MCP111-315E/TOG - Microchip Technology

MCP111/112

Features

• Ultra-low supply current: 1.75 µA (max.)

• Precision monitoring options of:

- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,

4.38V and 4.63V

• Resets microcontroller in a power-loss event

•Active-low V

OUT pin:

-MCP111 active-low, open-drain

-MCP112 active-low, push-pull

• Available in SOT23-3, TO-92, SC-70 and

SOT-89-3 packages

• Temperature Range:

- Extended: -40°C to +125°C

(except MCP1XX-195)

- Industrial: -40°C to +85°C (MCP1XX-195 only)

• Pb-free devices

Applications

• Critical Microcontroller and Microprocessor

Power-Moni tori ng Appl ic ati ons

• Computers

• Intelligent Instruments

• Port ab le Batte ry-Po wered Equipm en t

Description

The MCP111/112 are voltage-detecting devices

designed to keep a microcontroller in reset until the

system voltage has stabilized at the appropriate level

for reliable system operation. These devices also

operate as protection from brown-out conditions when

the system supply voltage drops below the specified

threshold voltage level. Ei gh t different trip v ol t ag es are

available.

Package Types

Block Diagram

TABLE 1: DEVICE FEATURES

3-Pin SOT23-3/SC-70

VDD

VOUT

MCP111/112

VSS

VOUT

3-Pin TO-92

VDD

1 32

VDD VSS

VOUT

3-Pin SOT-89

VDD

MCP111/112

VDD

Comparator

–Output

Driver VOUT

Band Gap

Reference

VSS

Device Output Reset Delay

(typ) Package Pin Out

(Pin # 1, 2, 3) Comment

Type Pull-up Resistor

MCP111 Open-drain External No VOUT, VSS, VDD

MCP112 Push-pull No No VOUT, VSS, VDD

MCP102 Push-pull No 120 ms RST, VDD, VSS See MCP102/103/121/131 Data Sheet

(DS21906)

MCP103 Push-pull No 120 ms VSS, RST, VDD See MCP102/103/121/131 Data Sheet

(DS21906)

MCP121 Open-drain External 120 ms RST, VDD, VSS See MCP102/103/121/131 Data Sheet

(DS21906)

MCP131 Open-Drain Internal (~95 kΩ)120 ms RST, VDD, VSS See MCP102/103/121/131 Data Sheet

(DS21906)

Micropower Voltage Detector

MCP111/112
DS21889D-page 2 © 2005 Microchip Technology Inc.
1.0 ELECTRICAL 
CHARACTERISTICS
Absolute Maximum Ratings†
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7.0V
Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Output current (RST)  . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/µ s
All inputs and outputs (except RST) w.r.t. VSS
 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0 .6V to (VDD + 1.0V)
RST output w.r.t. VSS  . . . . . . . . . . . . . . . . . . . -0 . 6 V to  1 3 .5 V
Storage temperature . . . . . . . . . . . . . . . . . . .65°C to + 150°C
Ambient temp. with power applied . . . . . . .  -40°C to + 125°C
Maximum Junction temp. with power applied . . . . . . . .150°C
ESD protection on all pins. . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2kV
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to  m aximum  rating conditions for  ext ended pe riods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless  otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111),
TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Operating Voltage Range VDD 1.0 — 5.5 V
Specified VDD Value to VOUT low VDD 1.0 — V I RST = 10 µA, V RST < 0.2V
Operating Current IDD —< 11.75µA
VDD Trip Point MCP1XX-195 VTRIP 1.872 1.900 1.929 V TA = +25°C (Note 1)
1.853 1.900 1.948 V TA = -40°C to +85°C (Note 2)
MCP1XX-240 2.285 2.320 2.355 V TA = +25°C (Note 1)
2.262 2.320 2.378 V Note 2
MCP1XX-270 2.591 2.630 2.670 V TA = +25°C (Note 1)
2.564 2.630 2.696 V Note 2
MCP1XX-290 2.857 2.900 2.944 V TA = +25°C (Note 1)
2.828 2.900 2.973 V Note 2
MCP1XX-300 2.886 2.930 2.974 V TA = +25°C (Note 1)
2.857 2.930 3.003 V Note 2
MCP1XX-315 3.034 3.080 3.126 V TA = +25°C (Note 1)
3.003 3.080 3.157 V Note 2
MCP1XX-450 4.314 4.380 4.446 V TA = +25°C (Note 1)
4.271 4.380 4.490 V Note 2
MCP1XX-475 4.561 4.630 4.700 V TA = +25°C (Note 1)
4.514 4.630 4.746 V Note 2
VDD Trip Point Tempco TTPCO — ±100 — ppm/°
C
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: This specification allows this device to be used in PICmicro® microcontroller applications that require the In-Circuit 
Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). 
This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (VOUT). The 
total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the 
VOUT pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 
0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.
4: This parameter is established by characterization and is not 100% tested.

