Datasheet SIGNATURE SERIES Comparators LM393xxx LM2903xx LM339xx LM2901xx General Description Key Specifications Operating Supply Voltage: Single Supply Dual Supply Supply Current: LM393xxx/LM2903xx LM339xx/LM2901xx Input Bias Current: Input Offset Current: Temperature Range: LM393xx/LM339xxx LM2903xx/LM2901xx LM393xxx, LM2903xx, LM339xx, and LM2901xx monolithic ICs integrate two or four independent comparator circuits on a single chip and feature high gain, low power consumption, and an operating voltage range from 2V to 36V (single power supply). Features Operable with a Single Power Supply Wide Operating Supply Voltage Range Input / Output Ground Sense Low Supply Current Open Collector Wide Temperature Range SO Package8 TSSOP8 Mini SO8 SO Package14 TSSOP14 Consumer Electronics Current Sense Application Battery Monitor Multivibrator 0.4mA (Typ) 1.1mA (Typ) 25nA (Typ) 5nA (Typ) -40C to + 85C -40C to +125C W(Typ) x D(Typ) x H(Max) 4.90mm x 6.0mm x 1.55mm 3.00mm x 6.4mm x 1.10mm 3.00mm x 4.9mm x 0.95mm 8.65mm x 6.0mm x 1.55mm 5.00mm x 6.4mm x 1.10mm Packages Application +2V to +36V 1V to 18V Pin Configuration SO Package8: (SOP-J8) LM393DT LM393WDT LM2903DT TSSOP8: (TSSOP-B8) LM393PT LM393WPT LM2903PT Mini SO8: (TSSOP-B8J) LM393ST OUTPUT 1 1 INVERTING 2 INPUT 1 NON-INVERTING INPUT 1 3 Vcc- 4 CH1 - + + CH2 + - + 8 Vcc 7 OUTPUT 2 6 INVERTING INPUT 2 5 NON-INVERTING INPUT 2 Pin Description LM393xxx/LM2903xx Pin No. Pin Name Function 1 OUTPUT 1 2 INVERTING INPUT 1 CH1 Inverting Input 3 NON-INVERTING INPUT 1 CH1 Non-inverting Input 4 Vcc- Negative power supply 5 NON-INVERTING INPUT 2 CH2 Non-inverting Input 6 INVERTING INPUT 2 CH2 Inverting Input 7 OUTPUT 2 CH2 Output 8 Vcc + Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211114001 CH1 Output Positive power supply This product is not designed protection against radioactive rays. 1/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Pin Configuration SO Package14: LM339DT (SOP-J14) LM2901DT TSSOP14: (TSSOP-B14J) LM339PT LM2901PT OUTPUT 2 1 14 OUTPUT 3 OUTPUT 1 2 13 OUTPUT 4 Vcc+ 3 CH1 - + CH4 - + 12 Vcc INVERTING INPUT 1 4 11 NON-INVERTING INPUT 4 NON-INVERTING 5 INPUT 1 10 INVERTING INPUT 4 INVERTING 6 INPUT 2 NON-INVERTING INPUT 2 7 CH2 - + CH3 - + 9 NON-INVERTING INPUT 3 8 INVERTING INPUT 3 Pin Description LM339xx/LM2901xx Pin No. Pin Name Function 1 OUTPUT 2 CH2 Output 2 OUTPUT 1 CH1 Output + 3 Vcc Positive power supply 4 INVERTING INPUT 1 CH1 Inverting Input 5 NON-INVERTING INPUT 1 CH1 Non-inverting Input 6 INVERTING INPUT 2 CH2 Inverting Input 7 NON-INVERTING INPUT 2 CH2 Non-inverting Input 8 INVERTING INPUT 3 CH3 Inverting Input 9 NON-INVERTING INPUT 3 CH3 Non-inverting Input 10 INVERTING INPUT 4 CH4 Inverting Input 11 NON-INVERTING INPUT 4 CH4 Non-inverting Input - 12 Vcc 13 OUTPUT 4 CH4 Output 14 OUTPUT 3 CH3 Output www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Negative power supply 2/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Circuit Diagram Vcc+ OUTPUT NON-INVERTING INPUT INVERTING INPUT Vcc - Figure 1. Circuit Diagram (each channel) Absolute Maximum Ratings (TA=25C) Parameter Ratings Symbol LM393xxx Vcc+-Vcc Supply Voltage PD LM2903xx LM2901xx +36 SO Package8 Power Dissipation LM339xx (Note 1,6) 0.67 TSSOP8 0.62(Note 2,6) Mini SO8 0.58 (Note 3,6) V - (Note 1,6) 0.67 - - 0.62(Note 2,6) - - - - SO Package14 - 1.02 - 1.02 TSSOP14 - 0.84(Note 5,6) - 0.84(Note 5,6) (Note 4,6) Unit W (Note 4,6) Differential Input Voltage(Note 7) VID +36 V Input Common-mode Voltage Range VICM (Vcc--0.3) to (Vcc-+36) V II -10 mA Operating Supply Voltage Vopr +2.0 to +36.0 (1.0 to 18.0) V Operating Temperature Range Topr Storage Temperature Range Tstg -55 to +150 C Maximum Junction Temperature Tjmax +150 C Input Current(Note 8) -40 to +85 -40 to +125 C Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (Note 1) To use at temperature above TA=25C reduce 5.4mW. (Note 2) To use at temperature above TA=25C reduce 5.0mW. (Note 3) To use at temperature above TA=25C reduce 4.7mW. (Note 4) To use at temperature above TA=25C reduce 8.2mW. (Note 5) To use at temperature above TA=25C reduce 6.8mW. (Note 6) Mounted on a FR4 glass epoxy PCB 70mmx70mmx1.6mm(Copper foil area less than 3%). (Note 7) The voltage difference between inverting input and non-inverting input is the differential input voltage. The input terminal voltage is set to more than Vcc-. (Note 8) An excessive input current will flow when input voltages of less than Vcc--0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Electric Characteristics LM393xxx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25C) Limit Temperature Parameter Symbol Range Min Typ Input Offset Voltage (Note 9,10) VIO Input Offset Current (Note 9,10) IIO Input Bias Current (Note 9,10) IIB Large Signal Voltage Gain AV Supply Current (Note 10) (All Comparators) ICC Input Common-mode Voltage Range (Note 10) VICM Output Saturation Voltage (Note 10) (Low Level Output Voltage) VOL Output Leakage Current (Note 10) (High Level Output Current) ILEAK Output Sink Current ISINK Max 25C - 1 7 Full range - - 9 25C - 5 50 Full range - - 150 25C - 25 250 Full range - - 400 25C 25 200 - Unit Conditions mV Vcc+=5V to 30V, VO=1.4V VICM=0 to 1.5V nA VO=1.4V nA VO=1.4V + (Note 10,11) Small Signal Response Time Large Signal Response Time tRE tREL 25C - 0.4 1 Full range - 1 2.5 25C 0 - + Vcc -1.5 Full range 0 - Vcc+-2.0 25C - 250 400 Full range - - 700 25C - 0.1 Full range - Full range V/mV mA Vcc =15V VO=1.4V to 11.4V, RL=15k + Vcc =5V, No Load Vcc+=30V, No Load V - mV VID=-1V, ISINK=4mA - nA - 1 A Vcc =30V, VID=1V VO=30V 6 16 - mA 25C - 1.3 - s 25C - 300 - ns + VID=-1V, VO=1.5V RL=5.1k, VRL=5V VIN=100mVp-p, Overdrive=5mV RL=5.1k, VRL=5V VIN=TTL input, VREF=1.4V (Note 9) Absolute value (Note 10) Full range: TA=-40C to +85C (Note 11) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Electric Characteristics - continued LM339xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25C) Parameter Symbol Input Offset Voltage (Note 12,13) VIO Input Offset Current (Note 12,13) IIO Input Bias Current (Note 12,13) IIB Large Signal Voltage Gain AV Supply Current (Note 13) (All Comparators) ICC Limit Temperature Range Min Typ Max 25C - 1 7 Full range - - 9 25C - 5 50 Full range - - 150 25C - 25 250 Full range - - 400 25C 25 200 - 25C - 1.1 2 Full range - 1.3 2.5 + Unit Conditions mV Vcc+=5V to 30V, VO=1.4V VICM=0 to 1.5V nA VO=1.4V nA VO=1.4V + Input Common-mode Voltage Range (Note 13) VICM Output Saturation Voltage (Note 13) (Low Level Output Voltage) VOL Output Leakage Current (Note 13) (High Level Output Current) ILEAK Output Sink Current (Note 13,14) ISINK Small Signal Response Time Large Signal Response Time tRE tREL 25C 0 - Vcc -1.5 Full range 0 - Vcc+-2.0 25C - 250 400 Full range - - 700 25C - 0.1 - V/mV mA V Vcc =15V VO=1.4V to 11.4V, RL=15k Vcc+=5V, No Load Vcc+=30V, No Load - mV VID=-1V, ISINK=4mA nA + Vcc =30V, VID=1V VO=30V Full range - - 1 A Full range 6 16 - mA 25C - 1.3 - s 25C - 300 - ns VID=-1V, VO=1.5V RL=5.1k, VRL=5V VIN=100mVp-p, Overdrive=5mV RL=5.1k, VRL=5V VIN=TTL input, VREF=1.4V (Note 12) Absolute value (Note 13) Full range: TA=-40C to +85C (Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Electric Characteristics - continued LM2903xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25C) Limit Temperature Parameter Symbol Range Min Typ Input Offset Voltage (Note 15,16) VIO Input Offset Current (Note 15,16) IIO Input Bias Current (Note 15,16) IIB Large Signal Voltage Gain AV Supply Current (Note 16) (All Comparators) ICC Max 25C - 2 7 Full range - - 15 25C - 5 50 Full range - - 150 25C - 25 250 Full range - - 400 25C 25 200 - 25C - 0.4 1 Full range - 1 2.5 + Unit Conditions mV Vcc+=5V to 30V, VO=1.4V VICM=0 to 1.5V nA VO=1.4V nA VO=1.4V + Input Common-mode Voltage Range (Note 16) VICM Output Saturation Voltage (Note 16) (Low Level Output Voltage) VOL Output Leakage Current (Note 16) (High Level Output Current) ILEAK Output Sink Current (Note 16,17) ISINK Small Signal Response Time Large Signal Response Time tRE tREL 25C 0 - Vcc -1.5 Full range 0 - Vcc+-2.0 25C - 250 400 Full range - - 700 25C - 0.1 - V/mV mA V Vcc =15V VO=1.4V to 11.4V, RL=15k Vcc+=5V, No Load Vcc+=30V, No Load - mV VID=-1V, ISINK=4mA nA + Vcc =30V, VID=1V VO=30V Full range - - 1 A Full range 6 16 - mA 25C - 1.3 - s 25C - - 1.0 s VID=-1V, VO=1.5V RL=5.1k, VRL=5V VIN=100mVp-p, Overdrive=5mV RL=5.1k, VRL=5V VIN=TTL input, VREF=1.4V VO at 95% (Note 15) Absolute value (Note 16) Full range: TA=-40C to +125C (Note 17) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Electric Characteristics - continued LM2901xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25C) Limit Temperature Parameter Symbol Range Min Typ Input Offset Voltage (Note 15,16) VIO Input Offset Current (Note 15,16) IIO Input Bias Current (Note 15,16) IIB Large Signal Voltage Gain AV Supply Current (Note 16) (All Comparators) ICC Max 25C - 1 7 Full range - - 15 25C - 5 50 Full range - - 150 25C - 25 250 Full range - - 400 25C 25 200 - 25C - 1.1 2 Full range - 1.3 2.5 + Unit Conditions mV Vcc+=5V to 30V, VO=1.4V VICM=0 to 1.5V nA VO=1.4V nA VO=1.4V + Input Common-mode Voltage Range (Note 16) VICM Output Saturation Voltage (Note 16) (Low Level Output Voltage) VOL Output Leakage Current (Note 16) (High Level Output Current) ILEAK Output Sink Current (Note 16,17) ISINK Small Signal Response Time Large Signal Response Time tRE tREL 25C 0 - Vcc -1.5 Full range 0 - Vcc+-2.0 25C - 250 400 Full range - - 700 25C - 0.1 - V/mV mA V Vcc =15V VO=1.4V to 11.4V, RL=15k Vcc+=5V, No Load Vcc+=30V, No Load - mV VID=-1V, ISINK=4mA nA + Vcc =30V, VID=1V VO=30V Full range - - 1 A Full range 6 16 - mA 25C - 1.3 - s 25C - - 1.0 s VID=-1V, VO=1.5V RL=5.1k, VRL=5V VIN=100mVp-p, Overdrive=5mV RL=5.1k, VRL=5V VIN=TTL input, VREF=1.4V VO at 95% (Note 18) Absolute value (Note 19) Full range: TA=-40C to +125C (Note 20) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer's document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (Vcc+/ Vcc-) Indicates the maximum voltage that can be applied between the positive power supply pin and negative power supply pin without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Operating and storage temperature ranges (Topr, Tstg) The operating temperature range indicates the temperature range within which the IC can operate. The higher the ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics. (5) Power dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature 25C(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting pin and inverting pins. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting pins. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. (4) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output Voltage) / (Differential Input Voltage) (5) Supply Current (ICC) Indicates the current that flows within the IC under specified no-load conditions. (6) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (7) Output Saturation Voltage, Low Level Output Voltage (VOL) Signifies the voltage range that can be output under specific output conditions. (8) Output Leakage Current, High Level Output Current (ILEAK) Indicates the current that flows into the IC under specific input and output conditions. (9) Output Sink Current (ISINK) Denotes the maximum current that can be output from the IC under specific output conditions. (10) Response Time (tRE) Response time indicates the delay time between the input and output signal which is determined by the time difference from the fifty percent of input signal swing to the fifty percent of output signal swing. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves LM393xxx/LM2903xx 1.6 1.0 0.8 1.2 LM393PT LM393WPT Supply Current [mA] Power Dissipation [W] 1.4 LM393DT LM393WDT LM2903DT 0.6 LM2903PT 0.4 LM393ST 1.0 -40C 0.8 25C 0.6 0.4 0.2 85C 0.2 0.0 0 25 125C 0.0 85 50 75 100 125 Ambient Temperature [C] 150 0 Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 10 20 30 Supply Voltage [V] 40 Figure 3. Supply Current vs Supply Voltage 1.6 200 Output Saturation Voltage [mV] 1.4 Supply Current [mA] 1.2 1.0 0.8 36V 5V 0.6 0.4 2V 150 125C 85C 100 25C 50 -40C 0.2 0 0.0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 5. Output Saturation Voltage vs Supply Voltage (ISINK=4mA) Figure 4. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM393xxx/LM2903xx 200 2.0 Output Saturation Voltage [V] Output Saturation Voltage [mV] 1.8 150 2V 100 5V 36V 50 1.6 1.4 125C 1.2 25C 1.0 0.8 85C 0.6 -40C 0.4 0.2 0.0 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 2 4 6 8 10 12 14 16 Output Sink Current [mA] 18 20 Figure 7. Output Saturation Voltage vs Output Sink Current (Vcc+=5V) Figure 6. Output Saturation Voltage vs Ambient Temperature ( ISINK=4mA) 8 40 30 5V Input Offset Voltage [mV] Output Sink Current [mA] 6 36V 20 2V 10 4 -40C 2 0 25C 85C 125C -2 -4 -6 0 -50 -8 -25 0 25 50 75 0 100 125 150 Ambient Temperature [C] 10 20 30 Supply Voltage [V] 40 Figure 9. Input Offset Voltage vs Supply Voltage Figure 8. Output Sink Current vs Ambient Temperature (VO=1.5V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued 8 160 6 140 4 120 Input Bias Current [nA] Input Offset Voltage [mV] LM393xxx/LM2903xx 2V 2 0 5V 36V -2 -4 100 -6 -40C 80 25C 60 40 85C 125C 20 -8 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 0 5 10 15 20 25 Supply Voltage [V] 30 35 Figure 11. Input Bias Current vs Supply Voltage Figure 10. Input Offset Voltage vs Ambient Temperature 50 160 40 140 Input Offset Current [nA] Input Bias Current [nA] 30 120 100 36V 80 60 40 5V 10 -40C 25C 0 85C -10 125C -20 -30 2V 20 20 -40 -50 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 13. Input Offset Current vs Supply Voltage Figure 12. Input Bias Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM393xxx/LM2903xx 50 140 40 130 Large Signal Voltage Gain [dB] Input Offset Current [nA] 30 20 2V 10 0 -10 5V 36V -20 -30 85C 110 25C 100 -40C 90 80 70 -40 60 -50 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 15. Large Signal Voltage Gain vs Supply Voltage Figure 14. Input Offset Current vs Ambient Temperature 140 160 Common-mode Rejection Ratio [dB] 130 Large Signal Voltage Gain [dB] 125C 120 36V 120 110 15V 100 5V 2V 90 80 70 60 140 120 85C 125C 100 -40C 80 25C 60 40 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 0 10 20 30 Supply Voltage [V] 40 Figure 17.Common-mode Rejection Ratio vs Supply Voltage Figure 16. Large Signal Voltage Gain vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued 150 6 125 4 36V Input Offset Voltage [mV] Common-mode Rejection Ratio [dB] LM393xxx/LM2903xx 100 5V 75 2V 50 25 -40C 85C 2 125C 0 -2 -4 0 -6 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 -1 Figure 18. Common-mode Rejection Ratio vs Ambient Temperature 0 1 2 3 Input Voltage [V] 4 5 Figure 19.Input Offset Voltage vs Input Voltage (Vcc+=5V) 200 5 180 Response Time (Low to High) [s] Power Supply Rejection Ratio [dB] 25C 160 140 120 100 80 -25 0 25 50 75 100 Ambient Temperature [C] 125 3 2 125C 150 85C 25C -40C 1 0 -100 60 -50 4 -80 -60 -40 -20 Overdrive Voltage [mV] 0 Figure 21. Response Time (Low to High) vs Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1k) Figure 20.Power Supply Rejection Ratio vs AmbientTemperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM393xxx/LM2903xx 5 Response Time (High to Low) [s] Response Time (Low to High) [s] 5 4 3 2 5mV overdrive 20mV overdrive 100mV overdrive 1 0 4 3 125C 85C 2 25C -40C 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 0 Figure 22. Response Time (Low to High) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1k) 20 40 60 80 Overdrive Voltage [mV] 100 Figure 23. Response Time (High to Low) vs Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1k) Response Time (High to Low) [s] 5 4 3 5mV overdrive 2 20mV overdrive 100mV overdrive 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 Figure 24. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1k) (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393-40C to 85C LM2903-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM339xx/LM2901xx 2.0 1.2 1.8 LM339DT 1.6 LM339PT Supply Current [mA] Power Dissipation [W] 1.0 0.8 LM2901DT 0.6 LM2901PT 0.4 -40C 1.4 25C 1.2 1.0 0.8 0.6 0.4 0.2 85C 125C 0.2 0.0 0 25 0.0 85 50 75 100 125 Ambient Temperature [C] 0 150 Figure 25. Power Dissipation vs Ambient Temperature (Derating Curve) 10 20 30 Supply Voltage [V] 40 Figure 26.Supply Current vs Supply Voltage 200 2.0 1.8 1.4 Output Saturation Voltage [mV] Supply Current [mA] 1.6 36V 1.2 1.0 5V 0.8 0.6 2V 0.4 150 125C 85C 100 25C 50 -40C 0.2 0 0.0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 28. Output Saturation Voltage vs Supply Voltage (ISINK=4mA) Figure 27.Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM339xx/LM2901xx 200 2.0 Output Saturation Voltage [V] Output Saturation Voltage [mV] 1.8 150 2V 100 5V 36V 50 1.6 1.4 125C 1.2 25C 1.0 0.8 85C 0.6 0.4 -40C 0.2 0.0 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 2 4 6 8 10 12 14 16 Output Sink Current [mA] 18 20 Figure 30. Output Saturation Voltage vs Output Sink Current (Vcc+=5V) Figure 29. Output Saturation Voltage vs Ambient Temperature ( ISINK=4mA) 8 40 30 5V 36V 20 2V 10 Input Offset Voltage [mV] Output Sink Current [mA] 6 4 -40C 2 0 25C 85C 125C -2 -4 -6 0 -50 -8 -25 0 25 50 75 100 125 150 Ambient Temperature [C] 0 10 20 30 Supply Voltage [V] 40 Figure 32. Input Offset Voltage vs Supply Voltage Figure 31. Output Sink Current vs Ambient Temperature (VO=1.5V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued 8 160 6 140 4 120 Input Bias Current [nA] Input Offset Voltage [mV] LM339xx/LM2901xx 2V 2 0 5V 36V -2 -4 100 -6 -40C 80 25C 60 40 85C 125C 20 -8 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 0 20 30 Supply Voltage [V] 40 Figure 34. Input Bias Current vs Supply Voltage Figure 33. Input Offset Voltage vs Ambient Temperature 160 50 40 140 30 120 Input Offset Current [nA] Input