DS90LV049HMTX/NOPB - NATIONAL SEMICONDUCTOR

DS90LV049H

DS90LV049H High Temperature 3V LVDS Dual Line Driver and Receiver Pair

Literature Number: SNLS200

DS90LV049H

High Temperature 3V LVDS Dual Line Driver and

Receiver Pair

General Description

The DS90LV049H is a dual CMOS flow-through differential

line driver-receiver pair designed for applications requiring

ultra low power dissipation, exceptional noise immunity, and

high data throughput. The device is designed to support data

rates in excess of 400 Mbps utilizing Low Voltage Differential

Signaling (LVDS) technology.

The DS90LV049H drivers accept LVTTL/LVCMOS signals

and translate them to LVDS signals. The receivers accept

LVDS signals and translate them to 3 V CMOS signals. The

LVDS input buffers have internal failsafe biasing that places

the outputs to a known H (high) state for floating receiver

inputs. In addition, the DS90LV049H supports a TRI-STATE

function for a low idle power state when the device is not in

use.

The EN and EN inputs are ANDed together and control the

TRI-STATE outputs. The enables are common to all four

gates.

Features

nHigh Temperature +125˚C Operating Range

nUp to 400 Mbps switching rates

nFlow-through pinout simplifies PCB layout

n50 ps typical driver channel-to-channel skew

n50 ps typical receiver channel-to-channel skew

n3.3 V single power supply design

nTRI-STATE output control

nInternal fail-safe biasing of receiver inputs

nLow power dissipation (70 mW at 3.3 V static)

nHigh impedance on LVDS outputs on power down

nConforms to TIA/EIA-644-A LVDS Standard

nAvailable in low profile 16 pin TSSOP package

Connection Diagram

Dual-In-Line

20161701

Order Number DS90LV049HMT

Order Number DS90LV049HMTX (Tape and Reel)

See NS Package Number MTC16

Functional Diagram

20161702

Truth Table

EN EN LVDS Out LVCMOS Out

L or Open L or Open OFF OFF

H L or Open ON ON

L or Open H OFF OFF

H H OFF OFF

September 2005

DS90LV049H High Temperature 3V LVDS Dual Line Driver and Receiver Pair

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (V

) −0.3Vto+4V

LVCMOS Input Voltage (D

) −0.3Vto(V

+ 0.3 V)

LVDS Input Voltage (R

IN+

IN-

) −0.3 V to +3.9 V

Enable Input Voltage (EN, EN) −0.3Vto(V

+ 0.3 V)

LVCMOS Output Voltage (R

OUT

) −0.3Vto(V

+ 0.3 V)

LVDS Output Voltage

OUT+

OUT-

) −0.3 V to +3.9 V

LVCMOS Output Short Circuit

Current (R

OUT

) 100 mA

LVDS Output Short Circuit

Current (D

OUT+

OUT−

)24mA

LVDS Output Short Circuit

Current Duration(D

OUT+

OUT−

) Continuous

Storage Temperature Range −65˚C to +150˚C

Lead Temperature Range

Soldering (4 sec.) +260˚C

Maximum Junction Temperature +150˚C

Maximum Package Power Dissipation @+25˚C

MTC Package 866 mW

Derate MTC Package 6.9 mW/˚C above +25˚C

ESD Rating

(HBM, 1.5 kΩ, 100 pF) ≥7kV

(MM, 0 Ω, 200 pF) ≥250 V

Recommended Operating

Conditions

Min Typ Max Units

Supply Voltage (V

) +3.0 +3.3 +3.6 V

Operating Free Air

Temperature (T

) −40 +25 +125 ˚C

Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 4, 6)

Symbol Parameter Conditions Pin Min Typ Max Units

LVCMOS Input DC Specifications (Driver Inputs, ENABLE Pins)

Input High Voltage

2.0 V

Input Low Voltage GND 0.8 V

Input High Current V

−10 1 +10 µA

Input Low Current V

= GND −10 −0.1 +10 µA

Input Clamp Voltage I

= −18 mA −1.5 −0.6 V

LVDS Output DC Specifications (Driver Outputs)

| Differential Output Voltage

= 100 Ω

(Figure 1)

