LM3488,LM3488Q
LM3488/LM3488Q High Efficiency Low-Side N-Channel Controller for Switching
Regulators
Literature Number: SNVS089L
LM3488/LM3488Q
October 17, 2011
High Efficiency Low-Side N-Channel Controller for
Switching Regulators
General Description
The LM3488 is a versatile Low-Side N-FET high performance
controller for switching regulators. It is suitable for use in
topologies requiring low side FET, such as boost, flyback,
SEPIC, etc. Moreover, the LM3488 can be operated at ex-
tremely high switching frequency in order to reduce the overall
solution size. The switching frequency of LM3488 can be ad-
justed to any value between 100kHz and 1MHz by using a
single external resistor or by synchronizing it to an external
clock. Current mode control provides superior bandwidth and
transient response, besides cycle-by-cycle current limiting.
Output current can be programmed with a single external re-
sistor.
The LM3488 has built in features such as thermal shutdown,
short-circuit protection and over voltage protection. Power
saving shutdown mode reduces the total supply current to
5µA and allows power supply sequencing. Internal soft-start
limits the inrush current at start-up.
Key Specifications
Wide supply voltage range of 2.97V to 40V
100kHz to 1MHz Adjustable and Synchronizable clock
frequency
±1.5% (over temperature) internal reference
5µA shutdown current (over temperature)
Features
LM3488Q is AEC-Q100 qualified and manufactured on an
Automotive Grade Flow
8-lead Mini-SO8 (MSOP-8) package
Internal push-pull driver with 1A peak current capability
Current limit and thermal shutdown
Frequency compensation optimized with a capacitor and
a resistor
Internal softstart
Current Mode Operation
Undervoltage Lockout with hysteresis
Applications
Distributed Power Systems
Notebook, PDA, Digital Camera, and other Portable
Applications
Offline Power Supplies
Set-Top Boxes
Typical Application Circuit
10138844
Typical SEPIC Converter
© 2011 National Semiconductor Corporation 101388 www.national.com
LM3488/LM3488Q High Efficiency Low-Side N-Channel Controller for Switching Regulators
Connection Diagram
10138802
8 Lead Mini SO8 Package (MSOP-8 Package)
Package Marking and Ordering Information
Order Number Package Type Package Marking Supplied As Feature
LM3488MM
MSOP-8
S21B 1000 units on Tape and Reel
LM3488MMX 3500 units on Tape and Reel
LM3488QMM
SSKB
1000 units on Tape and Reel AEC-Q100 (Grade 1) qualified.
Automotive Grade Production
Flow*
LM3488QMMX 3500 units on Tape and Reel
*Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market, including defect detection methodologies.
Reliability qualification is compliant with the requirements and temperature grades defined in the AEC-Q100 standard. Automotive grade products are identified
with the letter Q. For more information go to http://www.national.com/automotive.
Pin Descriptions
Pin Name Pin Number Description
ISEN 1Current sense input pin. Voltage generated across an external sense
resistor is fed into this pin.
COMP 2 Compensation pin. A resistor, capacitor combination connected to this
pin provides compensation for the control loop.
FB 3 Feedback pin. The output voltage should be adjusted using a resistor
divider to provide 1.26V at this pin.
AGND 4 Analog ground pin.
PGND 5 Power ground pin.
DR 6 Drive pin of the IC. The gate of the external MOSFET should be
connected to this pin.
FA/SYNC/SD 7 Frequency adjust, synchronization, and Shutdown pin. A resistor
connected to this pin sets the oscillator frequency. An external clock
signal at this pin will synchronize the controller to the frequency of the
clock. A high level on this pin for 30µs will turn the device off. The
device will then draw less than 10µA from the supply.
VIN 8 Power supply input pin.
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LM3488/LM3488Q
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage 45V
FB Pin Voltage -0.4V < VFB < 7V
FA/SYNC/SD Pin Voltage -0.4V < VFA/SYNC/SD
< 7V
Peak Driver Output Current (<10µs) 1.0A
Power Dissipation Internally Limited
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
ESD Susceptibilty
Human Body Model (Note 2) 2kV
Lead Temperature
MM Package
Vapor Phase (60 sec.)
Infared (15 sec.)
