BOC(LF) P: BOC Mobile DRAM Leaded/Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X/Z: 54balls BOC Mono J/V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S/D: 90balls FBGA Monolithic (11mm x 13mm) F/H: Smaller 90balls FBGA Mono Y/P: 54balls CSP DDP M/E: 90balls FBGA DDP 10. Temp & Power - COMMON (Temp, Power) C: Commercial, Normal (0'C - 95'C) & Normal Power C: (Mobile Only) Commercial (-25 ~ 70'C), Normal Power J: Commercial, Medium L: Commercial, Low (0'C - 95'C) & Low Power L: (Mobile Only) Commercial, Low, i-TCSR F: Commercial, Low, i-TCSR & PASR & DS E: Extended (-25~85'C), Normal N: Extended, Low, i-TCSR G: Extended, Low, i-TCSR & PASR & DS I: Industrial, Normal (-40'C - 85'C) & Normal Power P: Industrial, Low (-40'C - 85'C) & Low Power H: Industrial, Low, i-TCSR & PASR & DS 11. Speed (Wafer/Chip Biz/BGD: 00) DDR SDRAM CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3) B3: DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3) *1 A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3) B0: DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3) Note 1: "B3" has compatibility with "A2" and "B0" samsung.com/dram DRAM COMPONENT DRAM ORDERING INFORMATION DDR2 SDRAM CC: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7: DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) DDR3 SDRAM F7: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) F8: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) G8: DDR3-1066 (533MHz @ CL=8, tRCD=8, tRP=8) H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) K0: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) MA: DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13) NB: DDR3-2133 (1067MHz @ CL=14, tRCD=14, tRP=14) Graphics Memory 18: 1.8ns (550MHz) 04: 0.4ns (2500MHz) 20: 2.0ns (500MHz) 05: 0.5ns (2000MHz) 22: 2.2ns (450MHz) 5C: 0.56ns (1800MHz) 25: 2.5ns (400MHz) 06: 0.62ns (1600MHz) 2C: 2.66ns (375MHz) 6A: 0.66ns (1500MHz) 2A: 2.86ns (350MHz) 07: 0.71ns (1400MHz) 33: 3.3ns (300MHz) 7A: 0.77ns (1300MHz) 36: 3.6ns (275MHz) 08: 0.8ns (1200MHz) 40: 4.0ns (250MHz) 1H 2013 09: 0.9ns (1100MHz) 45: 4.5ns (222MHz) 1 : 1.0ns (1000MHz) 50/5A: 5.0ns (200MHz) 1 : 1.1ns (900MHz) 55: 5.5ns (183MHz) 12: 1.25ns (800MHz) 60: 6.0ns (166MHz) 14: 1.4ns (700MHz) 16: 1.6ns (600MHz) SDRAM (Default CL=3) 50: 5.0ns (200MHz CL=3) 60: 6.0ns (166MHz CL=3) 67: 6.7ns 75: 7.5ns PC133 (133MHz CL=3) XDR DRAM A2: 2.4Gbps, 36ns, 16Cycles B3: 3.2Gbps, 35ns, 20Cycles C3: 3.2Gbps, 35ns, 24Cycles C4: 4.0Gbps, 28ns, 24Cycles DS: Daisychain Sample Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3 Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3 Note: All of Lead-free or Halogen-free product are in compliance with RoHS DRAM Ordering Information 11 Module DRAM Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X XX T XX X X X X X X XX X AMB Vendor Speed Temp & Power PCB Revision Package Component Revision SAMSUNG Memory DIMM Data bits DRAM Component Type Depth Number of Banks Bit Organization 1. Memory Module: M 2. DIMM Type 3: DIMM 4: SODIMM 3. Data bits 12: x72 184pin Low Profile Registered DIMM 63: x63 PC100/PC133 SODIMM