MCP111/112

Threshold Hysteresis

(min. = 1%, max = 6%) MCP1XX-195 VHYS 0.019 — 0.114 V TA = +25°C

MCP1XX-240 0.023 — 0.139 V

MCP1XX-270 0.026 — 0.158 V

MCP1XX-290 0.029 — 0.174 V

MCP1XX-300 0.029 — 0.176 V

MCP1XX-315 0.031 — 0.185 V

MCP1XX-450 0.044 — 0.263 V

MCP1XX-475 0.046 — 0.278 V

VOUT Low-level Output Voltage VOL ——0.4VI

OL = 500 µA, VDD = VTRIP(MIN)

VOUT High-level Output Voltage VOH VDD – 0.6 — — V IOH = 1 mA, For only MCP112

(push-pull output)

Open-drain High Voltage on Output VODH — — 13.5

(3) VMCP111 only ,

VDD = 3.0V, Time voltage >

5.5V applied ≤ 100s,

current into pin limited to

2 mA, +25°C operation

recommended

Note 3, Note 4

Open-drain Output Leakage Current

(MCP111 only) IOD —0.1—µA

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111),

TA = -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.

3: This specification allows this device to be used in PICmicro® microcontroller applications that require the In-Circuit

Serial Programming™ (I CS P™ ) feature (see device-specific programming specifications for voltage requirements).

This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (VOUT). The

total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the

VOUT pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between

0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.

4: This parameter is established by characterization and is not 100% tested.

MCP111/112

FIGURE 1-1: Timing Diagram.

AC CHARACTERISTICS

TEMPERATURE CHARACTERISTIC S

Electrical Specifications: Unless otherwise indicated, all limits are spec ified for VDD = 1V to 5.5V, RPU = 100 kΩ

(only MCP111), TA = -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

VDD Detec t to VOUT Inactive tRPU —90 — µs Figure 1-1 and CL = 50 pF

(Note 1)

VDD Detec t to VOUT Active tRPD — 130 — µs VDD ramped from VTRIP(MAX) +

250 mV down to VTRIP(MIN) –

250 mV, per Figure 1-1,

CL = 50 pF (Note 1)

VOUT Rise Time After VOUT Active tRT —5 —µs For VOUT 10% to 90% of final

value per Figure 1-1, CL = 50 pF

(Note 1)

Note 1: These parameters are for design guidance only and are not 100% tested.

Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ

(only MCP111), TA = -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range TA-40 — +85 °C MCP1XX-195

Specified Temperature Range TA-40 — +125 °C Except MCP1XX-195

Maximum Junction Temperatur e TJ——+150°C

Storage Temperature Range TA-65 — +150 °C

Package Thermal Resistances

Thermal Resistance, 3L-SO T23 θJA — 336 — °C/W

Thermal Resistance, 3L-SC-70 θJA — 340 — °C/W

Thermal Resistance, 3L-TO-92 θJA —131.9 — °C/W

Thermal Resistance, 3L-SOT-89 θJA —110 —°C/W

VTRIP

VDD

VOUT

tRPU

VOH

tRT

tRPD

VOL

MCP111/112

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-1: IDD vs. Temperature

(MCP111-195).

FIGURE 2-2: IDD vs. Temperature

(MCP112-300).

FIGURE 2-3: IDD vs. Temperature

(MCP112-475).

FIGURE 2-4: IDD vs. VDD (MCP111-195).

FIGURE 2-5: IDD vs. VDD (MCP112-300).

FIGURE 2-6: IDD vs. VDD (MCP112-475).

