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Page <1> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Features:
• High Q and low ESR performance at high frequency
• Quality improvement of telephone calls for low power
loss and better performance
Applications:
• Mobile telecommunication: Mobile phone, WLAN
• RF module: Power amplier, VCO
• Tuners
External Dimensions:
The outline of MLCC
Description:
MLCC consists of a conducting material and electrodes. To
manufacture a chip-type SMT and achieve miniaturization, high density
and high efciency, ceramic condensers are used.
WTC HH series MLCC is used at high frequencies generally have
a small temperature coefcient of capacitance, typical within the
±30ppm/°C required for NP0 (C0G) classication and have excellent
conductivity internal electrode. Thus, WTC HH series MLCC will be
with the feature of low ESR and high Q characteristics.
# Reow soldering only is recommended.
Size
Inch (mm)
L
(mm)
W
(mm)
T
(mm)/Symbol Remark MB
(mm)
0402 (1005) 1±0.05 0.5±0.05 0.5±0.05 N # 0.25
+0.05/-0.1
0603 (1608)
1.6±0.1 0.8±0.1 0.8±0.07 S
0.4±0.15
1.6
+0.15/-0.1
0.8
+0.15/-0.1
0.8
+0.15/-0.1 X
General Electrical Data:
Dielectric NP0
Size 0402, 0603
Capacitance* 0402: 0.5pF to 470pF** & 0603: 0.5pF to 3300pF
Capacitance tolerance
Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V
Q* Cap<30pF: Q≥400+20C; Cap≥30pF: Q≥1,000
Insulation resistance at Ur ≥10GΩ or R×C≥100Ω-F whichever is smaller
Operating temperature -55°C to +125°C
Capacitance change ±30ppm/°C
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temper ature and 30~70% related humidity.
Apply 1±0.2Vrms, 1MHz±10% for Cap≤1000pF and 1±0.2Vrms, 1kHz±10% for Cap>1,000pF.
** 0402, Capacitance <0.5pF: On request.
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Page <2> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Capacitance Range
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with "^" mark is expressed product with Ag/Ni/Sn terminations.
3. 0402, Capacitance <0.5pF: On request.
4. For more information about products with special capacitance or other data, please contact WTC local representative
DIELECTRIC NP0
SIZE 0402 0603
Rated Voltage 16 25 50 16 25 50 100
0.5pF (0R5) N^ N^ N^ S^ S^ S^ S^
0.6pF (0R6) N^ N^ N^ S^ S^ S^ S^
0.7pF (0R7) N^ N^ N^ S^ S^ S^ S^
0.8pF (0R8) N^ N^ N^ S^ S^ S^ S^
0.9pF (0R9) N^ N^ N^ S^ S^ S^ S^
1.0pF (1R0) N^ N^ N^ S^ S^ S^ S^
1.2pF (1R2) N^ N^ N^ S^ S^ S^ S^
1.5pF (1R5) N^ N^ N^ S^ S^ S^ S^
1.8pF (1R8) N^ N^ N^ S^ S^ S^ S^
2.2pF (2R2) N^ N^ N^ S^ S^ S^ S^
2.7pF (2R7) N^ N^ N^ S^ S^ S^ S^
3.3pF (3R3) N^ N^ N^ S^ S^ S^ S^
3.9pF (3R9) N^ N^ N^ S^ S^ S^ S^
4.7pF (4R7) N^ N^ N^ S^ S^ S^ S^
5.6pF (5R6) N^ N^ N^ S^ S^ S^ S^
6.8pF (6R8) N^ N^ N^ S^ S^ S^ S^
8.2pF (8R2) N^ N^ N^ S^ S^ S^ S^
10pF (100) N N N S S S S
12pF (120) N N N S S S S
15pF (150) N N N S S S S
18pF (180) N N N S S S S
22pF (220) N N N S S S S
27pF (270) N N N S S S S
33pF (330) N N N S S S S
DIELECTRIC NP0
SIZE 0402 0603
Rated Voltage 16 25 50 16 25 50 100
39pF (390) N N N S S S S
47pF (470) N N N S S S S
56pF (560) N N N S S S S
68pF (680) N N N S S S S
82pF (820) N N N S S S S
100pF (101) N N N S S S S
120pF (121) N N N S S S S
150pF (151) N N N S S S S
180pF (181) N N N S S S S
220pF (221) N N N S S S S
270pF (271) N N N S S S S
330pF (331) N N N S S S S
390pF (391) N N N S S S S
470pF (471) N N N S S S S
560pF (561) S S S S
680pF (681) S S S S
820pF (821) S S S S
1,000pF (102) S S S S
1,200pF (122) XXX
1,500pF (152) XXX
1,800pF (182) XXX
2,200pF (222) XXX
2,700pF (272) XXX
3,300pF (332) XXX
Capacitance
Capacitance
Size Thickness (mm)/Symbol Paper Tape
7" reel 13" reel
0402 0.5±0.05 N10,000 20,000
0603 0.8±0.07 S4,000 15,000
0.8+0.15/-0.1 X
Unit : pieces
Packaging Dimension And Quantity:
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Page <3> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Reliability Test Conditions and Requirements:
No Item Test Condition Requirements
1Visual and
Mechanical -
No remarkable defect
Dimensions to conform to individual specication
sheet
2Capacitance Cap≤1,000pF, 1±0.2Vrms, 1MHz±10%
Cap>1,000pF, 1±0.2Vrms, 1kHz±10%
At 25°C ambient temperature
Shall not exceed the limits given in the detailed
spec
3Q/ D.F.