with SPD for 144pin 64: x64 PC100/PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x64 Unbuffered DIMM with SPD for 144pin/168pin (Intel/JEDEC) 68: x64 184pin Unbuffered DIMM 70: x64 200pin Unbuffered SODIMM 71: x64 204pin Unbuffered SODIMM 74: x72/ECC Unbuffered DIMM with SPD for 168pin (Intel/JEDEC) 77: x72/ECC PLL + Register DIMM with SPD for 168pin (Intel PC100) 78: x64 240pin Unbuffered DIMM 81: x72 184pin ECC unbuffered DIMM 83: x72 184pin Registered DIMM 90: x72/ECC PLL + Register DIMM 91: x72 240pin ECC unbuffered DIMM 92: x72 240pin VLP Registered DIMM 93: x72 240pin Registered DIMM 95: x72 240pin Fully Buffered DIMM with SPD for 168pin (JEDEC PC133) 4. DRAM Component Type B: DDR3 SDRAM (1.5V VDD) L: DDR SDRAM (2.5V VDD) S: SDRAM T: DDR2 SDRAM (1.8V VDD) 5. Depth 9. Package 09: 8M (for 128Mb/512Mb) 17: 16M (for 128Mb/512Mb) 16: 16M 28: 128M 29: 128M (for 128Mb/512Mb) 32: 32M 33: 32M (for 128Mb/512Mb) 51: 512M 52: 512M (for 512Mb/2Gb) 56: 256M 57: 256M (for 512Mb/2Gb) 59: 256M (for 128Mb/512Mb) 64: 64M 65: 64M (for 128Mb/512Mb) 1G: 1G 1K: 1G (for 2Gb) 6. # of Banks in Comp. & Interface 1: 4K/64mxRef., 4Banks & SSTL-2 2 : 8K/64ms Ref., 4Banks & SSTL-2 2: 4K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 8K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 4Banks & SSTL-1.8V 6: 8Banks & SSTL-1.8V 7. Bit Organization 0: x 4 3: x 8 4: x16 6: x 4 Stack (JEDEC Standard) 7: x 8 Stack (JEDEC Standard) 8: x 4 Stack 9: x 8 Stack 8. Component Revision A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. M: 1st Gen. Q: 17th Gen. 12 DRAM Ordering Information E: FBGA QDP (Lead-free & Halogen-free) G: FBGA H: FBGA (Lead-free & Halogen-free) J: FBGA DDP (Lead-free) M: FBGA DDP (Lead-free & Halogen-free) N: sTSOP Q: FBGA QDP (Lead-free) T: TSOP II (400mil) U: TSOP II (Lead-Free) V: sTSOP II (Lead-Free) Z: FBGA (Lead-free) 10. PCB Revision 0: Mother PCB 1: 1st Rev 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. A: Parity DIMM S: Reduced PCB U: Low Profile DIMM 11. Temp & Power C: Commercial Temp. (0C ~ 95C) & Normal Power L: Commercial Temp. (0C ~ 95C) & Low Power 12. Speed CC: (200MHz @ CL=3, tRCD=3, tRP=3) D5: (266MHz @ CL=4, tRCD=4, tRP=4) E6: (333MHz @ CL=5, tRCD=5, tRP=5) F7: (400MHz @ CL=6, tRCD=6, tRP=6) E7: (400MHz @ CL=5, tRCD=5, tRP=5) F8: (533MHz @ CL=7, tRCD=7, tRP=7) G8: (533MHz @ CL=8, tRCD=8, tRP=8) H9: (667MHz @ CL=9, tRCD=9, tRP=9) K0: (800MHz @ CL=10, tRCD=10, tRP=10) 7A: (133MHz CL=3/PC100 CL2) 13. AMB Vendor for FBDIMM 0, 5: Intel 1, 6, 8: IDT 9: Montage Note: All of Lead-free or Halogen-free product are in compliance with RoHS 1H 2013 samsung.com/dram SLC Flash Technology 0.0156 in 256Gb ODP 128Gb QDP 21nm DDR 21nm DDR 21nm DDR 16Gb QDP 42nm SDR 8Gb DDP 42nm SDR 4Gb 42nm SDR 2Gb 42nm SDR 1Gb 42nm SDR Part Number Package Type K9WDGY8S5M-CCK* K9QFGY8S7M-CCK* K9VHGY8SCM-CCK* K9WAG08U1D-SCB0* K9WAG08U1D-SIB0* K9K8G08U0D-SCB0* K9K8G08U0D-SIB0* K9F4G08U0D-SCB0* K9F4G08U0D-SIB0* K9F2G08U0C-SCB0* K9F2G08U0C-SIB0* K9F1G08U0D-SCB0* K9F1G08U0D-SIB0* 316FBGA 316FBGA 316FBGA TSOP1 TSOP1 TSOP-LF/HF TSOP-LF/HF, i-temp TSOP1 HF & LF TSOP1 HF & LF, i-temp TSOP-LF/HF TSOP-LF/HF, i-temp TSOP-LF/HF TSOP-LF/HF, i-temp Please contact your local Samsung sales representative for latest product offerings. Org. Vol(V) x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 3.3/1.8 3.3/1.8 3.3/1.8 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 Status MP MP MP MP MP MP MP MP MP MP MP MP MP F L A SH - SSD Density Note: All parts are lead free MLC Flash Type Density Technology Part Number Package Type Org. Vol(V) Status 512Gb ODP 256Gb QDP 21nm DDR 21nm DDR 21nm SDR 21nm DDR 21nm DDR 21nm SDR 21nm SDR 21nm DDR 21nm DDR 21nm SDR 21nm DDR 21nm DDR 21nm DDR 21nm DDR 21nm DDR 21nm DDR K9PHGY8S5A-HCK0000 K9HFGY8S5A-HCK0000 K9HDG08U1B-SCB0000 K9HDGY8U5B-HCK0000 K9LDGY8S1A-HCK0000 K9LCG08U0B-SCB0000 K9LCGY8U1B-HCK0000 K9GCGY8S0A-HCK0000 K9GCGD8U0A-MCB0000 K9GBG08U0B-SCB0000 K9GBGY8U0B-HCK0000 K9GBGD8U0A-MCB0000 K9CFGD8U1A-SCB0000 K9BDGD8U0A-SCB0000 K9ACGD8U0A-SCB0000 K9ABGD8U0C-SCB0000 132BGA 132BGA 48TSOP 132BGA 132BGA 48TSOP 132BGA 132BGA 60LGA 48TSOP 132BGA 60LGA 48TSOP 48TSOP 48TSOP 48TSOP x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 3.3/1.8 3.3/1.8 3.3 3.3 3.3/1.8 3.3 3.3 3.3/1.8 3.3 3.3 3.3/1.8 3.3 3.3 3.3 3.3 3.3 MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP 128Gb QDP 128Gb DDP 2bit 64Gb DDP 64Gb mono 32Gb mono 3bit 256Gb QDP 128Gb DDP 64Gb mono 32Gb mono Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead-free & halogen-free SD and microSD FLASH CARDS Application SD Cards uSD Cards Density Part Number Class 2GB MMAUF02G4ACA-QMP00 CL4 Ultra High Speed (UHS) 4GB 8GB 16GB MMBTF04G3CCH-QMM00 MMCTF08G3ACH-QMM00 MMCTF16GWACJ-SAC00 CL4 CL4 CL10 32GB 64GB MMCTF32GWACJ-SAC00 CL10 UHS 104 MMCTF64GWACJ-SAC00 CL10 UHS 104 CL4 UHS 104 UHS 104 UHS 104 2GB MMAUR02G3ACA-QMP00 4GB MMBTR04G3CCA-QMP00 CL4 UHS 104 8GB MMCTR08G3ACH-QMM00 CL4 UHS 104 16GB MMCTR16GUACJ-SAC00 CL10 UHS 104 32GB 64GB MMCTR32GUACJ-SAC00 CL10 UHS 104 MMCTR64GUACJ-SAC00 CL10 UHS 104 Please contact your local Samsung sales representative for part numbers and latest product offerings. samsung.com/flash 1H 2013 SLC AND MLC FLASH, SD/microSD FLASH 13 Industrial Cards Density Part Number Sequential Reads Sequential Writes 8GB MMCAF08G3ACA-QMWCV 24 MB/s 16MB/s 16GB MMCAF16GWACA-QMWCV 24 MB/s 21MB/s Please contact your local Samsung sales representative for part numbers and latest product offerings. MAINSTREAM eMMC Density Flash MMC Class Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) C/S 4GB 32Gb*1 4.41 100 KLM4G1YE4C-B001 60/6 2000/100 11.5x13x1.0 MP 8GB 64Gb*1 4.41 100 KLM8G1WE4A-A001 60/6 2000/100 12x16x1.0 MP 16GB 64Gb*2 4.41 400 KLMAG2WE4A-A001 80/10 2500/260 12x16x1.0 MP 32GB 64Gb*4 4.41 400 KLMBG4WE4A-A001 80/22 2500/400 12x16x1.0 MP 64GB 64Gb*8 4.41 400 KLMCG8WE4A-A001 80/22 2500/400 12x16x1.2 MP Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) C/S eMMC-Pro (High performance) Density Flash MMC Class 16GB 64Gb*2 4.5 1500 KLMAG2GE2A-A001 140/40 3500/1100 12x16x1.0 MP 32GB 64Gb*4 4.5 1500 KLMBG4GE2A-A001 140/50 3500/1500 12x16x1.0 MP 64GB 64Gb*8 4.5 1500 KLMCG8GE2A-A001 140/50 3500/1500 12x16x1.2 MP 128GB 64Gb*16 4.5 1500 