SN54HCT08, SN74HCT08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS063D – NOVEMBER 1988 – REVISED AUIGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Operating Voltage Range of 4.5 V to 5.5 V
D
Outputs Can Drive Up To 10 LSTTL Loads
D
Low Power Consumption, 20-µA Max ICC
D
Typical tpd = 13 ns
D
±4-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
D
Inputs Are TTL-Voltage Compatible
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1Y
2A
2B
2Y
GND
VCC
4B
4A
4Y
3B
3A
3Y
SN54HCT08 ...J OR W PACKAGE
SN74HCT08 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
1B
1A
NC
3Y
3A V
4B
2Y
GND
NC
SN54HCT08 . . . FK PACKAGE
(TOP VIEW)
CC
NC – No internal connection
description/ordering information
These devices contain four independent 2-input AND gates. They perform the Boolean function
Y
+
A•BorY
+
A
)
B in positive logic.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
–40 C to 85 C
PDIP – N T ube of 25 SN74HCT08N SN74HCT08N
–40 C to 85 C
SOIC – D
T ube of 50 SN74HCT08D
HCT08
–40 C to 85 C
SOIC – D
Reel of 2500 SN74HCT08DR
HCT08
–40 C to 85 C
Reel of 250 SN74HCT08DT
–40
°
C to 85
°
C
SOP – NS Reel of 2000 SN74HCT08NSR HCT08
SSOP – DB Reel of 2000 SN74HCT08DBR HT08
TSSOP – PW
T ube of 90 SN74HCT08PW
HT08
TSSOP – PW
Reel of 2000 SN74HCT08PWR
HT08
Reel of 250 SN74HCT08PWT
–55 C to 125 C
CDIP – J T ube of 25 SNJ54HCT08J SNJ54HCT08J
–55
°
C to 125
°
C
CFP – W T ube of 150 SNJ54HCT08W SNJ54HCT08W
LCCC – FK T ube of 55 SNJ54HCT08FK SNJ54HCT08FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
SN54HCT08, SN74HCT08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS063D – NOVEMBER 1988 – REVISED AUIGUST 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A B
OUTPUT
Y
H H H
LXL
X L L
logic diagram (positive logic)
A
BY
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT08 SN74HCT08
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 2 V
VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
∆t/∆vInput transition rise/fall time 500 500 ns
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54HCT08, SN74HCT08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS063D – NOVEMBER 1988 – REVISED AUIGUST 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HCT08 SN74HCT08
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
VOH
IOH = –20 µA
4.5 V
4.4 4.499 4.4 4.4
V
VOH
IOH = –4 mA
4.5 V
3.98 4.3 3.7 3.84
V
VOL
IOL = 20 µA
4.5 V
0.001 0.1 0.1 0.1
V
VOL
IOL = 4 mA
4.5 V
0.17 0.26 0.4 0.33
V
IIVI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 5.5 V 2 40 20 µA
∆ICC†One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 2.9 mA
Ci4.5 V
to 5.5 V 3 10 10 10 pF
†This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HCT08 SN74HCT08
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
tpd
A or B
Y
4.5 V 15 24 35 30
ns
tpd
A or B
Y
5.5 V 13 22 32 27
ns
tt
Y
4.5 V 9 15 22 19
ns
tt
Y
5.5 V 8 14 20 17
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per gate No load 20 pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54HCT08, SN74HCT08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS063D – NOVEMBER 1988 – REVISED AUIGUST 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
1.3 V1.3 V 0.3 V0.3 V 2.7 V 2.7 V 3 V
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
1.3 V
1.3 V1.3 V 10%10% 90% 90%
3 V
VOH
VOL
0 V
trtf
Input
In-Phase
Output
1.3 V
tPLH tPHL
1.3 V 1.3 V
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. t
PLH
and t
PHL
are the same as t
pd
.
CL = 50 pF
(see Note A)
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HCT08D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74HCT08DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08DTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT08NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT08NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HCT08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWT ACTIVE TSSOP PW 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74HCT08PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT08PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HCT08DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HCT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HCT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HCT08DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HCT08NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HCT08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HCT08PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HCT08DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HCT08DR SOIC D 14 2500 333.2 345.9 28.6
SN74HCT08DR SOIC D 14 2500 367.0 367.0 38.0
SN74HCT08DT SOIC D 14 250 367.0 367.0 38.0
SN74HCT08NSR SO NS 14 2000 367.0 367.0 38.0
SN74HCT08PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HCT08PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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