EE-SPX301 - OMRON AUTOMATION & SAFETY

iCE40LM Family Data Sheet

DS1045 Version 1.6, October 2015

www.latticesemi.com 1-1 DS1045 Introduction_01.3

January 2014 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

General Description

iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

smartphones, tablets and hand-held devices. The iCE40LM family includes integrated SPI & I2C blocks to interface with vir-

tually all mobile sensors and application processors. The iCE40LM family also features two Strobe Generators that can

generates strobes in Microsecond ranges with the Low-Power Strobe Generator, and also generates strobes in Nanosec-

ond ranges with the High-Speed Strobe Generator.

In addition, the iCE40LM family of devices includes logic to perform other functions such as mobile bridging, antenna tun-

ing, GPIO expansion, motion/gesture recognition, IR remote control, bar code emulation and other custom functions.

The iCE40LM family features three device densities, from 1100 to 3520 Look Up Tables (LUTs) of logic with programmable

I/Os that can be used as either SPI/I2C interface ports or general purpose I/O’s. It also has up to 80 kbits of Block RAMs to

work with user logic.

iCE40LM Family Data Sheet

Introduction

Features

Flexible Logic Architecture

• Three devices with 1100 to 3520 LUTs

• 18 I/O pins for 25-pin WLCSP

Ultra-low Power Devices

• Advanced 40 nm ultra-low power process

• As low as 120 µW standby power typical

Embedded and Distributed Memory

• Up to 80 kbits sysMEM™ Embedded Block 

RAM

Two Hardened I2C Interfaces

Two Hardened SPI Interfaces

Two On-Chip Strobe Generators

• Low-Power Strobe Generator 

(Microsecond ranges)

• High-Speed Strobe Generator 

(Nanosecond ranges)

High Current Drive Outputs for LED

• Three High Drive (HD) output in each device

• Source/sink nominal 24 mA

Flexible On-Chip Clocking

• Six low-skew global signal resource

Flexible Device Configuration

• SRAM is configured through SPI

Ultra-Small Form Factor

• As small as 25-pin WLCSP package 

1.71 mm x 1.71 mm

Applications

• Smartphones

• Tablets and Consumer Handheld Devices

• Handheld Commercial and Industrial Devices

• Multi Sensor Management Applications

• Sensor Pre-processing & Sensor Fusion

• Always-On Sensor Applications

1-2

Introduction

iCE40LM Family Data Sheet

Table 1-1. iCE40LM Family Selection Guide

Introduction

The iCE40LM family of ultra-low power FPGAs has three devices with densities ranging from 1100 to 3520 Look-

Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic, these devices also feature Embedded

Block RAM (EBR), two Strobe Generators (LPSG, HSSG), two hardened I2C Controllers and two hardened SPI

Controllers. These features allow the devices to be used in low-cost, high-volume consumer and mobile applica-

tions.

The iCE40LM devices are fabricated on a 40nm CMOS low power process. The device architecture has several

features such as user configurable I2C and SPI Controllers, either as master or slave, and two Strobe Generators.

The iCE40LM FPGAs are available in very small form factor packages, with the smallest in 25-pin WLCSP. The 25-

pin WLCSP package has a 0.35 mm ball pitch, resulting to an overall package size of 1.71 mm x 1.71 mm that eas-

ily fits into a lot of mobile applications. Table 1-1 shows the LUT densities, package and I/O pin count.

The iCE40LM devices offer enhanced I/O features such as pull-up resistors. Pull-up features are controllable on a

“per-pin” basis.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the

iCE40LM family of devices. Popular logic synthesis tools provide synthesis library support for iCE40LM. Lattice

design tools use the synthesis tool output along with the user-specified preferences and constraints to place and

route the design in the iCE40LM device. These tools extract the timing from the routing and back-annotate it into

the design for timing verification.

Lattice provides many pre-engineered IP (Intellectual Property) modules, including a number of reference designs,

licensed free of charge, optimized for the iCE40LM FPGA family. Lattice also can provide fully verified bit-stream for

some of the widely used target functions in mobile device applications, such as ultra-low power sensor manage-

ment, gesture recognition, IR remote, barcode emulator functions. Users can use these functions as offered by Lat-

tice, or they can use the design to create their own unique required functions. For more information regarding

Lattice's Reference Designs or fully-verified bitstreams, please contact your local Lattice representative.

Part Number iCE40LM1K iCE40LM2K iCE40LM4K

Logic Cells (LUT + Flip-Flop) 1100 2048 3520

RAM4K Memory Blocks 16 20 20

RAM4K RAM Bits 64K 80K 80K

Package Programmable I/O Count

25-pin WLCSP, 1.71 mm x 1.71 mm, 0.35 mm 18 18 18

36-pin ucBGA, 2.5 mm x 2.5 mm, 0.40 mm 28 28 28

49-pin ucBGA, 3 mm x 3 mm, 0.40 mm 37 37 37

www.latticesemi.com 2-1 DS1045 Architecture_01.5

March 2016 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Architecture Overview

The iCE40LM family architecture contains an array of Programmable Logic Blocks (PLB), two Strobe Generators,

two user configurable I2C controllers, two user configurable SPI controllers, and blocks of sysMEM™ Embedded

Block RAM (EBR) surrounded by Programmable I/O (PIO). Figure 2-1shows the block diagram of the iCE40LM-4K

device.

Figure 2-1. iCE40LM-4K Device, Top View

The logic blocks, Programmable Logic Blocks (PLB) and sysMEM EBR blocks, are arranged in a two-dimensional

grid with rows and columns. Each column has either logic blocks or EBR blocks. The PIO cells are located at the

top and bottom of the device, arranged in banks. The PLB contains the building blocks for logic, arithmetic, and reg-

ister functions. The PIOs utilize a flexible I/O buffer referred to as a sysIO buffer that supports operation with a vari-

ety of interface standards. The blocks are connected with many vertical and horizontal routing channel resources.

The place and route software tool automatically allocates these routing resources.

In the iCE40LM family, There are two sysIO banks, one on top and one on bottom. User can connect both VCCIOs

together, if all the I/Os are using the same voltage standard. Refer to the details in later sections of this document.

The sysMEM EBRs are large 4 kbit, dedicated fast memory blocks. These blocks can be configured as RAM, ROM

or FIFO with user logic using PLBs.

Every device in the family has two user SPI ports, one of these (right side) SPI port also supports programming

and configuration of the device. The iCE40LM also includes two user I2C ports, and two Strobe Generators.

I2CI2C

SPI SPI

I/O Bank 2

I/O Bank 0

4 kbit RAM Blocks

config

LPSGHSSG

Flip-flop with Enable

and Reset Controls

Carry Logic

4-Input Look-up

Table (LUT)

8 Logic Cells = Programmable Logic Block

PLB

4 kbit RAM Blocks 4 kbit RAM Blocks

4 kbit RAM Blocks

iCE40LM Family Data Sheet

Architecture

2-2

Architecture

iCE40LM Family Data Sheet

PLB Blocks

The core of the iCE40LM device consists of Programmable Logic Blocks (PLB) which can be programmed to per-

form logic and arithmetic functions. Each PLB consists of eight interconnected Logic Cells (LC) as shown in

Figure 2-2. Each LC contains one LUT and one register.

