© 2006 Microchip Technology Inc. Preliminary DS70178C
dsPIC30F1010/202X
Data Sheet
28/44-Pin High-Performance
Switch Mode Power Supply
Digital Signal Controllers
DS70178C-page ii Preliminary © 2006 Microchip Technology Inc.
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART ,
PRO MAT E, Pow erSmart, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
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SEEV AL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLI NK, PIC kit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
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All other trademarks mentioned herein are property of their
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© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrit y of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violat ion of the Digital Millennium Copyright Act. If suc h ac t s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
T empe, Arizona, Gresham, Oregon and Mountain View , California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 1
dsPIC30F1010/202X
High-Performance Modified RISC CPU:
Modified Harvard architecture
C compiler optimized in struction set architecture
83 base instructions wit h flexible addressing
modes
24-bit wide instructions, 16-bit wide data path
12 Kbytes on -chip Flash p rogr am spac e
512 bytes on-chip data RAM
16 x 16-bit working register array
Up to 30 MIPS operation:
- Dual Internal RC
- 9.7 and 14.55 MHz (±1%) Industrial Temp
- 6.4 and 9.7 MHz1%) Extended Temp
- 32X PLL with 480 MHz VCO
- PLL inputs ±3%
- External EC clock 6.0 to 14.55 MHz
- HS Cr ystal mode 6.0 to 14 .55 MHz
32 interrupt sources
Three external interrupt sources
8 user-selectable priority levels for each interrupt
4 processor exceptions and software traps
DSP Engine Features:
Modulo and Bit-Reversed modes
Two 40-bit wide accumulators with optional
saturati on log ic
17-bit x 17-bit si ngl e-c ycle hard w are frac tio nal /
integer multiplier
Single-cycle Multiply-Accumulate (MAC)
operation
40-stage Barrel Shifter
Dual data fetch
Peripheral Feat ures:
High-current sink/source I/O pins: 25 mA/25 mA
Three 16-bit timers/counters; optionally pair up
16-bit timers into 32-bit timer modules
One 16-bit Capture input functions
Two 16-bit Compare/PWM output functions
- Dual Compare mode available
3-wire SPI modules (supports 4 Frame modes)
•I
2CTM module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
UART Module:
- Supports RS-232, RS-485 and LIN 1.2
- Supports IrD A® with on-chip hardware endec
- Auto wake-up on Start bit
- Auto-Baud Detect
- 4-level FIFO buffer
Power Supply PWM Module Features:
Four P WM generators with 8 outputs
Each PWM gen era t or h as independ ent tim e b as e
and duty cycle
Duty cy cle re solution of 1.1 ns at 30 MIPS
Individual dead time for each PWM generator:
- Dead-time resolution 4.2 ns at 30 MIPS
- Dead time for rising and falling edges
Phase-shift resolut ion of 4.2 ns @ 30 MIPS
Frequency resolution of 8.4 ns @ 30 MIPS
PWM modes supported:
- Complementary
-Push-Pull
- Multi-Phase
- Variable Phase
- Current Reset
- Current-Limit
Independent Current-Limit and Fault Inputs
Output Override Control
Special Ev ent Trigge r
PWM generated ADC Trigger
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
28/44-Pin dsPIC30F1010/202X Enhanced Flash
SMPS 16-Bit Digital Signal Controller
dsPIC30F1010/202X
DS70178C-page 2 Preliminary © 2006 Microchip Technology Inc.
Analog Features:
ADC
10-bit resolution
2000 Ksps conve rsi on rate
Up to 12 input channels
“Conversion pairing” allows simultaneous conver-
sion of two input s (i.e ., curren t and volt age) wit h a
single trigger
PWM control loop:
- Up to six conversion pairs available
- Each conversion pair has up to four PWM
and seven other selectable trigger sources
Interrupt hardware supports up to 1M interrupts
per second
COMPARATOR
Four Analog Comparators:
- 20 ns response time
- 10-bit DAC reference generator
- Programmable output polarity
- Selectable input source
- ADC sample and co nvert capable
PWM module interface
- PWM Duty Cycle Control
- PWM Period Contr ol
- PWM Fault Detect
Specia l Event Trigger
PWM-generated ADC Trigger
Special Microcontroller Features:
Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100k (typical)
Self-reprogrammable under software control
Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
Flexible Watchdog Timer (WDT) with on-chip low
power RC oscillator for reliable operation
Fail- Safe cl ock monitor operation
Detects clock failure and switches to on-chip low
power RC oscillator
Programmable code protection
In-Circuit Serial Programming™ (ICSP™)
Selectable Power Managem ent mo des
- Sleep, Idle and Alternate Clock modes
CMOS Technology:
Low-power, high-speed Flash technology
3.3V and 5.0V operati on (±10%)
Industrial and Extended te mperature ranges
Low power consumption
dsPIC30F SWITCH MODE POWER SUPPLY FAMILY
Product
Pins
Packaging
Program
Memory
(Bytes)
Data SRAM
(Bytes)
Timers
Capture
Compare
UART
SPI
I2C™
PWM
ADCs
S & H
A/D
Inputs
Analog
Comparators
GPIO
dsPIC30F101028SDIP 6K 2562011112x2136 ch 2 21
dsPIC30F101028SOIC 6K 2562011112x2136 ch 2 21
dsPIC30F1010 28
QFN-S
6K 2562011112x2136 ch 2 21
dsPIC30F202028SDIP12K5123121114x2158 ch 4 21
dsPIC30F202028SOIC12K5123121114x2158 ch 4 21
dsPIC30F2020 28
QFN-S
12K5123121114x2158 ch4 21
dsPIC30F202344QFN12K5123121114x21512 ch4 35
dsPIC30F202344TQFP12K5123121114x21512 ch4 35
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 3
dsPIC30F1010/202X
Pin Diagrams
28-Pin SDIP and SOIC
dsPIC30F1010
MCLR
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
RE4
RE5V
SS
V
DD
AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AV
DD
AV
SS
AN2/CMP1C/CMP2A/CN4/RB2
PGD2/EMUD2/SCK1/SFLT3/INT2/RF6 PGC2/EMUC2/OC1/SFLT1/INT1/RD0
PGC1/EMUC1/EXTREF/T1CK/U1ARX/CN0/RE6
PGD1/EMUD1/T2CK/U1ATX/CN1/RE7 V
SS
OSC2/CLKO/RB7
OSC1/CLKI/RB6 V
DD
SFLT2/INT0/OCFLTA/RA9
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SDO1/SCL/U1TX/RF8
AN5/CMP2D/CN7/RB5
AN4/CMP2C/CN6/RB4
AN3/CMP1D/CMP2B/CN5/RB3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
28-Pin QFN-S
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC30F1010
PGD1/EMUD1/T2CK/U1ATX/CN1/RE7
5
4
AV
DD
AV
SS
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
RE4
RE5
V
DD
V
SS
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SDO1/SCL/U1TX/RF8
SFLT2/INT0/OCFLTA/RA9
PGC2/EMUC2/OC1/SFLT1/INT1/RD0
MCLR
AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AN2/CMP1C/CMP2A/CN4/RB2
AN3/CMP1D/CMP2B/CN5/RB3
AN4/CMP2C/CN6/RB4
AN5/CMP2D/CN7/RB5
V
SS
OSC1/CLKI/RB6
OSC2/CLKO/RB7
PGC1/EMUC1/EXTREF/T1CK/U1ARX/CN0/RE6
V
DD
PGD2/EMUD2/SCK1/SFLT3/INT2/RF6
dsPIC30F1010/202X
DS70178C-page 4 Preliminary © 2006 Microchip Technology Inc.
Pin Diagrams
28-Pin SDIP and SOIC
dsPIC30F2020
MCLR
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5V
SS
V
DD
AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AV
DD
AV
SS
AN2/CMP1C/CMP2A/CN4/RB2
PGD2/EMUD2/SCK1/SFLT3/OC2/INT2/RF6 PGC2/EMUC2/OC1/SFLT1/IC1/INT1/RD0
PGC1/EMUC1/EXTREF/PWM4L/T1CK/U1ARX/CN0/RE6
PGD1/EMUD1/PWM4H/T2CK/U1ATX/CN1/RE7 V
SS
AN7/CMP3D/CMP4B/OSC2/CLKO/RB7
AN6/CMP3C/CMP4A/OSC1/CLKI/RB6 V
DD
SFLT2/INT0/OCFLTA/RA9
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SDO1/SCL/U1TX/RF8
AN5/CMP2D/CMP3B/CN7/RB5
AN4/CMP2C/CMP3A/CN6/RB4
AN3/CMP1D/CMP2B/CN5/RB3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
28-Pin QFN-S
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC30F2020
PGD1/EMUD1/PWM4H/T2CK/U1ATX/CN1/RE7
5
4
AV
DD
AV
SS
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
V
DD
V
SS
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SDO1/SCL/U1TX/RF8
SFLT2/INT0/OCFLTA/RA9
PGC2/EMUC2/OC1/SFLT1/IC1/INT1/RD0
MCLR
AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AN2/CMP1C/CMP2A/CN4/RB2
AN3/CMP1D/CMP2B/CN5/RB3
AN4/CMP2C/CMP3A/CN6/RB4
AN5/CMP2D/CMP3B/CN7/RB5
V
SS
AN6/CMP3C/CMP4A/OSC1/CLKI/RB6
AN7/CMP3D/CMP4B/OSC2/CLKO/RB7
PGC1/EMUC1/EXTREF/PWM4L/T1CK/U1ARX/CN0/RE6
V
DD
PGD2/EMUD2/SCK1/SFLT3/OC2/INT2/RF6
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 5
dsPIC30F1010/202X
Pin Diagrams
44-PIN QFN
44
dsPIC30F2023
434241 40393837 3635
121314 15161718 192021
330
29
28
27
26
25
24
23
4
5
7
8
9
10
11
1
232
31
6
22
33
34
AN4/CMP2C/CMP3A/CN6/RB4
AN5/CMP2D/CMP3B/CN7/RB5
AN6/CMP3C/CMP4A/OSC1/CLKI/RB6
AN7/CMP3D/CMP4B/OSC2/CLKO/RB7
AN8/CMP4C/RB8
AN10/IFLT4/RB10
V
DD
AN11/IFLT2/RB11
V
SS
PGD/EMUD/SDO1/RF8
AN9/EXTREF/CMP4D/RB9
PGC2/EMUC2/OC1/IC1/INT1/RD0
V
DD
PGC1/EMUC1/PWM4L/T1CK/U1ARX/CN0/RE6
OC2/RD1
V
SS
SFLT2/INT0/OCFLTA/RA9
PGD2/EMUD2/SCK1/INT2/RF6
SFLT1/RA8
PGD1/EMUD1
/
PWM4H/T2CK/U1ATX/CN1/RE7
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
V
DD
V
SS
SYNCO/SS1/RF15
SDA/RG3
SFLT4/RA11
SFLT3/RA10
PGC/EMUC/SDI1/RF7
PWM2L/RE2 AN3/CMP1D/CMP2B/CN5/RB3
AN2/CMP1C/CMP2A/CN4/RB2
AN1/CMP1B/CN3/RB1
AN0/CMP1A/CN2/RB0
MCLR
U1RX/RF2
AV
DD
AV
SS
PWM1L/RE0
PWM1H/RE1
SYNCI/RF14
U1TX/RF3
SCL/ RG2
dsPIC30F1010/202X
DS70178C-page 6 Preliminary © 2006 Microchip Technology Inc.