215°C
260°C
DR Pin Voltage −0.4V VDR 8V
ILIM Pin Voltage 600mV
Operating Ratings (Note 1)
Supply Voltage 2.97V VIN 40V
Junction Temperature
Range −40°C TJ +125°C
Switching Frequency 100kHz FSW 1MHz
Electrical Characteristics
Specifications in Standard type face are for TJ = 25°C, and in bold type face apply over the full Operating Temperature
Range. Unless otherwise specified, VIN = 12V, RFA = 40k
Symbol Parameter Conditions Typical Limit Units
VFB Feedback Voltage VCOMP = 1.4V,
2.97 VIN 40V
1.26
1.2507/1.24
1.2753/1.28
V
V(min)
V(max)
ΔVLINE Feedback Voltage Line
Regulation
2.97 VIN 40V 0.001
%/V
ΔVLOAD Output Voltage Load
Regulation
IEAO Source/Sink ±0.5
%/V (max)
VUVLO Input Undervoltage Lock-out 2.85
2.97
V
V(max)
VUV(HYS) Input Undervoltage Lock-out
Hysteresis
170
130
210
mV
mV (min)
mV (max)
Fnom Nominal Switching Frequency RFA = 40K400
360
430
kHz
kHz(min)
kHz(max)
RDS1 (ON) Driver Switch On Resistance
(top)
IDR = 0.2A, VIN= 5V 16 Ω
RDS2 (ON) Driver Switch On Resistance
(bottom)
IDR = 0.2A 4.5 Ω
VDR (max) Maximum Drive Voltage
Swing(Note 6)
VIN < 7.2V VIN V
VIN 7.2V 7.2
Dmax Maximum Duty Cycle(Note 7) 100 %
Tmin (on) Minimum On Time 325
230
550
nsec
nsec(min)
nsec(max)
ISUPPLY Supply Current (switching) (Note 9)2.7 3.0
mA
mA (max)
IQQuiescent Current in
Shutdown Mode
VFA/SYNC/SD = 5V(Note 10), VIN =
5V
5
7
µA
µA (max)
VSENSE Current Sense Threshold
Voltage
VIN = 5V 156
135/ 125
180/ 190
mV
mV (min)
mV (max)
VSC Short-Circuit Current Limit
Sense Voltage
VIN = 5V 343
250
415
mV
mV (min)
mV (max)
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LM3488/LM3488Q
Symbol Parameter Conditions Typical Limit Units
VSL Internal Compensation Ramp
Voltage
VIN = 5V 92
52
132
mV
mV(min)
mV(max)
VSL ratio VSL/VSENSE 0.49 0.30
0.70
(min)
(max)
VOVP Output Over-voltage
Protection (with respect to
feedback voltage) (Note 8)
VCOMP = 1.4V 50
32/ 25
78/ 85
mV
mV(min)
mV(max)
VOVP(HYS) Output Over-Voltage
Protection Hysteresis(Note 8)
VCOMP = 1.4V 60
20
110
mV
mV(min)
mV(max)
Gm Error Ampifier
Transconductance
VCOMP = 1.4V
IEAO = 100µA (Source/Sink)
800
600/ 365
1000/ 1265
µmho
µmho (min)
µmho (max)
AVOL Error Amplifier Voltage Gain VCOMP = 1.4V
IEAO = 100µA (Source/Sink)
38
26
44
V/V
V/V (min)
V/V (max)
IEAO Error Amplifier Output Current
(Source/ Sink)
Source, VCOMP = 1.4V, VFB = 0V 110
80/ 50
140/ 180
µA
µA (min)
µA (max)
Sink, VCOMP = 1.4V, VFB = 1.4V −140
−100/ −85
−180/ −185
µA
µA (min)
µA (max)
VEAO Error Amplifier Output Voltage
Swing
Upper Limit
VFB = 0V
COMP Pin = Floating
2.2
1.8
2.4
V
V(min)
V(max)
Lower Limit
VFB = 1.4V
0.56
0.2
1.0
V
V(min)
V(max)
TSS Internal Soft-Start Delay VFB = 1.2V, VCOMP = Floating 4 msec
TrDrive Pin Rise Time Cgs = 3000pf, VDR = 0 to 3V 25 ns
TfDrive Pin Fall Time Cgs = 3000pf, VDR = 0 to 3V 25 ns
VSD Shutdown and
Synchronization signal
threshold (Note 5)
Output = High 1.27
1.4
V
V (max)
Output = Low 0.65
0.3
V
V (min)
ISD Shutdown Pin Current VSD = 5V −1 µA
VSD = 0V +1
IFB Feedback Pin Current 15 nA
TSD Thermal Shutdown 165 °C
Tsh Thermal Shutdown Hysteresis 10 °C
θJA Thermal Resistance MM Package 200 °C/W
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LM3488/LM3488Q
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin.