Figure 2-2. PLB Block Diagram

Logic Cells

Each Logic Cell includes three primary logic elements shown in Figure 2-2.

• A four-input Look-Up Table (LUT) builds any combinational logic function, of any complexity, requiring up to

four inputs. Similarly, the LUT element behaves as a 16x1 Read-Only Memory (ROM). Combine and cascade

multiple LUTs to create wider logic functions.

• A ‘D’-style Flip-Flop (DFF), with an optional clock-enable and reset control input, builds sequential logic func-

tions. Each DFF also connects to a global reset signal that is automatically asserted immediately following

device configuration.

• Carry Logic boosts the logic efficiency and performance of arithmetic functions, including adders, subtracters,

comparators, binary counters and some wide, cascaded logic functions.

Table 2-1. Logic Cell Signal Descriptions

Function Type Signal Names Description

Input Data signal I0, I1, I2, I3 Inputs to LUT

Input Control signal Enable Clock enable shared by all LCs in the PLB

Input Control signal Set/Reset1 Asynchronous or synchronous local set/reset shared by all LCs in

the PLB.

Input Control signal Clock Clock one of the eight Global Buffers, or from the general-purpose

interconnects fabric shared by all LCs in the PLB

Input Inter-PLB signal FCIN Fast carry in

Output Data signals O LUT or registered output

Output Inter-PFU signal FCOUT Fast carry out

1. If Set/Reset is not used, then the flip-flop is never set/reset, except when cleared immediately after configuration.

= Statically defined by configuration program

LUT

Carry Logic

Logic Cell

DFF

Flip-flop with

optional enable and

set or reset controls

Four-input

Look-Up Table

(LUT)

Clock

Enable

FCOUT

FCIN

Set/Reset

Shared Block-Level Controls

Programmable Logic

Block (PLB)

8 Logic Cells (LCs)

2-3

Architecture

iCE40LM Family Data Sheet

Routing

There are many resources provided in the iCE40LM devices to route signals individually with related control sig-

nals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing) segments.

The inter-PLB connections are made with three different types of routing resources: Adjacent (spans two PLBs), x4

(spans five PLBs) and x12 (spans thirteen PLBs). The Adjacent, x4 and x12 connections provide fast and efficient

connections in the diagonal, horizontal and vertical directions.

The design tool takes the output of the synthesis tool and places and routes the design.

Clock/Control Distribution Network

Each iCE40LM device has six global inputs, two pins on the top bank and four pins on the bottom bank

These global inputs can be used as high fanout nets, clock, reset or enable signals. The dedicated global pins are

identified as Gxx and the global buffers are identified as GBUF[7:0]. These six inputs may be used as general pur-

pose I/O if they are not used to drive the clock nets.

Table 2-2 lists the connections between a specific global buffer and the inputs on a PLB. All global buffers optionally

connect to the PLB CLK input. Any four of the eight global buffers can drive logic inputs to a PLB. Even-numbered

global buffers optionally drive the Set/Reset input to a PLB. Similarly, odd-numbered buffers optionally drive the

PLB clock-enable input. GBUF[7:6, 3:0] can connect directly to G[7:6, 3:0] pins respectively. GBUF4 and GBUF5

can connect to the two on-chip Strobe Generators (GBUF4 connects to LPSG, GBUF5 connects to HSSG).

Table 2-2. Global Buffer (GBUF) Connections to Programmable Logic Blocks

The maximum frequency for the global buffers are shown in the iCE40LM External Switching Characteristics tables

later in this document.

Global Hi-Z Control

The global high-impedance control signal, GHIZ, connects to all I/O pins on the iCE40LM device. This GHIZ signal

is automatically asserted throughout the configuration process, forcing all user I/O pins into their high-impedance

state.

Global Reset Control

The global reset control signal connects to all PLB and PIO flip-flops on the iCE40LM device. The global reset sig-

nal is automatically asserted throughout the configuration process, forcing all flip-flops to their defined wake-up

state. For PLB flip-flops, the wake-up state is always reset, regardless of the PLB flip-flop primitive used in the

application.

Global Buffer LUT Inputs Clock Clock Enable Reset

GBUF0

Yes, any 4 of 8

GBUF Inputs

Ye s Ye s

GBUF1 Yes Yes

GBUF2 Yes Yes

GBUF3 Yes Yes

GBUF4 Yes Yes

GBUF5 Yes Yes

GBUF6 Yes Yes

GBUF7 Yes Yes

2-4

Architecture

iCE40LM Family Data Sheet

sysCLOCK Phase Locked Loops (PLLs) - NOT SUPPORTED on the 25-Pin WLCSP

The sysCLOCK PLLs provide the ability to synthesize clock frequencies. The iCE40LM devices have one sys-

CLOCK PLL (Please note that the 25-pin WLCSP package does not support the PLL). REFERENCECLK is the ref-

erence frequency input to the PLL and its source can come from an external I/O pin, the internal strobe generator

or from internal routing. EXTFEEDBACK is the feedback signal to the PLL which can come from internal routing or

an external I/O pin. The feedback divider is used to multiply the reference frequency and thus synthesize a higher

frequency clock output.

The PLLOUT output has an output divider, thus allowing the PLL to generate different frequencies for each output.

The output divider can have a value from 1 to 64 (in increments of 2X). The PLLOUT outputs can all be used to

drive the iCE40 global clock network directly or general purpose routing resources can be used.

The LOCK signal is asserted when the PLL determines it has achieved lock and de-asserted if a loss of lock is

detected. A block diagram of the PLL is shown in Figure 2-3.

The timing of the device registers can be optimized by programming a phase shift into the PLLOUT output clock

which will advance or delay the output clock with reference to the REFERENCECLK clock. This phase shift can be

either programmed during configuration or can be adjusted dynamically. In dynamic mode, the PLL may lose lock

after a phase adjustment on the output used as the feedback source and not relock until the tLOCK parameter has

been satisfied.

The iCE40LM PLL functions the same as the PLLs in the iCE40 family. For more details on the PLL, see TN1251,

iCE40 sysCLOCK PLL Design and Usage Guide.

Figure 2-3. PLL Diagram

Table 2-3 provides signal descriptions of the PLL block.

Input

Divider

DIVR

Low-Pass

Filter

Voltage

Controlled

Oscillator

(VCO)

VCO

Divider

DIVQ

Feedback

Divider

DIVF

RANGE

Phase

Detector

Feedback_Path

Fine Delay

Adjustment

Feedback

Phase

Shifter

LATCHINPUTVALUE

REFERENCECLK

DYNAMICDELAY[7:0]

BYPASS

RESET

EXTFEEDBACK

PLLOUTCORE

PLLOUTGLOBAL

LOCK

BYPASS

Low Power mode

(iCEgate enabled)

SIMPLE

EXTERNAL

VCCPLLGNDPLL

Fine Delay

Adjustment

Output Port

2-5

Architecture

iCE40LM Family Data Sheet

Table 2-3. PLL Signal Descriptions

sysMEM Embedded Block RAM Memory

Larger iCE40LM device includes multiple high-speed synchronous sysMEM Embedded Block RAMs (EBRs), each

4 kbit in size. This memory can be used for a wide variety of purposes including data buffering, and FIFO.

sysMEM Memory Block

The sysMEM block can implement single port, pseudo dual port, or FIFO memories with programmable logic

resources. Each block can be used in a variety of depths and widths as shown in Table 2-4.

