DSP8-08AS
Phase leg
Standard Rectifier
12/4 3
Part number
DSP8-08AS
Backside: anode/cathode
FAV
F
VV1.08
RRM
8
800
=
V= V
I= A
2x
Features / Ad vantages: Applications: Package:
Planar passivated chips
Very low leakage current
Very low forward voltage drop
Improved thermal behaviour
Diode for main rectification
For single and three phase
bridge configurations
TO-263 (D2Pak)
Industry standard outline
RoHS compliant
Epoxy meets UL 94V-0
IXYS reserves the right to change limits, conditions and dimensions. 20130107bData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
DSP8-08AS
V = V
A²s
A²s
A²s
A²s
Symbol Definition
Ratings
typ. max.
I
R
V
IA
V
F
1.16
R1.5 K/W
R
min.
8
V
RSM
V
10T = 25°C
VJ
T = °C
VJ
mA0.2V = V
R
T = 25°C
VJ
I = A
F
V
T = °C
C
160
P
tot
100 WT = 25°C
C
RK/W
8
800
max. non-repetitive reverse blocking voltage
reverse current, drain current
forward voltage drop
total power dissipation
Conditions Unit
1.35
T = 25°C
VJ
150
V
F0
V0.79T = °C
VJ
175
r
F
33 m
V1.08T = °C
VJ
I = A
F
V
8
1.34
I = A
F
16
I = A
F
16
threshold voltage
slope resistance for power loss calculation only
µA
150
V
RRM
V800
max. re pe titive rev er se blockin g volt a ge T = 25°C
VJ
C
J
4
j
unction capacitance V = V400 T = 25°Cf = 1 MHz
RVJ
pF
I
FSM
t = 10 ms; (50 Hz), sine T = 45°C
VJ
max. forward surge current
T = °C
VJ
150
I²t T = 45°C
value for fusing
T = °C150
V = 0 V
R
V = 0 V
R
V = 0 V
V = 0 V
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
VJ
R
VJ
R
T = °C
VJ
175
120
130
50
50
A
A
A
A
100
110
72
70
800
FAV
d =rectangular 0.5
average forward current
thermal resistance junction to case
thJC
thermal resistance case to heatsink
thCH
Rectifier
900
0.25
IXYS reserves the right to change limits, conditions and dimensions. 20130107bData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
DSP8-08AS
Ratings
Product M
a
r
k
i
n
g
Date Code
Part No.
Logo
Assembly Code
XXXXXXXXX
IXYS
yywwz
000000
Assembly Line
DSP8-08A TO-220AB (3) 800
Package
T
VJ
°C
T
stg
°C150
storage temperature -55
Weight g2
Symbol Definition typ. max.min.Conditions
virt ua l j un ctio n temp eratu re
Unit
F
C
N60
mount ing for ce w i th cli p 20
I
RMS
RMS current 25 A
per terminal
175-55
DSP8-12AS
DSP8-12S
TO-263AA (D2Pak) (3)
TO-263AB (D2Pak) (2)
1200
1200
DSP8-12A
DSP8-12AC
TO-220AB (3)
ISOPLUS220AB (3)
1200
1200
TO-263
(
D2Pak
)
Similar Part Package Voltage class
DSP8-08S TO-263AB (D2Pak) (2) 800
Delivery Mode Quantity Code No.Part Number Marking on ProductOrdering
DSP8-08AS 504315Tube 50DSP8-08ASStandard
threshold voltage V0.79
m
V
0 max
R
0 max
slope resistance * 30
Equivalent Circuits for Simulation
T =
VJ
IV
0
R
0
Rectifier
175°C
* on die level
IXYS reserves the right to change limits, conditions and dimensions. 20130107bData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
DSP8-08AS
c2
A
A1
c
L
E
W
2x e
L1
D
123
3x b2
E1
3x b
H
D1
Supplier
Option
4
minmaxminmax
A 4.06 4.83 0.160 0.190
A1
A2
b 0.51 0.99 0.020 0.039
b2 1.14 1.40 0.045 0.055
c 0.40 0.74 0.016 0.029
c2 1.14 1.40 0.045 0.055
D 8.38 9.40 0.330 0.370
D1 8.00 8.89 0.315 0.350
D2
E 9.65 10.41 0.380 0.410
E1 6.22 8.50 0.245 0.335
e
e1
H 14.61 15.88 0.575 0.625
L 1.78 2.79 0.070 0.110
L1 1.02 1.68 0.040 0.066
Wtyp.
0.02 0.040 typ.
0.0008 0.002
Dim.
Millimeter Inches
typ. 0.10 typ. 0.004
2.41 0.095
0.098
4.28 0.169
All dimensions conform with
and/or within JEDEC standard.
2,54 BSC 0,100 BSC
2.5
12/4 3
Outlines TO-263 (D2Pak)
IXYS reserves the right to change limits, conditions and dimensions. 20130107bData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
DSP8-08AS
0.001 0.01 0.1 1
40
60
80
100
2345678011
10
1
10
2
0.60.81.01.21.41.6
0
4
8
12
16
20
024681012
0
4
8
12
16
0 25 50 75 100 125 150 175 200
1 10 100 1000 10000
0.0
0.4
0.8
1.2
1.6
0 50 100 150 200
0
4
8
12
16
20
24
28
50 Hz, 80% V
RRM
T
VJ
= 45°C
T
VJ
= 150°C
T
VJ
= 150°C
V
R
=0 V
T
VJ
= 45°C
I
F
[A]
V
F
[V]
I
FSM
[A]
t[s]
I
2
t
[A
2
s]
t[ms]
P
tot
[W]
I
F(AV)M
[A] T
amb
[°C]
I
F(AV)M
[A]
T
C
[°C]
Z
thJC
[K/W]
Fig. 1 Forward current versus
voltage drop per diode
Fig. 2 Surge overload current Fig. 3 I
2
t versus time per diode
Fig. 4 Power dissipation vs. direct output current and ambient temperature Fig. 5 Max. forward current vs.
case temperature
Fi
g
. 6 Transient thermal impedance
j
unction to case
t[ms]
Constants for Z
thJC
calculation:
iR
thi
(K/W) t
i
(s)
1 0.155 0.0005
2 0.332 0.0095
3 0.713 0.17
40.3 0.8
5 0.00001 0.00001
T
VJ
= 150°C
125°C
25°C
DC =
1
0.5
0.4
0.33
0.17
0.08
DC =
1
0.5
0.4
0.33
0.17
0.08
R
thJA
:
4 K/W
8 K/W
10 K/W
12 K/W
16 K/W
20 K/W
Rectifier
IXYS reserves the right to change limits, conditions and dimensions. 20130107bData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved