INTEGRATED CIRCUITS DIVISION
DS-MXHV9910-R04 www.ixysic.com 1
MXHV9910
Off-Line, High Brightness
LED Driver
Features
•8VDC to 450VDC Input Voltage Range
•>90% Efficiency
•Drives Multiple LEDs in Series/Parallel
Combinations
•Regulated LED Drive Current
•Linear or PWM Brightness Control
•Resistor-Programmable Oscillator Frequency
•RoHS Compliant
Applications
•Flat-Panel Display RGB Backlighting
•Signage and Decorative LED Lighting
•DC/DC or AC/DC LED Driver Applications
Description
The MXHV9910 is a low-cost, high-brightness (HB)
LED driver manufactured using IXYS IC Division’s
high-voltage BCDMOS on SOI process. This driver
has internal circuitry that allows it to operate from a
universal AC line or from 8VDC to 450VDC. This highly
versatile input operating voltage enables this IC to be
used in a broad range of HB LED applications.
The driver features a fixed-frequency, peak-current
control method, which provides an ideal solution for
driving multiple LEDs in series and in parallel. In
addition, LED dimming can be implemented by
applying a small DC voltage to the LD pin, or by
applying a low-frequency digital PWM signal to the
PWMD pin.
The MXHV9910 is available in a standard 8-lead SOIC
package and a thermally enhanced 8-lead SOIC
package with an Exposed Thermal Pad (EP)
Ordering Information
MXHV9910 Block Diagram
Part Description
MXHV9910B SOIC-8 (100/Tube)
MXHV9910BTR SOIC-8 Tape & Reel (2000/Reel)
MXHV9910BE SOIC-8 EP (100/Tube)
With Exposed Thermal Pad
MXHV9910BETR SOIC-8 EP Tape & Reel (2000/Reel)
With Exposed Thermal Pad
VDD
VIN
RT
LD
GND
PWMD
GATE
CS
6
1
8
7
5
3
+
-
+
-
4
2
OSC
Voltage
Regulator
Voltage
Reference
PWM
Control
250mV
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MXHV9910
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1 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 LED Driver Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2.1 Input Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.2 Current Sense Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.3 Current Sense Blanking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.4 Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.5 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.6 Inductor Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.7 Gate Output Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.8 Linear Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.9 PWM Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.10 Combination Linear and PWM Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.5 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5.1 MXHV9910B: SOIC-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5.2 MXHV9910BE: SOIC-8 With Exposed Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.6 Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.6.1 Tape & Reel Information for both 8-Pin Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
INTEGRATED CIRCUITS DIVISION
MXHV9910
R04 www.ixysic.com 3
1. Specifications
1.1 Package Pinout 1.2 Pin Description
1.3 Absolute Maximum Ratings
Electrical absolute maximum ratings are at 25°C.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
V
IN
CS
GND
GATE
R
T
LD
V
DD
PWMD
1
2
3
4
8
7
6
5
Pin# Name Description
1VINInput voltage
2CS
LED Current Sense input. Internal current
sense threshold is set at 250mV. The external
sense resistor sets the maximum LED current.
3 GND Device Ground
4 GATE External MOSFET gate driver output
5PWMD
Low-frequency PWM dimming control input with
internal pull-down resistor.
6VDD
Regulated supply voltage output. Requires a
storage capacitor to GND. Can be overdriven by
external voltage applied to VDD .
7LD
Linear Dimming. Apply a voltage less than
VCS(high) to dim the LED(s).
8RTResistor to GND sets the oscillator/primary
PWM frequency.
EP -
Electrical and thermal conductive pad on the
bottom of the MXHV9910BE. Connect this pad
to ground, and provide sufficient thermal
coupling to remove heat from the package.
Parameter Symbol Maximum Unit
Input Voltage to GND VIN-0.5 to +460 V
Inputs & Outputs Voltage to GND CS, LD, PWMD, GATE -0.3 to VDD+0.3 V
VDD , Externally Applied VDD.EXT 15 V
Power Dissipation
SOIC-8 With Thermal Tab PD
2.5 W
SOIC-8 W/O Thermal Tab 0.975 W
Maximum Junction Temperature TJmax 150 °C
Operating Temperature TA-40 to +85 °C
Junction Temperature (Operating) TJ-40 to +150 °C
Storage Temperature TSTG -55 to +150 °C
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1.4 Recommended Operating Conditions
1.5 Electrical Characteristics
Unless otherwise specified, all electrical specifications are provided for TA=25C.
