Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Overview KEMET's Ceramic Open Mode capacitor in X7R dielectric is designed to significantly minimize the probability of a low IR or short circuit condition when forced to failure in a board stress flex situation, thus reducing the potential for catastrophic failure. The Open Mode capacitor may experience a drop in capacitance; however, a short is unlikely because a crack will not typically propagate across counter electrodes within the device's "active area." Since there will not be any current leakage associated with a typical Open Mode flex crack, there is no localized heating and therefore little chance for a catastrophic and potentially costly failure event. Driven by the demand for a more robust and reliable component, the Open Mode capacitor was designed for critical applications where higher operating temperatures and mechanical stress are a concern. These capacitors are widely used in automotive circuits as well as power supplies (input and output filters) and general electronic applications. mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. When combined with flexible termination technology these devices offer the ultimate level of protection against a low IR or short circuit condition. Open Mode devices compliment KEMET's Floating Electrode (FECAP) and Floating Electrode with Flexible Termination (FF-CAP) product lines by providing a fail-safe design optimized for mid to high range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +125C. Concerned with flex cracks resulting from excessive tensile and shear stresses produced during board flexure and thermal cycling? These devices are available with KEMET's Flexible termination technology which inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although flexible termination technology does not eliminate the potential for Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C 1210 J 685 K 3 R A C TU Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric Failure Rate/ Design Termination Finish1 Packaging/Grade (C-Spec)2 0805 1206 1210 1812 F = Open Mode 2 Significant Digits K = 10% J = Open Mode + Number of Zeros M = 20% with Flexible Termination 4 = 16 V R = X7R 3 = 25 V 5 = 50 V 1 = 100 V 2 = 200 V A = N/A C = 100% Matte Sn L = SnPb (5% minimum) Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade Additional termination finish options may be available. Contact KEMET for details. SnPb termination finish option is not available on automotive grade product. 2 Additional reeling or packaging options may be available. Contact KEMET for details. 1 1, 2 One world. One KEMET (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Dimensions - Millimeters (Inches) - Standard Termination L W B T S EIA Size Code Metric Size Code 0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 1206 3216 1210 3225 3.20 (.126) 0.20 (.008) 1.60 (.063) 0.20 (.008) See Table 2 for 0.50 (0.02) 0.25 (.010) Thickness 0.50 (0.02) 0.25 (.010) 3.20 (.126) 0.20 (.008) 2.50 (.098) 0.20 (.008) 1812 4532 4.50 (.177) 0.30 (.012) 3.20 (.126) 0.30 (.012) L Length W Width T Thickness B Bandwidth S Separation Minimum 0.50 (0.02) 0.25 (.010) 0.75 (.030) N/A 0.60 (.024) 0.35 (.014) Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Dimensions - Millimeters (Inches) - Flexible Termination EIA Size Code Metric Size Code 0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 1206 3216 1210 3225 3.30 (.130) 0.40 (.016) 1.60 (.063) 0.20 (.008) See Table 2 for 0.60 (.024) 0.25 (.010) Thickness 0.60 (.024) 0.25 (.010) 3.30 (.130) 0.40 (.016) 2.50 (.098) 0.20 (.008) 1812 4532 4.50 (.178) 0.40 (.016) 3.20 (.126) 0.30 (.012) L Length W Width T Thickness B Bandwidth S Separation Minimum 0.50 (0.02) 0.25 (.010) 0.75 (.030) 0.70 (.028) 0.35 (.014) N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Benefits * * * * * * * * -55C to +125C operating temperature range Open Mode/fail open design Mid to high capacitance flex mitigation Lead (Pb)-Free, RoHS and REACH compliant EIA 0805, 1206, 1210, and 1812 case sizes DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V Capacitance offerings ranging from 1,000 pF to 6.8 F Available capacitance tolerances of 5%, 10%, and 20% * Non-polar device, minimizing installation concerns * 100% pure matte tin-plated termination finish allowing for excellent solderability * Commercial and Automotive (AEC-Q200) grades available * SnPb termination finish option available upon request (5% minimum) * Flexible termination option available upon request (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Applications Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or involve conversion to a 42 V system and raw power input side filtering in power conversion. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55C to +125C Capacitance Change with Reference to +25C and 0 VDC Applied (TCC) 15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit @ 25C Insulation Resistance (IR) Limit @ 25C 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 mA) 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V) See Insulation Resistance Limit Table (Rated voltage applied for 120 5 seconds @ 25C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz 50 Hz and 1.0 0.2 Vrms if capacitance 10 F 120 Hz 10Hz and 0.5 0.1 Vrms if capacitance > 10 F Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Voltage Dielectric Capacitance Value Dissipation Factor (Maximum %) > 25 X7R 16/25 Capacitance Shift Insulation Resistance 20% 10% of Initial Limit 3.0 All 5.0 < 16 7.5 Insulation Resistance Limit Table (X7R Dielectric) EIA Case Size 1,000 Megohm Microfarads or 100 G 500 Megohm Microfarads or 10 G 0201 N/A ALL 0402 < 0.012 F 0.012 F 0603 < 0.047 F 0.047 F 0805 < 0.15 F 0.15 F 1206 < 0.47 F 0.47 F 1210 < 0.39 F 0.39 F 1808 ALL N/A 1812 < 2.2 F 2.2 F 1825 ALL N/A 2220 < 10 F 10 F 2225 ALL N/A (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Table 1 - Capacitance Range/Selection Waterfall (0805 - 1812 Case Sizes) Capacitance 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 F 0.12 F 0.15 F 0.18 F 0.22 F 0.27 F 0.33 F 0.39 F 0.47 F 0.56 F 0.68 F 0.82 F 1.0 F 1.2 F 1.5 F 1.8 F 2.2 F 3.3 F 4.7 F 6.8 F Capacitance Cap Code 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 335 475 685 Cap Code Case Size/ Series C0805F C1206F C1210F C1812F Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GN GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GN GB GB GB GB GB GB GB GB GB GB GB GB GC GD GF GK GM GB GB GB GB GB GB GB GB GC GF GK GL GK GK Capacitance Tolerance K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DG DD DD DD DE DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DD DD DG DG DG DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DE DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DG Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EG EG EG EG EG EG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EG EG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EC EC EH EC EH EC EC EC EC EC EC EC EC EC EC EC EG EG ED EC EC EC EC EC EG EG EG EG EG EG EH FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FG FH FH FJ FM FG FS FD FD FD FD FD FD FD FD FD FD FD FD FG FG FH FD FD FD FD FD FD FD FD FD FG FG FG FH FH FJ FM FM FD FD FD FD FD FD FG FG FH FH FJ FR FR FR FS FD FD FG FG FH FH FJ FM FS Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Case Size/ Series C0805F C1206F (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1210F C1812F C1012_X7R_OPENMODE_SMD * 4/30/2014 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Table 2 - Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DD DE DG EC ED EG EH FD FG FH FM FJ FR FS GB GC GD GF GK GN GL GM 0805 0805 0805 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 0.90 0.10 1.00 0.10 1.25 0.15 0.90 0.10 1.00 0.10 1.60 0.15 1.60 0.20 0.95 0.10 1.25 0.15 1.55 0.15 1.70 0.20 1.85 0.20 2.25 0.20 2.50 0.30 1.00 0.10 1.10 0.10 1.25 0.15 1.50 0.10 1.60 0.20 1.70 0.20 1.90 0.20 2.00 0.20 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 4,000 2,500 2,000 2,000 4,000 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 0 10,000 10,000 10,000 10,000 8,000 8,000 10,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Table 3A - Land Pattern Design Recommendations per IPC-7351 - Standard Termination EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 Only for capacitance values 22 F Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Table 3B - Land Pattern Design Recommendations per IPC-7351 - Flexible Termination EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X C V2 X C Grid Placement Courtyard (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET's families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Ramp-Up Rate (TL to TP) Termination Finish SnPb 100% Matte Sn 100C 150C 60 - 120 seconds 150C 200C 60 - 120 seconds 183C 217C Time Above Liquidous (tL) 60 - 150 seconds 60 - 150 seconds Peak Temperature (TP) 235C 260C Time Within 5C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Time 25C to Peak Temperature TL tP Maximum Ramp Up Rate = 3C/sec Maximum Ramp Down Rate = 6C/sec tL Tsmax Tsmin tS 3C/second maximum 3C/second maximum Liquidous Temperature (TL) Ramp-Down Rate (TP to TL) TP Temperature Profile Feature 25 25 C to Peak Time 6C/second maximum 6C/second maximum 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: Standard termination system - 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system - 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 1,000 Cycles (-55C to +125C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55C/+125C. Note: Number of cycles required - 300, maximum transfer time - 20 seconds, dwell time - 15 minutes. Air - Air. Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108 /EIA-198 Storage Life MIL-STD-202 Method 108 150C, 0 VDC for 1,000 hours. Vibration MIL-STD-202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 - 2,000 Hz Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125C (85C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature- reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Construction - Standard Termination Detailed Cross Section Dielectric Material (BaTiO3) Dielectric Material Barrier Layer (BaTiO3) (Ni) Termination Finish (100% Matte Sn / Base Metal SnPb - 5% min) (Cu) Inner Electrodes (Ni) Base Metal (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% min) Inner Electrodes (Ni) Construction - Flexible Termination Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer Base Metal (Ni) (Cu) Termination Finish (100% Matte Sn / Epoxy Layer SnPb - 5% min) (Ag) Dielectric Material (BaTiO3) Inner Electrodes (Ni) Base Metal (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Termination Finish (100% Matte Sn / SnPb - 5% min) C1012_X7R_OPENMODE_SMD * 4/30/2014 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a "K" to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited to the "K" character only. Laser marking option is not available on: * C0G, Ultra Stable X8R and Y5V dielectric devices * EIA 0402 case size devices * EIA 0603 case size devices with Flexible Termination option. * KPS Commercial and Automotive Grade stacked devices. * X7R dielectric products in capacitance values outlined below EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 170 pF 150 pF 910 pF 2,000 pF 3,900 pF 6,700 pF 0.018 F 0.027 F 0.033 F Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of "KA8", which designates a KEMET device with rated capacitance of 100 F. Orientation of marking is vendor optional. KEMET ID (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com 2-Digit Capacitance Code C1012_X7R_OPENMODE_SMD * 4/30/2014 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional) cont'd Alpha Character 9 A Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 0.1 10 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 12 12 120 1,200 12,000 D 0.13 13 13 130 1,300 E 0.15 15 15 150 1,500 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 16 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 18 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 20 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 22 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 30 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 33 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 36 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 39 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 43 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 56 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 62 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 68 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 75 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 82 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 25 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 35 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 40 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 45 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 50 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 60 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 70 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 80 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 90 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration - Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Pitch (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo [10 pitches cumulative tolerance on tape 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 0.05 0.600 (0.079 0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 7.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 12.0 0.10 (0.157 0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 - 200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao Figure 4 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape s Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 56 10 72 - 200 5 S) Figure 5 - Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com R C1012_X7R_OPENMODE_SMD * 4/30/2014 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Paris, France Tel: 33-1-4646-1006 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Sasso Marconi, Italy Tel: 39-051-939111 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Bishop's Stortford, United Kingdom Tel: 44-1279-460122 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Espoo, Finland Tel: 358-9-5406-5000 Northeast Wilmington, MA Tel: 978-658-1663 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585 Southeast Asia Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 Central Novi, MI Tel: 248-306-9353 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 - 200 VDC (Commercial & Automotive Grade) Disclaimer All product specifications, statements, information and data (collectively, the "Information") in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation's ("KEMET") knowledge of typical operating conditions for such applications, but are not intended to constitute - and KEMET specifically disclaims - any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET's products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 4/30/2014 21