KLMDGAGE2A-A001 140/50 3500/1500 12x16x1.6 MP SOLID STATE DRIVES (SSD) Drive Type Drive Name Interface Form Factor Connector Component Power-loss Protection PM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 3-bit MLC No Client PC/ Embedded SM841 PM843 Data Center SM843 SM843T Storage Enclosure 14 SM1625 SATA III - 6Gb/s SATA III - 6Gb/s SATA III - 6Gb/s SATA III - 6Gb/s SAS Gen 2.0 - 6Gb/s Industrial Cards, eMMC & SSDs mSATA MO-300 2.5" 7mmT 2.5" 7mmT 2.5" 7mmT 2.5" 15mmT Mini PCI-E SF-8223 SF-8223 SF-8223 SFF-8482 2-bit MLC 3-bit MLC 2-bit MLC 2-bit MLC 2-bit E-MLC 1H 2013 No No No Yes Yes Density Part Number Status 128GB MZMTD128HAFV-00000 MP 256GB MZMTD256HAGM-00000 MP 512GB MZMTD512HAGL-00000 MP 128GB MZMPD128HAFV-00000 MP 256GB MZMPD256HAGM-00000 MP 512GB MZMPD512HAGL-00000 MP 120GB MZ7TD120HAFV-000DA MP 240GB MZ7TD240HAFV-000DA MP 480GB MZ7TD480HAGM-000DA MP 120GB MZ7PD120HAFV-000DA MP 240GB MZ7PD240HAFV-000DA MP 480GB MZ7PD480HAGM-000DA MP 120GB MZ7WD120HAFV-00003 MP 240GB MZ7WD240HAFV-00003 MP 480GB MZ7WD480HAGM-00003 MP 960GB MZ7WD960HAGP-00003 MP 100GB MZ6ER100HAFV-00003 MP 200GB MZ6ER200HAGM-00003 MP 400GB MZ6ER400HAGL-00003 MP 800GB MZ6ER800HAGL-00003 MP samsung.com/flash 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 K 9 X X X X X X X X - X X X X Pre-Program Version Customer Bad Block Temp Package --Generation Mode SAMSUNG Memory NAND Flash Small Classification Density Density Organization Organization Vcc 1. Memory (K) 2. NAND Flash : 9 3. Small Classification (SLC : Single Level Cell, MLC : Multi Level Cell) 7 : SLC eMMC 8 : MLC eMMC F : SLC Normal G : MLC Normal H : MLC QDP K : SLC DDP L : MLC DDP M : MLC DSP N : SLC DSP P : MLC 8 Die Stack Q : SLC 8 Die Stack S : SLC Single SM T : SLC SINGLE (S/B) U : 2 Stack MSP W : SLC 4 Die Stack 4~5. Density 12 : 512M 56 : 256M 1G : 1G 2G : 2G 4G : 4G 8G : 8G AG: 16G BG: 32G CG: 64G DG : 128G EG : 256G LG : 24G NG : 96G ZG : 48G 00 : NONE 6~7. Organization 00 : NONE 08 : x8 16 : x16 samsung.com/flash 8. Vcc A : 1.65V~3.6V B : 2.7V (2.5V~2.9V) C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V) E : 2.3V~3.6V R : 1.8V (1.65V~1.95V) Q : 1.8V (1.7V~1.95V) T : 2.4V~3.0V U : 2.7V~3.6V V : 3.3V (3.0V~3.6V) W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE 9. Mode 0 : Normal 1 : Dual nCE & Dual R/nB 3 : Tri/CE & Tri R/B 4 : Quad nCE & Single R/nB 5 : Quad nCE & Quad R/nB 9 : 1st block OTP A : Mask Option 1 L : Low grade 13. Temp C : Commercial I : Industrial 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 14. Customer Bad Block B : Include Bad Block D : Daisychain Sample L : 1~5 Bad Block N : ini. 0 blk, add. 10 blk S : All Good Block 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 15. Pre-Program Version 0 : None Serial (1~9, A~Z) 10. Generation M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation 11. ---12. Package A : COB B : FBGA (Halogen-Free, Lead-Free) C : CHIP BIZ D : 63-TBGA F : WSOP (Lead-Free) G : FBGA H : TBGA (Lead-Free) I : ULGA (Lead-Free) (12*17) J : FBGA (Lead-Free) L : ULGA (Lead-Free) (14*18) M : TLGA N : TLGA2 P : TSOP1 (Lead-Free) Q : TSOP2 (Lead-Free) S : TSOP1 (Halogen-Free, Lead-Free) T : TSOP2 U : COB (MMC) V : WSOP W : Wafer Y : TSOP1 Z : WELP (Lead-Free) 1H 2013 15 F L A SH - SSD FLASH ProductS Ordering Information Samsung has a vast portfolio of eMCP products for a variety of solutions, such as mobile phones, PMPs, and tablet computers. The following illustration shows Samsung's lineup of eMCP memory solutions, which can be deployed in almost any application. Samsung eMCP product suite with different densities and types of Mobile DRAM and eMMC ROM 64GB eMCP = eMMC + LPDDR1 or LPDDR2 or LPDDR3 32GB 16GB 8GB 4GB 2GB 256M 16 Multi-Chip Packages 512M 1G 2G 4G 1H 2013 8G 12G 16G 20G RAM samsung.com/mcp eMCP: eMMC + LPDDR3 Memory eMMC & MDRAM eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package 4GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm 8GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm 16GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm DRAM Density/Organization Voltage (eMMC-DRAM) Package eMCP: eMMC + LPDDR2 Memory eMMC Density 4Gb 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm 8GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm 16GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm 32GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm 64GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 186FBGA 12x16mm eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package 4GB 2Gb*2 (x32, 2CS/CKE) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm 8GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm 16GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm 32GB 512Mb (x16) 3.3V/1.8V - 1.8V 153FBGA 11.5x13mm 64GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA 12x16mm 4GB MCP eMMC & MDRAM eMCP: eMMC + MDDR Memory eMMC & MDRAM samsung.com/mcp 1H 2013 Multi-Chip Packages 17 Samsung Solid State Drives standard data center series Read-Intensive Environments pro data center series High-Read and Write Environments DELUXE enterprise series High-Write Environments Samsung PM843 Samsung SM843 Samsung SM1625 2.5 inches 2.5 inches 2.5 inches Capacity (GB) 120/240/480 120/240/480 100/200/400/800 Host Interface Serial ATA 3 (6 Gb/s) Serial ATA 3 (6 Gb/s) SAS (6 Gb/s) 1.5 Million Hours 2,000,000 hours 2,000,000 hours 1x1016 1x1017 1x1017 4.2W 3.4W 9W 300 mW 300 mW 4W Random Read Up to 60,000 IOPS Up to 70,000 IOPS Up to 101,000 IOPS Random Write Up to 2,500 IOPS Up to 11,500 IOPS Up to 38,000 IOPS Random Terabytes Written (TBW) Up to 320 TBW Up to 1,060 TBW Up to 1 WPD* Up to 10,200 TBW Up to 10 WPD* Sequential Read Up to 520 MB/s Up to 530 MB/s Up to 925 MB/s Sequential Writes Up to 330 MB/s Up to 420 MB/s Up to 595 MB/s Sequential Terabytes Written (TBW) Up to 1,280 TBW Up to 4,200 TBW Up to 5 WPD* Up to 26,500 TBW Up to 18 WPD* Physical Dimensions 100 x 70 x 7mm 100 x 70 x 7mm 100 x 70 x 15mm 60g 56g 169g Form Factor MTBF Uncorrectable Bit Error Rate (UBER) Power Consumption (Active) Power Consumption (Idle) Weight *WPD = Drive Writes Per Day for 5 Years Which SSD is right for you? For more information, email: SSD@ssi.samsung.com 18 SSDs 1H 2013 samsung.com/flash-ssd SOLID