Note: The g r ap hs and t ables provided fol low i ng thi s n ote are a statis tic al s umm ar y b as ed on a limited num ber of

samples and are provided for informational purpos es only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.2

0.4

0.6

0.8

1.2

1.4

1.6

-40

-20

100

120

140

Temperature (°C)

IDD (uA)

1.7V

1.0V

2.1V

2.8V

4.0V

5.0V

5.5V

MCP111-195

0.2

0.4

0.6

0.8

1.2

-40

-20

100

120

140

Temperatu re (°C)

IDD (uA)

1.7V

1.0V

2.1V

2.8V

4.0V

5.0V

MCP112-300 5.5V

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-40

-20

100

120

140

Temperature (°C)

IDD (uA)

1.7V

1.0V

2.1V

2.8V

4.0V

5.0V

5.5V

MCP112-475

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.02.03.04.05.06.

VDD (V)

IDD (uA)

-40°C

+25°C

+85°C

+125°C

MCP111-195

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.0 2.0 3.0 4.0 5.0 6.0

VDD (V)

IDD (uA)

MCP112-300

-40°C

+25°C

+85°C

+125°C

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.0 2.0 3.0 4.0 5.0 6.

VDD (V)

IDD (uA)

MCP112-475

-40°C

+25°C

+85°C

+125°C

MCP111/112

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-7: VTRIP and VHYST vs.

Temperature (MCP111-195).

FIGURE 2-8: VTRIP and VHYST vs.

Temperature (MCP112-300).

FIGURE 2-9: VTRIP and VHYST vs.

Temperature (MCP112-475).

FIGURE 2-10: VOL vs. IOL

(MCP111-195 @V

DD = 1.7V).

FIGURE 2-11: VOL vs. IOL

(MCP112-300 @V

DD = 2.7V).

FIGURE 2-12: VOL vs. IOL

(MCP112-475 @V

DD = 4.4V).

1.895

1.900

1.905

1.910

1.915

1.920

1.925

1.930

1.935

1.940

1.945

1.950

-60 -10 40 90 140

Temperature (°C)

VTRIP (V)

0.000

0.005

0.010

0.015

0.020

0.025

0.030

0.035

0.040

0.045

0.050

Hyst (V)

VTRIP, V decreasing

VTRIP, V increasing

VHYS, Hysteresis

MCP111-195

max temp is

+85°C

2.900

2.920

2.940

2.960

2.980

3.000

3.020

3.040

-60 -10 40 90 140

Temperature (°C)

VTRIP (V)

0.082

0.084

0.086

0.088

0.090

0.092

0.094

0.096

0.098

0.100

Hyst (V)

MCP112-300

VTRIP, V decreasing

VTRIP, V increasing

VHYS, Hysteresis

4.580

4.600

4.620

4.640

4.660

4.680

4.700

4.720

4.740

4.760

4.780

4.800

-60 -20 20 60 100 140

Temperature (°C)

VTRIP (V)

0.100

0.110

0.120

0.130

0.140

0.150

0.160

0.170

0.180

Hyst (V)

MCP112-475

VTRIP, V decreasing

VTRIP, V increasing

VHYS, Hysteresis

0.000

0.020

0.040

0.060

0.080

0.100

0.120

0.00 0.25 0.50 0.75 1.00

IOL (mA)

VOL (V)

-40°C

+25°C

+85°C

+125°C

MCP111-195

VDD = 1.7V

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

0.00 0.25 0.50 0.75 1.00

IOL (mA)

VOL (V)

MCP112-300

VDD = 2.7V

-40°C

+25°C

+85°C

+125°C

0.000

0.010

0.020

0.030

0.040

0.050

0.00 0.25 0.50 0.75 1.00

IOL (mA)

VOL (V)

MCP112-475

VDD = 4.4V

-40°C

+25°C

+85°C

+125°C

MCP111/112

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-13: VOL vs. Temperature

(MCP111-195 @ VDD = 1 .7V ).

FIGURE 2-14: VOL vs. Temperature

(MCP112-300 @ VDD = 2.7V).

FIGURE 2-15: VOL vs. Temperature

(MCP112-475 @ VDD = 4.4V).

FIGURE 2-16: VOH vs. IOH

(MCP112-300 @ VDD = 3.1V).

FIGURE 2-17: VOH vs. IOH

(MCP112-475 @ VDD = 4.8V).

