05800 6/17/2011 Rev: B
EN6337QI
3A Voltage Mode Synchronous Buck PWM
DC-DC Converter with Integrated Inductor
www.enpirion.com
Description
The EN6337QI is a Power System on a Chip
(PowerSoC) DC-DC converter. It integrates
MOSFET switches, small-signal circuits,
compensation, and the inductor in an advanced
4mm x 7mm QFN package.
The EN6337QI is specifically designed to meet
the precise voltage and fast transient
requirements of present and future high-
performance, low-power processor, DSP, FPGA,
memory boards and system level applications in
distributed power architecture. The device’s
advanced circuit techniques, ultra high switching
frequency, and proprietary integrated inductor
technology deliver high-quality, ultra compact,
non-isolated DC-DC conversion.
The Enpirion solution significantly helps in
system design and productivity by offering greatly
simplified board design, layout and
manufacturing requirements. In addition, a
reduction in the number of vendors required for
the complete power solution helps to enable an
overall system cost savings.
All Enpirion products are RoHS compliant and
lead-free manufacturing environment compatible.
Figure 1: Total Solution Footprint PWM mode
(Not to scale) Total Area ≈ 75 mm2
Features
• Integrated Inductor, MOSFETS, Controller
• Minimal external components.
• Up to 3A Continuous Output Current
Capability.
• 2 MHz operating frequency. Switching
frequency can be phase locked to an external
clock.
• High efficiency, up to 95%.
• Wide input voltage range of 2.5V to 6.6V.
• Light Load Mode with programmable set
point.
• Output Enable pin and Power OK signal.
• Programmable soft-start time.
• Under Voltage Lockout, Over Current, Short
Circuit and Thermal Protection.
• RoHS compliant, MSL level 3, 260C reflow.
Application
• Point of load regulation for processors, DSPs,
FPGAs, and ASICs
• Noise sensitive applications such as A/V, RF
and Gbit I/O
• Low voltage, distributed power architectures
such as 0.8V, 1.0V, 1.2, 2.5V, 3.3V, 5V rails
• Blade servers, RAID storage systems,
LAN/SAN adapter cards, wireless base
stations, industrial automation, test and
measurement, embedded computing,
communications, and multi-function printers.
• Ripple sensitive applications
• Beat frequency sensitive applications
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 2 www.enpirion.com
Figure 2: Typical Application Schematic (P WM mode)
Ordering Information
Part Number Temp Rating
(°C) Package
EN6337QI -40 to +85 38-pin QFN T&R
EN6337QI3 -40 to +85 38-pin QFN T&R
EN6337QI-E QFN Evaluation Board
Pin Assignments (Top View)
Figure 3: Top View Pinout Diagram (Not to Scale)
NOTE: All perimeter pins must be soldered to PCB.
Pin Description
PIN NAME FUNCTION
1-2, 12,
34-38 NC(SW)
NO CONNECT – These pins are internally connected to the common switching node of the
internal MOSFETs. They are not to be electrically connected to any external signal, ground,
or voltage. Failure to follow this guideline may result in damage to the device.
3-4,
22-25 NC NO CONNECT – These pins may be internally connected. Do not connect to each other or
to any other electrical signal. Failure to follow this guideline may result in device damage.
5-11 VOUT
Regulated converter output. Connect these pins to the load and place output capacitor
between these pins and PGND pins 13-15.
13-18 PGND
Input/Output power ground. Connect these pins to the ground electrode of the input and
output filter capacitors. See VOUT and PVIN pin descriptions for more details.
19-21 PVIN
Input power supply. Connect to input power supply. Decouple with input capacitor to
PGND pins 16-18.
26 LLM/SYNC
Dual function pin providing LLM Enable and External Clock Synchronization (see
Application Section). At static Logic HIGH, device will allow automatic engagement of light
load mode. At static logic LOW, the device is forced into PWM only. A clocked input to this
pin will synchronize the internal switching frequency to the external signal. If this pin is left
floating, it will pull to a static logic high, enabling LLM.
27 ENABLE
Input Enable. Applying logic high enables the output and initiates a soft-start. Applying
logic low disables the output.
28 POK
Power OK is an open drain transistor used for power system state indication. POK is logic
high when VOUT is within -10% of VOUT nominal.