(Dissipation Factor)
NP0: Cap≥30pF, Q≥1,000; Cap<30pF,
Q≥400+20C
4Dielectric Strength
To apply voltage: ( ≤100V ) 250% of rated
voltage
Duration: 1 to 5 sec
Charge and discharge current less than
50mA
No evidence of damage or ash over during test
To apply voltage:
200V~300V ≥2 times V DC
500V~999V ≥1.5 times V DC
Cut-off, set at 10mA
TEST= 15 sec.
RAMP=0
5Insulation
Resistance
Rated voltage:<200V
To apply rated voltage for max. 120 sec. ≥10ΩG
Rated voltage:200~630V
To apply rated voltage (500V max.)
for 60 sec.
≥10GΩ or R×C≥100Ω-F whichever is smaller
6Temperature
Coefcient
With no electrical load.
Operating temperature: -55°C to +125°C
at 25°C
Capacitance change: within ±30ppm/°C
7Adhesive Strength
of Termination
Pressurizing force:
5N (≤0603) and 10N (>0603)
Test time: 10±1 sec.
No remarkable damage or removal of the
terminations
8Vibration
Resistance
Vibration frequency: 10~55 Hz/min.
Total amplitude: 1.5mm
Test time: 6hrs. (Two hrs each in three
mutually perpendicular directions.)
No remarkable damage
Cap change and Q/D.F.: To meet initial spec.
9Solderability Solder temperature: 235±5°C
Dipping time: 2±0.5 sec. 95% min. coverage of all metalized area
10 Bending Test
The middle part of substrate shall be
pressurized by means of the pressurizing rod
at a rate of about 1 mm per second until the
deection becomes 1 mm and then the
pressure shall be maintained for 5±1 sec.
Measurement to be made after keeping at
room temp. for 24±2 hrs.
No remarkable damage
Cap change: within ±5.0% or ±0.5pF whichever is
larger
(This capacitance change means the change of
capacitance under specied exure of substrate
from the capacitance measured before the test.)
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Page <4> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
No Item Test Condition Requirements
11 Resistance to
Soldering Heat
Solder temperature: 260±5°C
Dipping time: 10±1 sec
Preheating: 120 to 150°C for 1 minute
before immerse the capacitor in a eutectic
solder
Measurement to be made after keeping at
room temp. for 24±2 hrs. (Class I) or 48±4
hrs. (Class II)
No remarkable damage
Cap change: within ±2.5% or ±0.25pF whichever
is larger
Q/D.F., I.R. and dielectric strength: To meet initial
requirements
25% max. leaching on each edge
12 Temperature Cycle
Conduct the ve cycles according to the
temperatures and time
Step Temp.
(°C)
Time
(Min.)
1Min. operating temp.
+0/-3 30 ±3
2Room temp. 2~3
3Max. operating temp.
+3/-0 30 ±3
4Room temp. 2~3
Measurement to be made after keeping at
room temp. for 24±2 hrs.
No remarkable damage
Cap change: within ±2.5% or ±0.25pF whichever
is larger
Q/D.F., I.R. and dielectric strength: To meet initial
requirements
13 Humidity (Damp
Heat) Steady State
Test temp.: 40±2°C
Humidity: 90~95% RH
Test time: 500+24/-0hrs.
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage
Cap change: within ±5.0% or ±0.5pF whichever
is larger
Q/D.F. value:
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF,
Q≥275+2.5C Cap<10pF; Q≥200+10C
I.R.: ≥1GΩor RxC≥50Ω-F whichever is smaller
14 Humidity (Damp
Heat) Load
Test temp.: 40±2°C
Humidity: 90~95%RH
Test time: 500+24/-0 hrs.
To apply voltage: rated voltage (Max.
500V)
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage.
Cap change: within ±7.5% or ±0.75pF whichever
is larger.
Q/D.F. value:
NP0: Cap≥30pF, Q≥200; Cap<30pF,
Q≥100+10/3C
I.R.: ≥500MΩ or RxC≥25Ω-F whichever is smaller.
15 High Temperature
Load (Endurance)
Test temp.:
NP0: 125±3°C
To apply voltage:
(1) <500V: 200% of rated voltage.
(2) 500V: 150% of rated voltage.
(3) ≥630V: 120% of rated voltage.
Test time: 1000+24/-0 hrs.
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage.
Cap change: within ±3.0% or ±0.3pF whichever
is larger.