Table 2-4. sysMEM Block Configurations1

Signal Name Direction Description

REFERENCECLK Input Input reference clock

BYPASS Input The BYPASS control selects which clock signal connects to the PLL-

OUT output.

0 = PLL generated signal

1 = REFERENCECLK

EXTFEEDBACK Input External feedback input to PLL. Enabled when the FEEDBACK_PATH

attribute is set to EXTERNAL.

DYNAMICDELAY[7:0] Input Fine delay adjustment control inputs. Enabled when

DELAY_ADJUSTMENT_MODE is set to DYNAMIC.

LATCHINPUTVALUE Input When enabled, forces the PLL into low-power mode; PLL output is held

static at the last input clock value. Set ENABLE ICEGATE_PORTA and

PORTB to ‘1’ to enable.

PLLOUTGLOBAL Output Output from the Phase-Locked Loop (PLL). Drives a global clock net-

work on the FPGA. The port has optimal connections to global clock

buffers GBUF4 and GBUF5.

PLLOUTCORE Output Output clock generated by the PLL, drives regular FPGA routing. The

frequency generated on this output is the same as the frequency of the

clock signal generated on the PLLOUTLGOBAL port.

LOCK Output When High, indicates that the PLL output is phase aligned or locked to

the input reference clock.

RESET Input Active low reset.

Block RAM

Configuration

Block RAM

Configuration

and Size

WADDR Port

Size (Bits)

WDATA Port

Size (Bits)

RADDR Port

Size (Bits)

RDATA Port

Size (Bits)

MASK Port

Size (Bits)

SB_RAM256x16

SB_RAM256x16NR

SB_RAM256x16NW

SB_RAM256x16NRNW

256x16 (4K) 8 [7:0] 16 [15:0] 8 [7:0] 16 [15:0] 16 [15:0]

SB_RAM512x8

SB_RAM512x8NR

SB_RAM512x8NW

SB_RAM512x8NRNW

512x8 (4K) 9 [8:0] 8 [7:0] 9 [8:0] 8 [7:0] No Mask Port

SB_RAM1024x4

SB_RAM1024x4NR

SB_RAM1024x4NW

SB_RAM1024x4NRNW

1024x4 (4K) 10 [9:0] 4 [3:0] 10 [9:0] 4 [3:0] No Mask Port

SB_RAM2048x2

SB_RAM2048x2NR

SB_RAM2048x2NW

SB_RAM2048x2NRNW

2048x2 (4K) 11 [10:0] 2 [1:0] 11 [10:0] 2 [1:0] No Mask Port

1. For iCE40LM EBR primitives with a negative-edged Read or Write clock, the base primitive name is appended with a ‘N’ and a ‘R’ or ‘W’

depending on the clock that is affected.

2-6

Architecture

iCE40LM Family Data Sheet

RAM Initialization and ROM Operation

If desired, the contents of the RAM can be pre-loaded during device configuration.

By preloading the RAM block during the chip configuration cycle and disabling the write controls, the sysMEM block

can also be utilized as a ROM.

Memory Cascading

Larger and deeper blocks of RAM can be created using multiple EBR sysMEM Blocks.

RAM4k Block

Figure 2-4 shows the 256x16 memory configurations and their input/output names. In all the sysMEM RAM modes,

the input data and addresses for the ports are registered at the input of the memory array.

Figure 2-4. sysMEM Memory Primitives

Table 2-5. EBR Signal Descriptions

The iCE40LM EBR block functions the same as EBR blocks in the iCE40 family. For further information on the sys-

MEM EBR block, please refer to TN1250, Memory Usage Guide for iCE40 Devices.

Signal Name Direction Description

WDATA[15:0] Input Write Data input.

MASK[15:0] Input Masks write operations for individual data bit-lines.

0 = write bit; 1 = don’t write bit

WADDR[7:0] Input Write Address input. Selects one of 256 possible RAM locations.

WE Input Write Enable input.

WCLKE Input Write Clock Enable input.

WCLK Input Write Clock input. Default rising-edge, but with falling-edge option.

RDATA[15:0] Output Read Data output.

RADDR[7:0] Input Read Address input. Selects one of 256 possible RAM locations.

RE Input Read Enable input.

RCLKE Input Read Clock Enable input.

RCLK Input Read Clock input. Default rising-edge, but with falling-edge option.

WCLK

WERE

WCLKE RCLKE

RCLK

WDATA[15:0] RDATA[15:0]

MASK[15:0]

WADDR[7:0] RADDR[7:0]

Write Port Read Port

RAM4K

RAM Block

(256x16)

2-7

Architecture

iCE40LM Family Data Sheet

sysIO Buffer Banks

iCE40LM devices have up to two I/O banks with independent VCCIO rails. Configuration bank VCC_SPI for the SPI 

I/Os is connected to VCCIO2 on the 25-pin WLCSP package.

Programmable I/O (PIO)

The programmable logic associated with an I/O is called a PIO. The individual PIOs are connected to their respec-

tive sysIO buffers and pads. The PIOs are placed on the top and bottom of the devices.

Figure 2-5. I/O Bank and Programmable I/O Cell

The PIO contains three blocks: an input register block, output register block iCEGate™ and tri-state register block.

To save power, the optional iCEGateTM latch can selectively freeze the state of individual, non-registered inputs

within an I/O bank. Note that the freeze signal is common to the bank. These blocks can operate in a variety of

modes along with the necessary clock and selection logic.

Input Register Block

The input register blocks for the PIOs on all edges contain registers that can be used to condition high-speed inter-

face signals before they are passed to the device core.

Output Register Block

The output register block can optionally register signals from the core of the device before they are passed to the

sysIO buffers.

Figure 2-6 shows the input/output register block for the PIOs.

OUT

VCCIO

I/O Bank 0 or 2

Voltage Supply

0 = Hi-Z

1 = Output

Enabled

PAD

iCEGATE

HOLD

Disabled ‘0’

OUTCLK

INCLK

Enabled ‘1’

Latch inhibits

switching for

power saving

VCCIO_2

VCC

Internal Core

Bank

Pull-up

Enable

Pull-up

Gxx pins optionally

connect directly to

an associated

GBUF global

buffer

SPI SPI

I/O Bank 2

I/O Bank 0

config

LPSGHSSG

PLB

VCCIO_0

PIO

4 kbit RAM Blocks

4 kbit RAM Blocks 4 kbit RAM Blocks

4 kbit RAM Blocks

2-8

Architecture

iCE40LM Family Data Sheet

Figure 2-6. iCE I/O Register Block Diagram

Table 2-6. PIO Signal List

sysIO Buffer

Each I/O is associated with a flexible buffer referred to as a sysIO buffer. These buffers are arranged around the

periphery of the device in groups referred to as banks. The sysIO buffers allow users to implement a wide variety of

standards that are found in today’s systems with LVCMOS interfaces.