Note 3: All limits are guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100%
tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate
Average Outgoing Quality Level (AOQL).
Note 4: Typical numbers are at 25°C and represent the most likely norm.
Note 5: The FA/SYNC/SD pin should be pulled to VIN through a resistor to turn the regulator off.
Note 6: The voltage on the drive pin, VDR is equal to the input voltage when input voltage is less than 7.2V. VDR is equal to 7.2V when the input voltage is greater
than or equal to 7.2V.
Note 7: The limits for the maximum duty cycle can not be specified since the part does not permit less than 100% maximum duty cycle operation.
Note 8: The over-voltage protection is specified with respect to the feedback voltage. This is because the over-voltage protection tracks the feedback voltage.
The over-voltage thresold can be calculated by adding the feedback voltage, VFB to the over-voltage protection specification.
Note 9: For this test, the FA/SYNC/SD Pin is pulled to ground using a 40K resistor .
Note 10: For this test, the FA/SYNC/SD Pin is pulled to 5V using a 40K resistor.
Typical Performance Characteristics Unless otherwise specified, VIN = 12V, TJ = 25°C.
IQ vs Temperature & Input Voltage
10138803
ISupply vs Input Voltage (Non-Switching)
10138834
ISupply vs VIN
10138835
Switching Frequency vs RFA
10138804
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LM3488/LM3488Q
Frequency vs Temperature
10138854
Drive Voltage vs Input Voltage
10138805
Current Sense Threshold vs Input Voltage
10138845
COMP Pin Voltage vs Load Current
10138862
Efficiency vs Load Current (3.3V In and 12V Out)
10138859
Efficiency vs Load Current (5V In and 12V Out)
10138858
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LM3488/LM3488Q
Efficiency vs Load Current (9V In and 12V Out)
10138860
Efficiency vs Load Current (3.3V In and 5V Out)
10138853
Error Amplifier Gain
10138855
Error Amplifier Phase
10138856
COMP Pin Source Current vs Temperature
10138836
Short Circuit Protection vs Input Voltage
10138857
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LM3488/LM3488Q
Compensation Ramp vs Compensation Resistor
10138851
Shutdown Threshold Hysteresis vs Temperature
10138846
Current Sense Voltage vs Duty Cycle
10138852
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LM3488/LM3488Q
Functional Block Diagram
10138806
Functional Description
The LM3488 uses a fixed frequency, Pulse Width Modulated
(PWM), current mode control architecture. In a typical appli-
cation circuit, the peak current through the external MOSFET
is sensed through an external sense resistor. The voltage
across this resistor is fed into the ISEN pin. This voltage is then
level shifted and fed into the positive input of the PWM com-
parator. The output voltage is also sensed through an external
feedback resistor divider network and fed into the error am-
plifier negative input (feedback pin, FB). The output of the
error amplifier (COMP pin) is added to the slope compensa-
tion ramp and fed into the negative input of the PWM com-
parator.
At the start of any switching cycle, the oscillator sets the RS
latch using the SET/Blank-out and switch logic blocks. This
forces a high signal on the DR pin (gate of the external MOS-
FET) and the external MOSFET turns on. When the voltage
on the positive input of the PWM comparator exceeds the
negative input, the RS latch is reset and the external MOSFET
turns off.
The voltage sensed across the sense resistor generally con-
tains spurious noise spikes, as shown in Figure 1. These
spikes can force the PWM comparator to reset the RS latch
prematurely. To prevent these spikes from resetting the latch,
a blank-out circuit inside the IC prevents the PWM comparator
from resetting the latch for a short duration after the latch is
set. This duration is about 150ns and is called the blank-out
time.
Under extremely light load or no-load conditions, the energy
delivered to the output capacitor when the external MOSFET
is on during the blank-out time is more than what is delivered
to the load. An over-voltage comparator inside the LM3488
prevents the output voltage from rising under these condi-
tions. The over-voltage comparator senses the feedback (FB
pin) voltage and resets the RS latch under these conditions.
The latch remains in reset state till the output decays to the
nominal value.
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LM3488/LM3488Q
10138807
FIGURE 1. Basic Operation of the PWM comparator
SLOPE COMPENSATION RAMP
The LM3488 uses a current mode control scheme. The main
advantages of current mode control are inherent cycle-by-cy-
cle current limit for the switch, and simpler control loop char-
acteristics. It is also easy to parallel power stages using
current mode control since as current sharing is automatic.