Pin Diagrams
10
11
2
3
4
5
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
PGD/EMUD/SDO1/RF8
AN9/EXTREF/CMP4D/RB9
PGC2/EMUC2/OC1/IC1/INT1/RD0
V
DD
PGC1/EMUC1/PWM4L/T1CK/U1ARX/CN0/RE6
SYNCI/RF14
V
SS
SFLT2/INT0/OCFLTA/RA9
PGD2/EMUD2/SCK1/INT2/RF6
SFLT1/RA8
AN3/CMP1D/CMP2B/CN5/RB3
AN2/CMP1C/CMP2A/CN4/RB2
AN1/CMP1B/CN3/RB1
AN0/CMP1A/CN2/RB0
MCLR
U1RX/RF2
AV
DD
AV
SS
PWM1L/RE0
PWM1H/RE1
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
V
DD
V
SS
SDA/RG3
SFLT4/RA11
SFLT3/RA10
PGC/EMUC/SDI1/RF7
AN4/CMP2C/CMP3A/CN6/RB4
AN5/CMP2D/CMP3B/CN7/RB5
AN6/CMP3C/CMP4A/OSC1/CLKI/RB6
AN7/CMP3D/CMP4B/OSC2/CLKO/RB7
AN8/CMP4C/RB8
SYNCO/SS1/RF15
V
DD
V
SS
SCL/RG2
U1TX/RF3
PGD1/EMUD1/PWM4H/T2CK/U1ATX/CN1/RE7
dsPIC30F2023
PWM2L/RE2
OC2/RD1
AN11/IFLT2/RB11
AN10/IFLT4/RB10
44-Pin TQFP
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 7
dsPIC30F1010/202X
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 19
3.0 Memory O rganization. ................................................................................................................................................................ 29
4.0 Address Generato r Units............................................................................................................................................................ 41
5.0 Interrupts.................................................................................................................................................................................... 47
6.0 I/O Ports .............. ....................... ....................... ....................... .................................................................................................. 77
7.0 Flash Pro g ram Memory........................ .............................. ............................. ........................................................................... 81
8.0 Timer1 Module ........................................................................................................................................................................... 87
9.0 Timer2/3 Module ........... .. .... .. ....... .. .. .. .... .. .. ....... .. .. .... .. .. .. ....... .. .. .... .. .. .. ....... .. .... .. .. .. ....... ............................................................ 91
10.0 Input Capture Module............................. .... ..... .... .. .. .... .. .. ....... .. .... .. .. .... ..... .... .. .. .... .. .. ....... .......................................................... 97
11.0 Output Compa re Module................ ............................. ................... ................... ....................................................................... 101
12.0 Power Supply PWM .......................................... .... .... .. .... ....... .... .. .... .. ......... .. .... .. .... .. ............................................................... 107
13.0 Serial Peripheral Interf ace (SP I)............................................................................................................................................... 145
14.0 I2C™ Module ........................................................................................................................................................................... 153
15.0 U nivers al Asynchr onous Receiver Transmi tter (UART) Module .............................................................................................. 161
16.0 10-bit 2 Msps Analog-to-Digital Converter (ADC) Module........................................................................................................ 169
17.0 SMPS Comparator Module .................. .. .. ....... .... .. .... .. .. ....... .... .. .. .... .. ....... .... .. .. .... .. .. ....... .... .. .................................................. 191
18.0 System Inte g r a tion ................ .............................. ................... ................... ................... ............................................................ 197
19.0 Instruction Set Summary.......................................................................................................................................................... 219
20.0 Development Support............................................................................................................................................................... 227
21.0 Electrical Characteristics.......................................................................................................................................................... 231
22.0 Pac kage Mark ing Information................................................................................................................................................... 267
dsPIC30F1010/202X
DS70178C-page 8 Preliminary © 2006 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our pu blications to bette r suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions o r c omm ents regarding this publication, please c ontact the M arketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.
Most Current Data Sheet
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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© 2006 Microchip Technology Inc. Preliminary DS70178C-page 9
dsPIC30F1010/202X
1.0 DEVICE OVERVIEW This document contains device specific information for
the dsPIC30F1010/202X SMPS devices. Thes e devices
contain extensive Digital Signal Processor (DSP) func-
tionality within a high-performance 16-bit microcontroller
(MCU) architecture, as reflected in the following block
diagrams. Figure 1-1 and Table 1-1 describe the
dsPIC30F1010 SMPS device, Figure 1-2 and Table 1-2
describe the dsPIC30F2020 device and Figure 1-3 and
Table 1-3 describe the dsPIC30F2023 SMPS device.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
dsPIC30F1010/202X
DS70178C-page 10 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 1-1 : dsPI C30F 1010 BLO CK DI AGRAM
Power-up
Timer
Oscillator
Start-up Timer
POR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLK1
MCLR
AN4/CMP2C/CN6/RB4
UART1SPI1 SMPS
PWM
Timing
Generation
AN5/CMP2D/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Prog ram Memory
(12 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C™
Comparator
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
RE4
10-bit ADC
Timers
RE5
PGC1/EMUC1/EXTREF/T1CK/
Output
Compare
Module
SFLT2/INT0/OCFLTA/RA9
PORTB
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SD01/SCL/U1TX/RF8
PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effecti ve Address
X RAGU
X WAGU
Y AGU AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AN2/CMP1C/CMP2A/CN4/RB2
AN3/CMP1D/CMP2B/CN5/RB3
16
16
16
16
16
PORTA
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Bloc k
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(256 bytes )
RAM X Data
(256 bytes)
RAM
Address
Latch
Address
Latch
Control Signals
to Variou s Blocks
PGC2/EMUC2/OC1/SFLT1/
16
16
OSC1/CLKI/RB6
OSC2/CLKO/RB7
INT1/RD0
PGD2/EMUD2/SCK1/SFLT3/
INT2/RF6
PGD1/EMUD1/T2CK/U1ATX/
Module
Input
Change
Notification U1ARX/CN0/RE6
CN1/RE7
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 11
dsPIC30F1010/202X
Table 1-1 provides a brief description of device I/O
pinouts for the dsPIC30F1010 and the functions that
may be multiplexed to a port pin. Multiple functions may
exist on one port pin. When multiplexing occurs, the
peripheral module’s functional requirem ents may force
an override of the data direction of the port pin.
TABLE 1-1: PINOUT I/O DESCRIPTIONS FOR dsPIC30F1010
Pin Name Pin
Type Buffer
Type Description
AN0-AN5 I Analog Analog input channels.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO I
OST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillat or mode. O ptionally function s as CLKO i n RC and EC m odes. Alway s
associated wit h OSC2 pin function.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
INT0
INT1
INT2
I
I
I
ST
ST
ST
External int errup t 0
External int errup t 1
External int errup t 2
SFLT1
SFLT2
SFLT3
PWM1L
PWM1H
PWM2L
PWM2H
I
I
I
O
O
O
O
ST
ST
ST
Shared Fault Pin 1
Shared Fault Pin 2
Shared Fault Pin 3
PWM 1 Low output
PWM 1 High output
PWM 2 Low output
PWM 2 High output
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an
active low Reset to the device.
OC1 O Compare outputs.
OCFLTA I ST Output Compare Fault Pin
OSC1
OSC2 I
I/O CMOS
Oscillator crystal input.
Oscil lator crys tal o utput. Co nnect s to crys tal or resona tor in Cr ystal Oscillato r
mode. Optionally functions as CLKO in FRC and EC modes.
PGD
PGC
PGD1
PGC1
PGD2
PGC2
I/O
I
I/O
I
I/0
I
ST
ST
ST
ST
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
In-C ircuit Seria l Programming data in put/output pin 1.
In-Circuit Serial Programming clock input pin 1.
In-C ircuit Seria l Programming data in put/output pin 2.
In-Circuit Serial Programming clock input pin 2.
RB0-RB7 I/O ST PORTB is a bidirectional I/O port.
RA9 I/O ST PORTA is a bidirectional I/O port.
RD0 I/O ST PORTD is a bidirectional I/O port.
Legend: CMOS = CMOS compat ible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F1010/202X
DS70178C-page 12 Preliminary © 2006 Microchip Technology Inc.
RE0-RE7 I/O ST PORTE is a bidirectional I/O port.
RF6, RF7, RF8
I/O ST PORTF is a bidirectional I/O port.
SCK1
SDI1
SDO1
I/O
I
O
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SCL
SDA I/O
I/O ST
ST Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
T1CK
T2CK I
IST
ST Timer1 external clock input.
Timer2 external clock input.
U1RX
U1TX
U1ARX
U1ATX
I
O
I
O
ST
ST
UART1 Receive.
UART1 Tr an smit.
Alternate U ART1 Receive.
Alternate U AR T1 Transmit.
CMP1A
CMP1B
CMP1C
CMP1D
CMP2A
CMP2B
CMP2C
CMP2D
I
I
I
I
I
I
I
I
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Comparator 1 Channel A
Comparator 1 Channel B
Comparator 1 Channel C
Comparator 1 Channel D
Comparator 2 Channel A
Comparator 2 Channel B
Comparator 2 Channel C
Comparator 2 Channel D
CN0-CN7 I ST Input Change notification inputs
Can be software programme d for internal weak pull-ups on all inputs.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
EXTREF I Analog External reference to Comparator DAC
TABLE 1-1: PINOUT I/O DESCRIPTIONS FOR dsPIC30F1010 (CONTINUED)
Pin Name Pin
Type Buffer
Type Description
Legend: CMOS = CMOS compat ible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 13
dsPIC30F1010/202X
FIGURE 1-2: dsPIC30F2020 BLOCK DIAGRAM
Power-up
Timer
Oscillator
Start-up Timer
POR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLK1
MCLR
AN4/CMP2C/CMP3A/CN6/RB4
UART1SPI1 SMPS
PWM
Timing
Generation
AN5/CMP2D/CMP3B/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Prog ram Memory
(12 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C™
Comparator
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PGC1/EMUC1/EXTREF/PWM4L/
Input
Capture
Module
Output
Compare
Module
SFLT2/INT0/OCFLTA/RA9
PORTB
PGC/EMUC/SDI1/SDA/U1RX/RF7
PGD/EMUD/SD01/SCL/U1TX/RF8
PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effecti ve Address
X RAGU
X WAGU
Y AGU AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AN2/CMP1C/CMP2A/CN4/RB2
AN3/CMP1D/CMP2B/CN5/RB3
16
16
16
16
16
PORTA
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Bloc k
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(256 bytes )
RAM X Data
(256 bytes)
RAM
Address
Latch
Address
Latch
Control Signals
to Variou s Blocks
PGC2/EMUC2/OC1/SFLT1/IC1/
16
16
AN6/CMP3C/CMP4A/
AN7/CMP3D/CMP4B/
OSC1/CLKI/RB6
OSC2/CLKO/RB7
INT1/RD0
PGD2/EMUD2/SCK1/SFLT3/OC2
/
INT2/RF6
PGD1/EMUD1/PWM4H/T2CK/
Module
Input
Change
Notification U1ARX/CN0/RE6
U1ATX/CN1/RE7
T1CK/
dsPIC30F1010/202X
DS70178C-page 14 Preliminary © 2006 Microchip Technology Inc.
Table 1-2 provides a brief description of device I/O
pinouts for the dsPIC30F2020 and the functions that
may be multiplexed to a port pin. Multiple functions may
exist on one port pin. When multiplexing occurs, the
periphe ral mo dule’s functional requir ements may force
an override of the data direction of the port pin.
TABLE 1-2: PINOUT I/O DESCRIPTIONS FOR dsPIC30F2020
Pin Name Pin
Type Buffer
Type Description
AN0-AN7 I Analog Analog input channels.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO I
OST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillat or mode. O ptionally function s as CLKO in RC and EC mode s. Always
associated wit h OSC2 pin function.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
IC1 I ST Capture input.
INT0
INT1
INT2
I
I
I
ST
ST
ST
External int errup t 0
External int errup t 1
External int errup t 2
SFLT1
SFLT2
SFLT3
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
I
O
O
O
O
O
O
O
O
ST
ST
ST
Shared Fault Pin 1
Shared Fault Pin 2
Shared Fault Pin 3
PWM 1 Low output
PWM 1 High output
PWM 2 Low output
PWM 2 High output
PWM 3 Low output
PWM 3 High output
PWM 4 Low output
PWM 4 High output
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an
active low Reset to the device.
OC1-OC2
OCFLTA O
I Compare outputs.
Output Compare Fault pin
OSC1
OSC2 I
I/O CMOS
Oscillator crystal input.
Oscil lator crys tal o utput. Co nnect s to crys tal or resona tor in Cr ystal Oscillato r
mode. Optionally functions as CLKO in FRC and EC modes.
PGD
PGC
PGD1
PGC1
PGD2
PGC2
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
In-C ircuit Serial Progr amming data input/output pi n 1.
In-Circuit Serial Programming clock input pin 1.
In-C ircuit Serial Progr amming data input/output pi n 2.
In-Circuit Serial Programming clock input pin 2.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 15
dsPIC30F1010/202X
RB0-RB7 I/O ST PORTB is a bidirectional I/O port.
RA9 I/O ST PORTA is a bidirectional I/O port.
RD0 I/O ST PORTD is a bidirectional I/O port.
RE0-RE7 I/O ST PORTE is a bidirectional I/O port.
RF6, RF7, RF8
I/O ST PORTF is a bidirectional I/O port.
SCK1
SDI1
SDO1
I/O
I
O
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SCL
SDA I/O
I/O ST
ST Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
T1CK
T2CK I
IST
ST Timer1 external clock input.
Timer2 external clock input.
U1RX
U1TX
U1ARX
U1ATX
I
O
I
O
ST
ST
O
UART1 Receive.
UART1 Tr an smit.
Alternate U ART1 Receive.
Alternate U AR T1 Transmit.