Pin Name I/O Type Description

OUTPUT_CLK Input Output register clock

CLOCK_ENABLE Input Clock enable

INPUT_CLK Input Input register clock

OUTPUT_ENABLE Input Output enable

D_OUT_0/1 Input Data from the core

D_IN_0/1 Output Data to the core

LATCH_INPUT_VALUE Input Latches/holds the Input Value

(1,0)

Pad

CLOCK_ENABLE

OUTPUT_ENABLE

OUTPUT_CLK

INPUT_CLK

LATCH_INPUT_VALUE

D_IN_1

D_IN_0

D_OUT_1

D_OUT_0

D_IN_1

D_IN_0

D_OUT_1

D_OUT_0

PIO Pair

= Statically defined by configuration program.

2-9

Architecture

iCE40LM Family Data Sheet

Typical I/O Behavior During Power-up

The internal power-on-reset (POR) signal is deactivated when VCC, VCCIO_0, VCCIO_2 and VCC_SPI (VCC_SPI is con-

nected to VCCIO_2 on the 25-pin WLCSP and 36-pin ucBGA packages) reach the level defined in the Power-On-

Reset Voltage table in the DC and Switching Characteristics section of this data sheet. After the POR signal is

deactivated, the FPGA core logic becomes active. You must ensure that all VCCIO banks are active with valid input

logic levels to properly control the output logic states of all the I/O banks that are critical to the application. The

default configuration of the I/O pins in a device prior to configuration is tri-stated with a weak pull-up to VCCIO. The

I/O pins maintain the pre-configuration state until VCC and VCCIO_2 reach the defined levels. The I/Os take on the

software user-configured settings only after VCC_SPI reaches the level and the device performs a proper download/

configuration. Unused I/Os are automatically blocked and the pull-up termination is disabled.

Supported Standards

The iCE40LM sysIO buffer supports all single-ended input and output standards. The buffer supports the LVCMOS

1.8, 2.5, and 3.3 V standards. The buffer has individually configurable options for bus maintenance (weak pull-up or

none).

Table 2-7 and Table 2-8 show the I/O standards (together with their supply and reference voltages) supported by

the iCE40LM devices.

Table 2-7. Supported Input Standards

Table 2-8. Supported Output Standards

On-Chip Strobe Generators

The iCE40LM devices feature two different Strobe Generators. One is tailored for low-power operation (Low Power

Strobe Generator – LPSG), and generates periodic strobes in the Microsecond (µs) ranges. The other is tailored

for high speed operation (High Speed Strobe Generator – HSSG), and generates periodic strobes in the Nanosec-

ond (ns) ranges.Add a paragraph:

The Strobe Generators (HSSG and LPSG) provide fixed periodic strobes, and these strobes can be used as a

clock source. When used as a clock source, the HSSG can provide strobe frequency in the range of 5 MHz - 20

MHz. The LPSG can provide strobe frequency in the range of 4 kHz - 20 kHz.

For further information on how to use the LPSG and HSSG, please refer to TN1275, iCE40LM On-Chip Strobe

Generator Usage Guide.

Input Standard VCCIO (Typical)

3.3 V 2.5 V 1.8 V

Single-Ended Interfaces

LVCMOS33 Yes

LVCMOS25 Yes

LVCMOS18 Ye s

Output Standard VCCIO (Typical)

Single-Ended Interfaces

LVCMOS33 3.3

LVCMOS25 2.5

LVCMOS18 1.8

2-10

Architecture

iCE40LM Family Data Sheet

User I2C IP

The iCE40LM devices have two I2C IP cores. Either of the two cores can be configured either as an I2C master or

as an I2C slave. Both I2C cores have preassigned pins, or user can select different pins, when the core is used.

When the IP core is configured as master, it will be able to control other devices on the I2C bus through the pre-

assigned pin interface. When the core is configured as the slave, the device will be able to provide I/O expansion to

an I2C Master. The I2C cores support the following functionality:

• Master and Slave operation

• 7-bit and 10-bit addressing

• Multi-master arbitration support

• Clock stretching

• Up to 400 kHz data transfer speed

• General Call support

For further information on the User I2C, please refer to TN1274, iCE40 I2C and SPI Hardened IP Usage Guide.

User SPI IP

The iCE40LM devices have two SPI IP cores. Both SPI cores have preassigned pins, or user can select different

pins, when the SPI core is used. Both SPI IP core can be configured as a SPI master or as a slave. When the SPI

IP core is configured as a master, it controls the other SPI enabled devices connected to the SPI Bus. When SPI IP

core is configured as a slave, the device will be able to interface to an external SPI master.

The SPI IP core supports the following functions:

• Configurable Master and Slave modes

• Full-Duplex data transfer

• Mode fault error flag with CPU interrupt capability

• Double-buffered data register

• Serial clock with programmable polarity and phase

• LSB First or MSB First Data Transfer

For further information on the User SPI, please refer to TN1274, iCE40 I2C and SPI Hardened IP Usage Guide.

High Drive I/O Pins

The iCE40LM family devices offer 3 High Drive (HD) outputs in each device in the family. The HD outputs are ideal

to drive LED signals on mobile application.

These HD outputs can be driven in different drive modes. The default is standard drive, which source/sink 8mA cur-

rent nominally. When HD drive option is selected, these HD outputs can source/sink 24mA current nominally.

The pins on the HD I/Os are labeled with HD in it.

Power On Reset

iCE40LM devices have power-on reset circuitry to monitor VCC, VCCIO_0, VCCIO_2 and VCC_SPI voltage levels dur-

ing power-up and operation. At power-up, the POR circuitry monitors these voltage levels. It then triggers down-

load from the external Flash memory after reaching the power-up levels specified in the Power-On-Reset Voltage

table in the DC and Switching Characteristics section of this data sheet. Before and during configuration, the I/Os

are held in tri-state. I/Os are released to user functionality once the device has finished configuration.

2-11

Architecture

iCE40LM Family Data Sheet

iCE40LM Configuration

This section describes the programming and configuration of the iCE40LM family.

Device Configuration

There are various ways to configure the Configuration RAM (CRAM) including:

• From a SPI Flash (Master SPI mode)

• System microprocessor to drive a Serial Slave SPI port (SSPI mode)

For more details on configuring the iCE40LM, please see TN1248, iCE40 Programming and Configuration.

Power Saving Options

The iCE40LM devices feature iCEGate and PLL low power mode to allow users to meet the static and dynamic

power requirements of their applications. Table 2-9 describes the function of these features.