Current mode control has an inherent instability for duty cy-
cles greater than 50%, as shown in Figure 2. In Figure 2, a
small increase in the load current causes the switch current
to increase by ΔIO. The effect of this load change, ΔI1, is :
From the above equation, when D > 0.5, ΔI1 will be greater
than ΔIO. In other words, the disturbance is divergent. So a
very small perturbation in the load will cause the disturbance
to increase.
To prevent the sub-harmonic oscillations, a compensation
ramp is added to the control signal, as shown in Figure 3.
With the compensation ramp,
10138809
FIGURE 2. Sub-Harmonic Oscillation for D>0.5
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LM3488/LM3488Q
10138811
FIGURE 3. Compensation Ramp Avoids Sub-Harmonic Oscillation
The compensation ramp has been added internally in
LM3488. The slope of this compensation ramp has been se-
lected to satisfy most of the applications. The slope of the
internal compensation ramp depends on the frequency. This
slope can be calculated using the formula:
MC = VSL.FS Volts/second
In the above equation, VSL is the amplitude of the internal
compensation ramp. Limits for VSL have been specified in the
electrical characteristics.
In order to provide the user additional flexibility, a patented
scheme has been implemented inside the IC to increase the
slope of the compensation ramp externally, if the need arises.
Adding a single external resistor, RSL(as shown in Figure 4)
increases the slope of the compensation ramp, MC by :
In this equation, ΔVSL is equal to 40.10-6RSL. Hence,
ΔVSL versus RSL has been plotted in Figure 5 for different fre-
quencies.
10138813
FIGURE 4. Increasing the Slope of the Compensation Ramp
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LM3488/LM3488Q
10138851
FIGURE 5. ΔVSL vs RSL
FREQUENCY ADJUST/SYNCHRONIZATION/SHUTDOWN
The switching frequency of LM3488 can be adjusted between
100kHz and 1MHz using a single external resistor. This re-
sistor must be connected between FA/SYNC/SD pin and
ground, as shown in Figure 6. Please refer to the typical per-
formance characteristics to determine the value of the resistor
required for a desired switching frequency.
The LM3488 can be synchronized to an external clock. The
external clock must be connected to the FA/SYNC/SD pin
through a resistor, RSYNC as shown in Figure 7. The value of
this resistor is dependent on the off time of the synchroniza-
tion pulse, TOFF(SYNC). Table 1 shows the range of resistors to
be used for a given TOFF(SYNC).
TABLE 1.
TOFF(SYNC) (µsec) RSYNC range (kΩ)
1 5 to 13
2 20 to 40
3 40 to 65
4 55 to 90
5 70 to 110
6 85 to 140
7 100 to 160
8 120 to 190
9 135 to 215
10 150 to 240
It is also necessary to have the width of the synchronization
pulse wider than the duty cycle of the converter (when DR pin
is high and the switching point is low). It is also necessary to
have the synchronization pulse width 300nsecs.
The FA/SYNC/SD pin also functions as a shutdown pin. If a
high signal (refer to the electrical characteristics for definition
of high signal) appears on the FA/SYNC/SD pin, the LM3488
stops switching and goes into a low current mode. The total
supply current of the IC reduces to less than 10µA under these
conditions.
Figure 8 and Figure 9 show implementation of shutdown func-
tion when operating in Frequency adjust mode and synchro-
nization mode respectively. In frequency adjust mode,
connecting the FA/SYNC/SD pin to ground forces the clock
to run at a certain frequency. Pulling this pin high shuts down
the IC. In frequency adjust or synchronization mode, a high
signal for more than 30µs shuts down the IC.
Figure 10 shows implementation of both frequency adjust with
RFA resistor and frequency synchronization with RSYNC. The
switching frequency is defined by RFA when a synchronization
signal is not applied. When sync is applied it overrides the
RFA setting.
10138814
FIGURE 6. Frequency Adjust
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LM3488/LM3488Q
10138815
FIGURE 7. Frequency Synchronization
10138816
FIGURE 8. Shutdown Operation in Frequency Adjust Mode
10138817
FIGURE 9. Shutdown Operation in Synchronization Mode
10138887
FIGURE 10. Frequency Adjust or Frequency Synchronization
SHORT-CIRCUIT PROTECTION
When the voltage across the sense resistor (measured on
ISEN Pin) exceeds 350mV, short-circuit current limit gets acti-
vated. A comparator inside LM3488 reduces the switching
frequency by a factor of 5 and maintains this condition till the
short is removed.
