Metal Element Current Sense Resistor ULR Series * * * * * * Robust metal strip able to withstand high temperature and high current. Low TCR and Inductance Resistance Range from 0.5 m to 50 m Power ratings from 1W to 3W in 1206, 2010 and 2512 chip size Designed for current sense circuits in power electronic systems Higher wattage devices feature PCB clearance gap to maximize thermal performance Electrical Data IRC Type Coating1 Power rating at 80C (Watts) Standard Resistance Values (m)2 TCR Tolerance Dielectric (ppm/C) (%) Withstanding Voltage (Volts) 1 - 10 50 1206 Chip Size ULRG1 Green 1 ULRB1 Black 1 5, 10 100 20, 25 75 1.5 1 - 10 50 1 11 - 15 50 2 7 - 10 50 2.5 4-6 50 0.5 - 0.75 100 1-3 50 75 1, 5 100 1, 5 100 1, 5 200 2010 Chip Size ULRG15 Green 2512 Chip Size ULRG1 ULRG2 ULRG25 Green ULRG3 3 ULRB1 1 11, 12, 15, 18, 20, 25, 30, 33, 40, 50 2 1, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, 10 Black ULRB2 100 Notes: 1.Black coating = wave or IR reflow soldering; Green coating = IR reflow solder. Wave reflow - solder mask must match the W and D dimensions on page 2 of data sheet. 2Non-listed resistance values available (contact factory). For non-listed resistance values above 20 m, please refer to our LRC / LRF series. 3 Package sizes 2010 and 1206 with the green coating are uncoated on the top surface and unmarked for resistance value. Environmental Data Test Short Term Overload (5x rated power for 5 seconds) R/R 0.5% + 0.5 m (black); R/R 1% (green) Load at rated power (1000 hours cyclic load @ 70C) R/R 1% + 0.5 m (black); R/R 1% (green) Temperatature Cycling (-55C to +150C; 1000 cycles) R/R 0.5% + 0.5 m (black); R/R 1% (green) Dry Heat (+170C, no load; 1000 hours) R/R 0.5% + 0.5 m (black); R/R 1% (green) Resistance to Solder Heat (260C for 10 seconds) R/R 0.5% + 0.5 m (black); R/R 1% (green) Solderability (235C for 2 seconds) Minimum 95% coverage Resistance to Solvents No deterioration of protective coating or marking Operating Temperature -55C to 170C General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com A Subsidiary of TT electronics plc ULR Issue December 2009 Sheet 1 of 6 Physical Data D L T W Coating Resistance Value (m) 1206 Chip Size L W T D (1 Watt) Green 1 - 10 3.2 0.25 1.6 0.10 0.6 0.2 0.98 0.38 Black 5 - 20 3.2 0.2 1.6 0.2 0.6 0.2 0.5 0.3 5.08 0.25 2.54 0.15 0.6 0.2 1.67 0.63 2010 Chip Size Green 2512 Chip Size Green Black (1.5 Watt) 1 - 10 (1 Watt, 2 Watt, 2.5 Watt, and 3 Watt) 0.5 2.68 0.25 0.75 2.48 0.25 1 - 1.5 1.43 0.25 2-3 4 6.35 0.25 3.18 0.35 0.6 0.2 1.18 0.25 2.18 0.25 5-6 1.93 0.25 7 1.43 0.25 8 - 20 1.18 0.25 2 > 2 - 50 6.4 0.2 3.2 0.2 0.6 0.2 2 0.2 0.9 0.2 Note: 1 Dimensions are for reference only Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com ULR Issue December 2009 Sheet 2 of 6 Electrical Connections 4-wire pad layout 2512 2-wire pad layout a 2512 4-wire measurement points a 2512 5.4 1.2 L 1.0 1.5 b 0.5 Probe dia. L unit: mm unit: mm 4-wire pad layout 1206 unit: mm 2-wire pad layout a unit: mm b 1.25 0.5 Probe dia. unit: mm unit: mm Resistance (m-ohm) a b L 2 3.1 4.0 1.3 1 2.04 1.2 4.1 2 1.74 1.8 3 1.24 4-5 2.04 2512 - Black > 2 - 50 0.5 2512 - Green 1206 2.6 L L Package 4-wire measurement points a 0.7 0.5 1206 2.1 4.0 2.78 0.9 Package 2010 - Green Resistance (m-ohm) a b 2.9 L 2.8 1.2 0.75 2.58 1.3 1 - 1.5 1.53 3.4 6-8 1.74 1.8 3.9 9 - 10 1.49 2.3 5 - 20 1.9 1 1.3 2-3 0.8 4-6 1.3 2-3 1.28 4 2.28 5-6 2.03 3.45 1.9 1206 - Black 2.4 7 1.53 3.4 8 - 20 1.28 3.9 1206 - Green 1.8 1.4 0.8 1.8 1.9 0.8 7-9 1.1 1.2 10 0.8 1.8 Note: 1 Green parts require the use of "D" dimensions on page 2 for parts being assembled in a wave reflow processes. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com ULR Issue December 2009 Sheet 3 of 6 Construction Black Type UL-94 V0 grade molding compound Ni / Sn Plating Resistive Alloy Copper Electrode A low TCR resistive alloy is coated with a molding compound that permits the part to be used in all reflow processes by controlling the solder attachment area. Copper electrode reduces resistance measurement sensitivity that can result from connection directly to the resistive alloy. Nickel / Tin plating provides a solder compliant surface. Green Type A low TCR alloy plate is grooved to set the final resistance. The lower faces are solder plated for connections, and the top surface is protectively coated and numerically marked with the resistance value, as described in Product Marking. This part is suitable for wave and IR reflow soldering processes. Wave reflow requires the solder mask to be dimensioned according to page 2 using the W and D dimensions of the part. Power Derating Curve Rated Power (%) Note: The power derating curve is a guidance based on a conservative design model. The ULR is a solid metal alloy construction that can withstand significantly greater operating temperatures than the conservative model permits. The protective coating will operate up to 260C and the alloy can withstand in exess of 350C. Therefore, the system thermal design will be a more significant design parameter due to the heat limitations of the solder joint. 100 50 0 0 70 170 Ambient Temperature (C) Thermal Images ULR Black 20 m at 2 Watts ULR Green 10 m at 2 Watts The above images are based on a standard test circuit board constructed of a four layer FR4 material with 2-ounce outer layers and 1-ounce inner layers, which is typical of many industry designs. Each of the above images are in ambient temperature conditions with no air flow. Contact IRC for more details or for other thermal image test data for specific resistance values and power levels. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com ULR Issue December 2009 Sheet 4 of 6 IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C / second max. 3C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100C 150C 60 -120 seconds 150C 200C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183C 60 - 150 seconds 217C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 10 - 30 seconds 20 - 40 seconds 6C / second max. 6C / second max. 6 minutes max. 8 minutes max. Average Ramp-up rate (Tsmax to Tp) Time within 5C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25C to Peak Temperature Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specified for the reflow profiles is a "supplier" minimum and a "user" maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 < 2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260C * 260C * 260C * 1.6 mm - 2.5 mm 260C * 250C * 245C * 2.5 mm 250C * 245C * 245C * Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com ULR Issue December 2009 Sheet 5 of 6 Plastic Tape Specification Top Tape D 0 E A F B T P1 Resistor P2 P0 W D direction of unreeling 1 1.4Min. Emboss Tape Size Resistance (m) A B W E F P0 P1 P2 D0 120.1 1.750.1 5.50.05 40.1 40.1 20.05 T ULR Green 0.5 - 7 2512 0.5 - 20 6.730.1 3.40.1 6.750.1 1.5+0.1, -0 0.810.1 1.5+0.1, -0 0.800.1 2010 1 - 10 2.850.1 5.550.1 120.1 1.750.1 5.50.05 40.1 40.1 20.05 1.550.05 0.850.1 1206 1 - 10 1.90.1 3.60.1 80.2 1.750.1 3.50.05 40.1 40.1 20.05 1.550.05 0.870.1 2512 1 - 50 3.60.2 6.90.2 120.2 1.750.1 5.50.05 40.05 40.1 20.05 1.5+0.1, -0 0.850.15 1206 5 - 20 2.00.15 3.60.2 8.00.2 1.750.1 3.50.05 40.1 40.1 20.05 1.5+0.1, -0 0.840.1 ULR Black Note: 1. 2. 3. 4. 5. The cumulative tolerance of 10 sprocket hole pitch is 0.2 mm. Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm. A & B measured 0.3 mm from the bottom of the packet. T measured at a point on the inside bottom of the packet to the top surface of the carrier. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole. Ordering Data Product Marking Specify type, resistance, tolerance, ROHS compliance and packaging. Example: Metal Element Current Sense Resistor, 1-watt, 10 m resistor. Part resistance is indicated by using two marking notation syles: * 4-digit: R002 = 2 m; R designates the decimal location in ohms. * 3-digit: 1M5 = 1.5 m; M designates the decimal location in milli-ohm. Sample Part No. ULR G 1 2512 R010 F LF SLT A IRC Type Coating Color Code G = Green, B = Black Power Rating (see specs table) Package Size Resistance Value (EIA 4-digit code) Example: 0.010 = R010 Tolerance (EIA format) F = 1%, J = 5% RoHS - Compliance LF = RoHS compliant Construction Packaging SLT = Standard Lead Tape Packaging Quantity Series ULR Green ULR Black Footprint Emboss Plastic Tape 2512 2,000 2010 2,000 1206 2,000 2512 4,000 1206 5,000 Reference Identifier Only applicable to black ULR Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com ULR Issue December 2009 Sheet 6 of 6