Table 2-9. iCE40LM Power Saving Features Description

Device Subsystem Feature Description

PLL When LATCHINPUTVALUE is enabled, forces the PLL into low-power mode; PLL output held static

at last input clock value.

iCEGate

To save power, the optional iCEGate latch can selectively freeze the state of individual, non-regis-

tered inputs within an I/O bank. Registered inputs are effectively frozen by their associated clock or

clock-enable control.

www.latticesemi.com 3-1 DS1045 DC and Switching_01.6

March 2016 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Absolute Maximum Ratings1, 2, 3

Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 1.42 V

Output Supply Voltage VCCIO and VCC_SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V

PLL Power Supply, VCCPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 1.3 V

I/O Tri-state Voltage Applied. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V

Dedicated Input Voltage Applied . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V

Storage Temperature (Ambient). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to 150 °C

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to 125°C

1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

Recommended Operating Conditions1

Power Supply Ramp Rates1, 2

Symbol Parameter Min. Max. Units

VCC1Core Supply Voltage 1.14 1.26 V

VCCIO1, 2, 3 I/O Driver Supply Voltage VCCIO_0, VCCIO_2 1.71 3.46 V

VCCPLL4PLL Power Supply Voltage 1.14 1.26 V

VCC_SPI5Config SPI port Power Supply Voltage 1.71 3.46 V

tJIND Junction Temperature Industrial Operation –40 100 °C

1. Like power supplies must be tied together. VCCIO_0 to VCCIO_2 if they are at same supply voltage and if they meet the power up sequence

requirement. Please refer to Power Up Sequence section. VCC and VCCPLL are not recommended to be tied together. Please refer to

TN1252, iCE40 Hardware Checklist.

2. See recommended voltages by I/O standard in subsequent table.

3. VCCIO pins of unused I/O banks should be connected to the VCC power supply on boards.

4. For 25-pin WLCSP, PLL is not supported.

5. For 25-pin WLCSP and 36-pin ucBGA packages, VCC_SPI is connected to VCCIO_2 on the package. VCC_SPI is used to power the SPI1

ports in both configuration mode and user mode.

Symbol Parameter Min. Max. Units

tRAMP Power supply ramp rates for all power supplies. 0.01 10 V/ms

1. Assumes monotonic ramp rates.

2. Power up sequence must be followed. Please refer to Power Up Sequence section.

iCE40LM Family Data Sheet

DC and Switching Characteristics

3-2

DC and Switching Characteristics

iCE40LM Family Data Sheet

Power-On-Reset Voltage Levels1

Power Up Sequence

For all iCE40LM devices, it is required to have the VCC/VCCPLL power supply powered up before all other power

supplies. The VCC/VCCPLL has to be higher than 0.5 V before other supplies are powered from GND.

In addition, for all iCE40LM devices, it is required that VCCSPI not be the last power supply to ramp up. The VCCSPI

has to be higher than 0.5 V before the last supply is ramped.

In the required power up sequence, VCC/VCCPLL should be ramped first. Following VCC/VCCPLL, VCCSPI should be

ramped next, followed by the remaining supplies. On the 25-pin WLCSP, VCCPLL is connected to VCC, and is pow-

ered up together with VCC. On the 25-pin WLCSP and 36-pin caBGA, VCCIO_2 is connected to VCC_SPI, and should

be powered up right after VCC/VCCPLL with VCCSPI. Due to this connection, VCCIO_0 cannot connect to VCCIO_2

even if they are at the same supply voltage. The sequence is defined below:

• For 49-pin caBGA: VCC, VCCPLL, VCC_SPI, VCCIO_0 and VCCIO_2; Order of VCCIO_0 and VCCIO_2 is not important.

• For 36-pin caBGA: VCC, VCCPLL, VCC_SPI/VCCIO_2, VCCIO_0

• For 25-pin WLCSP: VCC/VCCPLL, VCC_SPI/VCCIO_2, VCCIO_0

There is no power down sequence required. However, when partial power supplies are powered down, it is

required that the above sequence is followed when these supplies are powered up again.

ESD Performance

Please contact Lattice Semiconductor for additional information.

DC Electrical Characteristics

Over Recommended Operating Conditions

Symbol Parameter Min. Max. Units

VPORUP Power-On-Reset ramp-up trip point (circuit monitoring

VCC, VCCIO_2 and VCC_SPI)

VCC 0.67 0.99 V

VCCIO_2, VCC_SPI 0.70 1.59 V

VPORDN Power-On-Reset ramp-down trip point (circuit monitor-

ing VCC, VCCIO_2 and VCC_SPI)

VCC —0.66 V

VCCIO_2, VCC_SPII—1.59 V

1. These POR trip points are only provided for guidance. Device operation is only characterized for power supply voltages specified under rec-

ommended operating conditions.

Symbol Parameter Condition Min. Typ. Max. Units

IIL, IIH1, 3, 4 Input or I/O Leakage 0V < VIN < VCCIO + 0.2 V — — +/–10 µA

C1I/O Capacitance2VCCIO = 3.3 V, 2.5 V, 1.8 V

VCC = Typ., VIO = 0 to VCCIO + 0.2 V —6—pf

C2Global Input Buffer

Capacitance2

VCCIO = 3.3 V, 2.5 V, 1.8 V

VCC = Typ., VIO = 0 to VCCIO + 0.2 V —6—pf

VHYST Input Hysteresis VCCIO = 1.8 V, 2.5 V, 3.3 V — 200 — mV

IPU Internal PIO Pull-up

Current

VCCIO = 1.8 V, 0=<VIN<=0.65 VCCIO –3—–31 µA

VCCIO = 2.5 V, 0=<VIN<=0.65 VCCIO –8—–72 µA

VCCIO = 3.3 V, 0=<VIN<=0.65 VCCIO –11 — –128 µA

1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is not measured

with the output driver active. Internal pull-up resistors are disabled.

2. TJ 25 °C, f = 1.0 MHz.

3. Please refer to VIL and VIH in the sysIO Single-Ended DC Electrical Characteristics table of this document.

4. Some products are clamped to a diode when VIN is larger than VCCIO.

3-3

DC and Switching Characteristics

iCE40LM Family Data Sheet

Supply Current 1, 2, 3, 4

User I2C Specifications

User SPI Specifications

Symbol Parameter Typ. VCC4Units

ICCSTDBY Core Power Supply Static Current 100 uA

ICCPLLSTDBY PLL Power Supply Static Current 11 uA

ICCIOSTDBY

, ICC_SPISTDBY VCCIO, VCC_SPI Power Supply Static Current 2.5 uA

ICCPEAK Core Power Supply Startup Peak Current 11.2 mA

ICCPLLPEAK PLL Power Supply Startup Peak Current 2.8 mA

ICCIOPEAK, ICC_SPIPEAK VCCIO, VCC_SPI Power Supply Startup Peak Current 21.4 mA

1. Assumes blank pattern with the following characteristics: all outputs are tri-stated, all inputs are configured as LVCMOS and held at VCCIO

or GND, on-chip PLL is off. For more detail with your specific design, use the Power Calculator tool. Power specified with master SPI config-

uration mode. Other modes may be up to 25% higher.