Q/D.F. value:
NP0: Cap≥30pF, Q≥350
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF, Q≥200+10C
I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
Reliability Test Conditions and Requirements:
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Page <5> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Electrical Characteristics
Q value criteria vs. Specic frequency
HH series, 0402
Capacitance (pF)
Q value criteria vs. Specic frequency
HH series, 0603
Capacitance (pF)
Q factor specication vs. Specic frequency for 0402
Q factor specication vs. Specic frequency for 0603
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Page <6> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Electrical Characteristics
ESR vs. Frequency 0402 ESR vs. Frequency 0603
0402 "HH" Series
0402 "HH" Series
0603 “HH” Series
0603 “HH” Series
SRF vs. Capacitance
Impedance vs. Frequency 0402 Impedance vs. Frequency 0603
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Page <7> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Appendixes
Tape & Reel Dimensions
Size 0402 0603
Thickness N S, X
A00.62 ±0.05 1.02 ±0.05
B01.12 ±0.05 1.8 ±0.05
T0.6 ±0.05 0.95 ±0.05
K0- -
W8 ±0.1 8 ±0.1
P04 ±0.1 4 ±0.1
10×P040 ±0.1 40 ±0.1
P12 ±0.05 4 ±0.1
P22 ±0.05 2 ±0.05
D01.55 ±0.05 1.55 ±0.05
D1- -
E1.75 ±0.05 1.75 ±0.05
F3.5 ±0.05 3.5 ±0.05
The dimension of paper tape
The dimension of plastic tape
The dimension of reel
Size 0402 & 0603
Reel size 7" 13"
C13 +0.5/-0.2 13 +0.5/-0.2
W18.4 +1.5/-0 8.4 +1.5/-0
A178 ±0.1 250 ±1
N60 +1/-0 100 ±1
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Page <8> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension
is needed.
Cautions:
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store
the capacitors in the ambience of corrosive gas (e.g., hydrogen sulde, sulfur dioxide, chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct
sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight
or dewing condition. To store products on the shelf and avoid exposure to moisture.
Recommended soldering conditions:
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature
and concentration of N2 within oven are recommended.
Recommended reow soldering prole for SMT
process with SnAgCu series solder paste.
Recommended wave soldering prole for
SMT process with SnAgCu series solder.
No. Name NP0* NP0
1 Ceramic material CaZrO3 / BaTiO3 based
2 Inner electrode AgPd alloy Ni
3
Termination
Inner layer Ag Cu
4 Middle layer Ni
5 Outer layer Sn
* Partial NP0 items are with Ag/Ni/Sn(NME) terminations, please ref to product
range for detail.
The construction of MLCC
Constructions:
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Page <9> V1.012/04/13
Multilayer Ceramic Capacitors
High Q / Low ESR Series
Part Number Table
Description Part Number
Capacitor, RF, 0.5PF, 50V, NP0, 0402 MC000269
Capacitor, RF, 0.5PF, 50V, NP0, 0402 MC000270
Capacitor, RF, 0.6PF, 50V, NP0, 0402 MC000271
Capacitor, RF, 0.8PF, 50V, NP0, 0402 MC000272
Capacitor, RF, 10PF, 50V, NP0, 0402 MC000273
Capacitor, RF, 100PF, 50V, NP0, 0402 MC000274
Capacitor, RF, 1PF, 50V, NP0, 0402 MC000275
Capacitor, RF, 1PF, 50V, NP0, 0402 MC000276
Capacitor, RF, 1.2PF, 50V, NP0, 0402 MC000277
Capacitor, RF, 1.5PF, 50V, NP0, 0402 MC000278
Capacitor, RF, 1.5PF, 50V, NP0, 0402 MC000279
Capacitor, RF, 1.8PF, 50V, NP0, 0402 MC000280
Capacitor, RF, 1.8PF, 50V, NP0, 0402 MC000281
Capacitor, RF, 2.2PF, 50V, NP0, 0402 MC000282
Capacitor, RF, 2.2PF, 50V, NP0, 0402 MC000283
Capacitor, RF, 2.7PF, 50V, NP0, 0402 MC000284
Capacitor, RF, 3PF, 50V, NP0, 0402 MC000285
Capacitor, RF, 3.9PF, 50V, NP0, 0402 MC000286
Capacitor, RF, 3.9PF, 50V, NP0, 0402 MC000287
Capacitor, RF, 4.7PF, 50V, NP0, 0402 MC000288
Capacitor, RF, 4.7PF, 50V, NP0, 0402 MC000289
Capacitor, RF, 5.1PF, 50V, NP0, 0402 MC000290
Capacitor, RF, 5.6PF, 50V, NP0, 0402 MC000291
Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000292
Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000293
Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000294
Capacitor, RF, 8.2PF, 50V, NP0, 0402 MC000295
Capacitor, RF, 0.75PF, 50V, NP0, 0402 MC000296
Capacitor, RF, 100PF, 50V, NP0, 0603 MC000297
Capacitor, RF, 1PF, 50V, NP0, 0603 MC000298
Capacitor, RF, 2.2PF, 50V, NP0, 0603 MC000299
Capacitor, RF, 2.7PF, 50V, NP0, 0603 MC000300
Capacitor, RF, 3.3PF, 50V, NP0, 0603 MC000301