FIGURE 2-18: Typical Transient Response

(25 °C).

0.000

0.020

0.040

0.060

0.080

0.100

0.120

-40 0 40 80 120

Temperature (°C)

VOL (V)

IOL = 0.00 mA

MCP111-195

VDD = 1.7 V

IOL = 0.25 mA

IOL = 0.50 mA

IOL = 0.75 mA

IOL = 1.00 mA

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

-40 0 40 80 120

Temperature (°C)

VOL (V)

MCP112-300

VDD = 2.7V

IOL = 0.00 mA

IOL = 0.25 mA

IOL = 0.50 mA

IOL = 0. 75 mA

IOL = 1.00 mA

0.000

0.010

0.020

0.030

0.040

0.050

-40 0 40 80 120

Temperatu re (°C)

VOL (V)

IOL = 0.00 mA

IOL = 0.25 mA

IOL = 0.50 mA

IOL = 0.75 mA

IOL = 1.0 0 mA

MCP112-475

VDD = 4.4V

2.900

2.950

3.000

3.050

3.100

3.150

0.00 0.25 0.50 0.75 1.0

IOL (mA)

VOH (V)

-40 °C +25 °C

+85 °C

+125 °C

MCP112-300

VDD = 3.1V

4.680

4.700

4.720

4.740

4.760

4.780

4.800

4.820

0.00 0.25 0.50 0.75 1.00

IOL (mA)

VOH (V)

MCP112-475

VDD = 4.8V

-40 °C

+25 °C

+85 °C

+125 °C

100

200

300

400

500

600

0.001 0.01 0.1 1 10

VTRIP(min) - VDD

Transient D uration (µs)

MCP111-195

MCP112-475

MCP112-300

MCP111/112

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-19: tRPD vs. Temperature

(MCP111-195).

FIGURE 2-20: tRPD vs. Temperature

(MCP112-300).

FIGURE 2-21: tRPD vs. Temperature

(MCP112-475).

FIGURE 2-22: tRPU vs. Temperature

(MCP111-195).

FIGURE 2-23: tRPU vs. Temperature

(MCP112-300).

FIGURE 2-24: tRPU vs. Temperature

(MCP112-475).

100

150

200

250

300

350

-40 -15 10 35 60 85 110

Tempera tur e (°C)

tRPD (µs)

VDD decreasing from:

VTRIP(max) + 0.25V to VTRIP(min) - 0.25V

VDD decreasing from:

5V - 1.7V

VDD decreasing from:

5V - 0V

MCP111-195

100

120

140

160

-40 -15 10 35 60 85 110

Temperature (°C)

tRPD (µs)

VDD decreasing from:

VTRIP(max) + 0.25V to VTRIP(min) - 0.25V

VDD decreasing from:

5V - 2.7V

VDD decreasing from:

5V - 0V

MCP112-300

100

150

200

250

-40 -15 10 35 60 85 110

Temperature (°C)

tRPD (µs)

VDD decreasing from:

VTRIP(max) + 0.25V to VTRIP(min) - 0.25V

VDD decreasing from:

5V - 4.4V

VDD decreasing from:

5V - 0V

MCP112-475

100

150

200

250

300

350

400

-40 -15 10 35 60 85 110

Temperature (°C)

tRPU (µs)

VDD increasing from:

0V - 2.1V

VDD increasing

from: 0V - 5.5V

VDD increasing from:

0V - 2.8V VDD increasing

from: 0V - 4.0V

MCP111-195

100

120

140

-40 -15 10 35 60 85 110

Temperature (°C)

tRPU (µs)

VDD increasing from:

0V - 3.1V

VDD increasing from:

0V - 5.5V

VDD increasing from:

0V - 3.3V

VDD increasing from:

0V - 4.0V

MCP112-300

100

150

200

250

-40 -15 10 35 60 85 110

Tempera ture (°C )

tRPU (µs)

VDD increasing from:

0V - 4.9V

VDD increasing from:

0V - 5.0V

VDD increasing from:

0V - 5.5V

MCP112-475

MCP111/112

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-25: tRT vs. Temperature

(MCP111-195).

FIGURE 2-26: tRT vs. Temperature

(MCP112-300).

FIGURE 2-27: tRT vs. Temperature

(MCP112-475).