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LM3488/LM3488Q
Typical Applications
The LM3488 may be operated in either continuous or discon-
tinuous conduction mode. The following applications are de-
signed for continuous conduction operation. This mode of
operation has higher efficiency and lower EMI characteristics
than the discontinuous mode.
BOOST CONVERTER
The most common topology for LM3488 is the boost or step-
up topology. The boost converter converts a low input voltage
into a higher output voltage. The basic configuration for a
boost regulator is shown in Figure 11. In continuous conduc-
tion mode (when the inductor current never reaches zero at
steady state), the boost regulator operates in two cycles. In
the first cycle of operation, MOSFET Q is turned on and en-
ergy is stored in the inductor. During this cycle, diode D is
reverse biased and load current is supplied by the output ca-
pacitor, COUT.
In the second cycle, MOSFET Q is off and the diode is forward
biased. The energy stored in the inductor is transferred to the
load and output capacitor. The ratio of these two cycles de-
termines the output voltage. The output voltage is defined as:
(ignoring the drop across the MOSFET and the diode), or
where D is the duty cycle of the switch, VD is the forward volt-
age drop of the diode, and VQ is the drop across the MOSFET
when it is on. The following sections describe selection of
components for a boost converter.
10138822
FIGURE 11. Simplified Boost Converter Diagram (a) First cycle of operation. (b) Second cycle of operation
POWER INDUCTOR SELECTION
The inductor is one of the two energy storage elements in a
boost converter. Figure 12 shows how the inductor current
varies during a switching cycle. The current through an in-
ductor is quantified as:
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LM3488/LM3488Q
10138824
FIGURE 12. A. Inductor Current B. Diode Current
If VL(t) is constant, diL(t)/dt must be constant. Hence, for a
given input voltage and output voltage, the current in the in-
ductor changes at a constant rate.
The important quantities in determining a proper inductance
value are IL (the average inductor current) and ΔiL (the induc-
tor current ripple). If ΔiL is larger than IL, the inductor current
will drop to zero for a portion of the cycle and the converter
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LM3488/LM3488Q
will operate in discontinuous conduction mode. If ΔiL is small-
er than IL, the inductor current will stay above zero and the
converter will operate in continuous conduction mode. All the
analysis in this datasheet assumes operation in continuous
conduction mode. To operate in continuous conduction
mode, the following conditions must be met:
IL > ΔiL
Choose the minimum IOUT to determine the minimum L. A
common choice is to set ΔiL to 30% of IL. Choosing an ap-
propriate core size for the inductor involves calculating the
average and peak currents expected through the inductor. In
a boost converter,
and IL_peak = IL(max) + ΔiL(max),
where
A core size with ratings higher than these values should be
chosen. If the core is not properly rated, saturation will dra-
matically reduce overall efficiency.
The LM3488 can be set to switch at very high frequencies.
When the switching frequency is high, the converter can be
operated with very small inductor values. With a small induc-
tor value, the peak inductor current can be extremely higher
than the output currents, especially under light load condi-
tions.
The LM3488 senses the peak current through the switch. The
peak current through the switch is the same as the peak cur-
rent calculated above.
PROGRAMMING THE OUTPUT VOLTAGE
The output voltage can be programmed using a resistor di-
vider between the output and the feedback pins, as shown in
Figure 13. The resistors are selected such that the voltage at
the feedback pin is 1.26V. RF1 and RF2 can be selected using
the equation,
A 100pF capacitor may be connected between the feedback
and ground pins to reduce noise.
10138820
FIGURE 13. Adjusting the Output Voltage
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LM3488/LM3488Q
SETTING THE CURRENT LIMIT
The maximum amount of current that can be delivered to the
load is set by the sense resistor, RSEN. Current limit occurs
when the voltage that is generated across the sense resistor
equals the current sense threshold voltage, VSENSE. When
this threshold is reached, the switch will be turned off until the
next cycle. Limits for VSENSE are specified in the electrical
characteristics section. VSENSE represents the maximum val-
ue of the internal control signal VCS. This control signal,
however, is not a constant value and changes over the course
of a period as a result of the internal compensation ramp (See
Figure 3). Therefore the current limit threshold will also
change. The actual current limit threshold is a function of the
sense voltage (VSENSE) and the internal compensation ramp:
RSEN x ISWLIMIT = VCSMAX = VSENSE - (D x VSL)
Where ISWLIMIT is the peak switch current limit, defined by the
equation below. As duty cycle increases, the control voltage
is reduced as VSL ramps up. Since current limit threshold
varies with duty cycle, the following equation should be used
to select RSEN and set the desired current limit threshold:
The numerator of the above equation is VCS, and ISWLIMIT is
calculated as:
To avoid false triggering, the current limit value should have
some margin above the maximum operating value, typically
120%. Values for both VSENSE and VSL are specified in the
characteristic table. However, calculating with the limits of
these two specs could result in an unrealistically wide current
limit or RSEN range. Therefore, the following equation is rec-
ommended, using the VSL ratio value given in the EC table:
RSEN is part of the current mode control loop and has some
influence on control loop stability. Therefore, once the current
limit threshold is set, loop stability must be verified. To verify
stability, use the following equation:
If the selected RSEN is greater than this value, additional slope
compensation must be added to ensure stability, as described
in the section below.
