2000 May 24 8
Philips Components Product specification
Surface mount ceramic
multilayer capacitors Class 2, Y5V 16 V, 25 V and 50 V
TESTS AND REQUIREMENTS
Table 2 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
no visible damage
4.5 visualinspectionand
dimension check any applicable method using
×10 magnification in accordance with specification
4.6.1 capacitance f = 1 kHz; measuring voltage
1V
rms at 25 °Cwithin specified tolerance
4.6.2 tan δf = 1 kHz; measuring voltage
1V
rms at 25 °Cin accordance with specification
4.6.3 insulation resistance at UR (DC) for 1 minute RiCR≥500 s
4.6.4 voltage proof 2.5 ×URfor 1 minutes no breakdown or flashover
4.7.1 temperature
characteristic between minimum and maximum
temperature in accordance with specification
4.8 adhesion a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
4.9 bond strength of
plating on end face mounted in accordance with
CECC 32 100, paragraph 4.4 no visible damage
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
∆C/C: ±30%
4.10 Tb resistance to
soldering heat preconditioning: 120 to 150 °C
during 1 minute; 260 ±5°Cfor
10 ±0.5 s in a static solder bath
the terminations shall be well
tinned after recovery
∆C/C: ±20%
tan δ: original specification
Rins: original specification
resistance to
leaching 260 ±5°C for 30 ±1s
in a static solder bath using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%
4.11 Ta solderability zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±5°C
the terminations shall be well
tinned