250 350 450 mV

∆V

Change in Magnitude of V

for

Complementary Output States

1 35 |mV|

Offset Voltage 1.125 1.23 1.375 V

∆V

Change in Magnitude of V

for

Complementary Output States

1 25 |mV|

Output Short Circuit Current

(Note 14)

ENABLED,

OUT+

=0Vor

= GND, D

OUT−

=0V

OUT−

OUT+

−5.8 −9.0 mA

OSD

Differential Output Short Circuit

Current (Note 14) ENABLED, V

=0V −5.8 −9.0 mA

OFF

Power-off Leakage V

OUT

=0Vor3.6V

=0VorOpen

−20 ±1 +20 µA

Output TRI-STATE Current EN=0VandEN=V

OUT

=0VorV

−10 ±1 +10 µA

LVDS Input DC Specifications (Receiver Inputs)

Differential Input High Threshold V

= 1.2 V, 0.05 V, 2.35 V −15 35 mV

Differential Input Low Threshold

IN+

IN-

-100 −15 mV

CMR

Common-Mode Voltage Range V

= 100 mV, V

=3.3 V 0.05 3 V

Input Current

=3.6 V

=0 V or 2.8 V −12 ±4 +12 µA

=0 V

=0Vor2.8Vor3.6V −10 ±1 +10 µA

DS90LV049H

www.national.com 2

Electrical Characteristics (Continued)

Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 4, 6)

Symbol Parameter Conditions Pin Min Typ Max Units

LVCMOS Output DC Specifications (Receiver Outputs)

Output High Voltage I

= -0.4 mA, V

= 200 mV

OUT

2.7 3.3 V

Output Low Voltage I

= 2 mA, V

= 200 mV 0.05 0.25 V

Output TRI-STATE Current Disabled, V

OUT

=0VorV

-10 ±1 +10 µA

General DC Specifications

Power Supply Current (Note 3) EN = 3.3 V V

21 35 mA

DDZ

TRI-State Supply Current EN=0V 15 25 mA

Switching Characteristics

= +3.3V ±10%, T

= −40˚C to +125˚C (Notes 4, 13)

Symbol Parameter Conditions Min Typ Max Units

LVDS Outputs (Driver Outputs)

PHLD

Differential Propagation Delay High to Low

= 100 Ω

(Figure 2 and Figure 3)

0.7 2 ns

PLHD

Differential Propagation Delay Low to High 0.7 2 ns

SKD1

Differential Pulse Skew |t

PHLD

−t

PLHD

(Notes 5, 7) 0 0.05 0.4 ns

SKD2

Differential Channel-to-Channel Skew

(Notes 5, 8)

0 0.05 0.5 ns

SKD3

Differential Part-to-Part Skew (Notes 5, 9) 0 1.0 ns

TLH

Rise Time (Note 5) 0.2 0.4 1 ns

THL

Fall Time (Note 5) 0.2 0.4 1 ns

PHZ

Disable Time High to Z

= 100 Ω

(Figure 4 and Figure 5)

1.5 3 ns

PLZ

Disable Time Low to Z 1.5 3 ns

PZH

Enable Time Z to High 1 3 6 ns

PZL

Enable Time Z to Low 1 3 6 ns

MAX

Maximum Operating Frequency (Note 16) 200 250 MHz

LVCMOS Outputs (Receiver Outputs)

PHL

Propagation Delay High to Low

(Figure 6 and Figure 7)

0.5 2 3.5 ns

PLH

Propagation Delay Low to High 0.5 2 3.5 ns

SK1

Pulse Skew |t

PHL

−t

PLH

| (Note 10) 0 0.05 0.4 ns

SK2

Channel-to-Channel Skew (Note 11) 0 0.05 0.5 ns

SK3

Part-to-Part Skew (Note 12) 0 1.0 ns

TLH

Rise Time(Note 5) 0.3 0.9 1.4 ns

THL

Fall Time(Note 5) 0.3 0.75 1.4 ns

PHZ

Disable Time High to Z

(Figure 8 and Figure 9)

3 5.6 8 ns

PLZ

Disable Time Low to Z 3 5.4 8 ns

PZH

Enable Time Z to High 2.5 4.6 7 ns

PZL

Enable Time Z to Low 2.5 4.6 7 ns

MAX

Maximum Operating Frequency (Note 17) 200 250 MHz

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices

should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.

Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VTH,V

TL,

VOD and ∆VOD.

Note 3: Both, driver and receiver inputs are static. All LVDS outputs have 100 Ωload. All LVCMOS outputs are floating. None of the outputs have any lumped

capacitive load.

Note 4: All typical values are given for: VDD = +3.3 V, TA= +25˚C.

Note 5: These parameters are guaranteed by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage,

temperature) ranges.

Note 6: The DS90LV049H’s drivers are current mode devices and only function within datasheet specifications when a resistive load is applied to their outputs. The

typical range of the resistor values is 90 Ωto 110 Ω.

Note 7: tSKD1 or differential pulse skew is defined as |tPHLD −t

PLHD|. It is the magnitude difference in the differential propagation delays between the positive going

edge and the negative going edge of the same driver channel.

DS90LV049H

www.national.com3

Switching Characteristics (Continued)

Note 8: tSKD2 or differential channel-to-channel skew is defined as the magnitude difference in the differential propagation delays between two driver channels on

the same device.

Note 9: tSKD3 or differential part-to-part skew is defined as |tPLHD Max −t

PLHD Min|or|t

PHLD Max −t

PHLD Min|. It is the difference between the minimum and maximum

specified differential propagation delays. This specification applies to devices at the same VDD and within 5˚C of each other within the operating temperature range.

Note 10: tSK1 or pulse skew is defined as |tPHL −t

PLH|. It is the magnitude difference in the propagation delays between the positive going edge and the negative

going edge of the same receiver channel.

Note 11: tSK2 or channel-to-channel skew is defined as the magnitude difference in the propagation delays between two receiver channels on the same device.

Note 12: tSK3 or part-to-part skew is defined as |tPLH Max −t

PLH Min|or|t

PHL Max −t

PHL Min|. It is the difference between the minimum and maximum specified

propagation delays. This specification applies to devices at the same VDD and within 5˚C of each other within the operating temperature range.

Note 13: Generator waveform for all tests unless otherwise specified:f=1MHz, ZO=50Ω,t

r≤1 ns, and tf≤1 ns.

Note 14: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.

Note 15: All input voltages are for one channel unless otherwise specified. Other inputs are set to GND.

Note 16: fMAX generator input conditions: tr=t

f<1 ns (0% to 100%), 50% duty cycle,0Vto3V.Output Criteria: duty cycle = 45%/55%, VOD >250 mV, all channels

switching.

Note 17: fMAX generator input conditions: tr=t

f<1 ns (0% to 100%), 50% duty cycle, VID = 200 mV, VCM = 1.2 V . Output Criteria: duty cycle = 45%/55%, VOH

>2.7 V, VOL <0.25 V, all channels switching.

Parameter Measurement Information

20161703

FIGURE 1. Driver V

and V

Test Circuit

20161704

FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit

DS90LV049H

www.national.com 4

Parameter Measurement Information (Continued)

20161705

FIGURE 3. Driver Propagation Delay and Transition Time Waveforms

20161706

FIGURE 4. Driver TRI-STATE Delay Test Circuit

DS90LV049H

www.national.com5

Parameter Measurement Information (Continued)

20161707

FIGURE 5. Driver TRI-STATE Delay Waveform

20161709

FIGURE 6. Receiver Propagation Delay and Transition Time Test Circuit

20161710

FIGURE 7. Receiver Propagation Delay and Transition Time Waveforms

DS90LV049H

www.national.com 6

Parameter Measurement Information (Continued)

Typical Application

20161711

FIGURE 8. Receiver TRI-STATE Delay Test Circuit

20161714

FIGURE 9. Receiver TRI-STATE Delay Waveforms

20161708

FIGURE 10. Point-to-Point Application

DS90LV049H

www.national.com7

Applications Information

General application guidelines and hints for LVDS drivers

and receivers may be found in the following application

notes: LVDS Owner’s Manual (lit #550062-003), AN-805,

AN-808, AN-903, AN-916, AN-971, AN-977.