2. Frequency = 0 MHz.

3. TJ = 25 °C, power supplies at nominal voltage.

4. Does not include pull-up.

5. For 25-pin WLCSP, VCCPLL is tied internally on the package, and VCC_SPI is also connected to VCCIO_2 on the package.

Parameter

Symbol Parameter Description

spec (STD Mode) spec (FAST Mode)

UnitsMin Typ Max Min Typ Max

fSCL Maximum SCL clock frequency — — 100 — — 400 kHz

tHI SCL clock HIGH Time 4 — — 0.6 — — µs

tLO SCL clock LOW Time 4.7 — — 1.3 — — µs

tSU,DAT Setup time (DATA) 250 — — 100 — — ns

tHD,DAT Hold time (DATA) 0 — — 0 — — ns

tSU,STA Setup time (START condition) 4.7 — — 0.6 — — µs

tHD,STA Hold time (START condition) 4 — — 0.6 — — µs

tSU,STO Setup time (STOP condition) 4 — — 0.6 — — µs

tBUF Bus free time between STOP and START 4.7 — — 1.3 — — µs

tCO,DAT SCL LOW to DATAOUT valid — — 3.4 — — 0.9 µs

Parameter

Symbol Parameter Description Min Typ Max Units

fMAX Maximum SCK clock frequency — — 45 MHz

tHI HIGH period of SCK clock 9 — — ns

tLO LOW period of SCK clock 9 — — ns

tSUmaster Setup time (master mode) 2 — — ns

tHOLDmaster Hold time (master mode) 5 — — ns

tSUslave Setup time (slave mode) 2 — — ns

tHOLDslave Hold time (slave mode) 5 — — ns

tSCK2OUT SCK to out (slave mode) — — 13.5 ns

3-4

DC and Switching Characteristics

iCE40LM Family Data Sheet

sysIO Recommended Operating Conditions

sysIO Single-Ended DC Electrical Characteristics

Typical Building Block Function Performance1, 2

Pin-to-Pin Performance (LVCMOS25)

Standard

VCCIO (V)

Min. Typ. Max.

LVCMOS 3.3 3.14 3.3 3.46

LVCMOS 2.5 2.37 2.5 2.62

LVCMOS 1.8 1.71 1.8 1.89

Input/

Output

Standard

VIL VIH1

VOL Max.

(V)

VOH Min.

(V)

IOL Max.

(mA)

IOH Max.

(mA)Min. (V) Max. (V) Min. (V) Max. (V)

LVCMOS 3.3 –0.3 0.8 2.0 VCCIO + 0.2V 0.4 VCCIO – 0.4 8 –8

0.2 VCCIO – 0.2 0.1 –0.1

LVCMOS 2.5 –0.3 0.7 1.7 VCCIO + 0.2V 0.4 VCCIO – 0.4 6 –6

0.2 VCCIO – 0.2 0.1 –0.1

LVCMOS 1.8 –0.3 0.35VCCIO 0.65VCCIO VCCIO + 0.2V 0.4 VCCIO – 0.4 4 –4

0.2 VCCIO – 0.2 0.1 –0.1

1. Some products are clamped to a diode when VIN is larger than VCCIO.

Function Timing Units

Basic Functions

16-bit decoder 16.5 ns

4:1 MUX 18.0 ns

16:1 MUX 19.5 ns

Function Timing Units

Basic Functions

16:1 MUX 110 MHz

16-bit adder 100 MHz

16-bit counter 100 MHz

64-bit counter 40 MHz

Embedded Memory Functions

256x16 Pseudo-Dual Port RAM 150 MHz

1. The above timing numbers are generated using the iCECube2 design tool. Exact performance may vary with

device and tool version. The tool uses internal parameters that have been characterized but are not tested on

every device.

2. Using a VCC of 1.14 V at Junction Temp 85 oC.

3-5

DC and Switching Characteristics

iCE40LM Family Data Sheet

Derating Logic Timing

Logic timing provided in the following sections of the data sheet and the Lattice design tools are worst case num-

bers in the operating range. Actual delays may be much faster. Lattice design tools can provide logic timing num-

bers at a particular temperature and voltage.

Maximum sysIO Buffer Performance1

iCE40LM Family Timing Adders

Over Recommended Commercial Operating Conditions1, 2, 3

I/O Standard Max. Speed Units

Inputs

LVCMOS33 250 MHz

LVCMOS25 250 MHz

LVCMOS18 250 MHz

Outputs

LVCMOS33 250 MHz

LVCMOS25 250 MHz

LVCMOS18 155 MHz

1. Measured with a toggling pattern.

Buffer Type Description Timing (Typ.) Units

Input Adjusters

LVC M O S3 3 LVCMOS, VCCIO = 3.3 V 0.18 nS

LVC M O S2 5 LVCMOS, VCCIO = 2.5 V 0.00 nS

LVC M O S1 8 LVCMOS, VCCIO = 1.8 V 0.19 nS

Output Adjusters

LVC M O S3 3 LVCMOS, VCCIO = 3.3 V –0.12 nS

LVC M O S2 5 LVCMOS, VCCIO = 2.5 V 0.00 nS

LVC M O S1 8 LVCMOS, VCCIO = 1.8 V 1.32 nS

1. Timing adders are relative to LVCMOS25 and characterized but not tested on every device.

2. LVCMOS timing measured with the load specified in Switching Test Condition table.

3. Commercial timing numbers are shown.

3-6

DC and Switching Characteristics

iCE40LM Family Data Sheet

iCE40LM External Switching Characteristics

Over Recommended Commercial Operating Conditions

Parameter Description Device Units

Clocks

Global Clocks

fMAX_GBUF Frequency for Global Buffer Clock network All devices 185 MHz

tW_GBUF Clock Pulse Width for Global Buffer All devices 2 — ns

tSKEW_GBUF Global Buffer Clock Skew Within a Device All devices — 650 ps

Pin-LUT-Pin Propagation Delay

tPD Best case propagation delay through one

LUT logic All devices — 9.1 ns

General I/O Pin Parameters (Using Global Buffer Clock without PLL)1

tSKEW_IO Data bus skew across a bank of IOs All devices — 450 ps

tCO Clock to Output - PIO Output Register All devices — 11.5 ns

tSU Clock to Data Setup - PIO Input Register All devices –0.23 — ns

tHClock to Data Hold - PIO Input Register All devices 5.55 — ns

1. 25-pin WLCSP package does not support PLL.