Bias Current [nA] 10 100 36V 80 60 40 5V 10 -40C 25C 0 85C -10 125C -20 -30 2V 20 20 -40 -50 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 Figure 35. Input Bias Current vs Ambient Temperature 10 20 30 Supply Voltage [V] 40 Figure 36. Input Offset Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM339xx/LM2901xx 50 140 40 130 Large Signal Voltage Gain [dB] Input Offset Current [nA] 30 20 10 2V 0 5V -10 36V -20 -30 125C 120 85C 110 25C 100 -40C 90 80 70 -40 60 -50 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 38. Large Signal Voltage Gain vs Supply Voltage Figure 37. Input Offset Current vs Ambient Temperature 140 160 Common-mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 130 36V 120 110 15V 100 5V 2V 90 80 70 60 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 140 120 85C 125C 100 -40C 80 25C 60 40 0 10 20 30 Supply Voltage [V] 40 Figure 40. Common-mode Rejection Ratio vs Supply Voltage Figure 39. Large Signal Voltage Gain vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued 150 6 125 4 36V Input Offset Voltage [mV] Common-mode Rejection Ratio [dB] LM339xx/LM2901xx 100 75 5V 2V 50 25 85C -40C 2 125C 0 -2 -4 0 -6 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 -1 Figure 41. Common-mode Rejection Ratio vs Ambient Temperature 0 1 2 3 Input Voltage [V] 4 5 Figure 42. Input Offset Voltage vs Input Voltage (Vcc+=5V) 200 5 180 Response Time (Low to High) [s] Power Supply Rejection Ratio [dB] 25C 160 140 120 100 80 -25 0 25 50 75 100 Ambient Temperature [C] 125 3 2 125C 1 0 -100 60 -50 4 150 -80 85C 25C -40C -60 -40 -20 Overdrive Voltage [mV] 0 Figure 44. Response Time (Low to High) vs Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1k) Figure 43. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Typical Performance Curves - continued LM339xx/LM2901xx 5 Response Time (High to Low) [s] Response Time (Low to High) [s] 5 4 3 2 5mV overdrive 20mV overdrive 100mV overdrive 1 0 4 3 125C 85C 2 25C -40C 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 0 20 40 60 80 Overdrive Voltage [mV] 100 Figure 46. Response Time (High to Low) vs Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1k) Figure 45. Response Time (Low to High) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1k) Response Time (High to Low) [s] 5 4 3 5mV overdrive 2 20mV overdrive 100mV overdrive 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [C] 125 150 Figure 47. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1k) (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339-40C to 85C LM2901-40C to 125C www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Application Information Measurement Circuit 1 NULL Method Measurement Condition Parameter VF SW1 SW2 Vcc+,Vcc-,EK,VICM unitV SW3 Vcc+ Vcc- EK VICM Calculation Input Offset Voltage VF1 ON ON ON 5 to 30 0 -1.4 0 1 Input Offset Current VF2 OFF OFF ON 5 0 -1.4 0 2 VF3 OFF ON VF4 ON OFF ON ON Input Bias Current VF5 Large Signal Voltage Gain VF6 5 0 -1.4 0 5 0 -1.4 0 15 0 -1.4 0 15 0 -11.4 0 ON ON -Calculation1. Input Offset Voltage (VIO) VIO = 2. Input Offset Current (IIO) IIO = 3. Input Bias Current (IB) IB = 4. Large Signal Voltage Gain (AV) AV = 20Log 10 x (1+RF/RS) |VF5-VF6| |VF1| 3 4 [V] 1+RF/RS |VF2-VF1| [A] RI x(1+RF/RS) |VF4-VF3| 2 x RI x(1+RF/RS) [A] [dB] 0.1F RF=50k SW1 Vcc 15V EK RS=50 0.1F 500k + RI=10k VO 500k DUT NULL SW3 RS=50 1000pF RI=10k RL VICM 50k SW2 Vcc - VF VRL -15V Figure 48. Measurement Circuit 1 (each Comparator) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Application Information - continued Measurement Circuit 2: Switch Condition