CMP1A
CMP1B
CMP1C
CMP1D
CMP2A
CMP2B
CMP2C
CMP2D
CMP3A
CMP3B
CMP3C
CMP3D
CMP4A
CMP4B
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Comparator 1 Channel A
Comparator 1 Channel B
Comparator 1 Channel C
Comparator 1 Channel D
Comparator 2 Channel A
Comparator 2 Channel B
Comparator 2 Channel C
Comparator 2 Channel D
Comparator 3 Channel A
Comparator 3 Channel B
Comparator 3 Channel C
Comparator 3 Channel D
Comparator 4 Channel A
Comparator 4 Channel B
CN0-CN7 I ST Input Change notification inputs
Can be software programme d for internal weak pull-ups on all inputs.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
EXTREF I Analog External reference to Comparator DAC
TABLE 1-2: PINOUT I/O DESCRIPTIONS FOR dsPIC30F2020 (CONTINUED)
Pin Name Pin
Type Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F1010/202X
DS70178C-page 16 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 1-3 : dsPI C30F 2023 BLO CK DI AGRAM
Power-up
Timer
Oscillator
Start-up Timer
POR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLK1
MCLR
AN4/CMP2C/CMP3A/CN6/RB4
UART1SPI1 Power Supply
PWM
Timing
Generation
AN5/CMP2D/CMP3B/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Prog ram Memory
(12 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C™
Comparator
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PGC1/EMUC1/PWM4L/T1CK/
Input
Capture
Module
Output
Compare
Module
PORTB
SCL/RG2
SDA/RG3
PORTG
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effecti ve Address
X RAGU
X WAGU
Y AGU AN0/CMP1A/CN2/RB0
AN1/CMP1B/CN3/RB1
AN2/CMP1C/CMP2A/CN4/RB2
AN3/CMP1D/CMP2B/CN5/RB3
16
16
16
16
16
PORTA
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Bloc k
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(256 bytes )
RAM X Data
(256 bytes)
RAM
Address
Latch
Address
Latch
Control Signals
to Variou s Blocks
OC2/RD1
16
16
AN6/CMP3C/CMP4A/
AN7/CMP3D/CMP4B/
OSC1/CLKI/RB6
OSC2/CLKO/RB7
PGD1/EMUD1/PWM4H/T2CK/
Module
SFLT1/RA8
SFLT2/INT0/OCFLTA/RA9
SFLT3/RA10
PGC/EMUC/SDI1/RF7
PGD/EMUD/SD01/RF8
PORTF
PGD2/EMUD2/SCK1/INT2/RF6
AN8/CMP4C/RB8
AN9/EXTREF/CMP4D/RB9
AN10/IFLT4/RB10
AN11/IFLT2/RB11
SYNCI/RF14
PGC2/EMUC2/OC1/IC1/INT1/
SFLT4/RA11
SYNCO/SSI/RF15
U1TX/RF3
U1RX/RF2
Input
Change
Notification
U1ARX/CN0/RE6
U1ATX/CN1/RE7
RD0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 17
dsPIC30F1010/202X
Table 1-3 provides a brief description of device I/O
pinouts for the dsPIC30F2023 and the functions that
may be multiplexed to a port pin. Multiple functions may
exist on one port pin. When multiplexing occurs, the
peripheral module’s functional requirem ents may force
an override of the data direction of the port pin.
TABLE 1-3: PINOUT I/O DESCRIPTIONS FOR dsPIC30F2023
Pin Name Pin
Type Buffer
Type Description
AN0-AN11 I Analog Analog input channels.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO I
OST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillat or mode. O ptionally function s as CLKO in R C and EC mo des. Always
associated with OSC2 pin function.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
IC1 I ST Capture input.
INT0
INT1
INT2
I
I
I
ST
ST
ST
External int errup t 0
External int errup t 1
External int errup t 2
SFLT1
SFLT2
SFLT3
SFLT4
IFLT2
IFLT4
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
I
I
I
I
O
O
O
O
O
O
O
O
ST
ST
ST
ST
ST
ST
Shared Fault 1
Shared Fault 2
Shared Fault 3
Shared Fault 4
Independent Fault 2
Independent Fault 4
PWM 1 Low output
PWM 1 High output
PWM 2 Low output
PWM 2 High output
PWM 3 Low output
PWM 3 High output
PWM 4 Low output
PWM 4 High output
SYNCO
SYNCI O
I
ST PWM SYNC output
PWM SYNC input
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an
active low Reset to the device.
OC1-OC2
OCFLTA O
I
ST Compare outputs.
Output Compare Fault condition.
OSC1
OSC2 I
I/O CMOS
Oscillator crystal input.
Oscil lator crys tal o utput. Co nnect s to crys tal or resona tor in Cr ystal Oscillato r
mode. Optionally functions as CLKO in FRC and EC modes.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F1010/202X
DS70178C-page 18 Preliminary © 2006 Microchip Technology Inc.
PGD
PGC
PGD1
PGC1
PGD2
PGC2
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
In-C ircuit Seria l Programming data in put/output pin 1.
In-Circuit Serial Programming clock input pin 1.
In-C ircuit Seria l Programming data in put/output pin 2.
In-Circuit Serial Programming clock input pin 2.
RA8-RA11 I/O ST PORTA is a bidirectional I/O port.
RB0-RB11 I/O ST PORTB is a bidirectional I/O port.
RD0,RD1 I/O ST PORTD is a bidirectional I/O port.
RE0-RE7 I/O ST PORTE is a bidirectional I/O port.
RF2, RF3,
RF6-RF8, RF14,
RF15
I/O ST PORTF is a bidirectional I/O port.
RG2, RG3 I/O ST PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
I/O
I
O
I
ST
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchroniz ati on .
SCL
SDA I/O
I/O ST
ST Synchronous serial clock input/output for I2C.
Synchronous serial data input/output for I2C.
T1CK
T2CK I
IST
ST Timer1 external clock input.
Timer2 external clock input.
U1RX
U1TX
U1ARX
U1ATX
I
O
I
O
ST
ST
UART1 Receive.
UART1 Tr an smit.
Alternate U ART1 Receive.
Alternate U AR T1 Transmit
CMP1A
CMP1B
CMP1C
CMP1D
CMP2A
CMP2B
CMP2C
CMP2D
CMP3A
CMP3B
CMP3C
CMP3D
CMP4A
CMP4B
CMP4C
CMP4D
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Comparator 1 Channel A
Comparator 1 Channel B
Comparator 1 Channel C
Comparator 1 Channel D
Comparator 2 Channel A
Comparator 2 Channel B
Comparator 2 Channel C
Comparator 2 Channel D
Comparator 3 Channel A
Comparator 3 Channel B
Comparator 3 Channel C
Comparator 3 Channel D
Comparator 4 Channel A
Comparator 4 Channel B
Comparator 4 Channel C
Comparator 4 Channel D
CN0-CN7 I ST Input Change notification inputs
Can be software programme d for internal weak pull-ups on all inputs.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
EXTREF I Analog External reference to Comparator DAC
TABLE 1-3: PINOUT I/O DESCRIPTIONS FOR dsPIC30F2023 (CONTINUED)
Pin Name Pin
Type Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 19
dsPIC30F1010/202X
2.0 CPU ARCHITECTURE
OVERVIEW
2.1 Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23 bits wide with the Least Significant
bit (LSb) always clear (see Section 3.1 “Program
Address Space”), and the Most Significant bit (MSb)
is ign ored du ring no rmal program executi on, ex cept for
certain specialized instructions. Thus, the PC can
address up to 4M instruction words of user program
space. An instruction prefetch mechanism is used to
help maintain throughput. Program loop constructs,
free from loop count management overhead, are sup-
ported using the DO and REPEAT instructions, both of
which are interruptible at any point.
The working register array consists of 16x16-bit regis-
ters, each of which can act as data, address or offset
registers. One working register (W15) operates as a
software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split
into two blocks, referred to as X and Y data memory.
Each block has its own independent Address Genera-
tion Unit (AGU). Most instructions operate solely
through the X memory AGU, which provides the
appearance of a single unified data space. The
Multiply-Accumulate (MAC) class of dual source DSP
instructions operate through both the X and Y AGUs,
splitting the data address space into two parts (see
Section 3.2 “Data Address Space”). The X and Y
data space boundary is device-specific and cannot be
alter ed by the user . Each dat a word consis ts of 2 bytes,
and mos t instruction s can address data eith er as words
or bytes.
There are two methods of accessing data stored in
program memory:
The upper 32 Kbytes of data sp ace memory can be
mapped into the lower half (user space) of program
space at any 16K program word boundary, defined
by the 8-bit Program Space Visibility Page
(PSVPAG) register. This lets any instruction access
program space as if it were data space, with a limit a-
tion that the access requires an additional cycle.
Moreover , only the lower 16 bits of each instruction
word can be accessed using this method.
Linear indirect access of 32K word pages within
progra m spac e is also possibl e using any w orking
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
Overhead-free circular buffers (modulo addressing)
are supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for
DSP algorithms.
The X AGU also supports Bit-Reversed Addressing
mode on destination effective addresses, to greatly
simplify input or output data reordering for radix-2 FFT
algorith ms . Re fer to Secti on 4.0 “Address Generator
Units for details on modulo and Bit-Reversed
Addressing.
The core s up ports Inherent (no opera nd), Relative, Lit-
eral, Memory Direct, Register Direct, Register Indirect,
Register Offset and Literal Offset Addressing modes.
Instruct ions ar e associat ed with p redefined Addressin g
modes, depending upon their functional requirements.
For m os t i ns tru c ti o ns , the c or e i s c apa bl e of e xe c ut i ng
a data (or program data) memory read, a working reg-
ister (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3-operand instructions are supported, allowing
C = A + B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capab ility and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit b idi rec tio nal b arrel shi fter. Data in the a cc um ul a-
tor or any worki ng r egist er can be shif ted up to 15 bits
right or 16 bits left in a single cycle. The DSP instruc-
tions ope rate sea mles sly with all other in struct ions an d
have be en desi gned for o ptimal re al-time p erforma nce.
The MAC class of instructions can concurrently fetch
two data operands from memory, while multiplying two
W registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear for all others. This has been
achieved in a transparent and flexible manner, by
dedicating certain working registers to each address
spac e for the MAC class of instructions.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle, with certain
exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are res erv ed ) an d 54 interrupt s . Eac h in terru pt
is prioritized based on a user-assigned priority between
1 and 7 (1 being the lowest priority and 7 being the
highest) in conjunction with a predetermined ‘natural
order’. T raps hav e fixed prio rities, rangi ng from 8 to 15.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
dsPIC30F1010/202X
DS70178C-page 20 Preliminary © 2006 Microchip Technology Inc.
2.2 Programmers Model
The programmer’s model is shown in Figure 2-1 and
consists of 16x16-bit working registers (W0 through
W15), 2x40-bit accumulators (ACCA and ACCB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT), and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register asso-
ciated with each of them, as shown in Figure 2-1. The
shadow registe r is used as a te mporary holding register
and can tr ansfer its con ten t s t o or fro m i t s hos t reg is ter
upon the occurrence of an event. None of the shadow
registers are accessible directly. The following rules
apply for transfer of registers into and out of shadows.
PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start, and popped on loop end.
When a byte operation is performed on a working reg-
ister, only th e Least Signific ant Byte (LSB) of the t arget
register is affected. However, a benefit of memory
mapped working registers is that both the Least and
Most Significant Bytes (MSBs) can be manipulated
through byte wide data memory space accesses.
2.2.1 SOFTWARE STACK POINTER/
FRAM E POIN TE R
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated software Stack Pointer (SP), and
will be automatically modified by exception processing
and sub routine calls and returns. However , W15 can be
referenced by any instruction in the same manner as all
other W registers. This simplifies the reading, writing
and manipulation of the Stack Pointer (e.g., creating
stac k fram es ).
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a Stack Frame Pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
2.2.2 STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS Register
(SR), the LSB of which is referred to as the SR Low
Byte (SRL) and the MSB as the SR High Byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation status flags
(includ ing the Z bit ), as well as the CPU Inter rupt Prior-
ity Level Status bi t s , IPL <2:0 >, a nd the REPEAT ac tiv e
Status bit, RA. During exception processing, SRL is
concate na ted with the MSB of the PC to form a
complete word value, which is then stacked.
The upper byte of the STATUS register contains the
DSP Adder/Subtracter status bits , the DO Loop Active
bit (DA) and the Digit Carry (DC) Status bit.
2.2.3 PROGRA M COUNTER
The Program Counter is 23 bits wide. Bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
Note: In order to protect against misaligned
stack accesses, W15<0> is always clear.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 21
dsPIC30F1010/202X
FIGURE 2-1 : PRO GRAMMER’ S MOD EL
TABPAG
PC22 PC0
7 0
D0D15
Program Counter
Data Table Page Address
STATUS Register
Working Registers
DSP Operand
Registers
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
DSP Address
Registers
AD39 AD0AD31
DSP
Accumulators ACCA
ACCB
PSVPAG
7 0Program Space Visibility Page Address
Z
0
OA OB SA SB
RCOUNT
15 0
REPEAT Loop Counter
DCOUNT
15 0
DO Loop Counter
DOSTART
22 0
DO Loop Start Address
IPL2 IPL1
SPLIM Stack Pointer Limit Register
AD15
SRL
PUSH.S Shadow
DO Shadow
OAB SAB
15 0 Core Configuration Register
Legend
CORCON
DA DC RA N
TBLPAG
PSVPAG
IPL0 OV
W0/WREG
SRH
DO Loop End Address
DOEND
22
C
dsPIC30F1010/202X
DS70178C-page 22 Preliminary © 2006 Microchip Technology Inc.
2.3 Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fraction al d iv ide ope rati on , as w ell as 32/1 6-b it a nd 1 6/
16-bit signed and unsigned integer divide operations, in
the form of single instr uction iterative divides. The
following instructions and data sizes are supported:
1. DIVF – 16/16 signed fractional divide
2. DIV.sd – 32/16 signed divide
3. DIV.ud – 32/16 unsigned divide
4. DIV.sw – 16/16 signed divide
5. DIV.uw – 16/16 unsigned divide
The 16/16 divides are simila r to the 32/16 (same number
of iterations), but the dividend is eithe r zero-extended or
sign-extended during the first iteration.
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a series
of disc rete div ide ins tructions) will not function correctl y
because the instruction flow depends on RCOUNT.
