date 03/23/2020
page 1 of 2
SERIES: SF100 DESCRIPTION: THERMAL PAD
cuidevices.com
FEATURES
• 1.5 W/m*K thermal conductivity
• naturally tacky
• silicone based
• electrical isolation
• sizes to match CUI peltier footprints
SPECIFICATIONS
parameter test method/conditions/description min typ max units
material silicone elastomer
color blue
thickness ASTM D751 0.5 mm
specic gravity ASTM D297 2.2 g/cc
hardness ASTM D2240 15 80 shore OO
tensile strength ASTM D412 35 psi
continuous use temperature -58 200 °C
dielectric breakdown voltage ASTM D149 2500 V
dielectric constant (1 MHz) ASTM D150 6.0
volume resistivity ASTM D257 1013 Ω*cm
thermal conductivity ASTM D5470 1.5 W/m*K
RoHS yes
PART NUMBER KEY
Base Number Footprint Size (mm):
10x10 = 1010
15x15 = 1515
15x30 = 1530
20x20 = 2020
20x40 = 2040
26.25x50 = 2650
30x12 = 3012
30x30 = 3030
31.25x30 = 3130
40x40 = 4040
41.25x45 = 4145
50x50 = 5050
70x70 = 7070
SF100 - XXXX 05
Additional Resources: Product Page
date 03/23/2020 page 2 of 2CUI Devices SERIES: SF100 DESCRIPTION: THERMAL PAD
cuidevices.com
CUI Devices oers a one (1) year limited warranty. Complete warranty information is listed on our website.
CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no
responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any
component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to aect its safety or
eectiveness.
rev. description date
1.0 initial release 11/02/2018
1.01 brand update 03/23/2020
The revision history provided is for informational purposes only and is believed to be accurate.
REVISION HISTORY
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