STATE DRIVES (SSD) Drive Type Drive Name Interface Form Factor Connector Component Power-loss Protection PM841 SATA III - 6Gb/s mSATA MO-300 Mini PCI-E 3-bit MLC No Client PC/ Embedded SM841 PM843 Data Center SM843 SM843T Storage Enclosure SM1625 SATA III - 6Gb/s SATA III - 6Gb/s SATA III - 6Gb/s SATA III - 6Gb/s SAS Gen 2.0 - 6Gb/s mSATA MO-300 2.5" 7mmT 2.5" 7mmT 2.5" 7mmT 2.5" 15mmT Mini PCI-E 2-bit MLC SF-8223 3-bit MLC SF-8223 2-bit MLC SF-8223 2-bit MLC SFF-8482 2-bit E-MLC No No No Yes Yes Density Part Number Status 128GB MZMTD128HAFV-00000 MP 256GB MZMTD256HAGM-00000 MP 512GB MZMTD512HAGL-00000 MP 128GB MZMPD128HAFV-00000 MP 256GB MZMPD256HAGM-00000 MP 512GB MZMPD512HAGL-00000 MP 120GB MZ7TD120HAFV-000DA MP 240GB MZ7TD240HAFV-000DA MP 480GB MZ7TD480HAGM-000DA MP 120GB MZ7PD120HAFV-000DA MP 240GB MZ7PD240HAFV-000DA MP 480GB MZ7PD480HAGM-000DA MP 120GB MZ7WD120HAFV-00003 MP 240GB MZ7WD240HAFV-00003 MP 480GB MZ7WD480HAGM-00003 MP 960GB MZ7WD960HAGP-00003 MP 100GB MZ6ER100HADD-00003 MP 200GB MZ6ER200HAFV-00003 MP 400GB MZ6ER400HAGL-00003 MP 800GB MZ6ER800HAGL-00003 MP Interface SATA Speed Type Loading Lightscribe Model BD Combo 6X Slim Tray X SN-406AB BD Writer 6X Slim Tray X SN-506BB Model STOR AG E Blu-ray Slim Blu-ray writer Slim external Interface Speed Type Loading Lightscribe USB 2.0 BD Writer 6X Slim Tray X Interface Speed Type Loading Lightscribe Model SATA DVD Write 24X H/H Tray X SH-224BB Type Loading Lightscribe SE-506AB SE-506BB DVD-W H/H DVD-W SLIM Interface SATA Speed DVD Write 8X Slim Tray X Type Loading Lightscribe Model SN-208BB SN-208DB DVD-W Slim External Interface Speed USB 2.0 DVD Write 8X samsung.com/flash-ssd samsungodd.com Model Ultra Slim Tray X SE-218BB Slim Tray X SE-208DB 1H 2013 SSDs & Optical Disc Drives 19 DID Product Classification E-DID: Exclusive DID Outdoor: High Luminance Super Narrow 1500 - 2000nit Wall-mounted Narrow P-DID: Performance DID Thin/Light (Edge LED) Narrow Black Bezel B-DID: Basic DID Large Format Display 70"/82" Landscape/Portrait convertible Why DID Instead of TV? Commercial (DID) Consumer (TV) Warranty 18 months to 2 years 90 days to 1 year Reliability Designed for continuous use in different environments Turned on for 20 hours + Variety of temperatures & location Designed for in-home use in controlled environment Turned on for 6-8 hours In-home living room Picture Quality Designed for PC signals LCD backlight covers a wider color spectrum necessary for PC source integration giving better picture quality Designed for TV signals Location Can be oriented in either portrait or landscape mode Can only be oriented in landscape mode Product Segmentation HEAVY USE E-DID: Exclusive All features of P-DID plus Specialty: SNB, High Brightness Robust design P-DID: Performance All features of B-DID plus Narrow & Black Bezel Typ. Brightness: 700 (cd/m2) B-DID: Basic Landscape/Portrait High reliability Pol. (Haze 44%) Long lifetime: more than 2 years Professional Outdoor Events Billboard * Control Room * Simulation * Scoreboard * Sports Broadcasting * Billboard Entertainment Transportation Communication Rental * Casino * Theatre * Poster * Menu * Airport * Train/Bus Station * Conference Room * Rental * Staging Commercial Education * Kiosk * Mart Board * E-Board LIGHT USE Product Segmentation Type Abbr Warranty Bezel Suggested Run Time Brightness Usage Applications Pricing E-DID Exclusive 2 years Narrow and Super Narrow 20 hours + 450 to 1500 nits Heavy Outdoor, Video Walls High-value commercial range P-DID Performance 2 years Narrow 20 hours + 600/700 nits Medium Semi-Outdoor Mid-price range B-DID Basic 18 months Normal 12 hours 450 nits Light Indoor, e-Board High-value commercial range 20 DID PRODUCT CLASSIFICATION 1H 2013 samsungdisplay.com Samsung Digital Information Display (DID) Panel Lineup Type E-DID P-DID B-DID Current Model Size Model resolution Bezel Backlight Brightness (typical) Contrast Ratio Response Time Frequency MP* Comment High Tni 85C LTI216XM01 21.6" 960x960 Super narrow D-LED 450 nits 4,000:1 8ms 60Hz Now Square panel Yes LTI460HN03 46" FHD Narrow + Black CCFL 1500 nits 3,000:1 8ms 60Hz Ltd Avail. High Bright, Hi Temp LC, 1/4 Pol. Yes LTI460HN01 46" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED Yes LTI460HN07 46" FHD Super narrow D-LED 450 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED Yes LTI460AA05 46" HD Super narrow CCFL 450 nits 4,000:1 8ms 60Hz Ltd Avail. 7.3mm Active to Active LTI550HN01 55" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED Yes LTI550HN05 55" FHD Super narrow D-LED 450 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED Yes LTI400HA08 40" FHD Narrow + Black CCFL 700 nits 3,000:1 8ms 60Hz Now LTI400HA10 40" FHD Narrow E-LED 700 nits 3,000:1 8ms 60Hz Now LTI460HN05 46" FHD Narrow + Black CCFL 700 nits 3,500:1 8ms 60Hz Now LTI460HN08 46" FHD Narrow E-LED 700 nits 4,000:1 8ms 60Hz Feb. '13 LTI550HN03 55" FHD Narrow CCFL 700 nits 4,000:1 8ms 60Hz Now Yes LTI550HN06 55" FHD Narrow E-LED 700 nits 4,000:1 8ms 60Hz Now Yes LTI700HD01 70" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Ltd Avail. LTI820HT-L01 82" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Ltd Avail. LTI460HN04-N 46" FHD Normal CCFL 450 nits 3,000:1 8ms 60Hz Ltd Avail. Yes LTI550HN02 55" FHD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now Yes LTI700HA02 70" FHD Normal E-LED 400 nits 4,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI820HD03 82" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI460AP01 46" HD Narrow Transparent/ No BLU 4,500:1 8ms 60Hz Now LTI220MT02 46" WSXGA+ Narrow Transparent/ No BLU 5,000:1 5ms 60Hz Now LED Yes Yes LED Yes LVDS Input DI S PL AYS Transparent Yes samsungdisplay.com 1H 2013 DID PANEL LINEUP 21 Tablets Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 7" LTN070AL01 PLS WXGA 1280 800 16:10 216 400 Now 10.1" LTL101AL02 PLS WXGA 1280 800 16:10 149 400 Now PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP LTM230HT10 TN FHD 1920 1080 16:9 96 300 Now LTM230HL01 PLS FHD 1920 1080 16:9 96 300 Now MONITORs Size 23" 27" 22 LTM270HT03 TN FHD 1920 1080 16:09 82 300 Now LTM270DL02 PLS QHD 2560 1440 16:09 109 300 Now LTM270DL03 PLS FHD 1920 1080 16:09 82 350 Apr. '13 TABLETS & MONITORS 1H 2013 samsungdisplay.com