The divi de instru ction does not autom aticall y set up th e
RCOUNT value, and it must, therefore, be explicitly
and correctly specified in the REPEAT instruction, as
shown in Table 2-1 (REPEAT will execute the target
instruction {operand value + 1} times). The REPEAT
loop coun t mus t be se t up for 18 ite rati ons of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
TABLE 2-1: DIVIDE INSTRUCTIONS
Note: The Divide flow is interruptible. However,
the user needs to save the context as
appropriate.
Instruction Function
DIVF Signed fractional divide: Wm/Wn W0; Rem W1
DIV.sd Signed divide: (Wm + 1:Wm)/Wn W0; Rem W1
DIV.ud Unsigned divide: (Wm + 1:Wm)/Wn W0; Rem W1
DIV.sw Signed divide: Wm / Wn W0; Rem W1
DIV.uw Unsigned divide: Wm / Wn W0; Rem W1
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 23
dsPIC30F1010/202X
2.4 DSP Engine
The DSP engine consists of a high speed 17-bit x
17-bit mu ltiplier , a barrel shifter , and a 40-bit adder/sub-
tracter (with two target accumulators, round and
saturati on log ic ).
The DSP engine also has the capability to perform inher-
ent accumulator-to-accumulator operations, which
require no additional data. These instructions are ADD,
SUB and NEG.
The DSP engine has various options selected through
various bits in the CPU Core Configuration Register
(CORCON), as listed below:
1. Fractional or integer DSP multiply (IF).
2. Signed or unsigned DSP multiply (US).
3. Conventional or convergent rounding (RND).
4. Automatic saturation on/off for ACCA (SATA).
5. Automatic saturation on/off for ACCB (SATB).
6. Automatic saturation on/off for writes to data
memory (SATDW).
7. Accumulator Saturation mode selection
(ACCSAT).
A block diagram of the DSP engine is shown in
Figure 2-2.
Note: For CORCON layout, see Table 3-3.
TABLE 2-2: DSP INSTRUCTION SUMMARY
Instruction Algebraic Operation ACC WB?
CLR A = 0 Yes
ED A = (x – y)2No
EDAC A = A + (x – y)2No
MAC A = A + (x * y) Yes
MAC A = A + x2No
MOVSAC No change in A Yes
MPY A = x * y No
MPY.N A = – x * y No
MSC A = A – x * y Yes
dsPIC30F1010/202X
DS70178C-page 24 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 2-2: DSP E NGI NE BLO CK DI AGRA M
Zero Backfill
Sign-Extend
Barrel
Shifter
40-bit Accumulator A
40-bit Accumulator B Round
Logic
X Data Bus
To/From W Array
Adder
Saturate
Negate
32
32
33
16
16 16
16
40 40
40 40
S
a
t
u
r
a
t
e
Y Data Bus
40
Carry/Borrow Out
Carry/Borrow In
16
40
Multiplier/Scaler
17-bit
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 25
dsPIC30F1010/202X
2.4.1 MULTIPLIER
The 17x17-bit multiplier is capable of signed or
unsign ed ope ration an d can m ultiplex its output u sing a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the mul-
tiplier input value. The output of the 17x17-bit multiplier/
scaler is a 33-bit value, which is sign-extended to 40
bits. Integer data is inheren tly represented as a s igned
two’s complement value, where the MSB is defined as
a sign bit. Generally speaking, the range of an N-bit
two’s complement integer is -2N-1 to 2N-1 – 1. For a 16-
bit integ er, the da ta range is -32 76 8 (0x 800 0) to 3276 7
(0x7FFF), including 0. For a 32-bit integer, the data
range is -2,147,483,648 (0x8000 0000) to
2,147,48 3,6 45 (0x7 FFF FFFF).
When the multiplier is configured for fractional multipli-
cation, the data is represented as a two’s complement
fraction , where the M SB is define d as a sign b it and the
radix po int is im plied to lie just a fter the si gn bit (QX f or-
mat). The range of an N-bit two’s complement fraction
with this implied radix point is -1.0 to (1-21-N). For a
16-bit fraction, the Q15 data range is -1.0 (0x8000) to
0.999969482 (0x7FFF), including 0, and has a preci-
sion of 3 .01518 x10-5. In F ractional mode, a 16x 16 mul-
tiply operation generates a 1.31 product, which has a
precision of 4.65661x10-10.
The same multiplier is used to support the MCU multi-
ply instructions, which include integer 16-bit signed,
unsigned and mixed sign multiplies.
The MUL instruction may be directed to use byte or
word size d opera nds. By te opera nds wil l direct a 1 6-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.4.2 DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can
select one of two accumulators (A or B) as its pre-
accumulation source and post-accumulation destina-
tion. For the ADD and LAC instructions, the data to be
accum ulated or l oaded ca n be optio nally sca led via th e
barrel shifter, prior to accumulation.
2.4.2.1 Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active high and the other input is
true data (not complemented), whereas in the case of
subtrac tion, the carry/borrow input is active low and the
other input is complemented. The adder/subtracter
generates overflow Status bits SA/SB and OA/OB,
which are latched an d reflected in t he ST ATUS regi ster .
Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
Overflow into guard bits 32 through 39: this is a
recoverable overfl ow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow; they are:
1. OA:
ACCA overflowed into guard bits
2. OB:
ACCB overflowed into guard bits
3. SA:
ACCA saturated (bit 31 overflo w and saturatio n)
or
ACCA overflowed into guard bits and saturated
(bit 39 over flow and saturation)
4. SB:
ACCB saturated (bit 31 overflo w and saturatio n)
or
ACCB overflowed into guard bits and saturated
(bit 39 over flow and saturation)
5. OAB:
Logical OR of OA and OB
6. SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the correspond-
ing overflow trap flag enable bit (OVATE, OVBTE) in
the INTCON1 register (refer to Section 5.0 “Inter-
rupts”) is set. This allows the user to take immediate
action, for example, to correct system gain.
dsPIC30F1010/202X
DS70178C-page 26 Preliminary © 2006 Microchip Technology Inc.
The SA and SB bit s are modified each time da ta passes
through the adder/subtracter, but can only be cleared by
the user. When set, they indicate that the accumulator
has overflowed its maximum range (bit 31 for 32 -bit sat-
uration, or bit 39 for 40-bit saturation) and will be satu-
rated (if saturation is enabled). When saturation is not
enabled, SA and SB default to bit 39 overflow and thus
indicate that a cat astrophic overfl ow has occurred. If the
COVTE bit in the INTCON1 register is set, SA and SB
bits wil l generate an arithmetic w arning trap when
saturation is disabled .
The overflow and saturation Status bits can optionally
be viewed in the STATUS Register (SR) as the logical
OR of OA an d OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). Th is allows programm ers to check
one bit in the STATUS Register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This is useful for
complex number arithmetic, which typically uses both
the accumulators.
The device supports three Saturation and Overflow
modes.
1. Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic load s the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0x8000000000) into the target accumula-
tor. The SA or SB bit is set and remains set until
cleared by the user. This is referr ed to as ‘super
saturation’ and provides protection against erro-
neous data or unexpected algorithm problems
(e.g., gain calculations).
2. Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then load s the maximally positive
1.31 value (0x007FFFFFFF) or maximally nega-
tive 1.31 value (0x0080000000) into the target
accumulator. The SA or SB bit is se t and remains
set until cleared by the user . When this Saturation
mode is in effect, the guard bits are not used (so
the OA, OB or OAB bits are never set).
3. Bit 39 Catastrophic Overflow
The bit 39 overflow Status bit from the adder is
used to set the SA or SB bit, which remain set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying it s sign). If the COVTE b it in
the INTCON1 register is set, a catastrophic
ove rflow can initiate a trap exception.
2.4.2.2 Accumulator ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the acc umulator that is not targeted by the instruction
into dat a spac e memory. The write is perfo rmed ac ross
the X bus into combined X and Y addres s space. The
following addressing modes are supported:
1. W13, Registe r Dire ct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
2. [W13] + = 2, Register Indirect with Post-Incre-
ment: The rounded contents of the non-target
accum ulator are written into the addre ss pointed
to by W13 as a 1.15 fraction. W13 is then
incremented by 2 (fo r a wo rd wr ite).
2.4.2.3 Round Logic
The round logic is a combinational block, which per-
forms a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is det ermined by the state of the RND bit
in the CORCON register. It generates a 16-bit, 1.15 data
value which is passed to the data space write saturation
logic. If rounding is not indicated by the instruction, a
truncated 1.15 data value is stored and the least
significant word (lsw) is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the AC CxH w ord (bi t s 16
through 31 of the accumulator). If the ACCxL wo rd (bits
0 through 15 of the accumulator) is between 0x8000
and 0xFFFF (0x8000 included), ACCxH is incre-
mented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this
algorith m is that over a su ccessio n of random roun ding
operations, the value will tend to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb (bit
16 of the accumulator) of ACCxH is examined. If it is ‘1’,
ACCxH is inc remen ted. If it is ‘0’, ACCxH is not modi-
fied. Assuming that bit 16 is effectively random in
nature, th is s c hem e w i ll re mo ve any rou ndi ng b ias th at
may accumulate .
The SAC and SAC.R instructions store either a trun-
cated (SAC) or rounded (SAC.R) version of the cont ents
of the t arget accumul ator to data mem ory , via the X bu s
(subject to data saturation, see Section 2.4.2.4 “Data
Space Write Saturation”). Note tha t for th e MAC cl as s
of instructions, the accumulator write back operation
will fu nction in t he same ma nner , a ddressing combine d
MCU (X and Y) data space though the X bus. For this
class of instructions, the data is always subject to
rounding.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 27
dsPIC30F1010/202X
2.4.2.4 Data Space Write Saturat ion
In addition to adder/sub tracter saturation, writes to data
space may also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15 frac-
tional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
combin ed and used t o sele ct the a ppropri ate 1.1 5 frac-
tional value as output to write to data space memory.
If the SATDW bit in the CORCON register is set, data
(after roundi ng or trun ca tio n) is tes te d for ove rflo w and
adjusted accordingly. For input data greater than
0x007FF F, data writte n to memory i s forced to the max-
imum posit ive 1. 15 val ue, 0x7FFF. For i nput data le ss
than 0x FF8000, dat a wri tten to memo ry is f orced to the
maximum negative 1.15 value, 0x8000. The MSb of the
source (bit 39) is used to determine the sign of the
operand bei ng tes ted.
If the SATDW bit i n the CORCON register is not set , the
input data is always passed through unmodified under
all conditions.
2.4.3 BARREL SHIFTER
The barrel shifter is capable of performing up to 15-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
The sh ifter requi res a s ign ed bi nary v al ue to de term in e
both the m agnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit res ult for DSP shift ope rations an d a 16-bit resu lt
for MCU shift operations. Data from the X bus is pre-
sented to the barrel shifter between bit positions 16 to
31 for right sh ifts, and bit positio ns 0 to 15 for left sh ifts.
dsPIC30F1010/202X
DS70178C-page 28 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 29
dsPIC30F1010/202X
3.0 MEMORY ORGANIZATION
3.1 Program Address Space
The program address space is 4M instruction words. It
is addressable by a 24-bit value from either the 23-bit
PC, table instruction Effective Address (EA), or data
space EA, when program space is mapped into data
space, as defined by Table 3-1. Note that the program
spa ce add ress i s increm ented b y tw o betwee n suc ces-
sive program words, in order to provide compatibility
with data space addressing.
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE) , for all access es other than TBLRD/TBLWT,
which use TBLPAG<7> to determi ne user or conf igura-
tion space access. In Table 3-1, Read/Write instruc-
tions, b it 23 allows a ccess to the Devic e ID, the User ID
and the Configuration bits. Otherwise, bit 23 is always
clear.
FIGURE 3-1:
PROGRAM SPACE MEMORY
MAP F OR dsPIC 30F10 10/
202X
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
Note: The address map shown in Figure 3-1 is
conceptual, and the actual memory con-
figuration may vary across individual
devices depending on available memory.
Reset – Target Address
User Memory
Space
000000
7FFFFE
00007E
Ext. Osc. Fail Trap
000002
000080
User Flash
Progra m Mem ory
002000
001FFE
Address Erro r Trap
Stack Error Trap
Arithmetic Warn. Trap
Reserved
Reserved
Reserved
Vector 0
Vector 1
Vector 52
Vector 53
(4K instructions)
Reserved
(Read 0’s)
0000FE
000100
000014
Al ternate Vect or Table
Reset – GOTO Instruction
000004
Reserved
Device Configuration
Configuration Memory
Space
800000
F80000
Registers F8000E
F80010
DEVID (2) FEFFFE
FF0000
FFFFFE
Reserved F7FFFE
8005FE
800600
UNITID (32 instr.)
8005BE
8005C0
Reserved
Reserved
Vector Tables
dsPIC30F1010/202X
DS70178C-page 30 Preliminary © 2006 Microchip Technology Inc.
TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION
FIGURE 3-2: DATA ACCESS FROM PROGR AM SPACE ADDRESS GENERATION
Access Type Access
Space Program Sp ac e Address
<23> <22:16> <15> <14:1> <0>
Instruction Access User 0 PC<22:1> 0
TBLRD/TBLWT User
(TBLPAG<7> = 0)TBLPAG<7:0> Data EA <15:0>
TBLRD/TBLWT Configuration
(TBLPAG<7> = 1)TBLPAG<7:0> Data EA <15:0>
Program Space Visibility User 0 PSVPAG<7:0> Data EA <14:0>
0Program Counter
23 bits
1
PSVPAG Reg
8 bits
EA
15 bits
Program
Using
Select
TBLPAG Reg
8 bits
EA
16 bits
Using
Byte
24-bit EA
0
0
1/0
Select
User/
Configuration
Table
Instruction
Program
Space
Counter
Using
Space
Select
Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.
Visibility
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 31
dsPIC30F1010/202X
3.1.1 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
This arc hit ec ture f etc hes 24 -bi t w ide prog ram me mo ry.
Consequently, instructions are always aligned. How-
ever, as the architecture is modified Harvard, data can
also be present in prog ram space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the rema ppi ng of a 16K word prog ram space page in to
the u pp e r half o f da ta space (s ee Section 3.1.2 “Data
Access from Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL instruc-
tions of fer a direct method of readin g or writing the least
significant word (lsw) of any address within program
space, without going through data space. The TBLRDH
and TBLWTH instructions are the only method whereby
the upper 8 bits of a program space word can be
accessed as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide add res s s p ac es , res id ing sid e by si de, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the Least Significant
Data Word, and TBLRDH and TBLWTH access the
space which contains the Most Significant Data Byte.
Figure 3-2 shows h ow th e EA is cre ate d for ta ble op er-
ations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
A set of Ta ble In str ucti ons is pro vid ed t o move byt e or
word sized data to and from program space.
1. TBLRDL: Table Read Low
Word: Read the lsw of the program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LSBs of the program
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> m aps to the d estination byte when byte
select = 1.
2. TBLWTL: Table Write Lo w (re fer t o Section 7.0
“Flash Program Memory” for details on Flash
Programming).
3. TBLRDH: Table Read High
Word: Read the most significant word of the
program address;
P<23:16> maps to D<7:0>; D<15:8> always
be = 0.
Byte: Read one of the MSBs of the program
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
4. TBLWTH: Table Wri te Hi gh (ref er to Section 7.0
“Flash Program Memory” for details on Flash
Programming).
FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFIC ANT W OR D)
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’).
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
dsPIC30F1010/202X
DS70178C-page 32 Preliminary © 2006 Microchip Technology Inc.
FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE)
3.1.2 DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM
SPACE VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space, without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled, by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetch es are requ ire d.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP ope ration uses p rogram sp ace mapp ing to acces s
this m em ory reg ion , Y d ata space should typic al ly co n-
tain state (variable) data for DSP operations, whereas
X data space should typically contain coefficient
(constant) da ta.
Although each dat a sp ace address, 0x8000 and higher ,
maps directly into a corresponding program memory
address (see Figure 3-5), only the lower 16-bits of the
24-bit program word are used to contain the data. The
upper 8 bits shoul d be progra mmed to forc e an illeg al
instruction to maintain machine robustness. Refer to
the “dsPIC30F/33F Programmer s Reference Manual”
(DS70157) for details on instruction encoding.
Note that by incrementing the PC by 2 for each pro-
gram memory word, the Least Significant 15 bits of
data space addresses directly map to the Least Signif-
icant 15 bits in the corresponding program space
address es. The remainin g bits are prov ided by the Pro-
gram Sp ace V is ibilit y Page regi ster, PSVPAG<7:0>, as
shown in Figure 3-5.
For instructions that use PSV which are executed
outside a REPEAT loop:
The following instructions will require one instruc-
tion cycle in addition to the specified execution
time:
-MAC class of instructions with data operand
prefetch
-MOV instr ucti ons
-MOV.D instructions
All other instructions will require two instruction
cycl es in addition to th e specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
The follo wing inst ances will re quire two ins truction
cycl es in addition to th e specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interr upt is servi ced
Any other iteration of the REPEAT loop will allow
the instruction, accessing data using PSV, to
execute in a single cycle.
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’)
TBLRDH.W
TBLRDH.B (Wn<0> = 1)
TBLRDH.B (Wn<0> = 0)
Note: PSV acc ess is tempo raril y disabl ed durin g
Table Reads/Writes.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 33
dsPIC30F1010/202X
FIGU RE 3- 5 : DATA SPACE WI ND O W I NT O PROG R AM SPACE OP ER AT ION
3.2 Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instruc-
tions), o r as o ne u nified lin ear a ddress ran ge (fo r MC U
instruc tions). The dat a spaces are accessed usi ng two
Address Generation Units (AGUs) and separate data
paths.
3.2.1 DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of th is ar chi tec tur e is th at
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent linear
addressing space, X and Y spaces have contiguous
addresses.
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the
256 byte data address space (including all Y
addresses). When executing one of the MAC class of
instructions, the X block consists of the 256 bytes data
address space excluding the Y address block (for data
reads on ly). In other word s, all other i nstructions rega rd
the entire data memory as one composite address
space. The MAC class instructions extract the Y
address space from data space and address it using
EAs source d from W10 and W1 1. The remaining X data
space is addressed using W8 and W9. Both address
spaces are concurrently accessed only with the MAC
class instructions.
A data space memory map is shown in Figure 3-6.
23 15 0
PSVPAG(1)
15
15
EA<15> =
0
EA<15> = 1
16
Data
Space
EA
Data Space Program Space
8
15 23
0x0000
0x8000
0xFFFF
0x00
0x100100
0x001FFE
Data Read
Upper half of Data
Space is mapped
into Program Space
Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
0x001200
Address
Con cat enat i on
BSET CORCON,#2 ; PSV bit set
MOV #0x00, W0 ; Set PSVPAG register
MOV W0, PSVPAG
MOV 0x9200, W0 ; Access program memory location
; using a data space access
dsPIC30F1010/202X
DS70178C-page 34 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 3-6 : DATA SPACE MEMO R Y MA P
0x0000
0x07FE
0x08FE
0xFFFE
LSB
Address
16 b i ts
LSBMSB
MSB
Address
0x0001
0x07FF
0x08FF
0xFFFF
0x8001 0x8000
Optionally
Mapped
into Program
Memory
0x09FF 0x09FE
0x0801 0x0800
0x0901 0x0900
Near
Data
SFR Space
512 bytes
SRAM Space
2560 bytes
Note: Unimplemented SFR or SRAM locations read as ‘0’.
Space
Unimplemented (X)
X Data
SFR Space
X Data RAM (X)
Y Data RAM (Y)
(Note)
256 bytes
256 bytes
(See Note)
0x0A00
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 35
dsPIC30F1010/202X
FIGURE 3-7: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS
SFR SPACE
(Y SPACE)
X SPACE
SFR SPACE
UNUSED
X SPACE
X SPACE
Y SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write) MAC Class Ops Read-Only
Indirect EA using any W Indirect EA using W10, W11
MAC Class Ops (W r i te)
Indirect EA using W8, W9
dsPIC30F1010/202X
DS70178C-page 36 Preliminary © 2006 Microchip Technology Inc.
3.2.2 DATA SPACES
The X data space is used by all instructions and sup-
ports all Addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X dat a sp ace als o suppo rts m odulo address ing for
all instructions, subject to Addressing mode restric-
tions. Bit-Reversed Addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to pro-
vide two concurrent data read paths. No writes occur
across the Y bus. This class of instructions dedicates
two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
address space is considere d a c om bin ati on of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports modulo addressing for
automat ed c irc ul ar bu f fe r s. Of c ours e, all othe r ins tru c-
tions ca n access the Y dat a address sp ace thro ugh the
X data path, as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user pro-
gramma ble. Shoul d an EA poin t to d ata out side it s own
assigned address space, or to a location outside phys-
ical mem ory, an all-zero word/byte wi ll be returne d. For
example, although Y address space is visible by all
non-MAC instructions using any Addressing mode, an
attempt by a MAC instruction to fetch data from that
space , using W 8 or W9 (X space p ointer s), wi ll ret urn
0x0000.
TABLE 3-2: EFFECT OF INVALID
MEMORY ACCESSES
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
3.2.3 DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organ ized as 16-bit wide words. Data space mem ory is
organized in byte addressable, 16-bit wide blocks.
3.2.4 DATA ALIGNMENT
To help maintain backward compatibility with PIC®
MCU devices and improve data space memory usage
efficiency, the dsPIC30F instruction set supports both
word and byte operation s. Data is al igned in dat a mem-
ory and registers as words, but all data space EAs
resolve to bytes. Data byte re ads will rea d the comp lete
word, whi ch contain s the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
acces ses are possible fro m the Y data pa th as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte-wide entities with shared (word) address decode,
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a conse quence of this byte access ibility, all effec tive
address c alc ul atio ns (in cl udi ng tho se ge nera ted by th e
DSP operations, which are restricted to word sized
data) a re internally scale d to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode,
[Ws++], will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
All word accesses must be al igned to an even a ddress.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word opera-
tions, or translating from 8-bit MCU code. Sh ould a mis-
aligned read or write be attempted, an address error
trap will be generated. If the error occurred on a read,
the instruction underway is completed, whereas if it
occurred on a write, th e instructi on will be execu ted but
the write will not occur. In either case, a trap will then
be exec uted, a llow ing the syste m and/ or user to exam-
ine the machine state prior to execution of the address
fault.
FIGURE 3-8: DATA ALIGNMENT
Attempted Operation Data Returned
EA = an unimplemented address 0x0000
W8 or W9 used to access Y data
spa ce in a MAC instru ction 0x0000
W10 or W11 used to access X
data space in a MAC instruction 0x0000
15 8 7 0
0001
0003
0005
0000
0002
0004
Byte 1 Byte 0
Byte 3 Byte 2
Byte 5 Byte 4
LSBMSB
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 37
dsPIC30F1010/202X
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
Zero-Extend (ZE) instruction on the appropriate
address.
Although m os t i ns truc tio ns are capab le of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words .
3.2.5 NEAR DATA SPACE
An 8 Kbyte ‘near ’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly add res sab le via a 13-bit abso lute address fiel d
within all memory direct instructions. The remaining X
address space and all of the Y address space is
address able indirec tly. Addi tionally, the whole of X da ta
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6 SOFTWARE STACK
The dsPI C DSC de vice c ontain s a softwa re st ack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher ad dresses. It pre-dec rements for stack pops and
post-increments for stack pushes, as shown in
Figure 3-9. Note that for a PC push during any CALL
instruc tio n, the M SB o f t he PC i s ze ro-ex te nde d b efo re
the push, ensuring that the MSB is always clear.
Ther e is a Stack Pointer Limit register (S PLIM ) associ-
ated with the Stack Pointer. SPLIM is uninitialized at
Reset. As is the case for the Stack Pointer, SPLIM<0>
is forced to ‘0’, because all stack operations must be
word-aligned. Whenever an Effective Address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the valu e i n SPL IM. If the c ont ents of the Stack Pointer
(W15) and the SPLIM register are equal and a push
operatio n is perform ed, a st ack error trap will no t occur.
The stack error trap will occur on a subsequent push
operation. Thus, for example, if it is desirable to cause
a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
Similarly, a S tack Pointer Underflow (st ack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM reg ister should not be immediately
follow ed by an ind irec t read ope rati on usi ng W15.
FIGURE 3-9: CALL ST ACK FRAME
3.2.7 DATA RAM PROTECTION
The dsPIC30F1010/202X devices support data RAM
protection features which enable segments of RAM to
be protec ted w hen us ed i n c onj unc ti on wi th Bo ot C od e
Segment Security. BSRAM (Secure RAM segment for
BS) is accessible only from the Boot Segment Flash
code when enabled. See Table 3-3 for the BSRAM
SFR.
Note: A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
015
W15 (before CALL)
W15 (after CALL)
Stack Grows Toward s
Higher Addres s
PUSH: [W15++]
POP: [--W15]
0x0000
PC<22:16>
dsPIC30F1010/202X
DS70178C-page 38 Preliminary © 2006 Microchip Technology Inc.