FIGURE 2-28: Open-Drain Leakage

Current vs. V oltage Applied to VOUT Pin

(MCP111-195).

-40 -15 10 35 60 85 110

Temperature (°C)

tRT (µs)

VDD increasing from:

0V - 2.1V

VDD increasing from:

0V - 5.5V

VDD increasing from:

0V - 2.8V

VDD increasing

from: 0V - 4.0V

MCP111-195

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

-40 -15 10 35 60 85 110

Temperature (°C)

tRT (µs)

VDD increasing from:

0V - 3.1V

VDD increasing from:

0V - 5.5V

VDD increasing from:

0V - 3.3V

VDD increasing from:

0V - 4.0V

MCP112-300

0.0800

0.0900

0.1000

0.1100

0.1200

0.1300

0.1400

0.1500

-40 -15 10 35 60 85 110

Temperature (°C)

tRT (µs)

VDD increasing from:

0V - 4.8V

VDD increasing from:

0V - 5.5V

VDD increasing from:

0V - 4.9V

VDD increasing from:

0V - 5.0V

MCP112-475

1.E-13

1.E-12

1.E-11

1.E-10

1.E-09

1.E-08

1.E-07

1.E-06

1.E-05

1.E-04

1.E-03

1.E-02

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14

Pull-Up Voltage (V)

Open-Drain Leakage (A)

125°C

25°C - 40°C

10m

100µ

10µ

1µ

10n

100n

100p

10p

100f

MCP111/112

3.0 PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No.

Symbol Function

SOT-23-3

SC-70 SOT-89-3 T0-92

111V

OUT Output State

VDD Falling:

H = VDD > VTRIP

L = VDD < VTRIP

VDD Rising:

H = VDD > VTRIP + VHYS

L = VDD < VTRIP + VHYS

223V

SS Gr ound reference

332V

DD Positive pow e r suppl y

—4—V

DD Positive pow e r suppl y

MCP111/112

4.0 APPLICATION INFORMATION

For many of today’s microcontroller applications, care

must be taken to prevent low-power conditions that can

cause many different system problems. The most

common causes are brown-out conditions, where the

system supply drops below the operating level momen-

tarily . The second most common cause is when a slowly

decaying power supply causes the microcontroller to

begin executing instructions without sufficient voltage to

sustain SRAM, thus producing indeterminate results.

Figure 4-1 shows a typical application circ uit.

FIGURE 4-1: Typic al App li ca tio n Circui t.

4.1 VTRIP Operation

The volt age trip point ( VTRIP) is determined on the falling

edge of VDD. The a ctual vol tage tr ip poi nt (V TRIPAC) will

be between the minimum trip point (VTRIPMIN) and the

maximum trip point (VTRIPMAX). There is a hyst eres is on

this trip point to remove any “jitter” that would occur on

the VOUT pin when the device VDD is at the trip point.

Figure 4-2 shows the state of the VOUT pin as

determined by the VDD voltage. The VTRIP specification

is for falling VDD voltages. When the VDD voltage is

rising, the VOUT pin will not be driven high until VDD is at

VTRIP + VHYS.

FIGURE 4-2: VOUT Operation as Determined by the VTRIP and VHYS.

MCP11X

VDD

VOUT MCLR

(Reset Input)

VSS GND

PICmicro®

Microcontroller

RPU

Note 1: RPU may be required with the MCP111

due to the open-drain output. Resisto

RPU is not required with the MCP112.

0.1

µF (1)

VDD VTRIPMAX

VTRIPMIN VTRIPAC

VTRIPAC

VTRIPAC + VHYSAC

VOUT

< 1 V is outside the

device specifications

MCP111/112

4.2 Negative Going VDD Transients

The minimum pulse width (time) required to cause a

reset may be an important criteria in the implementa-

tion of a Power-on Reset (POR) circuit. This time is

referred to as trans ient duration, de fined as the amount

of time needed for these supervisory devices to

respond to a drop in VDD. The tran sient du ration t ime is

dependa nt on the magnitude of V TRIP – VDD. Gener ally

speaking, the transient duration decreases with

increases in VTRIP – VDD.

