C106D1G - ON SEMICONDUCTOR - Product.Express

September, 2011 − Rev. 10

1Publication Order Number:

C106/D

C106 Series

Sensitive Gate Silicon

Controlled Rectifiers

Reverse Blocking Thyristors

Glassivated PNPN devices designed for high volume consumer

applications such as temperature, light, and speed control; process and

remote control, and warning systems where reliability of operation is

important.

Features

•Glassivated Surface for Reliability and Uniformity

•Power Rated at Economical Prices

•Practical Level Triggering and Holding Characteristics

•Flat, Rugged, Thermopad Construction for Low Thermal Resistance,

High Heat Dissipation and Durability

•Sensitive Gate Triggering

•These are Pb−Free Devices

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Characteristic Symbol Max Unit

Peak Repetitive Off−State Voltage (Note 1)

(Sine Wave, 50−60 Hz, RGK = 1 kW,

TC = −40° to 110°C)

C106B

C106D, C106D1*

C106M, C106M1*

VDRM,

VRRM

200

400

600

On-State RMS Current

(180°Conduction Angles, TC = 80°C)

IT(RMS) 4.0 A

Average On−State Current

(180°Conduction Angles, TC = 80°C)

IT(AV) 2.55 A

Peak Non-Repetitive Surge Current

(1/2 Cycle, Sine Wave, 60 Hz, TJ = +25°C)

ITSM 20 A

Circuit Fusing Considerations (t = 8.3 ms) I2t 1.65 A2s

Forward Peak Gate Power

(Pulse Width v1.0 msec, TC = 80°C)

PGM 0.5 W

Forward Average Gate Power

(Pulse Width v1.0 msec, TC = 80°C)

PG(AV) 0.1 W

Forward Peak Gate Current

(Pulse Width v1.0 msec, TC = 80°C)

IGM 0.2 A

Operating Junction Temperature Range TJ−40 to

+110

°C

Storage Temperature Range Tstg −40 to

+150

°C

Mounting Torque (Note 2) −6.0 in. lb.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings

apply for zero or negative gate voltage; however, positive gate voltage shall

not be applied concurrent with negative potential on the anode. Blocking

voltages shall not be tested with a constant current source such that the

voltage ratings of the devices are exceeded.

2. Torque rating applies with use of compression washer (B52200F006).

Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink

thermal resistance. Anode lead and heatsink contact pad are common.

TO−225AA

CASE 077

STYLE 2

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

SCRs

4 A RMS, 200 − 600 Volts

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MARKING DIAGRAM & PIN ASSIGNMENT

Y = Year

WW = Work Week

C106xx = Device Code

xx = B, D, D1, M, M1

G = Pb−Free Package

YWW

C106xxG

1. Cathode

2. Anode

3. Gate

C106 Series

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THERMAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Case RqJC 3.0 °C/W

Thermal Resistance, Junction−to−Ambient RqJA 75 °C/W

Maximum Lead Temperature for Soldering Purposes 1/8 in. from Case for 10 Seconds TL260 °C

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Peak Repetitive Forward or Reverse Blocking Current

(VAK = Rated VDRM or VRRM, RGK = 1 kW)T

J = 25°C

TJ = 110°C

IDRM, IRRM

−

100

ON CHARACTERISTICS

Peak Forward On−State Voltage (Note 3)

(ITM = 4 A)

VTM − − 2.2 V

Gate Trigger Current (Continuous dc) (Note 4)

(VAK = 6 Vdc, RL = 100 W)T

J = 25°C

TJ = −40°C

IGT

−

200

500

Peak Reverse Gate Voltage (IGR = 10 mA) VGRM − − 6.0 V

Gate Trigger Voltage (Continuous dc) (Note 4)

(VAK = 6 Vdc, RL = 100 W)T

J = 25°C

TJ = −40°C

VGT

0.4

0.5

0.60

0.75

0.8

1.0

Gate Non−Trigger Voltage (Continuous dc) (Note 4)

(VAK = 12 V, RL = 100 W, TJ = 110°C)

VGD 0.2 − − V

Latching Current

(VAK = 12 V, IG = 20 mA, RGK = 1 kW)T

J = 25°C

TJ = −40°C

−

0.20

0.35

5.0

7.0

Holding Current (VD = 12 Vdc)

(Initiating Current = 20 mA, RGK = 1 kW)T

J = 25°C

TJ = −40°C

TJ = +110°C

−

0.19

0.33

0.07

3.0

6.0

2.0

DYNAMIC CHARACTERISTICS

Critical Rate−of−Rise of Off−State Voltage

(VAK = Rated VDRM, Exponential Waveform, RGK = 1 kW,

TJ = 110°C)

dv/dt −8.0 −V/ms

3. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.