TA BLE 3-3: CORE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
W0 0000 W0/WREG 0000 0000 0000 0000
W1 0002 W1 0000 0000 0000 0000
W2 0004 W2 0000 0000 0000 0000
W3 0006 W3 0000 0000 0000 0000
W4 0008 W4 0000 0000 0000 0000
W5 000A W5 0000 0000 0000 0000
W6 000C W6 0000 0000 0000 0000
W7 000E W7 0000 0000 0000 0000
W8 0010 W8 0000 0000 0000 0000
W9 0012 W9 0000 0000 0000 0000
W10 0014 W10 0000 0000 0000 0000
W11 0016 W11 0000 0000 0000 0000
W12 0018 W12 0000 0000 0000 0000
W13 001A W13 0000 0000 0000 0000
W14 001C W14 0000 0000 0000 0000
W15 001E W15 0000 1000 0000 0000
SPLIM 0020 SPLIM 0000 0000 0000 0000
ACCAL 0022 ACCAL 0000 0000 0000 0000
ACCAH 0024 ACCAH 0000 0000 0000 0000
ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000
ACCBL 0028 ACCBL 0000 0000 0000 0000
ACCBH 002A ACCBH 0000 0000 0000 0000
ACCBU 002C Sign-Extension (ACCB<39>) ACCBU 0000 0000 0000 0000
PCL 002E PCL 0000 0000 0000 0000
PCH 0030 —PCH0000 0000 0000 0000
TBLPAG 0032 —TBLPAG0000 0000 0000 0000
PSVPAG 0034 PSVPAG 0000 0000 0000 0000
RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu
DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu
DOSTARTL 003A DOSTARTL 0uuuu uuuu uuuu uuu0
DOSTARTH 003C —DOSTARTH0000 0000 0uuu uuuu
DOENDL 003E DOENDL 0uuuu uuuu uuuu uuu0
DOENDH 0040 DOENDH 0000 0000 0uuu uuuu
SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000
CORCON 0044 US EDT DL2 DL1 DL0 SATA SATB
SATDW
ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000
Legend: u = uninitialized bit
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 39
dsPIC30F1010/202X
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
MODCON 0046 XMODEN YMODEN BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000
XMODSRT 0048 XS<15:1> 0uuuu uuuu uuuu uuu0
XMODEND 004A XE<15:1> 1uuuu uuuu uuuu uuu1
YMODSRT 004C YS<15:1> 0uuuu uuuu uuuu uuu0
YMODEND 004E YE<15:1> 1uuuu uuuu uuuu uuu1
XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu
DISICNT 0052 DISICNT<13:0> 0000 0000 0000 0000
BSRAM 0750
IW_BSR
IR_BSR
RL_BSR
0000 0000 0000 0000
TA BLE 3-3: CORE REGISTER MAP (CONTINUED)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Legend: u = uninitialized bit
dsPIC30F1010/202X
DS70178C-page 40 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 41
dsPIC30F1010/202X
4.0 ADDRESS GENERATOR UNITS
The dsPIC DSC core contains two independent
address generator un its: the X AGU and Y AGU. The Y
AGU supports word sized data reads for the DSP MAC
class of instructions only. The dsPIC DSC AGUs
support three types of data addressing:
Linear Addressing
Modulo (Circular) Addressing
Bit-Revers ed Addre ss in g
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressi ng is on ly appli cable to data s pace a ddresses .
4.1 Instruction Addressing Modes
The Addressing modes in Table 4-1 form the basis of
the Addressing modes o ptimized to support the specific
features of individual instructions. The Addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
4.1.1 FILE REGISTER INSTRUCTIONS
Most fil e re gis ter i ns truc tio ns use a 13-bi t ad dres s field
(f) to directly address data present in the first 8192
bytes of data memory (near data space). Most file
register instructions employ a working register, W0,
whic h is den oted as WREG in these i nstruc tions. The
destination is typically either the same file register, or
WREG (with the exception of the MUL instruction),
which w rites the re sult t o a re gister or regi ster p air. The
MOV instruction allows additional flexibility and can
access the entire data space.
TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
Addressing Mode Description
File Register Direct The address of the file register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn forms the EA.
Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.
dsPIC30F1010/202X
DS70178C-page 42 Preliminary © 2006 Microchip Technology Inc.
4.1.2 MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where Ope r and 1 is alwa ys a w orking regis ter (i. e., th e
Addressing mode can only be register direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following Addressing modes are
supported by MCU instructions:
Register Direc t
Register Indi rec t
Register Indi rec t Post-mod ifi ed
Register Indi rec t Pre- mo dif ied
5-bit or 10-bit Literal
4.1.3 MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
Addressing modes supported by most MCU instruc-
tions, move and accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
In summary, the following Addressing modes are
supported by move and accumulator instructions:
Register Direc t
Register Indi rec t
Register Indi rec t Post-mod ifi ed
Register Indi rec t Pre- mo dif ied
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Lite ral
16-bit Literal
4.1.4 MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to a s MAC instruction s, utilize a si mplified set of
Addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will alway s be directed to th e
Y AGU. The effective addresses generat ed (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
In summary, the following Addressing modes are
supported by the MAC class of instructions:
Register Indirect
Register Indirect Post-modified by 2
Register Indirect Post-modified by 4
Register Indirect Post-modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5 OTHER INSTRUCTIONS
Besides the various Ad dressing mo des outlined above,
some i nstructio ns use li teral con sta nts of various sizes.
For example, BRA (branch) instructions use 16-bit
signed l iterals to spe cify the branch de stination dire ctly ,
whereas the DISI instruction uses a 14-bit unsigned
literal fiel d. In som e in stru cti ons , suc h as ADD Acc, the
source of an operand or result is implied by the opc ode
it self. Cert ain opera tions, such as NOP, do not have any
operands.
Note: Not all instructions support all the
Addressi ng modes given abo ve. Individual
instructions may support different subsets
of these Addressin g modes.
Note: For the MOV instructions, the Addressing
mode specified in the instruction can differ
for the source and destination EA. How-
ever, the 4-bit Wb (Registe r Offset) field is
shared between both source and
destination (but typically only used by
one).
Note: Not all instructions support all the
Addressi ng modes given abo ve. Individual
instructions may support different subsets
of these Addressin g modes.
Note: Register Indirect with Register Offset
Addressing is only available for W9 (in X
spac e) and W11 (in Y spac e).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 43
dsPIC30F1010/202X
4.2 Modulo Addressing
Modulo addressing is a method of providing an auto-
mated means to support circular data buffers using
hardwa re. The ob jectiv e is to remo ve t he need for soft-
ware to perform data address boundary checks when
executing tightly looped code, as is typical in many
DSP algorithms.
Modulo addressing can operate in either data or pro-
gram space (since the data pointer mechanism is essen-
tially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into p rogram space) and Y d ata spaces. Modulo
addressing can operate on any W register poin ter. How-
ever, it is not advisable to use W14 or W15 for modulo
addressing, since these two registers are used as the
Stack Frame Pointer and Stack Pointer, respectiv ely.
In general, any particular circular buffer can only be
configu red to operate in one direct ion, as ther e are c er-
tain restrictions on the buffer start address (for incre-
menting buffers) or end address (for decrementing
buffers) based upon the dire ction of the buf fer.
The only exception to the usage restrictions is for buff-
ers which have a power-of-2 length. As these buffers
satisfy the start and end address criteria, they may
operate in a Bidirectional mode, (i.e., address bound-
ary checks will be performed on both the lower and
upper address boundaries).
4.2.1 START AND END ADDRESS
The modulo addressing scheme requires that a
starting and an end address be specified and loaded
into the 16-bit modulo buffer address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
The leng th of a ci rcular buf fer is not di rectly spec ified. It
is determined by the difference between the corre-
sponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
4.2.2 W ADDRESS REGISTER
SELECTION
The Mod ulo an d Bi t-Rev ers ed Add ress in g Co ntro l re g-
ister M O DCON <1 5:0 > c on t ai ns enable fla gs as w ell a s
a W register field to specify the W address registers.
The XWM and YWM fields select which registers will
operate with mo dulo addressing. If XWM = 15, X RAGU
and X WAGU modulo addressing are disabled.
Similarly, if YWM = 15, Y AGU modulo addressing is
disabled.
The X Address Space Pointer W register (XWM) to
which modulo addressing is to be applied, is stored in
MODCON <3 :0> (s ee Table 3-3). Modulo ad dres si ng is
enabled for X data sp ace when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which modulo addressing is to be applied, is stored in
MODCON<7:4>. Modulo addressing is enabled for Y
data space when YWM is set to any value other than 15
and the YMODEN bit is set at MODCON<14>.
Note: Y-space modulo addressing EA calcula-
tions assume word sized data (LSb of
every EA is always clear).
dsPIC30F1010/202X
DS70178C-page 44 Preliminary © 2006 Microchip Technology Inc.
FIGURE 4-1: MODULO ADDRESSI NG OPERATION EXAMPLE
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
Byte
Address MOV #0x1100,W0
MOV W0, XMODSRT ;set modulo start address
MOV #0x1163,W0
MOV W0,MODEND ;set modulo end address
MOV #0x8001,W0
MOV W0,MODCON ;enable W1, X AGU for modulo
MOV #0x0000,W0 ;W0 holds buffer fill value
MOV #0x1110,W1 ;point W1 to buffer
DO AGAIN,#0x31 ;fill the 50 buffer locations
MOV W0, [W1++] ;fill the next location
AGAIN: INC W0,W0 ;increment the fill value
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 45
dsPIC30F1010/202X
4.2.3 MODULO ADDRESSING
APPLICABILITY
Modulo addressing can be applied to the Effective
Address (EA) calculation associated with any W regis-
ter. It is important to realize that the address bound-
aries c he ck fo r ad dre sses le ss th an or greater tha n th e
upper (for incrementing buffers) and lower (for decre-
menting buffers) boundary addresses (not just equal
to). Address changes may, therefore, jump beyond
boundaries and still be adjusted correctly.
4.3 Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
re-ordering for radix-2 FFT algorithms. It is supported
by t he X AGU for data writes only.
The modifier , which may be a constant value or register
contents, is regarded as having its bit order reversed.
The addres s sourc e and dest inat ion are ke pt in norma l
order. Thus, the only operand requiring reversal is the
modifier.
4.3.1 BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1. BWM (W register selection) in the MODCON
register is any v alue other than 15 (the stack can
not be accessed using Bit-Reversed
Addressing) and
2. the BREN bit is set in the XBREV register and
3. the Addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
If the length of a bit-reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zero s.
XB<14:0> is th e b it-re vers ed ad dres s modifi er o r ‘p iv ot
point’ which is typically a constant. In the case of an
FFT computation, its value is equal to half of the FFT
dat a buffer size.
When enabled, Bit-Reversed Addressing will only be
executed for register indirect with pre-increment or
post-inc remen t addres sing an d word siz ed dat a wri tes.
It will no t functio n for any ot her Addres sing m ode or for
byte sized data, and normal addresses will be gener-
ated instea d. When Bit-R eversed Addr essin g is active,
the W Address Pointer will always be added to the
address modifier (XB) and the offset associated with
the register Indirect Addressing mode will be ignored.
In addition, as word sized data is a requirement, the
LSb of the EA is ignored (and always clear).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the bit-reversed pointer.
FIGURE 4-2: BIT-REVERSED ADDRES S EXAMPLE
Note: The m odu lo corr ected ef fective add res s i s
written back to the re giste r only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7 + W2])
is used , m odu lo a dd res s c orrec ti on i s p er-
formed, but the contents of the register
remains unchanged.
Note: All Bit-Reversed EA calculations assume
word sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note: Modulo addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempt s to do this , Bit-Reversed Addr ess-
ing wil l assume priori ty when activ e for the
X WAGU, and X WAGU modulo address-
ing will be disabled. However, modulo
addressing will continue to function in the
X RAGU.
b3 b2 b1 0
b2 b3 b4 0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16 word Bit-Reversed Buffer
b7 b6 b5 b1
b7 b6 b5 b4b11 b10 b9 b8
b11 b10 b9 b8
b15 b14 b13 b12
b15 b14 b13 b12
Sequenti al Addre ss
Pivot Point
dsPIC30F1010/202X
DS70178C-page 46 Preliminary © 2006 Microchip Technology Inc.
TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Normal
Address Bit-Reversed
Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0000 00000 0
0001 11000 8
0010 20100 4
0011 31100 12
0100 40010 2
0101 51010 10
0110 60110 6
0111 71110 14
1000 80001 1
1001 91001 9
1010 10 0101 5
1011 11 1101 13
1100 12 0011 3
1101 13 1011 11
1110 14 0111 7
1111 15 1111 15
Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value(1)
32768 0x4000
16384 0x2000
8192 0x1000
4096 0x0800
2048 0x0400
1024 0x0200
512 0x0100
256 0x0080
128 0x0040
64 0x0020
32 0x0010
16 0x0008
80x0004
40x0002
20x0001
Note 1: Modifier values greater than 256 words exceed the data memory available on the dsPIC30F1010/202X device
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 47
dsPIC30F1010/202X
5.0 INTERRUPTS
The dsPIC30 F1010/ 202X devic e has up to 35 in terrupt
sources and 4 processor exceptions (traps), which
must be arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt Vec-
tor Table (IVT) and transferring the address contained
in the interrupt vector to the Program Counter (PC).
The interrupt vector is transferred from the program
data bus into the Program Counter, via a 24-bit wide
multiplexer on the input of the Program Counter.
The Interrupt Vector Table and Alternate Interrupt Vec-
tor Table (AIVT) are placed near the beginning of pro-
gram memory (0x000004). The IVT and AIVT are
shown in Figure 5-1.
The interrupt controller is responsible for pre-
processing the interrupts and processor exceptions,
prior to their being presented to the processor core.
The peripheral interrupts and traps are enabled, priori-
tized and controlled using centralized special function
registers:
IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All interrupt request flags are maintained in these
three registers. The flags are set by their respec-
tive peripherals or external signals, and they are
cleared via software.
IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All interrupt enable control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
IPC0<15:0>... IPC11<7:0>
The user-as s ign abl e prio rity lev el assoc iate d with
eac h of these i nterrupts is held centrally in these
twelve registe rs.
IPL<3:0> The current CPU priority level is explic-
itly stored in the IPL bits. IPL<3> is present in the
CORCON reg ister , whereas IPL<2:0 > are present
in the STATUS Register (SR) in the processor
core.
INTCON1< 15: 0>, IN TCO N2<15:0>
Global interru pt co ntrol fu nctio ns are deriv ed from
these two registers. INTCON1 contains the con-
trol and status flags for the processor exceptions.