SW No. Supply Current - SW1 SW2 SW3 SW4 SW5 SW6 SW7 ON OFF ON OFF OFF OFF OFF Output Sink Current VO=1.5V ON OFF ON OFF ON ON OFF Output Saturation Voltage ISINK=4mA ON OFF ON OFF OFF OFF ON Output Leakage Current VO=36V ON OFF ON OFF OFF OFF ON ON ON OFF ON OFF ON OFF RL=5.1k Response Time VRL=5V Vcc + A SW1 SW4 SW2 SW3 Vcc SW5 SW6 SW7 - RL A VIN+ VIN- VRL V VO Figure 49. Measurement Circuit 2 (each Comparator) Input Voltage Input Voltage 1.5V 1.405V VREF=1.4V ov=5mV Overdrive Voltage Overdrive Voltage VREF=1.4V ov=5mV 1.3V t t Input wave Input wave Output Voltage Vcc Output Voltage + Vcc + + + Vcc /2 0V Vcc /2 0V tRE (Low to High) tRE (High to Low) t Figure 50. Response Time www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Example of Circuit Reference voltage is VIN- IN Vcc + VRL VREF RL + IN OUT Reference voltage t VREF Vcc - OUT High When the input voltage is bigger than reference voltage, output voltage is high. When the input voltage is smaller than reference voltage, output voltage is low. Low t IN Reference voltage is VIN+ Vcc Reference voltage VREF + VREF RL + IN VRL OUT t OUT Vcc - High When the input voltage is smaller than reference voltage, output voltage is high. When the input voltage is bigger than reference voltage, output voltage is low. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/34 Low t TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol JAC/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 51(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (JA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). JA = (TJmaxTA) / PD C/W The Derating curve in Figure 51(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (JA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 51(c) and (d) shows an example of the derating curve for LM393xxx, LM2903xx, LM339xx, and LM2901xx. Power dissipation of LSI [W] PDmax JA=(TJmax-TA)/ PD C/W Power dissipation of IC P2 Ambient temperature TA [ C ] JA2 < JA1 JA2 P1 TJmax JA1 0 25 Chip surface temperature TJ [ C ] 50 100 125 150 (b) Derating Curve (a) Thermal Resistance 1.2 1.0 (Note 21) LM393DT LM393WDT(Note 21) 0.8 LM393PT(Note 22) LM393WPT(Note 22) 0.6 LM339DT(Note 24) 1.0 Power Dissipation [C] Power Dissipation [C] 75 Ambient temperature TA [ C ] (Note 21) LM2903DT (Note 22) LM2903PT 0.4 LM393ST(Note 23) 0.2 LM339PT(Note 25) 0.8 LM2901DT(Note 24) LM2901PT(Note 25) 0.6 0.4 0.2 0.0 0 85 25 50 75 100 125 Ambient Temperature [C] 0.0 0 150 85 25 50 75 100 125 Ambient Temperature [C] (c) LM393xxx/LM2903xx 150 (d) LM339xx/LM2901xx (Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit 5.4 5.0 4.7 8.2 6.8 mW/C When using the unit above TA=25C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm x70mm x1.6mm (cooper foil area below 3%) is mounted. Figure 51. Thermal Resistance and Derating Curve www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Operational Notes - continued 11. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ N P N P+ N Parasitic Element N P+ N P N P+ B N C E Parasitic Element P Substrate P Substrate Parasitic Element Pin B B GND GND Parasitic Element GND GND Parasitic element or Transistor Figure 52. Example of Monolithic IC Structure 12. Unused Circuits When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting input pin to a potential within the in-phase input voltage range (VICM). Please keep this potential in VICM VICM Vcc+ OPEN + - VccFigure 53. Disable Circuit Example 13. Input Voltage Applying Vcc- + 36V to the input pin is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common-mode input voltage range of the electric characteristics. 