29 RLLM
Programmable LLM engage resistor to AGND allows for adjustment of load current at which
Light-Load Mode engages. Can be left open for PWM only operation.
30 SS
Soft-Start node. The soft-start capacitor is connected between this pin and AGND. The
value of this capacitor determines the startup time.
31 VFB
External Feedback Input. The feedback loop is closed through this pin. A voltage divider at
VOUT is used to set the output voltage. The midpoint of the divider is connected to VFB. A
phase lead capacitor from this pin to VOUT is also required to stabilize the loop.
32 AGND Analog Ground. This is the controller ground return. Connect to a quiet ground.
33 AVIN
Input power supply for the controller. Connect to input voltage at a quiet point.
39 PGND
Device thermal pad to be connected to the system GND plane. See Layout
Recommendations section.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 3 www.enpirion.com
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the
recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may
impair device life. Exposure to absolute maximum rated conditions for extended periods may affect
device reliability.
PARAMETER SYMBOL MIN MAX UNITS
Supply Voltage – PVIN, AVIN, VOUT VIN -0.5 7.0 V
Pin Voltages – ENABLE, POK, LLM/SYNC -0.5 VIN +0.3 V
Pin Voltages – VFB, SS, RLLM -0.5 2.75 V
Storage Temperature Range TSTG -65 150 °C
Maximum Operating Junction Temperature TJ-ABS Max 150 °C
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A 260 °C
ESD Rating - all pins (based on HBM) 2000 V
Recommended Operating Conditions
PARAMETER SYMBOL MIN MAX UNITS
Input Supply Voltage VIN 2.5 6.6 V
Operating Junction Temperature TJ-OP - 40 125 °C
Operating Ambient Temperature TAMB - 40 85 °C
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A 260 °C
Thermal Characteristics
PARAMETER SYMBOL MIN TYP MAX UNITS
Thermal Shutdown TSD 160 °C
Thermal Shutdown Hysteresis TSDH 35 °C
Thermal Resistance: Junction to Ambient (Note 1) θJA 30 °C/W
Thermal Resistance: Junction to Case θJC 3 °C/W
Note 1: Based on 2oz. external copper layers and proper thermal design in line with EIA/JEDEC JESD51-7
standard for high thermal conductivity boards.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 4 www.enpirion.com
Electrical Characteristics
NOTE: VIN=6.6V over operating temperature range unless otherwise noted. Typical values are at TA = 25°C.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Operating Input Voltage VIN 2.5 6.6 V
Under Voltage Lock-out –
VIN Rising VUVLOR Voltage above which UVLO is not
asserted 2.3 V
Under Voltage Lock-out –
VIN Falling VUVLOF Voltage below which UVLO is
asserted 2.075 V
Shut-Down Supply Current IS ENABLE=0V 100
μA
Operating Quiescent
Current IQ LLM/SYNC = High 650 μA
Feedback Pin Voltage
EN6337QI
EN6337QI3
VFB
Feedback node voltage at:
VIN = 5V, ILOAD = 0, TA = 25°C
0.7425
0.735
0.75
0.75
0.7575
0.765
V
Feedback Pin Voltage
EN6337QI
EN6337QI3
VFB
Feedback node voltage at:
2.5V ≤ VIN ≤ 6.6V
0A ≤ ILOAD ≤ 3A, TA = -40 to 85°C
0.735
0.7275
0.75
0.75