CURRENT LIMIT WITH EXTERNAL SLOPE
COMPENSATION
RSL is used to add additional slope compensation when re-
quired. It is not necessary in most designs and RSL should be
no larger than necessary. Select RSL according to the follow-
ing equation:
Where RSEN is the selected value based on current limit. With
RSL installed, the control signal includes additional external
slope to stabilize the loop, which will also have an effect on
the current limit threshold. Therefore, the current limit thresh-
old must be re-verified, as illustrated in the equations below :
VCS = VSENSE – (D x (VSL + ΔVSL))
Where ΔVSL is the additional slope compensation generated
and calculated as:
ΔVSL = 40 µA x RSL
This changes the equation for current limit (or RSEN) to:
The RSEN and RSL values may have to be calculated iteratively
in order to achieve both the desired current limit and stable
operation. In some designs RSL can also help to filter noise
on the ISEN pin.
If the inductor is selected such that ripple current is the rec-
ommended 30% value, and the current limit threshold is 120%
of the maximum peak, a simpler method can be used to de-
termine RSEN. The equation below will provide optimum sta-
bility without RSL, provided that the above 2 conditions are
met:
POWER DIODE SELECTION
Observation of the boost converter circuit shows that the av-
erage current through the diode is the average load current,
and the peak current through the diode is the peak current
through the inductor. The diode should be rated to handle
more than its peak current. The peak diode current can be
calculated using the formula:
ID(Peak) = IOUT/ (1−D) + ΔIL
In the above equation, IOUT is the output current and ΔIL has
been defined in Figure 12
The peak reverse voltage for boost converter is equal to the
regulator output voltage. The diode must be capable of han-
dling this voltage. To improve efficiency, a low forward drop
schottky diode is recommended.
POWER MOSFET SELECTION
The drive pin of LM3488 must be connected to the gate of an
external MOSFET. In a boost topology, the drain of the ex-
ternal N-Channel MOSFET is connected to the inductor and
the source is connected to the ground. The drive pin (DR)
voltage depends on the input voltage (see typical perfor-
mance characteristics). In most applications, a logic level
MOSFET can be used. For very low input voltages, a sub-
logic level MOSFET should be used.
The selected MOSFET directly controls the efficiency. The
critical parameters for selection of a MOSFET are:
1. Minimum threshold voltage, VTH(MIN)
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LM3488/LM3488Q
2. On-resistance, RDS(ON)
3. Total gate charge, Qg
4. Reverse transfer capacitance, CRSS
5. Maximum drain to source voltage, VDS(MAX)
The off-state voltage of the MOSFET is approximately equal
to the output voltage. VDS(MAX) of the MOSFET must be
greater than the output voltage. The power losses in the
MOSFET can be categorized into conduction losses and ac
switching or transition losses. RDS(ON) is needed to estimate
the conduction losses. The conduction loss, PCOND, is the
I2R loss across the MOSFET. The maximum conduction loss
is given by:
where DMAX is the maximum duty cycle.
The turn-on and turn-off transitions of a MOSFET require
times of tens of nano-seconds. CRSS and Qg are needed to
estimate the large instantaneous power loss that occurs dur-
ing these transitions.
The amount of gate current required to turn the MOSFET on
can be calculated using the formula:
IG = Qg.FS
The required gate drive power to turn the MOSFET on is equal
to the switching frequency times the energy required to deliver
the charge to bring the gate charge voltage to VDR (see elec-
trical characteristics and typical performance characteristics
for the drive voltage specification).