3-7

DC and Switching Characteristics

iCE40LM Family Data Sheet

sysCLOCK PLL Timing – Preliminary

Over Recommended Operating Conditions

Parameter Descriptions Conditions Min. Max. Units

fIN Input Clock Frequency

(REFERENCECLK, EXTFEEDBACK) 10 133 MHz

fOUT Output Clock Frequency (PLLOUT) 16 275 MHz

fVCO PLL VCO Frequency 533 1066 MHz

fPFD Phase Detector Input Frequency 10 133 MHz

AC Characteristics

tDT Output Clock Duty Cycle 40 60 %

tPH Output Phase Accuracy — +/–12 deg

tOPJIT1, 5, 6

Output Clock Period Jitter fOUT <= 100 MHz — 450 ps p-p

fOUT > 100 MHz — 0.5 UIPP

Output Clock Cycle-to-cycle Jitter fOUT <= 100 MHz — 750 ps p-p

fOUT > 100 MHz — 0.10 UIPP

Output Clock Phase Jitter fPFD <= 25 MHz — 275 ps p-p

fPFD > 25 MHz — 0.05 UIPP

tWOutput Clock Pulse Width At 90% or 10% 1.33 — ns

tLOCK2, 3 PLL Lock-in Time — 50 us

tUNLOCK PLL Unlock Time — 50 ns

tIPJIT4Input Clock Period Jitter fPFD  20 MHz — 1000 ps p-p

fPFD < 20 MHz — 0.02 UIPP

tFDTAP Fine Delay adjustment, per Tap 98 226 ps

tSTABLE3LATCHINPUTVALUE LOW to PLL Stable — 500 ns

tSTABLE_PW3LATCHINPUTVALUE Pulse Width 100 — ns

tRST RESET Pulse Width 10 — ns

tRSTREC RESET Recovery Time 10 — us

tDYNAMIC_WD DYNAMICDELAY Pulse Width 100 — VCO

Cycles

1. Period jitter sample is taken over 10,000 samples of the primary PLL output with a clean reference clock. Cycle-to-cycle jitter is taken over

1000 cycles. Phase jitter is taken over 2000 cycles. All values per JESD65B.

2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment.

3. At minimum fPFD. As the fPFD increases the time will decrease to approximately 60% the value listed.

4. Maximum limit to prevent PLL unlock from occurring. Does not imply the PLL will operate within the output specifications listed in this table.

5. The jitter values will increase with loading of the PLD fabric and in the presence of SSO noise.

6. PLL jitter and lock time measurements are based on an external clean clock source. With different clock source, these values maybe differ-

ent.

3-8

DC and Switching Characteristics

iCE40LM Family Data Sheet

SPI Master Configuration Time1

sysCONFIG Port Timing Specifications

Symbol Parameter Conditions Max. Units

tCONFIG POR/CRESET_B to Device I/O Active

All devices - Low Frequency (Default) 95 ms

All devices - Medium frequency 35 ms

All devices - High frequency 18 ms

1. Assumes sysMEM Block is initialized to an all zero pattern if they are used.

Symbol Parameter Conditions Min. Typ. Max. Units

All Configuration Modes

tCRESET_B

Minimum CRESET_B LOW pulse width

required to restart configuration, from

falling edge to rising edge

200 — — ns

tDONE_IO

Number of configuration clock cycles

after CDONE goes HIGH before the

PIO pins are activated

49 — — Cycles

Slave SPI

tCR_SCK

Minimum time from a rising edge on

CRESET_B until the first SPI WRITE

operation, first SPI_XCK clock. During

this time, the iCE40LM device is clear-

ing its internal configuration memory

1200 — — µs

fMAX CCLK clock frequency Write 1 — 25 MHz

Read1—15—MHz

tCCLKH CCLK clock pulsewidth HIGH 20 — — ns

tCCLKL CCLK clock pulsewidth LOW 20 — — ns

tSTSU CCLK setup time 12 — — ns

tSTH CCLK hold time 12 — — ns

tSTCO CCLK falling edge to valid output 13 — — ns

Master SPI

fMCLK MCLK clock frequency

Low Frequency

(Default)

6.5 13 MHz

Medium Frequency 19.5 38 MHz

High Frequency 33 66 MHz

tMCLK CRESET_B HIGH to first MCLK edge 1200 — — µs

1. Supported with 1.2 V Vcc and at 25 oC.

3-9

DC and Switching Characteristics

iCE40LM Family Data Sheet

Switching Test Conditions

Figure 3-1 shows the output test load used for AC testing. The specific values for resistance, capacitance, voltage,

and other test conditions are shown in Table 3-1.

Figure 3-1. Output Test Load, LVCMOS Standards

Table 3-1. Test Fixture Required Components, Non-Terminated Interfaces

Test Condition R1CLTiming Reference VT

LVCMOS settings (L -> H, H -> L) 0 pF

LVCMOS 3.3 = 1.5 V —

LVCMOS 2.5 = VCCIO/2 —

LVCMOS 1.8 = VCCIO/2 —

LVCMOS 3.3 (Z -> H)

188 0 pF

1.5 VOL

LVCMOS 3.3 (Z -> L) 1.5 VOH

Other LVCMOS (Z -> H) VCCIO/2 VOL

Other LVCMOS (Z -> L) VCCIO/2 VOH

LVCMOS (H -> Z) VOH - 0.15 VOL

LVCMOS (L -> Z) VOL - 0.15 VOH

Note: Output test conditions for all other interfaces are determined by the respective standards.

DUT

Test Poi n t

www.latticesemi.com 4-1 DS1045 Pinout Information_01.4

March 2016 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Signal Descriptions

Signal Name Function I/O Description

Power Supplies

VCC Power — Core Power Supply

VCCIO_0,

VCCIO_2

Power — Power for I/Os in Bank 0 and 2.

VCC_SPI Power — Power supply for SPI1 ports. For 25-pin WLCSP and

36-pin ucBGA packages, this signal is connected to

VCCIO_2.

VCCPLL Power — Power supply for PLL. For 25-pin WLCSP, this is con-

nected internally to VCC.

GND/GNDPLL GROUND — Ground

Configuration

CRESETB Configuration I Configuration Reset, active LOW. No internal pull-up

resistor. Either actively driven externally or connect

an 10 kOhm pull-up to VCCIO_2.

CDONE Configuration I/O Configuration Done. Includes a weak pull-up resistor

to VCCIO_2.

Config SPI

Primary Secondary

PIOB_xx[HD] SPI_SCK Configuration I/O This pin is shared with device configuration. During

configuration:

In Master SPI mode, this pin outputs the clock to

external SPI memory.

In Slave SPI mode, this pin inputs the clock from

external processor.

General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function [HD]=High

Drive I/O.

PIOB_xx[HD] SPI_SDO Configuration Output This pin is shared with device configuration. During

configuration:

In Master SPI mode, this pin outputs the command

data to external SPI memory.

In Slave SPI mode, this pin connects to the MISO pin

of the external processor.

General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function [HD]=High

Drive I/O.

PIOB_xx[HD] SPI_SI Configuration Input This pin is shared with device configuration. During

configuration:

In Master SPI mode, this pin receives data from exter-

nal SPI memory.

In Slave SPI mode, this pin connects to the MOSI pin

of the external processor.

General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function [HD]=High

Drive I/O.

iCE40LM Family Data Sheet

Pinout Information

4-2

Pinout Information

iCE40LM Family Data Sheet

PIOB_xx[HD] SPI_SS_B Configuration I/O This pin is shared with device configuration. During

configuration:

In Master SPI mode, this pin outputs to the external

SPI memory.

In Slave SPI mode, this pin inputs from the external

processor.

General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function [HD]=High

Drive I/O.

Global Signals

Primary Secondary

PIOT_xx G0 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G0 pin drives the GBUF0 global buffer.

PIOT_xx G1 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G1 pin drives the GBUF1 global buffer.