0.765
0.7725
V
Feedback pin Input
Leakage Current (Note 1) IFB VFB pin input leakage current -5 5 nA
VOUT Rise Time (Note 1) tRISE
Measured from when VIN > VUVLOR &
ENABLE pin voltage crosses its
logic high threshold to when VOUT
reaches its final value. CSS = 15 nF
0.9 1.2 1.5 ms
Soft Start Capacitor Range CSS_RANGE 10 68 nF
Output Drop Out
Voltage
Resistance (Note 1)
VDO
RDO
VINMIN - VOUT at Full load
Input to Output Resistance
210
70
315
105
mV
mΩ
Continuous Output Current IOUT PWM mode
LLM mode (Note 2)
0
0.002 3
3 A
Over Current Trip Level IOCP V
IN = 5V, VOUT = 1.2V 5 A
Disable Threshold VDISABLE ENABLE pin logic low. 0.0 0.6 V
ENABLE Threshold VENABLE ENABLE pin logic high
2.5V ≤ VIN ≤ 6.6V 1.8 VIN V
ENABLE Lockout Time TENLOCKOUT 4.2 ms
ENABLE pin Input Current
(Note 1) IENABLE ENABLE pin has ~180kΩ pull down 40 μA
Switching Frequency (Free
Running) FSW Free Running frequency of
oscillator 1.9 MHz
External SYNC Clock
Frequency Lock Range FPLL_LOCK Range of SYNC clock frequency 1.5 2.3 MHz
SYNC Input Threshold –
Low (LLM/SYNC PIN) VSYNC_LO SYNC Clock Logic Level 0.8 V
SYNC Input Threshold –
High (LLM/SYNC PIN)
(Note 3)
VSYNC_HI SYNC Clock Logic Level 1.8 2.5 V
POK Lower Threshold POKLT Output voltage as a fraction of
expected output voltage 90 %
POK Output low Voltage VPOKL With 4mA current sink into POK 0.4 V
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 5 www.enpirion.com
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
POK Output Hi Voltage VPOKH 2.5V ≤ VIN ≤ 6.6V VIN V
POK pin VOH leakage
current (Note 1) IPOKL POK high 1 µA
LLM Engage Headroom Minimum VIN-VOUT to ensure proper
LLM operation 800 mV
LLM Logic Low
(LLM/SYNC PIN) VLLM_LO LLM Static Logic Level 0.3 V
LLM Logic High
(LLM/SYNC PIN) VLLM_HI LLM Static Logic Level 1.5 V
LLM/SYNC Pin Current LLM/SYNC Pin is <2.5V <100 nA
Note 1: Parameter guaranteed by design.
Note 2: LLM operation is normally only guaranteed above the minimum specified output current. Contact Enpirion
Applications support for designs that need to operate at a lower IOUT.
Note 3: For proper operation of the synchronization circuit, the high-level amplitude of the SYNC signal should not be
above 2.5V.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 6 www.enpirion.com
Typical Performance Characteristics
Efficiency VIN = 3.3V, VOUT (From top to bottom) =
2.5, 1.8, 1.2, 1.0V
Efficiency VIN = 5.0V, VOUT (From top to bottom) =
3.3, 2.5, 1.8, 1.2, 1.0V
PWM Output Ripple: VIN = 3.3V, VOUT = 1.0V, IOUT = 3A
CIN = 22μF, COUT = 47μF/1206 + 10uF/0805
PWM Output Ripple: VIN = 3.3V, VOUT = 1.0V, IOUT = 3A
CIN = 22μF, COUT = 47μF/1206 + 10uF/0805
PWM Output Ripple: VIN = 5.0V, VOUT = 1.0V, IOUT = 3A
CIN = 22μF, COUT = 47μF/1206 + 10uF/0805
PWM Output Ripple: VIN = 5.0V, VOUT = 1.0V, IOUT = 3A
CIN = 22μF, COUT = 47μF/1206 + 10uF/0805
PWM/LLM Efficiency vs. Load Performance at Vin=3. 3V
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0.01 0.1 1 10
Load (A)
Efficiency (
%)
Vout=2.5
Vout=1.8
Vout=1.2
Vout=1
Vout=1
Vout=1.2
Vout=1.8
Vout=2.5
#REF!