CONTACTS Feel free to contact your local distributor or sales representative with any Samsung sales inquiries. Representatives Name Location Phone Name Location Phone Adelsa Ciudad Juarez 52-656-613-3517 Infinity Sales Los Angeles 818-880-6480 Adelsa Monterrey 52-818-214-0011 Infinity Sales Orange County 714-669-8520 Adelsa Mexico City (HQ) 52-555-560-5002 InTELaTECH Calgary 905-629-0082 Adelsa Guadalajara 52-333-122-3054 InTELaTECH Montreal 905-629-0082 ATMI Washington 425-869-7636 InTELaTECH Ottawa 905-629-0082 ATMI Oregon 503-643-8307 InTELaTECH Toronto 905-629-0082 Bear/VAI Ohio 440-526-1991 I-Squared San Jose 408-988-3400 Bear/VAI Western PA 440-526-1991 I-Squared Petaluma 707-773-3108 Bear/VAI Indiana/Kentucky 440-832-7637 Neptune Electr. (NECCO) NY, PA, MD 631-234-2525 Bear/VAI Michigan 440-526-1991 New Elpis (LCD) Ontario 905-275-3516 Massachusetts 781-229-8888 Bestronics Vista 760-598-8500 New Tech Solutions Core Illinois 847-843-8888 New Tech Solutions CT/NY 585-204-2183 Core Wisconsin 414-791-1666 Rep One Associates Alabama 256-539-7371 Crestone Colorado 303-280-7202 Rep One Associates Charlotte, NC 704-846-5744 Crestone Utah 303-280-7202 Rep One Associates Georgia 770-209-9242 Customer 1st Iowa 319-393-1351 Rep One Associates Raleigh, NC 919-424-3804 Customer 1st Kansas 913-390-9119 Rep One Associates Florida 256-539-7371 Customer 1st Minnesota 952-851-7909 Summit Sales Phoenix/El Paso 480-998-4850 Digit-Tech Sales Sao Paulo, Brazil 5511-3165-2218 West Associates Dallas 972-680-2800 Digit-Tech Sales Puerto Rico 787-892-4260 West Associates Austin 512-343-1199 Digit-Tech Sales Miami (export) 305-591-2400 West Associates Houston 512-538-2810 Distributors Company Name Location Contact Edge Electronics, Inc. Headquarters 75 Orville Dr., Unit 2 Bohemia, NY 11716 Phone: 800.647.EDGE (3343) Fax: 631.471.3405 www.edgeelectronics.com Email: edge@edgeelectronics.com Avnet, Inc. Phoenix, Arizona Headquarters 2211 South 47th Street Phoenix, AZ 85034 www.avnet.com For sales inquiries: (800) 332-8638 www.avnetexpress.com WPG Americas Inc. Corporate Office 5285 Hellyer Avenue Suite 150 San Jose, CA 95138 Tel 408-392-8100 Tel 888-WPG-8881 Fax 408-436-9551 www.wpgamericas.com For sales inquiries: inquiry@wpgamericas.com Arrow Electronics, Inc. Corporate Headquarters Corporate Headquarters 7459 S. Lima Street Englewood, CO 80112-5816 Phone: (303) 824-4000 www.arrow.com For sales inquiries: www.arrownac.com/onlinesales@arrow.com/(800) 833-3557 For all product information please visit: samsung.com/us/oem-solutions C ONTA CTS To access our online sales portal, visit: https://smarttools.ssi.samsung.com samsung.com/us/oem-solutions 1H 2013 CONTACTS 23 Memory DRAM Flash SRAM MCP System LSI ASICs APs Display Drivers Imaging ICs Foundry Storage Solid State Drives Optical Disc Drives DISPLAYS Monitors Smartphones Tablets TVs Samsung Semiconductor, Inc. 3655 North First Street San Jose, CA 95134-1713 samsung.com/us/oem-solutions Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Copyright 2013. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-13-ALL-001 | Printed 02/13