LVDS drivers and receivers are intended to be primarily used

in an uncomplicated point-to-point configuration as is shown

in Figure 10. This configuration provides a clean signaling

environment for the fast edge rates of the drivers. The re-

ceiver is connected to the driver through a balanced media

which may be a standard twisted pair cable, a parallel pair

cable, or simply PCB traces. Typically, the characteristic

differential impedance of the media is in the range of 100 Ω.

A termination resistor of 100 Ω(selected to match the me-

dia), and is located as close to the receiver input pins as

possible. The termination resistor converts the driver output

current (current mode) into a voltage that is detected by the

receiver. Other configurations are possible such as a multi-

receiver configuration, but the effects of a mid-stream con-

nector(s), cable stub(s), and other impedance discontinuities

as well as ground shifting, noise margin limits, and total

termination loading must be taken into account.

The TRI-STATE function allows the device outputs to be

disabled, thus obtaining an even lower power state when the

transmission of data is not required.

The DS90LV049H has a flow-through pinout that allows for

easy PCB layout. The LVDS signals on one side of the

device easily allows for matching electrical lengths of the

differential pair trace lines between the driver and the re-

ceiver as well as allowing the trace lines to be close together

to couple noise as common-mode. Noise isolation is

achieved with the LVDS signals on one side of the device

and the TTL signals on the other side.

POWER DECOUPLING RECOMMENDATIONS

Bypass capacitors must be used on power pins. Use high

frequency ceramic (surface mount is recommended) 0.1 µF

and 0.001 µF capacitors in parallel at the power supply pin

with the smallest value capacitor closest to the device supply

pin. Additional scattered capacitors over the printed circuit

board will improve decoupling. Multiple vias should be used

to connect the decoupling capacitors to the power planes. A

10 µF (35 V) or greater solid tantalum capacitor should be

connected at the power entry point on the printed circuit

board between the supply and ground.

PC BOARD CONSIDERATIONS

Use at least 4 PCB layers (top to bottom); LVDS signals,

ground, power, TTL signals.

Isolate TTL signals from LVDS signals, otherwise the TTL

may couple onto the LVDS lines. It is best to put TTL and

LVDS signals on different layers which are isolated by a

power/ground plane(s).

Keep drivers and receivers as close to the (LVDS port side)

connectors as possible.

DIFFERENTIAL TRACES

Use controlled impedance traces which match the differen-

tial impedance of your transmission medium (i.e. cable) and

termination resistor. Run the differential pair trace lines as

close together as possible as soon as they leave the IC

(stubs should be <10 mm long). This will help eliminate

reflections and ensure noise is coupled as common-mode.

In fact, we have seen that differential signals which are 1 mm

apart radiate far less noise than traces 3 mm apart since

magnetic field cancellation is much better with the closer

traces. In addition, noise induced on the differential lines is

much more likely to appear as common-mode which is re-

jected by the receiver.

Match electrical lengths between traces to reduce skew.

Skew between the signals of a pair means a phase differ-

ence between signals which destroys the magnetic field

cancellation benefits of differential signals and EMI will re-

sult. (Note the velocity of propagation, v = c/Er where c (the

speed of light) = 0.2997 mm/ps or 0.0118 in/ps). Do not rely

solely on the autoroute function for differential traces. Care-

fully review dimensions to match differential impedance and

provide isolation for the differential lines. Minimize the num-

ber or vias and other discontinuities on the line.

Avoid 90˚ turns (these cause impedance discontinuities).

Use arcs or 45˚ bevels.

Within a pair of traces, the distance between the two traces

should be minimized to maintain common-mode rejection of

the receivers. On the printed circuit board, this distance

should remain constant to avoid discontinuities in differential

impedance. Minor violations at connection points are allow-

able.

TERMINATION

Use a termination resistor which best matches the differen-

tial impedance or your transmission line. The resistor should

be between 90 Ωand 130 Ω. Remember that the current

mode outputs need the termination resistor to generate the

differential voltage. LVDS will not work without resistor ter-

mination. Typically, connecting a single resistor across the

pair at the receiver end will suffice.

