1
FEATURES
D(SOIC)PACKAGE
(TOP VIEW)
1
2
36
7
8
45
OUT
VCC+
IN–
IN+
VCC– NC
NCNC
DBV(SOT-23-5)PACKAGE
(TOP VIEW)
1
2
5
OUT VCC+
34
IN+ IN–
VCC–
NC – Nointernalconnection
DESCRIPTION/ORDERING INFORMATION
TS321
www.ti.com
...................................................................................................................................... SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008
LOW-POWER SINGLE OPERATIONAL AMPLIFIER
•Wide Power-Supply Range– Single Supply … 3 V to 30 V– Dual Supply … ± 1.5 V to ± 15 V•Large Output Voltage Swing …0 V to 3.5 V (Min) (V
CC
= 5 V)•Low Supply Current … 500 µA (Typ)•Low Input Bias Current … 20 nA (Typ)•Stable With High Capacitive Loads
The TS321 is a bipolar operational amplifier for cost-sensitive applications in which space savings are important.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
Tube of 75 TS321IDSOIC – D SR321IReel of 2500 TS321IDR– 40 ° C to 125 ° C
Reel of 3000 TS321IDBVRSOT-23-5 – DBV 9C1_Reel of 250 TS321IDBVT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com.(2) DBV: The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
VCC
IN–
IN+
OUT
TS321
SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008 ......................................................................................................................................
www.ti.com
SCHEMATIC DIAGRAM
2Submit Documentation Feedback Copyright © 2005 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS321
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
TS321
www.ti.com
...................................................................................................................................... SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Single 32V
CC
Supply voltage
(2)
VDual ± 16V
ID
Differential input voltage
(3)
32 VV
I
Input voltage range
(2) (4)
– 0.3 32 VI
I
Input current
(4)
50 mAt
short
Duration of output short circuit to ground UnlimitedD package 97θ
JA
Package thermal impedance, junction to free air
(5) (6)
° C/WDBV package 206T
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) These voltage values are with respect to the midpoint between V
CC+
and V
CC –
.(3) Differential voltages are at IN+ with respect to IN – .(4) Neither input must ever be more positive than V
CC+
or more negative than V
CC –
.(5) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Selecting the maximum of 150 ° C can affect reliability.(6) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
Single supply 3 30V
CC
Supply voltage VDual supply ± 1.5 ± 15T
A
Operating free-air temperature – 40 125 ° C
Copyright © 2005 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TS321
Electrical Characteristics
TS321
SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008 ......................................................................................................................................
www.ti.com
V
CC+
= 5 V, V
CC –
= GND, V
O
= 1.4 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
MIN TYP MAX UNIT
25 ° C 0.5 4R
S
= 0, 5 V < V
CC+
< 30 V,V
IO
Input offset voltage mV0 < V
IC
< (V
CC+
– 1.5 V)
Full range 525 ° C 2 30I
IO
Input offset current nAFull range 5025 ° C 20 150I
IB
Input bias current
(1)
nAFull range 20025 ° C 50 100Large-signal differential voltage V
CC
= 15 V, R
L
= 2 k Ω,A
VD
V/mVamplification V
O
= 1.4 V to 11.4 V
Full range 2525 ° C 0 V
CC+
– 1.5V
ICR
Common-mode input voltage
(2)
V
CC
= 30 V VFull range 0 V
CC+
– 225 ° C 26 27R
L
= 2 k Ω
Full range 25.5V
CC
= 30 V
25 ° C 27 28V
OH
High-level output voltage R
L
= 10 k ΩVFull range 26.525 ° C 3.5V
CC
= 5 V R
L
= 2 k Ω
Full range 325 ° C 5 15V
OL
Low-level output voltage R
L
= 10 k ΩVFull range 20V
CC
= 30 V, V
I
= 10 mV, R
L
= 2 k Ω,GBP Gain bandwidth product 25 ° C 0.8 MHzf = 100 kHz, C
L
= 100 pFV
CC
= 15 V, V
I
= 0.5 V to 3 V,SR Slew rate 25 ° C 0.4 V/ µsR
L
= 2 k Ω, C
L
= 100 pF, unity gainφ
m
Phase margin 25 ° C 60 °CMRR Common-mode rejection ratio R
S
≤10 k Ω25 ° C 65 85 dBI
SOURCE
Output source current V
CC
= 15 V, V
O
= 2 V, V
ID
= 1 V 25 ° C 20 40 mAV
O
= 2 V 25 ° C 10 20 mAI
SINK
Output sink current V
CC
= 15 V, V
ID
= 1 V
V
O
= 0.2 V 25 ° C 12 50 µAI
O
Short-circuit to GND V
CC
= 15 V 25 ° C 40 60 mASVR Supply-voltage rejection ratio V
CC
= 5 V to 30 V 25 ° C 65 110 dBV
CC
= 5 V 500 80025 ° CV
CC
= 30 V 600 900I
CC
Total supply current No load µAV
CC
= 5 V 600 900Full rangeV
CC
= 30 V 1000V
CC
= 30 V, V
O
= 2 V
pp
, A
V
= 20 dB,THD Total harmonic distortion 25 ° C 0.015 %R
L
= 2 k Ω, f = 1 kHz, C
L
= 100 pFe
N
Equivalent input noise voltage V
CC
= 30 V, f = 1 kHz, R
S
= 100 Ω25 ° C 50 nV/ √Hz
(1) The direction of the input current is out of the device. This current essentially is constant, independent of the state of the output, so noloading change exists on the input lines.(2) The input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of thecommon-mode voltage range is V
CC+
– 1.5 V, but either or both inputs can go to 32 V without damage.
4Submit Documentation Feedback Copyright © 2005 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS321
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TS321ID ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDE4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS321IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 18-May-2009
Addendum-Page 1
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-May-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS321IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TS321IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TS321IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Dec-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS321IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TS321IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TS321IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Dec-2011
Pack Materials-Page 2
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