1.6 Thermal Characteristics
1 Use of a four-layer PCB can improve thermal dissipation (reference EIA/JEDEC JESD51-5).
Parameter Symbol Minimum Nominal Maximum Unit
Input Voltage Range VIN8 - 450 VDC
PWMD Frequency fPWMD - 500 - Hz
Operating Temperature TA-40 - +85 °C
Parameter Conditions Symbol Minimum Typical Maximum Unit
Input
Input DC Voltage Range DC Input Voltage VIN 8 - 450 VDC
Shut-Down Mode Supply Current PWMD to GND, VIN=15 to 450V IINSD -0.30.6mA
Maximum Voltage to VDD Pin External Voltage applied to VDD Pin VDDmax --12V
Regulator
Internal Voltage Regulator
VIN=15V to 450V,
IDD(ext)=0,
GATE Output=Open
VDD 7.2 7.8 8.4 VDC
VDD Current Available
for External Circuitry -IDD(ext) --2mA
VDD Load Regulation VIN=15V, IL=1mA VDD - - 200 mV
PWM Dimming
PWMD Input Low Voltage VIN=8V to 450V VEN(low) --0.5
V
PWMD Input High Voltage VIN=8V to 450V VEN(high) 2.4 - -
PWMD Pull-Down Resistance VIN=12V, VPWMD=VDD REN70 115 165 k
Current Sense Comparator
Current Sense (CS) Input Current
CS Low CS=0V IIL --45-90
A
CS High CS=VDD IIH -0±15
Current Sense Threshold Voltage -40°C < TA < 85°CV
CS(high) 200 - 280 mV
Current Sense Blanking Interval RT=400ktBLANK- 400 - ns
Delay from CS Trip to Gate Low RT=400ktDELAY - 300 - ns
Oscillator
Oscillator Frequency (Gate Driver) RT=400kfS51 64 77 kHz
Gate Driver
Gate High Output Voltage IOUT= -10mA VGATE(hi) VDD-0.3 --
V
Gate Low Output Voltage IOUT=10mA VGATE(lo) - 0.03 0.3
Gate Output Rise Time CGATE=500pF tRISE -16-ns
Gate Output Fall Time CGATE=500pF tFA LL -7-
Parameter Package Symbol Minimum Typical Maximum Unit
Thermal Resistance,
Junction-to-Ambient
SOIC-8 With Thermal Pad (BE) 1
RJA
-50-
°C/W
SOIC-8 W/O Thermal Pad (B) - 128 -
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MXHV9910
R04 www.ixysic.com 5
2. Functional Description
Figure 1 Typical Application Circuit
2.1 Overview
The MXHV9910 is a high-efficiency, low cost, off-line
LED driver designed using IXYS IC Division's state of
the art BCDMOS on SOI process. The driver can
operate from a DC supply voltage between 8 to
450VDC . The versatile input supply voltage range
enables this driver to be used in a broad range of
applications such as flat panel display RGB
backlighting, signage, decorative LED lighting, and
incandescent lamp replacement.
The MXHV9910 IC is configured in a buck converter
topology, which is a perfect choice for off-line and DC
applications driving multiple LEDs in series or parallel.
This method provides excellent efficiency and enables
a buck switcher design using a minimum number of
external components. An external current sense
resistor sets the peak current to the LED string. In
addition, LED dimming can be implemented by either
applying a DC control voltage to the LD pin, or by
applying a low frequency, pulse-width modulated
digital signal to the PWMD pin (typically 500 Hz).
2.2 LED Driver Theory of Operation
The gate driver pulse width mode (PWM) control
circuit is enabled by connecting the PWMD pin to the
VDD pin. When enabled, the rising edge of each
internal clock turns on the gate driver and the external
power MOSFET, causing the inductor current to ramp
up the voltage across the current sense resistor
located at the CS pin. When the rising voltage at the
current sense, CS, pin exceeds VCS(high), the internally
set threshold, the gate drive signal goes low and turns
off the external power MOSFET. Turning the power
MOSFET off causes the inductor current to decay until
the next rising edge of the clock, and the process
repeats.
The peak current threshold is set by comparing the
voltage developed across the RSENSE resistor to the
internal threshold, VCS(high). This default threshold can
be overridden externally by applying a voltage less
than VCS(high) to the LD pin. The lower of these two
thresholds limits the peak current in the inductor
A soft-start function can be implemented by slowly
ramping up the DC voltage at the LD pin from 0mV to
a level greater than 250mV. Figure 2 shows a typical
recommended soft-start circuit design.