The INTCON2 r egister controls the external inter-
rupt request signal behavior and the use of the
alternate vector table.
The INTTREG register contains the associated
interrupt vector number and the new CPU inter-
rupt priority level, which are latched into vector
number (VECNUM<6:0>) and Interrupt level
(ILR<3:0>) b it field s in the INTT REG regi ster. The
new interrupt priority level is the priority of the
pending interrupt.
All interrupt sources can be user assigned to one of 7
priority levels, 1 through 7, via the IPCx registers.
Each interrupt source is associated with an interrupt
vector, as shown in Figure 5-1. Levels 7 and 1 repre-
sent the highest and lowest maskable priorities,
respectively.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts i s prev en ted . Th us , i f a n i nte rrupt is curre ntl y
being serviced, processing of a new interrupt is
preve nte d, e ven if th e ne w inte rrup t is of hi gher priorit y
than the one currently being serviced.
Certain interrupts have specialized control bits for
features like edge or level triggered interrupts, inter-
rupt-on-change, etc. Control of these features remains
within the peripheral module that generates the
interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stor ed in the vecto r locati on in Program Mem-
ory that cor respond s to the interrupt. Ther e are 63 dif-
fer ent vect ors with in the I VT (ref er to Fig ure 5-1). T hese
vectors are contained in locations 0x000004 through
0x0000FE of program memory (refer to Figure 5-1).
These l ocations cont ain 24-bit addresses , and, in order
to preserve robustness, an address error trap will take
place should the PC attempt to fetch any of these
words during normal execution. This prevents execu-
tion of random data as a result of accidentally decre-
menting a PC into vector space, accidentally mapping
a data space address int o vector spac e, or the PC roll-
ing over to 0x000000 after reaching the end of imple-
mented program memory space. Execution of a GOTO
instruction to this vector space will also generate an
address error trap.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157). Note: Interrupt flag bits get set whe n an Interru pt
conditi on occ urs, regar dless o f the s tate of
its corresponding enable bit. User soft-
ware should ensure the appropriate inter-
rupt flag bits are clear prior to enabling an
interrupt.
Note: Assigning a priority level of 0 to an inter-
rupt source is equivalent to disabling that
interrupt.
Note: The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
dsPIC30F1010/202X
DS70178C-page 48 Preliminary © 2006 Microchip Technology Inc.
5.1 Interrupt Priority
The user-a ssig nable In terrupt Prio rity (IP<2:0>) b its for
each ind ividual interrupt source are located in the Least
Significant 3 bits of each nibble, within the IPCx
register(s). Bit 3 of each nibble is not used and is read
as a ‘0’. These bits define the priority level assigned to
a particular interrupt by the user.
Since more than one interrupt request source may be
assigned to a specific user specified priority level, a
means is provided to assign priority within a given level.
This method is called “Natural Order Priority” and is
final.
Natural order priority is dete rmined by the po sition of an
interrupt in the vector table, and only affects interrupt
operation when multiple interrupts with the same user-
assigned priority become pending at the same time.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC DSC devices and their
associated vector numbers.
The ability for the user to assign every interrupt to one
of sev en priority l ev els i mp lie s that the u se r c an as sig n
a very high overall priority level to an interrupt with a
low natural order priority. The INT0 (external interrupt
0) may be assigned to priority level 1, thus giving it a
very low effective priority.
TABLE 5-1: dsPIC30F1010/202X
INTERRUPT VECTOR TABLE
Note: The user selectable priority levels start at
0, as the l owest priori ty, and le vel 7, as th e
highest priority.
Note 1: The natural order priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The natural order priority number is the
same as the INT number.
INT
Number Vector
Number Interrupt Source
Highest Natural Order Priority
0 8 INT 0 External Interrupt 0
1 9 IC1 – Input Ca pture 1
2 10 OC1 – Output Compare 1
3 11 T1 – Timer 1
4 12 Reserved
5 13 OC2 – Output Compare 2
6 14 T2 – Timer 2
7 15 T3 – Timer 3
8 16 SPI1
9 17 U 1RX – UART1 Recei ver
10 18 U1TX – UART1 Transmitt er
11 19 ADC – ADC Convert Done
12 20 NVM – NVM Write Complete
13 21 SI 2C – I2C™ Slav e Eve nt
14 22 MI2C – I2C M as te r Ev ent
15 23 Reserved
16 24 I N T1 – Extern al In te rrupt 1
17 25 I N T2 – Extern al In te rrupt 2
18 26 PW M Special Event Trigger
19 27 PWM Gen#1
20 28 PWM Gen#2
21 29 PWM Gen#3
22 30 PWM Gen#4
23 31 Reserved
24 32 Reserved
25 33 Reserved
26 34 Reserved
27 35 C N – I nput Chang e Not i fic at io n
28 36 Reserved
29 37 Analog Co m parator 1
30 38 Analog Co m parator 2
31 39 Analog Co m parator 3
32 40 Analog Co m parator 4
33 41 Reserved
34 42 Reserved
35 43 Reserved
36 44 Reserved
37 45 ADC Pair 0 Conversion Done
38 46 ADC Pair 1 Conversion Done
39 47 ADC Pair 2 Conversion Done
40 48 ADC Pair 3 Conversion Done
41 49 ADC Pair 4 Conversion Done
42 50 ADC Pair 5 Conversion Done
43 51 Reserved
44 52 Reserved
45-53 53-61 Reserved
Lowest Natural Order Priority
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 49
dsPIC30F1010/202X
5.2 Reset Sequence
A Reset is not a true exception, because the interrupt
controll er is not involv ed in the Reset proce ss. The pro-
cessor initializes its registers in response to a Reset,
which forces the PC to zero. The processor t hen begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory loca-
tion, im media tel y follo wed by th e addres s t arget for th e
GOTO instruction. The processor executes the GOTO to
the speci f ie d add res s and then begi ns op erat ion at the
specified target (start) address.
5.2.1 RESET SOURCES
In addition to External Reset and Power-on Reset
(POR), there are 6 sources of error conditions which
‘trap’ to the Reset vector.
Watchdog Time-out:
The watchdog has timed out, indicating that the
process or is no longer ex ecu tin g the corre ct flo w
of code.
Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer will cause a Reset.
Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
Trap Lockout:
Occurrence of multiple Trap conditions
simultaneously will cause a Reset.
5.3 Traps
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority as shown in Figure 5-1. They
are intended to provide the user a means to correct
errone ous o pera tio n d urin g debug and w he n o pera ting
within the application.
Note that many of these trap conditions can only be
detected when th ey occur. Consequentl y, the ques tion-
able instruction is allowed to complete prior to trap
exception processing. If the user chooses to recover
from the error, the result of the erroneous action that
caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Le ve l 15, whic h impl ies tha t the IPL3 i s alw ays
set during processing of a trap.
If the us er is n ot cur rentl y execu ting a trap, a nd he s et s
the IP L<3:0> bit s to a value of 0111’ (Level 7), t hen al l
interr upts are disabled, b ut traps c an still b e processed.
5.3.1 TRAP SOURCES
The following traps are provided with increasing prior-
ity. However, since all traps can be nested, priority has
little effect.
Math Error Trap:
The Math Error trap executes under the following four
circumstances:
1. Should an attempt be made to divide by zero,
the divide operation will be aborted on a cycle
boundary and the trap taken.
2. If enabled, a Math Error trap will be taken when
an arithmetic operation on either accumulator A
or B causes an overflow from bit 31 and the
accumulator guard bits are not utilized.
3. If enabled, a Math Error trap will be taken when
an arithmetic operation on either accumulator A
or B causes a catastrophic overflow from bit 39
and all saturation is disabled.
4. If the shift amount specified in a shift instruction
is greater than the maximum allowed shift
amount, a trap will occur.
Note: If the user does not intend to take correc-
tive acti on in the event of a T rap Error co n-
dition, these vectors must be loaded with
the address of a default handler that sim-
ply contains the RESET instruction. If, on
the ot her hand, one of the vector s cont ain-
ing an invalid address is called, an
address error trap is generated.
dsPIC30F1010/202X
DS70178C-page 50 Preliminary © 2006 Microchip Technology Inc.
Address Error Trap:
This trap is initiated when any of the following
circumstances occurs:
1. A misaligned data word access is attempted.
2. A data fetch from our unimplemented data
memory location is attempted.
3. A data access of an unimplemented program
memory location is attempted.
4. An instruction fetch from vector space is
attempted.
5. Execution of a “BRA #literal” instruction or a
GOTO #literal” ins truc ti on, w he re literal
is an u nimplem ented pr ogram me mory addr ess.
6. Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
Stack Error Trap:
This trap is initiated under the following conditions:
1. The Stack Pointer is loaded with a value which
is greater than the (user-programmable) limit
value written into the SPLIM register (stack
overflow).
2. The Stack Pointer is loaded with a value which
is less than 0x0800 (simple stack underflow).
Oscillato r Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
5.3.2 HARD AND SOFT TRAPS
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-1 is implemented,
whic h may requir e the user t o check if oth er traps are
pending, in order to completely correct the fault.
‘Soft’ traps incl ude exceptions of priority lev el 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, acknowledged, or is being processed,
a hard trap conflict will occur.
The devic e is automatic ally Reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
FIGURE 5-1: TRAP VECTORS
Note: In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Address Error Trap Vector
Oscillator Fail Trap Vector
Stack Error Trap Vector
Reser ved Vector
Math E rror Trap Vector
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Reser ved Vector
Reser ved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
Math E rror Trap Vector
Decreasing
Priority
0x000000
0x000014
Reserved
Stack Error Trap Vector
Reser ved Vector
Reser ved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
IVT
AIVT
0x000080
0x00007E
0x0000FE
Reserved
0x000094
Reset - GOTO Instruction
Reset - GOTO Addr ess 0x000002
Reserved 0x000082
0x000084
0x000004
Reser ved Vector
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 51
dsPIC30F1010/202X
5.4 Interrupt Sequence
All inte rrupt event flags are sampled in the be ginning of
each instruction cycle by the IFSx registers. A pending
interr upt reque st (IRQ) i s indic ated by the flag bit being
equal t o a 1’ in an IFSx register . The IRQ will cause an
interrupt to occur if the corresponding bit in the interrupt
enable (IECx) register is set. For the remainder of the
instruction cycle, the priorities of all pending interrupt
requests are evaluated.
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The processor then stacks the current Program
Counter and the low byte of the processor STATUS
Register (SRL), as shown in Figure 5-2. The low byte
of the STATUS register contains the processor priority
level at the time, prior to the beginning of the interrupt
cycle. The processor then loads the priority level for
this interrupt into the STATUS register. This action will
disab le al l lower prior ity i nterr upts un til th e comp letion
of the Interrupt Service Routine (ISR).
FIGURE 5-2: INTERRUPT STACK
FRAME
The RETFIE (Return from Interrupt) instruction will
unstack the Program Counter and status registers to
return the processor to its state prior to the interrupt
sequence.
5.5 Alternate Vector Table
In Program Me mory , the IVT is followe d by the AIVT, as
shown in Figure 5-1. Access to the Alternate Vector
Table is provided by the ALTIVT bit in the INTCON2
register. If the ALTIVT bit is set, a ll int errupt a nd ex cep-
tion processes will use the alternate vectors instead of
the defa ult vectors. The alternate vectors are organized
in the same manner as the default vectors. The AIVT
supports emulation and debugging efforts by providing
a means to switch between an application and a sup-
port environment, without requiring the interrupt vec-
tors to be reprogrammed. This feature also enables
switching between applications for evaluation of
diffe rent software algorithms at run time.
If the AIVT is not required, the program memory allo-
cated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
5.6 Fast Context Saving
A context saving option is available using shadow reg-
isters. Shadow registers are provided for the DC, N,
OV, Z and C bits i n SR, and th e registe rs W0 throu gh
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
inst ruc tion s onl y.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority IS R shou ld no t inc lude the s ame ins truc-
tions. Users must save the key registers in software
during a lower priorit y interrupt, if t he higher prio rity ISR
uses fast context saving.
5.7 External Interrupt Requests
The interrupt controller supports three external inter-
rupt request signals, INT0-INT2. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 re gister has thre e bits, INT0EP-INT2EP, that
select the polarity of the edge detection circuitry.
5.8 Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine needed to process the interrupt request.
Note 1: The user can always lower the priority
level by writing a new value into SR. The
Interrupt Service Routine must clear the
interrupt flag bits in the IFSx register
before lowering the processor interrupt
priority, in order to avoid recursive
interrupts.
2: The IPL3 bit (CORCON<3>) is always
clear when interrupts are being pro-
cessed. It is set only during execution of
traps.