PWM/LLM Eff icie ncy vs. Load Perf orm ance at Vi n=5V
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0.01 0.1 1 10
Load (A)
Efficiency (%
)
Vout=3.3
Vout=2.5
Vout=1.8
Vout=1.2
Vout=1
Vout=1
Vout=1.2
Vout=1.8
Vout=2.5
Vout=3.3
20 MHz BW limit
20 MHz BW limit
500 MHz BW
500 MHz BW
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 7 www.enpirion.com
LLM Output Ripple: VIN = 3.3V, VOUT = 1.0V,
IOUT = 0.1A, CIN = 22μF, COUT = 2x47μF/1206
LLM Output Ripple: VIN = 5.0V, VOUT = 1.0V,
IOUT = 0.1A, CIN = 22μF, COUT = 2x47μF/1206
Load Transient: VIN = 5.0V, VOUT = 1.0V, LLM Enabled
Ch.1: VOUT, Ch.2: IOUT = 0.01↔3A
CIN = 22μF, COUT = 2x47μF/1206
Load Transient: VIN = 5.0V, VOUT = 3.0V, LLM Enabled
Ch.1: VOUT, Ch.2: IOUT = 0.01↔3A
CIN = 22μF, COUT = 2x47μF/1206
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 8 www.enpirion.com
PWM Load Transient: VIN = 5.0V, VOUT = 1.0V
Ch.1: VOUT, Ch.2: IOUT = 0↔3A
CIN = 22μF, COUT = 47μF/1206 + 10µF/0805
PWM Load Transient: VIN = 5.0V, VOUT = 3.0V
Ch.1: VOUT, Ch.2: IOUT = 0↔3A
CIN = 22μF, COUT = 47μF/1206 + 10µF/0805
Power Up/Down at No Load: VIN/VOUT = 5.5V/3.3V,
15nF soft-start capacitor, COUT ≈ 50µF
Ch.1: ENABLE, Ch. 2: VOUT, Ch. 3: POK, Ch.4: IOUT
Power Up/Do wn into 1.1Ω load: VIN/VOUT = 5.5V/3.3V,
15nF soft-start capacitor, COUT ≈ 50µF
Ch.1: ENABLE, Ch. 2: VOUT, Ch. 3: POK, Ch.4: IOUT
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 9 www.enpirion.com
Functional Block Diagram
Figure 4: Functional Block Diagram
Functional Description
Synchronous Buck Converter
The EN6337QI is a synchronous,
programmable power supply with integrated
power MOSFET switches and integrated
inductor. The nominal input voltage range is
2.5V to 6.6V. The output voltage is
programmed using an external resistor divider
network. The control loop is voltage-mode with
a type III compensation network. Much of the
compensation circuitry is internal to the device.
However, a phase lead capacitor is required
along with the output voltage feedback resistor
divider to complete the type III compensation
network. The device uses a low-noise PWM
topology and also integrates a unique light-load
mode (LLM) to improve efficiency at light
output load currents. LLM can be disabled with
a logic pin. Up to 3A of continuous output
current can be drawn from this converter. The
2 MHz switching frequency allows the use of
small size input / output capacitors, and
enables wide loop bandwidth within a small
foot print.
Protection Features:
The power supply has the following protection
features:
• Over-current protection (to protect the IC
from excessive load current)
• Thermal shutdown with hysteresis.
• Under-voltage lockout circuit to keep the
converter output off while the input voltage
is less than 2.3V.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 10 www.enpirion.com
Additional Features:
• The switching frequency can be phase-
locked to an external clock to eliminate or
move beat frequency tones out of band.
• Soft-start circuit allowing controlled startup
when the converter is initially powered up.
The soft start time is programmable with an
appropriate choice of soft start capacitor.
• Power good circuit indicating the output
voltage is greater than 90% of programmed
value as long as feedback loop is closed.
• To maintain high efficiency at low output
current, the device incorporates automatic
light load mode operation.
Enable Operation
The ENABLE pin provides a means to enable
normal operation or to shut down the device.
When the ENABLE pin is asserted (high) the
device will undergo a normal soft start. A logic
low on this pin will power the device down in a
controlled manner. From the moment ENABLE
goes low, there is a fixed lock out time before
the output will respond to the ENABLE pin re-
asserted (high). This lock out is activated for
even very short logic low pulses on the
ENABLE pin. See the Electrical Characteristics
Table for technical specifications for this pin.
LLM/SYNC Pin
This is a dual function pin providing LLM
Enable and External Clock Synchronization. At
static Logic HIGH, device will allow automatic
engagement of light load mode. At static logic
LOW, the device is forced into PWM only. A
clocked input to this pin will synchronize the
internal switching frequency – LLM mode is not
available if this input is clocked. If this pin is
left floating, it will pull to a static logic high,
enabling LLM.
Frequency Sy nchronization
The switching frequency of the DC/DC
converter can be phase-locked to an external
clock source to move unwanted beat
frequencies out of band. To avail this feature,
the clock source should be connected to the
LLM/SYNC pin. An activity detector recognizes
the presence of an external clock signal and
automatically phase-locks the internal oscillator
to this external clock. Phase-lock will occur as
long as the clock frequency is in the range
specified in the Electrical Characteristics Table.