PDrive = FS.Qg.VDR
INPUT CAPACITOR SELECTION
Due to the presence of an inductor at the input of a boost
converter, the input current waveform is continuous and tri-
angular, as shown in Figure 12. The inductor ensures that the
input capacitor sees fairly low ripple currents. However, as the
input capacitor gets smaller, the input ripple goes up. The rms
current in the input capacitor is given by:
The input capacitor should be capable of handling the rms
current. Although the input capacitor is not as critical in a
boost application, low values can cause impedance interac-
tions. Therefore a good quality capacitor should be chosen in
the range of 10µF to 20µF. If a value lower than 10µF is used,
then problems with impedance interactions or switching noise
can affect the LM3478. To improve performance, especially
with VIN below 8 volts, it is recommended to use a 20 resistor
at the input to provide a RC filter. The resistor is placed in
series with the VIN pin with only a bypass capacitor attached
to the VIN pin directly (see Figure 14). A 0.1µF or 1µF ceramic
capacitor is necessary in this configuration. The bulk input
capacitor and inductor will connect on the other side of the
resistor with the input power supply.
10138893
FIGURE 14. Reducing IC Input Noise
OUTPUT CAPACITOR SELECTION
The output capacitor in a boost converter provides all the out-
put current when the inductor is charging. As a result it sees
very large ripple currents. The output capacitor should be ca-
pable of handling the maximum rms current. The rms current
in the output capacitor is:
Where
and D, the duty cycle is equal to (VOUT − VIN)/VOUT.
The ESR and ESL of the output capacitor directly control the
output ripple. Use capacitors with low ESR and ESL at the
output for high efficiency and low ripple voltage. Surface
Mount tantalums, surface mount polymer electrolytic and
polymer tantalum, Sanyo- OSCON, or multi-layer ceramic ca-
pacitors are recommended at the output.
Designing SEPIC Using LM3488
Since the LM3488 controls a low-side N-Channel MOSFET,
it can also be used in SEPIC (Single Ended Primary Induc-
tance Converter) applications. An example of SEPIC using
LM3488 is shown in Figure 15. As shown in Figure 15, the
output voltage can be higher or lower than the input voltage.
The SEPIC uses two inductors to step-up or step-down the
input voltage. The inductors L1 and L2 can be two discrete
inductors or two windings of a coupled transformer since
equal voltages are applied across the inductor throughout the
switching cycle. Using two discrete inductors allows use of
catalog magnetics, as opposed to a custom transformer. The
input ripple can be reduced along with size by using the cou-
pled windings of transformer for L1 and L2.
Due to the presence of the inductor L1 at the input, the SEPIC
inherits all the benefits of a boost converter. One main ad-
vantage of SEPIC over boost converter is the inherent input
to output isolation. The capacitor CS isolates the input from
the output and provides protection against shorted or mal-
functioning load. Hence, the A SEPIC is useful for replacing
boost circuits when true shutdown is required. This means
that the output voltage falls to 0V when the switch is turned
off. In a boost converter, the output can only fall to the input
voltage minus a diode drop.
The duty cycle of a SEPIC is given by:
www.national.com 18
LM3488/LM3488Q
In the above equation, VQ is the on-state voltage of the MOS-
FET, Q, and VDIODE is the forward voltage drop of the diode.
10138844
FIGURE 15. Typical SEPIC Converter
POWER MOSFET SELECTION
As in boost converter, the parameters governing the selection
of the MOSFET are the minimum threshold voltage, VTH
(MIN), the on-resistance, RDS(ON), the total gate charge, Qg, the
reverse transfer capacitance, CRSS, and the maximum drain
to source voltage, VDS(MAX). The peak switch voltage in a
SEPIC is given by:
VSW(PEAK) = VIN + VOUT + VDIODE
The selected MOSFET should satisfy the condition:
VDS(MAX) > VSW(PEAK)
The peak switch current is given by:
The rms current through the switch is given by:
POWER DIODE SELECTION
The Power diode must be selected to handle the peak current
and the peak reverse voltage. In a SEPIC, the diode peak
current is the same as the switch peak current. The off-state
voltage or peak reverse voltage of the diode is VIN + VOUT.
Similar to the boost converter, the average diode current is
equal to the output current. Schottky diodes are recommend-
ed.
SELECTION OF INDUCTORS L1 AND L2
Proper selection of the inductors L1 and L2 to maintain con-
stant current mode requires calculations of the following pa-
rameters.
Average current in the inductors:
IL2AVE = IOUT
Peak to peak ripple current, to calculate core loss if neces-
sary:
maintains the condition IL > ΔiL/2 to ensure constant current
mode.