Figur e 4- 3 shows a t ypical t ransient duratio n vs. reset

comparator overdrive for which the MCP111/112 will

not generate a reset pulse. It shows that the farther

below the trip point the transient pulse goes, the

duration of the pulse required to cause a reset gets

shorter. Figure 2-18 shows the transient response

characteris ti cs for the MCP111/112.

A 0.1 µF bypass capacitor, mounted as close as

possible to the VDD pin, provides additional transient

immunity (refer to Figure 4-1).

FIGURE 4-3: Example of Typical

Transient Duration Waveform.

4.3 Effect of Temperature on T ime-out

Period (tRPU)

The time-out period (tRPU) determines how long the

device remains in the reset condition. This is affected

by both VDD and temperature. The graph shown in

Figur es 2-22, 2-23 and 2-24 sho w the ty pical respo nse

for different VDD values and temperatures.

4.4 Using in PICmicro®

Microcontroller ICSP™

Applications (MCP111 only)

Figure 4-4 shows the typical application circuit for using

the MCP111 for voltage supervisory function when the

PICmicro microcontroller will be programmed via the

In-Circuit Serial Programming™ (ICSP)

feature. Additional information is available in TB087,

“Using Vo ltage Supervisors with PICmicro® Micr ocon-

troller Systems which Implement In-Circuit Serial

Programming™”, DS91087.

FIGURE 4-4: Typical Application Circuit

for PICmicro® Microcontroller with the ICSP™

feature.

Time (µs)

Supply Vo ltage

VTRIP(MIN) - VDD

tTRANS

VTRIP(MAX)

VTRIP(MIN)

Note: It is recommend ed that th e current into the

RST pin be current limited by a 1 kΩ

resistor.

VDD/VPP

VDD

MCLR

(reset input)

(Active-Low)

VSS

PICmicro®

MCU

RPU

0.1 µF

1kΩ

MCP111

VDD

RST

VSS

MCP111/112

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

3-Pin SOT-23

3-Lead TO-92

XXXXXX

YWWNNN

Example:

MCP111

290E

TO^^

547256

Part Number SOT-23 Part Number SOT-23

MCP111T-195I/TT MPNN MCP112T-195I/TT MRNN

MCP111T-240ETT MQNN MCP112T-240ETT MSNN

MCP111T-270E/TT MGNN MCP112T-270E/TT MANN

MCP111T-290E/TT NHNN MCP112T-290E/TT MBNN

MCP111T-300E/TT MJNN MCP112T-300E/TT MCNN

MCP111T-315E/TT MKNN MCP112T-315E/TT MDNN

MCP111T-450E/TT MLNN MCP112T-450E/TT MENN

MCP111T-475E/TT MMNN MCP112T-475E/TT MFNN

Example:

XXNN

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanume ric trac ea bil ity code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designat or ( )

can be found on the outer packaging for this package.

Note: In the ev ent the fu ll Mic rochip part nu mber ca nnot be m arked o n one lin e, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

3-Pin SOT-89 Example:

Part Number SOT-89 Part Number SOT-89

MCP111T-195I/MB MP MCP112T-195I/MB MR

MCP111T-240EMB MQ MCP112T-240EMB MS

MCP111T-270E/MB MG MCP112T-270E/MB MA

MCP111T-290E/MB NH MCP112T-290E/MB MB

MCP111T-300E/MB MJ MCP112T-300E/MB MC

MCP111T-315E/MB MK MCP112T-315E/MB MD

MCP111T-450E/MB ML MCP112T-450E/MB ME

MCP111T-475E/MB MM MCP112T-475E/MB MF

XXYYWW

NNN

MCP111/112

Package Marking Information (Continued)

3-Pin SC-70

Top Side

Part Number SC-70 Part Number SC-70

MCP111T-195I/LB EPN MCP112T-195I/LB ERN

MCP111T-240E/LB EQN MCP112T-240E/LB ESN

MCP111T-270E/LB EGN MCP112T-270E/LB EAN

MCP111T-290E/LB EHN MCP112T-290E/LB EBN

MCP111T-300E/LB EJN MCP112T-300E/LB ECN

MCP111T-315E/LB EKN MCP112T-315E/LB EDN

MCP111T-450E/LB ELN MCP112T-450E/LB EEN

MCP111T-475E/LB EMN MCP112T-475E/LB EFN

Example:

XXN

Top Side

Par t Number SC-70 Part Number SC-70

MCP111T-195I/LB EPNN MCP112T-195I/LB ERNN

MCP111T-240E/LB EQNN MCP112T-240E/LB ESNN

MCP111T-270E/LB EGNN MCP112T-270E/LB EANN

MCP111T-290E/LB EHNN MCP112T-290E/LB EBNN

MCP111T-300E/LB EJNN MCP112T-300E/LB ECNN

MCP111T-315E/LB EKNN MCP112T-315E/LB EDNN

MCP111T-450E/LB ELNN MCP112T-450E/LB EENN

MCP111T-475E/LB EMNN MCP112T-475E/LB EFNN

Example:

XXNN

MCP111/112

3-Lead Plastic Small Outline Transistor (MB) (SOT89)

0.560.43.022.017BLead 2 Width

0.440.35.017.014

Lead Thickness

1.831.62.072.064D1Tab Length

4.604.40.181.173DOverall Length

2.292.13.090.084E1

Molded Package Width at Top

4.253.94.167.155HOverall Width

1.601.40.063.055AOverall Height

3.00 BSC.118 BSC

Outside lead pitch (basic)

1.50 BSC.059 BSC

Pitch

MAXMINMAXMINDimension Limits

MILLIMETERS*INCHESUnits

shall not exceed .005" (0.127mm) per side.

Notes:

JEDEC Equivalent: TO-243

Drawing No. C04-29

*Controlling Parameter

Foot Length L .035 .047 0.89 1.20

Leads 1 & 3 Width B1 .014 .019 0.36 0.48

Molded Package Width at Base

E .090 .102 2.29 2.60

Tab Corner Radii R 0.254.010

Revised 07-24-03

DD1

Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions

MCP111/112

3-Lead Plastic Small Outline Transistor (TT) (SOT-23)

10501050

Mold Draft Angle Bottom 10501050

Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004

Lead Thickness 10501050

Foot Angle 0.550.450.35.022.018.014LFoot Length 3.042.922.80.120.115.110DOveral l Length 1.401.301.20.055.051.047E1Molded Package Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff § 1.020.950.88.040.037.035A2Molded Package Thickness 1.121.010.89.044.040.035AOverall Height 1.92.076

Outside lead pitch (basic) 0.96

.038

Pitch 33

Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mits MILLIMETERSINCHES*Units

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-236

Drawing No. C04-104

§ Significant Characteristic

MCP111/112

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

12°8°12°8°

Mold Draft Angle Bottom

12°8°12°8°

Mold Draft Angle Top

0.400.15.016.006BLead Width

0.250.08.010.003

Lead Thickness

0.410.10.016.004LFoot Length

2.251.80.089.071DOverall Length

1.351.15.053.045E1Molded Package Width

2.401.80.094.071EOverall Width

.0100.00.0004.000A1Standoff

1.000.80.039.031A2Molded Package Thickness

1.100.80.043.031AOverall Height

1.30 BSC.

Outside lead pitch (basic)

0.65 BSC.

Pitch

33Number of Pins

MAXMINMAXMINDimension Limits

MILLIMETERS*INCHESUnits

shall not exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

Notes:

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

*Controlling Parameter

p1 D

A A2

.026 BSC.

.051 BSC.

MCP111/112

3-Lead Plastic Transistor Outline (TO) (TO-92)

432432

Mold Draft Angle Bottom 654654

0.560.480.41.022.019.016BLead Width 0.510.430.36.020.017.014

Lead Thickness

2.412.292.16.095.090.085RMolded Package Radius 4.954.644.32.195.183.170DOverall Len gth 4.954.714.45.195.186.175E1Overall Width 3.943.623.30.155.143.130ABottom to Package Flat 1.27.050

Pitch 33

Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mits MILLIMETERSINCHES*Units

Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49

*Controlling Parameter

Mold Draft Angle Top

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-92

Drawing No. C04-101

MCP111/112

5.2 Product Tape and Reel Specifications

FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)

FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS

Top

Cover

Tape

TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS

Case

Outline Package

Type

Carrier

Dimensions Cavity

Dimensions Output

Quantity

Units

Reel

Diameter in

mm P

mm A0

mm B0

mm K0

TT SOT-23B 3L 8 4 3.15 2.77 1.22 3000 180

LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180

Standard Reel Component Orientation

Device

Marking

PIN 1

User Direction of Feed

MCP111/112

FIGURE 5-3: TO-92 DEVICES

FIGURE 5-4: SOT-89 DEVICE S

Device

Marking

Seal

Tape

Back

Tape

MARK

FACE

User Direction of Feed

MARK

FACE

MARK

FACE

Note: Bent leads are for Tape and Reel only.