Figure 2 Soft-Start RC Network
+
-
+
-
Voltage
Regulator
Voltage
Reference
PWM
Control
250mV
V
DD
V
IN
R
T
LD
GND
PWMD
GATE
CS
V
DD
6
8
1
7
5
3
4
2
8-450V
RSENSE
OSC
MXHV9910
VIN
CS
GND
GATE
RT
LD
VDD
PWMD
51kΩ
2kΩ0.1μF
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MXHV9910
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Figure 3 MXHV9910 Waveforms (From Application Circuit in Figure 6)
2.2.1 Input Voltage Regulator
The MXHV9910 has an internal voltage regulator that
can work with input voltages ranging from 12VDC to
450 VDC. When the input voltage applied at the VIN pin
is greater than 12VDC , the internal voltage regulator
regulates this voltage down to a typical 7.8V. The VDD
pin is the internal regulator output pin and must be
bypassed by a low ESR capacitor, typically 0.1F, t o
provide a low impedance path for high frequency
switching noise.
The MXHV9910 driver does not require the bulky
start-up resistors typically needed for off-line
controllers. An internal voltage regulator provides
sufficient voltage and current to power the internal IC
circuits. This voltage is also available at the VDD pin,
and can be used as bias voltage for external circuitry.
The internal voltage regulator can by bypassed by
applying an external DC voltage to the VDD pin that is
slightly higher than the internal regulator’s maximum
output voltage. This feature reduces power dissipation
of the integrated circuit and is more suitable in isolated
applications where an auxiliary transformer winding
could be used to supply VDD .
The total input current drawn by the VIN pin is equal to
the integrated circuit quiescent current, which is
0.6mA maximum, plus the gate driver current. The
gate driver current is dependant on the switching
frequency and the gate charge of the external power
MOSFET.
The following equation can be used to approximate
the VIN input current:
Where QGATE is the total gate charge of the external
power MOSFET, and fS is the switching oscillator
frequency.
2.2.2 Current Sense Resistor
The peak LED current is set by an external current
sense resistor connected from the CS pin to ground.
The value of the current sense resistor is calculated
based on the desired average LED current, the current
sense threshold, and the inductor ripple current.
The inductor is typically selected to be large enough to
keep the ripple current (the peak-to-peak difference in
the inductor current waveform) to less than 30% of the
average LED current. Factoring in this ripple current
requirement, the current sense resistor can be
determined by:
Where:
•Vcsth = nominal current sense threshold = 0.25V
•riout = inductor ripple = 0.3
•ILED = average LED current
The power dissipation rating of the sense resistor can
be found with the following formula:
CH1:
50mA/div
FS 65kHz
CH2:
CH3:
5mV/div x 10
Time Scale: 5s/div
Max 77mA
10V/div
INTEGRATED CIRCUITS DIVISION
MXHV9910
R04 www.ixysic.com 7
It is a good practice to select a power rating that is at
least twice the calculated value. This will give proper
margins, and make the design more reliable.
2.2.3 Current Sense Blanking
The MXHV9910 has an internal current-sense
blanking circuit. When the power MOSFET is turned
on, the external inductor can cause an undesired
spike at the current sense pin, CS, initiating a
premature termination of the gate pulse. To avoid this
condition, a typical 400ns internal leading edge
blanking time is implemented. This internal feature
eliminates the need for external RC filtering, thus
simplifying the design. During the current sense
blanking time, the current limit comparator is disabled,
preventing the gate-drive circuit from terminating the
gate-drive signal.
2.2.4 Enable/Disable
Connecting the PWMD pin to VDD enables the gate
driver. Connecting PWMD to GND disables the gate
driver and sets the device into the shut-down mode. In
the shut-down mode, the gate output drive is disabled
while all other functions remain active. The maximum
quiescent current in the shut-down mode is 0.6mA.
2.2.5 Oscillator
The MXHV9910 operates in a constant frequency
mode. Setting the oscillator frequency is achieved by
connecting an external resistor between RT and GND.
In general, switching frequency selection is based on
the inductor size, controller power dissipation, and the
input filter capacitor.
The typical off-line LED driver switching frequency, fS,
is between 30kHz and 120kHz. This operating range
gives designers a reasonable compromise between
switching losses and inductor size. The internal RC
oscillator has a frequency accuracy of ±20%. Figure 4
shows the RT resistor selection for the desired fS.
Figure 4 Resistor Selection
2.2.6 Inductor Design
The inductor value is determined based on LED ripple
current, maximum on-time, the forward voltage drop of
all LEDs in a string at the desired current, and the
minimum input voltage, which is based on design
requirements. The maximum on-time is determined by
the duty cycle and switching frequency. The maximum
duty cycle is given by:
Where:
•VLEDstring is the LED string voltage at desired
average LED current.