Surface mount 1% to 2% resistors are best. PCB stubs,

component lead, and the distance from the termination to the

receiver inputs should be minimized. The distance between

the termination resistor and the receiver should be <10 mm

(12 mm MAX).

PROBING LVDS TRANSMISSION LINES

Always use high impedance (>100 kΩ), low capacitance

(<2 pF) scope probes with a wide bandwidth (1 GHz)

scope. Improper probing will give deceiving results.

CABLES AND CONNECTORS, GENERAL COMMENTS

When choosing cable and connectors for LVDS it is impor-

tant to remember:

Use controlled impedance media. The cables and connec-

tors you use should have a matched differential impedance

of about 100 Ω. They should not introduce major impedance

discontinuities.

Balanced cables (e.g. twisted pair) are usually better than

unbalanced cables (ribbon cable, simple coax.) for noise

reduction and signal quality. Balanced cables tend to gener-

ate less EMI due to field canceling effects and also tend to

pick up electromagnetic radiation a common-mode (not dif-

ferential mode) noise which is rejected by the receiver.

FAIL-SAFE FEATURE

An LVDS receiver is a high gain, high speed device that

amplifies a small differential signal (20 mV) to CMOS logic

levels. Due to the high gain and tight threshold of the re-

ceiver, care should be taken to prevent noise from appearing

as a valid signal.

DS90LV049H

www.national.com 8

Applications Information (Continued)

The receiver’s internal fail-safe circuitry is designed to

source/sink a small amount of current, providing fail-safe

protection (a stable known state of HIGH output voltage) for

floating receiver inputs.

The DS90LV049H has two receivers, and if an application

requires a single receiver, the unused receiver inputs should

be left OPEN. Do not tie unused receiver inputs to ground or

any other voltages. The input is biased by internal high value

pull up and pull down current sources to set the output to a

HIGH state. This internal circuitry will guarantee a HIGH,

stable output state for open inputs.

External lower value pull up and pull down resistors (for a

stronger bias) may be used to boost fail-safe in the presence

of higher noise levels. The pull up and pull down resistors

should be in the 5 kΩto 15 kΩrange to minimize loading and

waveform distortion to the driver. The common-mode bias

point should be set to approximately 1.2 V (less than 1.75 V)

to be compatible with the internal circuitry.

For more information on failsfe biasing of LVDS interfaces

please refer to AN-1194.

Pin Descriptions

Pin No. Name Description

10, 11 D

Driver input pins, LVCMOS levels. There is a pull-down current

source present.

6, 7 D

OUT+

Non-inverting driver output pins, LVDS levels.

5, 8 D

OUT−

Inverting driver output pins, LVDS levels.

2, 3 R

IN+

Non-inverting receiver input pins, LVDS levels. There is a pull-up

current source present.

1, 4 R

IN-

Inverting receiver input pins, LVDS levels. There is a pull-down

current source present.

14, 15 R

OUT

Receiver output pins, LVCMOS levels.

9, 16 EN, EN Enable and Disable pins. There are pull-down current sources

present at both pins.

12 V

Power supply pin.

13 GND Ground pin.

Typical Performance Curves

Differential Output Voltage

vs Load Resistor

Power Supply Current

vs Frequency

20161719 20161721

DS90LV049H

www.national.com9

Physical Dimensions inches (millimeters) unless otherwise noted

16-Lead (0.100" Wide) Molded Thin Shrink Small Outline Package, JEDEC

Order Number DS90LV049HMT

Order Number DS90LV049HMTX (Tape and Reel)

NS Package Number MTC16

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves

the right at any time without notice to change said circuitry and specifications.

For the most current product information visit us at www.national.com.

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WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR

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(b) support or sustain life, and whose failure to perform when

properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to result

in a significant injury to the user.

2. A critical component is any component of a life support

device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or

system, or to affect its safety or effectiveness.

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DS90LV049H High Temperature 3V LVDS Dual Line Driver and Receiver Pair

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