4. RGK is not included in measurement.

C106 Series

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+ Current

+ Voltage

VTM

IDRM at VDRM

Symbol Parameter

VDRM Peak Repetitive Off State Forward Voltage

IDRM Peak Forward Blocking Current

VRRM Peak Repetitive Off State Reverse Voltage

IRRM Peak Reverse Blocking Current

VTM Peak On State Voltage

IHHolding Current

Voltage Current Characteristic of SCR

Anode +

on state

Reverse Blocking Region

(off state)

Reverse Avalanche Region

Anode −

Forward Blocking Region

IRRM at VRRM

(off state)

JUNCTION TEMPERATURE ≈ 110°C

100

110

3.6

0 .4 .8 1.61.2 2.0 2.4 3.2

4.0

IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES)

HALF SINE WAVE

RESISTIVE OR INDUCTIVE LOAD.

50 to 400 Hz

2.8 3.6.4 .8 1.61.2 2.0 2.4 3.2 4.02.6

IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES)

HALF SINE WAVE

RESISTIVE OR INDUCTIVE LOAD

50 TO 400Hz.

C°T , CASE TEMPERATURE ( C)

P , AVERAGE ON‐STATE POWER DISSIPATION (WATTS)

(AV)

Figure 1. Average Current Derating Figure 2. Maximum On−State Power Dissipation

C106 Series

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100

95-40 -25 -10 205355080

110

TJ, JUNCTION TEMPERATURE (°C)

GT mI

Figure 3. Typical Gate Trigger Current versus

Junction Temperature

Figure 4. Typical Holding Current versus

Junction Temperature

0.9

0.2

0.3

0.4

0.7

1.0

0.8

95-45 -25 -10 205355080

0.6

110

TJ, JUNCTION TEMPERATURE (°C)

0.5

Figure 5. Typical Gate Trigger Voltage versus

Junction Temperature

Figure 6. Typical Latching Current versus

Junction Temperature

, GATE TRIGGER CURRENT ( A)

1000

95-40 -25 -10 205355080

100

110

TJ, JUNCTION TEMPERATURE (°C)

HmI, HOLDING CURRENT ( A)

1000

95-40 -25 -10 205355080

100

110

TJ, JUNCTION TEMPERATURE (°C)

LmI, LATCHING CURRENT ( A)

, GATE TRIGGER VOLTAGE (V)

C106 Series

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The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-106 package with

competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it

compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for

mounting compatibility.

ON Semiconductor C-106 Package Competitive C-106 Package

.315

____

.285

.105

____

.095

.054

____

.046

.420

____

.400

____

.360

.385

____

.365

.135

____

.115

.520

____

.480

.127

____

.123 DIA

.105

____

.095 .190

____

.170

.026

____

.019

.025

____

.035

.295

____

.305

.148

____

.158

.115

____

.130

.015

____

.025

.050

____

.095

.145

____

.155

5 TYP

.425

____

.435

.575

____

.655

.020

____

.026

123

.045

____

.055

.095

____

.105

.040

.094 BSC

PACKAGE INTERCHANGEABILITY

ORDERING INFORMATION

Device Package Shipping†

C106BG TO−225AA

(Pb−Free)

500 Units / Box

C106DG TO−225AA

(Pb−Free)

500 Units / Box

C106D1G* TO−225AA

(Pb−Free)

500 Units / Box

C106MG TO−225AA

(Pb−Free)

500 Units / Box

C106M1G* TO−225AA

(Pb−Free)

500 Units / Box

*D1 signifies European equivalent for D suffix and M1 signifies European equivalent for M suffix.

C106 Series

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PACKAGE DIMENSIONS

TO−225

CASE 77−09

ISSUE Z

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 077-01 THRU -08 OBSOLETE, NEW STANDARD

077-09.

STYLE 2:

PIN 1. CATHODE

2. ANODE

3. GATE

−B−

−A−M

132

2 PL

0.25 (0.010) B M

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.425 0.435 10.80 11.04

B0.295 0.305 7.50 7.74

C0.095 0.105 2.42 2.66

D0.020 0.026 0.51 0.66

F0.115 0.130 2.93 3.30

G0.094 BSC 2.39 BSC

H0.050 0.095 1.27 2.41

J0.015 0.025 0.39 0.63

K0.575 0.655 14.61 16.63

M5 TYP 5 TYP

Q0.148 0.158 3.76 4.01

R0.045 0.065 1.15 1.65

S0.025 0.035 0.64 0.88

U0.145 0.155 3.69 3.93

V0.040 --- 1.02 ---

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

C106/D

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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

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