•Vin is the minimum input voltage to VIN
The maximum duty cycle must be restricted to less
than 50% in order to prevent sub-harmonic oscillations
and open loop instability.
The converter maximum ON-time is given by:
Where fs is the switching frequency of the internal
oscillator.
0
50
100
150
200
250
0 200 400 600 800 1000 1200
Frequency (kHz)
RT (kΩ)
Oscillator Frequency, fS, vs. RT
(TA=27ºC)
Dmax
VLEDstring
Vin
--------------------------=
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The inductor value for the given ripple is:
The inductor peak current rating is given by:
2.2.7 Gate Output Drive
The MXHV9910 uses an internal gate drive circuit to
turn on and off an external power MOSFET. The gate
driver can drive a variety of MOSFETs. For a typical
off-line application, the total MOSFET gate charge will
be less than 25nC.
2.2.8 Linear Dimming
A linear dimming function can be implemented by
applying a DC control voltage to the LD pin. By varying
this voltage, the user can adjust the current level in the
LEDs, which in turn will increase or decrease the light
intensity. The control voltage to the LD pin can be
generated from an external voltage divider network
from VDD . This function is useful if the user requires a
LED current at a particular level and there is no exact
Rsense value available. Note that applying a voltage
higher than the current sense threshold voltage at the
LD pin will not change the output current due to the
fixed threshold setting. When the LD pin is not used, it
should be connected to VDD .
Figure 5 Typical Linear Dimming Application Circuit
2.2.9 PWM Dimming
Pulse width modulation dimming can be implemented
by driving the PWMD pin with a low frequency square
wave signal in the range of a few hundred Hertz. The
PWMD signal controls the LED brightness by gating
the PWM gate driver output pin GATE.
The signal can be generated by a microcontroller or a
pulse generator with a duty cycle proportional to the
amount of desired light output. When PWMD is low,
gate drive is off; when PWMD is high, gate drive is
enabled.
HB LEDs
350mA
D1
BYV26B
C1
0.1μF
400V
C2
22μF
400V
R1
402kΩ
L1
4.7mH
R3
0.56Ω
R2
51kΩ
RA1
5.0kΩ
C3
2.2μF
16V
C4
0.1μF
25V
AC
AC +
-
BR1
Fuse F2
2A
NTC1 MXHV9910
VIN
CS
GND
GATE
RT
LD
VDD
PWMD
IXTA8N50P
LD
Monitor
AC Input
90 - 265Vrms
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R04 www.ixysic.com 9
Figure 6 Buck Driver for PWM Dimming Application Circuit
2.2.10Combination Linear and PWM Dimming
A combination of linear and PWM dimming techniques
can be used to achieve a large dimming ratio.
Note: The output current will not go to zero if the LD
pin is pulled to GND because the minimum gate driver
on-time is equal to the current sense blanking interval.
To achieve zero LED current, the PWMD pin should be
used.
HB LEDs
900mA Max
ASMT-Mx00
D1 Schottky
40V
0.1μF
50V
402kΩ
220μH
R1
0.27Ω
10μF
50VMXHV9910
V
IN
CS
GND
GATE
R
T
LD
V
DD
PWMD
Q1
V
IN
12 - 30V
DC
PWM
CPC1001N*
*Optional Isolation
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3. Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
MXHV9910B / MXHV9910BE MSL 1
Device Maximum Temperature x Time
MXHV9910B / MXHV9910BE 260°C for 30 seconds
INTEGRATED CIRCUITS DIVISION
MXHV9910
R04 www.ixysic.com 11
3.5 Mechanical Dimensions
3.5.1 MXHV9910B: SOIC-8
3.5.2 MXHV9910BE: SOIC-8 With Exposed Thermal Pad
Note: Thermal pad should be electrically connected to GND, pin 3.
Dimensions
mm
(inches)
PCB Land Pattern
Pin 1
Pin 8
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.270 REF
(0.050)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
0.559 ± 0.254
(0.022 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
4.928 ± 0.254
(0.194 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
1.270 REF
(0.050)
0.762 ± 0.254
(0.030 ± 0.010)
7º
2.540 ± 0.254
(0.100 ± 0.010)
3.556 ± 0.254
(0.140 ±0.010)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)
INTEGRATED CIRCUITS DIVISION
MXHV9910
12 www.ixysic.com R04
3.6 Packaging Information
3.6.1 Tape & Reel Information for both 8-Pin Packages
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256)
P=8.00
(0.315)
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specifications: DS-MXHV9910-R04
© Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
6/16/2014