For proper operation of the synchronization
circuit, the high-level amplitude of the SYNC
signal should not be above 2.5V. Please note
LLM is not available when synchronizing to an
external frequency.
Spread Spectrum Mode
The external clock frequency may be swept
between the limits specified in the Electrical
Characteristics Table at repetition rates of up
to 10 kHz in order to reduce EMI frequency
components.
Soft-Start Operation
During Soft-start, the output voltage is ramped
up gradually upon start-up. The output rise
time is controlled by the choice of soft-start
capacitor, which is placed between the SS pin
(30) and the AGND pin (32).
Rise Time: TR ≈ (CSS* 80kΩ) ± 25%
During start-up of the converter, the reference
voltage to the error amplifier is linearly
increased to its final level by an internal current
source of approximately 10uA. Typical soft-
start rise time is ~1.2mS with SS capacitor
value of 15nF. The rise time is measured from
when VIN > VUVLOR and ENABLE pin voltage
crosses its logic high threshold to when VOUT
reaches its programmed value. Please note
LLM function is disabled during the soft-start
ramp-up time.
POK Operation
The POK signal is an open drain signal
(requires a pull up resistor to VIN or similar
voltage) from the converter indicating the
output voltage is within the specified range.
The POK signal will be logic high (VIN) when
the output voltage is above 90% of
programmed VOUT. If the output voltage goes
below this threshold, the POK signal will be
logic low.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 11 www.enpirion.com
Light Load Mode (LLM) Operation
The EN6337QI uses a proprietary light load
mode to provide high efficiency at low output
currents. When the LLM/SYNC pin is high, the
device is in automatic LLM “Detection” mode.
When the LLM/SYNC pin is low, the device is
forced into PWM mode. In automatic LLM
“Detection” mode, when a light load condition
is detected, the device will:
(1) Step VOUT up by approximately 1.0% above
the nominal operating output voltage
setting, VNOM and as low as -0.5% below
VNOM, and then
(2) Shut down unnecessary circuitry, and then
(3) Monitor VOUT.
When VOUT falls below VNOM, the device will
repeat (1), (2), and (3). The voltage step up, or
pre-positioning, improves transient droop when
a load transient causes a transition from LLM
mode to PWM mode. If a load transient
occurs, causing VOUT to fall below the threshold
VMIN, the device will exit LLM operation and
begin normal PWM operation. Figure 5
demonstrates VOUT behavior during transition
into and out of LLM operation.
VOUT
IOUT
LLM
Ripple
PWM
Ripple
VMAX
VNOM
VMIN
Load
Step
Figure 5: VOUT behavior in LLM operation.
Many multi-mode DCDC converters suffer from
a condition that occurs when the load current
increases only slowly so that there is no load
transient driving VOUT below the VMIN threshold.
In this condition, the device would never exit
LLM operation. This could adversely affect
efficiency and cause unwanted ripple. To
prevent this from occurring, the EN6337QI
periodically exits LLM mode into PWM mode
and measures the load current. If the load
current is above the LLM threshold current, the
device will remain in PWM mode. If the load
current is below the LLM threshold, the device
will re-enter LLM operation. There may be a
small overshoot or undershoot in VOUT when
the device exits and re-enters LLM.
The load current at which the device will enter
LLM mode is a function of input and output
voltage, and the RLLM pin resistor. Contact
Enpirion Applications support for details
regarding the optimization of this resistor for
specific operating conditions. For PWM only
operation, the RLLM pin can be left open.
To ensure normal LLM operation, LLM mode
should be enabled and disabled with specific
sequencing. For applications with explicit LLM
pin control, enable LLM after VIN ramp up is
complete. For applications with only ENABLE
control, tie LLM to ENABLE; enable the device
after VIN ramp up is complete, and disable the
device before VIN ramp down begins. For
designs with ENABLE and LLM tied to VIN,
make sure the device soft-start time is longer
than the VIN ramp-up time. LLM will start
operating after the soft-start time is completed.