14. Power Supply (single/dual) The comparator operates when the specified voltage supplied is between Vcc+ and Vcc-. Therefore, the single supply comparator can be used as a dual supply comparator as well. 15. Terminal short-circuits When the output and Vcc+ pins are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 16. IC Handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Physical Dimension, Tape and Reel information Package Name SO Package8 (SOP-J8) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 27/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Physical Dimension, Tape and Reel Information - continued Package Name TSSOP8 (TSSOP-B8) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 28/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Physical Dimension, Tape and Reel Information - continued Package Name Mini SO8 (TSSOP-B8J) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 29/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Physical Dimension, Tape and Reel Information - continued Package Name SO Package14 (SOP-J14) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 30/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Physical Dimension, Tape and Reel Information - continued Package Name TSSOP14 (TSSOP-B14J) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 31/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Ordering Information L M x Part Number LM393DT LM393WDT LM393PT LM393WPT LM393ST LM339DT LM339PT LM2903DT LM2903PT LM2901DT LM2901PT x x x x x T ESD Tolerance Package type Packaging and forming specification applicable D : S.O package T: Embossed tape and reel W : 2kV None : Normal P : SSOP S : Mini SO Line-up Topr Channels Normal 2 -40C to +85C 2kV 4 Normal 2 -40C to +125C Normal 4 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SO Package8 Reel of 2500 Orderable Part Number LM393DT TSSOP8 Reel of 2500 LM393PT ESD Package Mini SO8 Reel of 2500 LM393ST SO Package8 Reel of 2500 LM393WDT TSSOP8 Reel of 2500 LM393WPT SO Package14 Reel of 2500 LM339DT TSSOP14 Reel of 2500 LM339PT SO Package8 Reel of 2500 LM2903DT TSSOP8 Reel of 2500 LM2903PT SO Package14 Reel of 2500 LM2901DT TSSOP14 Reel of 2500 LM2901PT 32/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Marking Diagram SOP-J8(TOP VIEW) TSSOP-B8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8J(TOP VIEW) SOP-J14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B14J (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Product Name LM393 LM339 LM2903 LM2901 Package Type DT SO Package8 (SOP-J8) PT TSSOP8 (TSSPO-B8) ST Mini SO8 (TSSOP-B8J) WDT SO Package8 (SOP-J8) WPT TSSOP8 (TSSPO-B8) DT SO Package14 (SOP-J14) PT TSSOP14 (TSSOP-B14J) DT SO Package8 (SOP-J8) PT TSSOP8 (TSSPO-B8) DT SO Package14 (SOP-J14) PT TSSOP14 (TSSOP-B14J) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 33/34 Marking 393 339 2903 2901 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 LM393xxx LM2903xx LM339xx Datasheet LM2901xx Land Pattern Data All dimensions in mm Land length Land width 2 b2 PKG Land pitch e Land space MIE SO Package8 (SOP-J8) SO Package14 (SOP-J14) 1.27 3.90 1.35 0.76 TSSOP8 (TSSPO-B8) TSSOP14 (TSSOP-B14J) 0.65 4.60 1.20 0.35 Mini SO8 (TSSOP-B8J) 0.65 3.20 1.15 0.35 SOP-J8, TSSOP-B8, TSSOP-B8J, SOP-J14, TSSOP-B14J b2 e MIE 2 Revision History Date Revision 6.July.2015 001 Changes New Release www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 34/34 TSZ02201-0RFR0G200530-1-2 6.July.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. 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