Peak current in the inductor, to ensure the inductor does not
saturate:
19 www.national.com
LM3488/LM3488Q
IL1PK must be lower than the maximum current rating set by
the current sense resistor.
The value of L1 can be increased above the minimum rec-
ommended to reduce input ripple and output ripple. However,
once DIL1 is less than 20% of IL1AVE, the benefit to output ripple
is minimal.
By increasing the value of L2 above the minimum recom-
mended, ΔIL2 can be reduced, which in turn will reduce the
output ripple voltage:
where ESR is the effective series resistance of the output ca-
pacitor.
If L1 and L2 are wound on the same core, then L1 = L2 = L.
All the equations above will hold true if the inductance is re-
placed by 2L. A good choice for transformer with equal turns
is Coiltronics CTX series Octopack.
SENSE RESISTOR SELECTION
The peak current through the switch, ISW(PEAK) can be adjust-
ed using the current sense resistor, RSEN, to provide a certain
output current. Resistor RSEN can be selected using the for-
mula:
Sepic Capacitor Selection
The selection of SEPIC capacitor, CS, depends on the rms
current. The rms current of the SEPIC capacitor is given by:
The SEPIC capacitor must be rated for a large ACrms current
relative to the output power. This property makes the SEPIC
much better suited to lower power applications where the rms
current through the capacitor is relatively small (relative to
capacitor technology). The voltage rating of the SEPIC ca-
pacitor must be greater than the maximum input voltage.
Tantalum capacitors are the best choice for SMT, having high
rms current ratings relative to size. Ceramic capacitors could
be used, but the low C values will tend to cause larger
changes in voltage across the capacitor due to the large cur-
rents. High C value ceramics are expensive. Electrolytics
work well for through hole applications where the size re-
quired to meet the rms current rating can be accommodated.
There is an energy balance between CS and L1, which can
be used to determine the value of the capacitor. The basic
energy balance equation is:
Where
is the ripple voltage across the SEPIC capacitor, and
is the ripple current through the inductor L1. The energy bal-
ance equation can be solved to provide a minimum value for
CS:
Input Capacitor Selection
Similar to a boost converter, the SEPIC has an inductor at the
input. Hence, the input current waveform is continuous and
triangular. The inductor ensures that the input capacitor sees
fairly low ripple currents. However, as the input capacitor gets
smaller, the input ripple goes up. The rms current in the input
capacitor is given by:
The input capacitor should be capable of handling the rms
current. Although the input capacitor is not as critical in a
boost application, low values can cause impedance interac-
tions. Therefore a good quality capacitor should be chosen in
the range of 10µF to 20µF. If a value lower than 10µF is used,
then problems with impedance interactions or switching noise
can affect the LM3478. To improve performance, especially
with VIN below 8 volts, it is recommended to use a 20 resistor
at the input to provide a RC filter. The resistor is placed in
series with the VIN pin with only a bypass capacitor attached
to the VIN pin directly (see Figure 14). A 0.1µF or 1µF ceramic
capacitor is necessary in this configuration. The bulk input
capacitor and inductor will connect on the other side of the
resistor with the input power supply.
www.national.com 20
LM3488/LM3488Q
Output Capacitor Selection
The ESR and ESL of the output capacitor directly control the
output ripple. Use low capacitors with low ESR and ESL at
the output for high efficiency and low ripple voltage. Surface
mount tantalums, surface mount polymer electrolytic and
polymer tantalum, Sanyo- OSCON, or multi-layer ceramic ca-
pacitors are recommended at the output.
The output capacitor of the SEPIC sees very large ripple cur-
rents (similar to the output capacitor of a boost converter. The
rms current through the output capacitor is given by:
The ESR and ESL of the output capacitor directly control the
output ripple. Use low capacitors with low ESR and ESL at
the output for high efficiency and low ripple voltage. Surface
mount tantalums, surface mount polymer electrolytic and
polymer tantalum, Sanyo- OSCON, or multi-layer ceramic ca-
pacitors are recommended at the output for low ripple.
Other Application Circuits
10138843
FIGURE 16. Typical High Efficiency Step-Up (Boost) Converter
21 www.national.com
LM3488/LM3488Q
Physical Dimensions inches (millimeters) unless otherwise noted
www.national.com 22
LM3488/LM3488Q
Notes
23 www.national.com
LM3488/LM3488Q
Notes
LM3488/LM3488Q High Efficiency Low-Side N-Channel Controller for Switching Regulators
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