NOTE: For proper LLM operation the
EN6337QI requires a minimum difference
between VIN and VOUT, and a minimum LLM
load requirement as specified in the Electrical
Characteristics Table. For LLM designs
requiring lower voltage headroom or a lower
minimum load, contact Enpirion Applications
support.
Over-Current Protection
The current limit function is achieved by
sensing the current flowing through the Power
PFET. When the sensed current exceeds the
over current trip point, both power FETs are
turned off for the remainder of the switching
cycle. If the over-current condition is removed,
the over-current protection circuit will enable
normal PWM operation. If the over-current
condition persists, the soft start capacitor will
gradually discharge causing the output voltage
to fall. When the OCP fault is removed, the
output voltage will ramp back up to the desired
voltage. This circuit is designed to provide high
noise immunity.
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 12 www.enpirion.com
Thermal Overload Protection
Thermal shutdown circuit will disable device
operation when the Junction temperature
exceeds approximately 150ºC. After a thermal
shutdown event, when the junction
temperature drops by approx 20ºC, the
converter will re-start with a normal soft-start.
Input Under-Voltage Lock-Out
Internal circuits ensure that the converter will
not start switching until the input voltage is
above the specified minimum voltage.
Hysteresis and input de-glitch circuits ensure
high noise immunity and prevent false UVLO
triggers.
Compensation
The EN6337QI uses a type 3 compensation
network. As noted earlier, a piece of the
compensation network is the phase lead
capacitor CA in Figure 6. This network is
optimized for use with about 50-100μF of
output capacitance and will provide wide loop
bandwidth and excellent transient performance
for most applications. Voltage mode operation
provides high noise immunity at light load.
In some applications, modifications to the
compensation may be required. For more
information, contact Enpirion Applications
Engineering support.
Application Information
The EN6337QI output voltage is programmed
using a simple resistor divider network. Figure
6 shows the resistor divider configuration.
)75.0( *75.0
200
VVOUT RA
RB
kRA
−
=
Ω=
Figure 6: VOUT Resistor Divider &
Compensation Capacitor
An additional compensation capacitor CA is
also required in parallel with the upper resistor.
Input Capacitor Selection
The EN6337QI requires about 20uF of input
capacitance. Low-cost, low-ESR ceramic
capacitors should be used as input capacitors
for this converter. The dielectric must be X5R
or X7R rated. Y5V or equivalent dielectric
formulations must not be used as these lose
too much capacitance with frequency,
temperature and bias voltage. In some
applications, lower value capacitors are
needed in parallel with the larger, capacitors in
order to provide high frequency decoupling.
Recommended Input Capacitors
Description MFG P/N
10 µF, 10V, 10%
X7R, 1206
(2 capacitors needed)
Murata GRM31CR71A106KA01L
Taiyo Yuden LMK316B7106KL-T
22 µF, 10V, 20%
X5R, 1206
(1 capacitor needed)
Murata GRM31CR61A226ME19L
Taiyo Yuden LMK316BJ226ML-T
Output Capacitor Selection
The EN6337QI has been nominally optimized
for use with approximately 50-100μF of output
capacitance. Low ESR ceramic capacitors are
required with X5R or X7R rated dielectric
formulation. Y5V or equivalent dielectric
formulations must not be used as these lose
too much capacitance with frequency,
temperature and bias voltage.
Output ripple voltage is determined by the
aggregate output capacitor impedance. Output
impedance, denoted as Z, is comprised of
effective series resistance, ESR, and effective
series inductance, ESL:
Z = ESR + ESL
Placing output capacitors in parallel reduces
the impedance and will hence result in lower
PWM ripple voltage. In addition, higher output
capacitance will improve overall regulation and
ripple in light-load mode.
nTotal ZZZZ 1
...
111
21
+++=
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 13 www.enpirion.com
Typical PWM Ri pple Voltages
Output Capacitor
Configuration
Typical Outp ut Ripple (mVp-p)
(as measured on EN6337QI
Evaluation Board)*
1 x 47 µF 25
47 µF + 10 µF 14
* Note: 20 MHz BW limit
Recommended Ou tput Capacitors
Description MFG P/N
47uF, 6.3V, 20%
X5R, 1206
(1 or 2 capacitors needed)
Murata GRM31CR60J476ME19L
Taiyo
Yuden JMK316BJ476ML-T
10uF, 10V, 10%
X5R, 1206
(Optional 1 capacitor in
parallel with 47uF above)
Murata GRM31CR71A106KA01L
Taiyo
Yuden LMK316BJ226ML-T
For best LLM performance, we recommend
using just 2x47uF capacitors mentioned in the
above table, and no 10uF capacitor.