Pin 1

User Direction of Feed

P, Pitch

Standard Reel Component Orientation Reverse Reel Component Orientation

W, Width

of Carrier

Tape

Pin 1

© 2005 Microchip Technology Inc. DS21889D-page 21
MCP111/112
APPENDIX A: REVISION HISTORY
Revision D (June 2005)
1. Added SOT-89-3 package information
throughout.
Revision C (March 2005)
The following is  the list of modifications:
1. Added  Section 4.4 “Using in PICmicro®
Microcontroller ICSP™ Applications
(MCP111 only)” on using the MCP111 in
PICmicro microcontroller ICSP applications.
2. Added VODH specifications in Section 1.0
“Electrical Characteristics” (for ICSP
applications).
3. Added Figure 2-28.
4. Added devices features table to page 1.
5. Updated SC-70 package markings and added
Pb-free marking information to Section 5.0
“Packaging information”.
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
1. Corrected package marking information in
Section 5.0 “Packaging information”
Revision A (May 2004)
• Original Release of this Document.

MCP111/112

NOTES:

MCP111/112

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: MCP111: MicroPo w er Voltage Detector, ope n-d ra i n

MCP111T: Mic roPo w er Voltage Detector, open-d ra in

(Tape and Ree l)

MCP11 2: Mic roP o wer Voltage Detector, push-p ull

MCP11 2T: Mic roPo w er Voltage Detector, push-pul l

(Tape and Ree l)

Monitor i ng Optio ns: 195 = 1.90V

240 = 2.32V

270 = 2.63V

290 = 2.90V

300 = 2.93V

315 = 3.08V

450 = 4.38V

475 = 4.63V

Temperature Range: I = -40°C to +85°C (MCP11X-195 only)

E = -40°C to +125°C (Except MCP11X-195 only)

Package: LB = SC-70, 3-lead

MB = SOT-89, 3-lead

TO = TO-92, 3-lead

TT = SOT-23B, 3-lead

PART NO. XXX X

Temperature

Monitoring

Options

Device

Examples:

a) MCP 111T- 195I/TT: Ta pe and Ree l,

1.95V option, open-drain ,

-40°C to +85°C,

SOT-23B package.

b) MCP 111T-315E /LB : Tape and Ree l,

3.15V option, open-drain,

-40°C to +125°C,

SC-70-3 package.

c) MCP111-300E/TO: 3.00V option, open-drain,

-40°C to +125°C,

TO-92-3 package.

d) MCP111-315E/MB: 3.15V option, open-drain,

-40°C to +125 °C ,

SOT-89-3 pac kage .

a) MCP 112T-290E/T T: Tape and Ree l,

2.90V o ptio n, push -p ull, -

40°C to +125°C,

SOT-23B-3 package.

b) MCP 112T-475E/L B : Tape and Ree l,

4.75V option, push-pull,

-40°C to +125°C,

SC-70-3 package.

c) MCP112-450E/TO: 4.5V option, push-pull,

-40°C to +125°C,

TO-92-3 package.

d) MCP112-315E/MB: 3.15V option, push-pull,

-40°C to +125 °C ,

SOT-89-3 package.

Range

Package

Tape/Reel

Option

MCP111/112

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIN D WHETHER EXPRESS OR IMPLIED ,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. U se of Microc hip’s products as critical com ponents in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSm art , rfPIC, and

SmartShunt are registered trademark s of Microchip

Tec hnology Incor porated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDE V, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPI Cworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Linear Active Thermistor,

MPASM, MPLIB , MPLINK, MP SIM, PICkit, PICDE M,

PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,

PowerMate, Powe rTool, rfLAB, rfPICD EM , Select Mode,

Smart Serial, SmartTel, Total Endurance and WiperLock are

trademarks of Microchip Technology Incorporated in the

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SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of its kind on the market t oday, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contai ned in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving the c ode prot ect ion features of our

products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

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