PIOT_xx G3 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G3 pin drives the GBUF3 global buffer.

PIOT_xx G4 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G4 pin drives the GBUF4 global buffer.

PIOT_xx G5 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G5 pin drives the GBUF5 global buffer.

PIOB_xx G6 General I/O I/O In user mode, after configuration, this pin can be pro-

grammed as general I/O in user function.

Global Input Global input used for high fanout, or clock/reset net.

The G6 pin drives the GBUF6 global buffer.

LED Signals

PIOT_xx General I/O I/O In user mode, with user's choice, this pin can be pro-

grammed as I/O in user function in the top (xx = I/O

location).

PIOB_xx General I/O I/O In user mode, with user's choice, this pin can be pro-

grammed as I/O in user function in the bottom (xx =

I/O location) [HD]=High Drive I/O.

Signal Name Function I/O Description

4-3

Pinout Information

iCE40LM Family Data Sheet

Pin Information Summary

Pin Type

iCE40LM-1K iCE40LM-2K iCE40LM-4K

SWG25 CM36 CM49 SWG25 CM36 CM49 SWG25 CM36 CM49

General Purpose I/O Per Bank Bank 0 7 15 20 7 15 20 7 15 20

Bank 2111 13 17 11 13 17 11 13 17

Total General Purpose I/Os 18 28 37 18 28 37 18 28 37

Vcc 112112112

Vccio Bank 0111111111

Bank 2111111111

VCC_SPI 001001001

VCCPLL 011011011

Miscellaneous Dedicated Pins 222222222

GND 224224224

NC 000000000

Reserved 000000000

Total Balls 25 36 49 25 36 49 25 36 49

SPI Interfaces Bank 0000000000

Bank 2111222222

I2C Interfaces Bank 0111222222

Bank 2000000000

1. Including General Purpose I/Os powered by VCC_SPI and VCCPLL.

www.latticesemi.com 5-1 DS1045 Order Info_01.4

March 2014 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

iCE40LM Part Number Description

Logic Cells

Package

SWG25 = 25-Ball WLCSP (0.35 mm Ball Pitch)

SWG25TR1K = 25-Ball WLCSP (0.35 mm Ball Pitch)

in tape and reel 1,000 units

CM36 = 36-Ball ucBGA (0.4mm Ball Pitch)

CM36TR1K = 36-Ball ucBGA (0.4mm Ball Pitch)

in tape and reel 1,000 units

CM49 = 49-Ball ucBGA (0.4mm Ball Pitch)

CM49TR1K = 49-Ball ucBGA (0.4mm Ball Pitch)

in tape and reel 1,000 units

Device Family

iCE40LM FPGA

iCE40LMXXX - XXXXXXX

1K = 1,100 Logic Cells

2K = 2,048 Logic Cells

4K = 3,520 Logic Cells

All parts are shipped in tape-and-reel.

Shipping Method

TR = Tape and Reel

TR1K = Tape and Reel 1,000 units

Ordering Part Numbers

Part Number LUTs Supply Voltage Package Leads Temp.

iCE40LM1K-SWG25TR 1100 1.2 V Halogen-Free caBGA 25 IND

iCE40LM1K-SWG25TR1K 1100 1.2 V Halogen-Free caBGA 25 IND

iCE40LM1K-CM36TR 1100 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM1K-CM36TR1K 1100 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM1K-CM49TR 1100 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM1K-CM49TR1K 1100 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM2K-SWG25TR 2048 1.2 V Halogen-Free caBGA 25 IND

iCE40LM2K-SWG25TR1K 2048 1.2 V Halogen-Free caBGA 25 IND

iCE40LM2K-CM36TR 2048 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM2K-CM36TR1K 2048 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM2K-CM49TR 2048 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM2K-CM49TR1K 2048 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM4K-SWG25TR 3520 1.2 V Halogen-Free caBGA 25 IND

iCE40LM4K-SWG25TR1K 3520 1.2 V Halogen-Free caBGA 25 IND

iCE40LM4K-CM36TR 3520 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM4K-CM36TR1K 3520 1.2 V Halogen-Free ucBGA 36 IND

iCE40LM4K-CM49TR 3520 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM4K-CM49TR1K 3520 1.2 V Halogen-Free ucBGA 49 IND

iCE40LM Family Data Sheet

Ordering Information

January 2014 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

www.latticesemi.com 6-1 DS1045 Further Info_01.1

For Further Information

A variety of technical notes for the iCE40 family are available on the Lattice web site.

• TN1248, iCE40 Programming and Configuration

• TN1274, iCE40 I2C and SPI Hardened IP Usage Guide

• TN1275, iCE40LM On-Chip Strobe Generator Usage Guide

• TN1276, Advanced iCE40 I2C and SPI Hardened IP Usage Guide

• TN1250, Memory Usage Guide for iCE40 Devices

• TN1251, iCE40 sysCLOCK PLL Design and Usage Guide

• iCE40LM Pinout Files

• iCE40LM Pin Migration Files

•Thermal Management document

•Lattice design tools

•Schematic Symbols

iCE40LM Family Data Sheet

Supplemental Information

March 2016 Data Sheet DS1045

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

www.latticesemi.com 7-1 DS1045 Revision History

Date Version Section Change Summary

March 2016 1.6 Architecture Updated Typical I/O Behavior During Power-up section. Indicated 36-pin

ucBGA in package in description.

DC and Switching

Characteristics

Updated Recommended Operating Conditions1 section. Revised foot-

note 5.

Pinout Information Updated Signal Descriptions section. General update of signal names

and descriptions.

March 2015 1.5 DC and Switching

Characteristics

Updated sysIO Single-Ended DC Electrical Characteristics section.

Changed LVCMOS 3.3 and LVCMOS 2. 5 VOH Min. (V) from 0.5 to 0.4.

August 2014 1.4 DC and Switching

Characteristics

Updated the Recommended Operating Conditions section. Added VCC

and VCCPLL information to footnote 1.

Updated Power Up Sequence section.Revised and added information

on required power up sequence.

March 2014 1.3 Ordering Information Updated Ordering Part Numbers section. Changed packages from

csBGA to ucBGA.

01.2 Architecture Updated Typical I/O Behavior During Power-up section. Added VCCIO_0

to the first statement.

Updated Power On Reset section. Added VCCIO_0 to the first statement.

Ordering Information Updated iCE40LM Part Number Description section. Added shipping

method and packages.

Added part numbers in Ordering Part Numbers section.

January 2014 01.1 All Updated document status from Advance.

Introduction Updated device features.

DC and Switching

Characteristics

Updated the following tables:

— sysCLOCK PLL Timing – Preliminary

— Supply Current

— sysCONFIG Port Timing Specifications.

Pinout Information Updated SPI and Config SPI Ports information in Signal Descriptions

table.

October 2013 01.0 All General updates for product launch.

Pinout Information Updated ball map to 25-pin WLCSP.

September 2013 00.2 EAP All General updates to all sections.

August 2013 00.1 EAP All Initial release.

iCE40LM Family Data Sheet

Revision History