The VOUT sense point should be just after the
last output filter capacitor right next to the
device. Additional bulk output capacitance
beyond the above recommendations can be
used on the output node of the EN6337QI as
long as the bulk capacitors are far enough from
the VOUT sense point such that they don’t
interfere with the control loop operation.
In some cases modifications to the
compensation or output filter capacitance may
be required to optimize device performance
such as transient response, ripple, or hold-up
time. The EN6337QI provides the capability to
modify the control loop response to allow for
customization for such applications. For more
information, contact Enpirion Applications
Engineering support.
Power-Up Sequencing
During power-up, ENABLE should not be
asserted before PVIN, and PVIN should not be
asserted before AVIN. Tying all three pins
together meets these requirements.
Thermal Considerations
The Enpirion EN6337QI DC-DC converter is
packaged in a 7x4x1.85mm 38-pin QFN
package. The QFN package is constructed
with copper lead frames that have exposed
thermal pads. The recommended maximum
junction temperature for continuous operation
is 125°C. Continuous operation above 125°C
will reduce long-term reliability. The device has
a thermal overload protection circuit designed
to shut it off at a junction temperature specified
in the Electrical Characteristics Table.
The silicon is mounted on a copper thermal
pad that is exposed at the bottom of the
package. The thermal resistance from the
silicon to the exposed thermal pad is very low.
In order to take advantage of this low
resistance, the exposed thermal pad on the
package should be soldered directly on to a
copper ground pad on the printed circuit board
(PCB). The PCB then acts as a heat sink. In
order for the PCB to be an effective heat sink,
the device thermal pad should be coupled to
copper ground planes or special heat sink
structures designed into the PCB (refer to the
Layout Recommendations section).
The junction temperature, TJ, is calculated from
the ambient temperature, TA, the device power
dissipation, PD, and the device junction-to-
ambient thermal resistance, θJA in °C/W, as
follows:
TJ = TA + (PD) (θJA)
The junction temperature, TJ, can also be
expressed in terms of the device case
temperature, TC, and the device junction-to-
case thermal resistance, θJC in °C/W, as
follows:
TJ = TC + (PD) (θJC)
The device case temperature, TC, is the
temperature at the center of the exposed
thermal pad at the bottom of the package.
The device junction-to-ambient and junction-to-
case thermal resistances, θJA and θJC, are
shown in the Thermal Characteristics table on
page 3. The θJC is a function of the device and
the QFN package design. The θJA is a function
of θJC and the user’s system design
parameters that include the thermal
effectiveness of the customer PCB and airflow.
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The θJA value shown in the Thermal
Characteristics table on page 3 is for free
convection with the device heat sunk (through
the thermal pad) to a copper plated four-layer
PC board with a full ground and a full power
plane following EIA/JEDEC JESD51-7
Standard. The θJA can be reduced with the use
of forced air convection. Because of the strong
dependence on the thermal effectiveness of
the PCB and the system design, the actual θJA
value will be a function of the specific
application.
Layout Recommendations
Figure 7 shows critical components and layer 1
traces of a recommended minimum footprint
EN6337QI layout with ENABLE tied to VIN in
PWM mode. Alternate ENABLE configurations,
and other small signal pins need to be
connected and routed according to specific
customer application. Please see the Gerber
files on the Enpirion website www.enpirion.com
for exact dimensions and other layers. Please
refer to this Figure while reading the layout
recommendations in this section.
Recommendation 1: Input and output filter
capacitors should be placed on the same side
of the PCB, and as close to the EN6337QI
package as possible. They should be
connected to the device with very short and
wide traces. Do not use thermal reliefs or
spokes when connecting the capacitor pads to
the respective nodes. The +V and GND traces
between the capacitors and the EN6337QI
should be as close to each other as possible
so that the gap between the two nodes is
minimized, even under the capacitors.
Recommendation 2: Three PGND pins are
dedicated to the input circuit, and three to the
output circuit. The slit in Figure 7 separating
the input and output GND circuits helps
minimize noise coupling between the converter
input and output switching loops.
Recommendation 3: The system ground
plane should be the first layer immediately
below the surface layer. This ground plane
should be continuous and un-interrupted below
the converter and the input/output capacitors.
Please see the Gerber files on the Enpirion
website www.enpirion.com.
Recommendation 4: The large thermal pad
underneath the component must be connected
to the system ground plane through as many
vias as possible.
Figure 7: Top PCB Layer Critical Components
and Copper for Minimum Footprint
The drill diameter of the vias should be
0.33mm, and the vias must have at least 1 oz.
copper plating on the inside wall, making the
finished hole size around 0.20-0.26mm. Do not
use thermal reliefs or spokes to connect the
vias to the ground plane. This connection
provides the path for heat dissipation from the
converter. Please see Figures: 7, 8, and 9.
Recommendation 5: Multiple small vias (the
same size as the thermal vias discussed in
recommendation 4 should be used to connect
ground terminal of the input capacitor and
output capacitors to the system ground plane.
It is preferred to put these vias under the
capacitors along the edge of the GND copper
closest to the +V copper. Please see Figure 7.
These vias connect the input/output filter
capacitors to the GND plane, and help reduce
parasitic inductances in the input and output
current loops. If the vias cannot be placed
under CIN and COUT, then put them just outside
the capacitors along the GND slit separating
the two components. Do not use thermal reliefs
or spokes to connect these vias to the ground
plane.
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EN6337QI
©Enpirion 2011 all rights reserved, E&OE 15 www.enpirion.com
Recommendation 6: AVIN is the power supply
for the internal small-signal control circuits. It
should be connected to the input voltage at a
quiet point. In Figure 7 this connection is made
at the input capacitor close to the VIN
connection.
Recommendation 7: The layer 1 metal under
the device must not be more than shown in
Figure 7. See the section regarding exposed
metal on bottom of package. As with any
switch-mode DC/DC converter, try not to run
sensitive signal or control lines underneath the
converter package on other layers.
Recommendation 8: The VOUT sense point
should be just after the last output filter
capacitor. Keep the sense trace as short as
possible in order to avoid noise coupling into
the control loop.
Recommendation 9: Keep RA, CA, and RB
close to the VFB pin (see Figures 6 and 7).
The VFB pin is a high-impedance, sensitive
node. Keep the trace to this pin as short as
possible. Whenever possible, connect RB
directly to the AGND pin instead of going
through the GND plane.
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Pac ka ge
Lead frames offers many advantages in
thermal performance, in reduced electrical lead
resistance, and in overall foot print. However,
they do require some special considerations.
In the assembly process lead frame
construction requires that, for mechanical
support, some of the lead-frame cantilevers be
exposed at the point where wire-bond or
internal passives are attached. This results in
several small pads being exposed on the
bottom of the package.
Only the large thermal pad and the perimeter
pads are to be soldered to the PC board. The
PCB top layer under the EN6337QI should be
clear of any metal except for the large thermal
pad. The “grayed-out” region in Figure 8
represents the area that should be clear of any
metal (traces, vias, or planes), on the top layer
of the PCB.
Figure 8: Lead-Frame Exposed Metal. Grey area highlights exposed metal below which
there should not be any metal (traces, vias, or planes) on the top layer of PCB.
VIN copper covered by
soldermask acceptable near
or under this exposed pad.
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©Enpirion 2011 all rights reserved, E&OE 16 www.enpirion.com
Recommended PCB Footprint
Figure 9: EN6337QI Package PCB Footprint
Dimensions in mm
05800 6/17/2011 Rev: B
EN6337QI
©Enpirion 2011 all rights reserved, E&OE 17 www.enpirion.com
Package and Mechanical
Figure 10: EN6337QI Package Dimensions
Contact Information
Enpirion, Inc.
Perryville III Corporate Park
53 Frontage Road - Suite 210
Hampton, NJ 08827 USA
Phone: 1.908.894.6000
Fax: 1.908.894.6090
Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is
believed to be accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may
result from its use. Enpirion products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment
used in hazardous environment without the express written authority from Enpirion.