<Free Word>
015
W15 (befor e CALL
)
W15 (after CALL)
Stack Grows Towards
Higher Address
PUSH : [W15++]
POP : [--W15]
0x0000
PC<15:0>
SRL IPL3 PC<22:16>
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DS70178C-page 52 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-1: INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14 OVAERR: Accumulator A Overflow Trap Flag bit
1 = Trap was caused by overfl ow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13 OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overfl ow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Enable bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Enable bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10 OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap disabled
bit 9 OVBTE: Accumul ator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap disabled
bit 8 COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B enabled
0 = Trap disabled
bit 7 SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was not caused by an invalid accumulator shift
bit 6 DIV0ERR: Arithmetic Error Status bit
1 = Math error trap was caused by a divided by zero
0 = Math error trap was not caused by an invalid accumulator shift
bit 5 Unimplemented: Read as ‘0
bit 4 MATHERR: Arithmetic Error Status bit
1 = Overflow trap has occurred
0 = Overflow trap has not occurred
bit 3 ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 53
dsPIC30F1010/202X
bit 2 STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1 OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0 Unimplemented: Read as ‘0
REGISTER 5-1: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
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DS70178C-page 54 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-2: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
ALTIVT DISI
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
INT2EP INT1EP INT0EP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit
1 = Use alternate vector table
0 = Use standard (default) vector table
bit 14 DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-3 Unimplemented: Read as ‘0
bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 55
dsPIC30F1010/202X
REGISTER 5-3: IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T3IF T2IF OC2IF T1IF OC1IF IC1IF INT0IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14 MI2CIF: I2C Master Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13 SI2CIF: I2C Slav e Even t s Interrup t Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 NVMIF: Nonvolatile Memory Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 ADIF: ADC Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 SPI1IF: SPI1 Eve nt Interru pt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 T3IF: Timer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 T2IF: Timer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4 Unimplemented: Read as ‘0
bit 3 T1IF: Timer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
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DS70178C-page 56 Preliminary © 2006 Microchip Technology Inc.
bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
REGISTER 5-3: IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 57
dsPIC30F1010/202X
REGISTER 5-4: IFS1: INTERRUPT FLAG STATUS REGISTER 1
R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 U-0
AC3IF AC2IF AC1IF CNIF
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PWM4IF PWM3IF PWM2IF PWM1IF PSEMIF INT2IF INT1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 AC3IF: Analog Comparator #3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14 AC2IF: Analog Comparator #2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13 AC1IF: Analog Comparator #1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 Unimplemented: Read as ‘0
bit 11 CNIF: Input Change Notif ica tio n Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10-7 Unimplemented: Read as ‘0
bit 6 PWM4IF: Pulse Width Modulation Generator #4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 PWM3IF: Pulse Width Modulation Generator #3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4 PWM2IF: Pulse Width Modulation Generator #2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3 PWM1IF: Pulse Width Modulation Generator #1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 PSEMIF: PWM Special Event Match Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
dsPIC30F1010/202X
DS70178C-page 58 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-5: IFS2: INTERRUPT FLAG STATUS REGISTER 2
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-00 R/W-0
ADCP5IF ADCP4IF ADCP3IF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
ADCP2IF ADCP1IF ADCP0IF —AC4IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0
bit 10 ADCP5IF: ADC Pair 5 Conversion Done Interrupt Flag Status b it
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 ADCP4IF: ADC Pair 4 Conversion Done Interr upt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 ADCP3IF: ADC Pair 3 Conversion Done Interr upt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 ADCP2IF: ADC Pair 2 Conversion Done Interr upt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 ADCP1IF: ADC Pair 1 Conversion Done Interr upt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 ADCP0IF: ADC Pair 0 Conversion Done Interr upt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4-1 Unimplemented: Read as ‘0
bit 0 AC4IF: Analog Comparator #4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 59
dsPIC30F1010/202X
REGISTER 5-6: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T3IE T2IE OC2IE T1IE OC1IE IC1IE INT0IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14 MI2CIE: I2C Master Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13 SI2CIE: I2C Slave Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 NVMIE: Nonvolatile Memory Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 ADIE: ADC Conversion Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 SPI1IE: SPI1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4 Unimplemented: Read as ‘0
bit 3 T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
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DS70178C-page 60 Preliminary © 2006 Microchip Technology Inc.
bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
REGISTER 5-6: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 61
dsPIC30F1010/202X
REGISTER 5-7: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 U-0
AC3IE AC2IE AC1IE CNIE
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PWM4IE PWM3IE PWM2IE PWM1IE PSEMIE INT2IE INT1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 AC3IE: Analog Comparator #3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 14 AC2IE: Analog Comparator #2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13 AC1IE: Analog Comparator #1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 Unimplemented: Read as ‘0
bit 11 CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10-7 Unimplemented: Read as ‘0
bit 6 PWM4IE: Pulse Width Modulation Generator #4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 PWM3IE: Pulse Width Modulation Generator #3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4 PWM2IE: Pulse Width Modulation Generator #2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3 PWM1IE: Pulse Width Modulation Generator #1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 PSEMIE: PWM Special Event Match Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 INT2IE: External Interrupt 2 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 INT1IE: External Interrupt 1 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
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DS70178C-page 62 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-8: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
ADCP5IE ADCP4IE ADCP3IE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
ADCP2IE ADCP1IE ADCP0IE —AC4IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0
bit 10 ADCP5IE: ADC Pair 5 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 ADCP4IE: ADC Pair 4 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 ADCP3IE: ADC Pair 3 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 ADCP2IE: ADC Pair 2 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 ADCP1IE: ADC Pair 1 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 ADCP0IE: ADC Pair 0 Conversion done Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4-1 Unimplemented: Read as ‘0
bit 0 AC4IE: Analog Comparator #4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 63
dsPIC30F1010/202X
REGISTER 5-9: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
T1IP<2:0> OC1IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
IC1IP<2:0> INT0IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Prior ity bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC30F1010/202X
DS70178C-page 64 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-10: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
T3IP<2:0> T2IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—OC2IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 65
dsPIC30F1010/202X
REGISTER 5-11: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADIP<2:0> U1TXIP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
U1RXIP<2:0> SPI1IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 ADIP<2:0>: ADC Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 SPI1IP<2:0>: SPI1 Event Interrupt Priori ty bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
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DS70178C-page 66 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-12: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
—MI2CIP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—SI2CIP<2:0> NVMIP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0
bit 10-8 MI2CIP<2:0>: I2C Master Events Interrupt Priori ty bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 SI2CIP<2:0>: I2C Slave Even ts Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 NVMIP<2:0>: Nonvol ati le Me mo ry Interru pt Priori ty bit s
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 67
dsPIC30F1010/202X
REGISTER 5-13: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
PWM1IP<2:0> PSEMIP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
INT2IP<2:0> INT1IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 PWM1IP<2:0>: PWM Generator #1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 PSEMIP<2:0>: PWM Special Event Match Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
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REGISTER 5-14: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
PWM4IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
PWM3IP<2:0> PWM2IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0
bit 10-8 PWM4IP<2:0>: PWM Generator #4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 PWM3IP<2:0>: PWM Generator #3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 PWM2IP<2:0>: PWM Generator #2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 69
dsPIC30F1010/202X
REGISTER 5-15: IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—CNIP<2:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11-0 Unimplemented: Read as ‘0
dsPIC30F1010/202X
DS70178C-page 70 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-16: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
AC3IP<2:0> AC2IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
AC1IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 AC3IP<2:0>: Analog Comparator 3 Inte rrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 AC2IP<2:0>: Analog Comparator 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 AC1IP<2:0>: Analog Comparator 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 71
dsPIC30F1010/202X
REGISTER 5-17: IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
AC4IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Unimplemented: Read as ‘0
bit 2-0 AC4IP<2:0>: Analog Comparator 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC30F1010/202X
DS70178C-page 72 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-18: IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADCP2IP<2:0> ADCP1IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
ADCP0IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 ADCP2IP<2:0>: ADC Pair 2 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 ADCP1IP<2:0>: ADC Pair 1 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 ADCP0IP<2:0>: ADC Pair 0 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 73
dsPIC30F1010/202X
REGISTER 5-19: IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
ADCP5IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADCP4IP<2:0> ADCP3IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Re ad as ‘0
bit 10 - 8 ADCP5IP<2:0>: ADC Pair 5 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 ADCP4IP<2:0>: ADC Pair 4 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 ADCP3IP<2:0>: ADC Pair 3 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC30F1010/202X
DS70178C-page 74 Preliminary © 2006 Microchip Technology Inc.
REGISTER 5-20: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
—ILR<3:0>
bit 15 bit 8
U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
VECNUM<6:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11-8 ILR: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7 Unimplemented: Read as ‘0
bit 6-0 VECNUM: Vector Number o f Pending Interrupt bits
0111111 = Interrupt Ve ctor pending is number 135
0000001 = Interrupt Ve ctor pending is number 9
0000000 = Interrupt Ve ctor pending is number 8
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 75
dsPIC30F1010/202X
TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP
SFR
Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
INTCON1
0080
NSTDIS
OVAERR OVBERR COVAERR
COVBERR
OVATE OVBTE COVTE
SFTACERR
DIV0ERR
MATHERR
ADDRERR
STKERR OSCFAIL
0000 0000 0000 0000
INTCON2
0082 ALTIVT DISI INT2EP INT1EP
INT0EP
0000 0000 0000 0000
IFS0 0084 MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF T1IF OC1IF IC1IF INT0IF
0000 0000 0000 0000
IFS1 0086 AC3IF AC2IF AC1IF —CNIF PWM4IF PWM3IF PWM2IF PWM1IF PSEMIF INT2IF INT1IF
0000 0000 0000 0000
IFS2 0088 ADCP5IF ADCP4IF ADCP3IF ADCP2IF ADCP1IF ADCP0IF —AC4IF
0000 0000 0000 0000
IEC0 0094 MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE T1IE OC1IE IC1IE INT0IE
0000 0000 0000 0000
IEC1 0096 AC3IE AC2IE AC1IE CNIE PWM4IE PWM3IE PWM2IE PWM1IE PSEMIE INT2IE INT1IE
0000 0000 0000 0000
IEC2 0098 ADCP5IE ADCP4IE ADCP3IE ADCP2IE ADCP1IE ADCP0IE —AC4IE
0000 0000 0000 0000
IPC0 00A4 T1IP<2:0> OC1IP<2:0> IC1IP<2:0> INT0IP<2:0>
0100 0100 0100 0100
IPC1 00A6 T31P<2:0> T2IP<2:0> —OC2IP<2:0>
0100 0100 0100 0000
IPC2 00A8 ADIP<2:0> U1TXIP<2:0> U1RXIP<2:0> SPI1IP<2:0>
0100 0100 0100 0100
IPC3 00AA —MI2CIP<2:0> —SI2CIP<2:0> NVMIP<2:0>
0000 0100 0100 0100
IPC4 00AC PWM1IP<2:0> PSEMIP<2:0> INT2IP<2:0> INT1IP<2:0>
0100 0100 0100 0100
IPC5 00AE PWM4IP<2:0> PWM3IP<2:0> PWM2IP<2:0>
0000 0100 0100 0100
IPC6 00B0 CNIP<2:0>
0100 0000 0000 0000
IPC7 00B2 AC3IP<2:0> —AC2IP<2:0> —AC1IP<2:0>
0100 0100 0100 0000
IPC8 00B4 AC4IP<2:0>
0000 0000 0000 0100
IPC9 00B6 ADCP2IP<2:0> ADCP1IP<2:0> ADCP0IP<2:0>
0100 0100 0100 0000
IPC10 00B8 ADCP5IP<2:0> ADCP4IP<2:0> ADCP3IP<2:0>
0000 0100 0100 0100
INTTREG
00E0 —ILR<3:0> VECNUM<6:0>
0000 0000 0000 0000
Note: Refer to the “dsPIC30F/33F Family Reference Manual” (DS70157) for descriptions of register bit fields.
dsPIC30F1010/202X
DS70178C-page 76 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 77
dsPIC30F1010/202X
6.0 I/O PORTS
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
6.1 Parallel I/O (P I O ) P o rts
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
All port pins have three registers directly associated
with the operation of the port pin. The data direction
register (TRISx ) determ ines whe ther the pin is an inp ut
or an output. If the data direction bit is a ‘1’, t hen the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins, and writes to the
port pins, write the latch (LATx).
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
When a pin is shared with another peripheral or func-
tion that is defined as an input only, it is nevertheless
regarded as a dedicated port because there is no
other competing source of outputs.
A Parallel I/O (PIO) port that shares a pin with a periph-
eral is, in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has own ership of the outp ut dat a and co ntrol si gnals of
the I/O pad cell. Figure 6-1 shows how ports are shared
with o ther periphe rals, and th e associa ted I/O cell (pad)
to which they are connected. Table 6-1 and Table 6-2
show the register formats for the shared ports, PORTA
through PORTF, for the dsPIC30F1010/2020 and
PORTA through POR TG for the ds PIC30F2023 devic e,
respectively.
FIGURE 6-1: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
QD
CK
WR LAT +
TRIS Latch
I/O P a d
WR Port
Data Bus
QD
CK
Data Latch
Read LAT
Read Po rt
Read TRIS
1
0
1
0
W R TRIS
Peripheral Ou tput Data Output Enable
Peripheral In put D ata
I/O Cell
Peripheral Module
Peripheral Ou tput Enable
PIO Module
Output Multiplexers
Output Data
Inp u t Data
Peripheral Module Enable
dsPIC30F1010/202X
DS70178C-page 78 Preliminary © 2006 Microchip Technology Inc.
6.2 Configuring Analog Port Pins
The use of the ADPC FG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their correspond-
ing TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
When read ing the POR T register, all pins confi gured as
analog in put channel w ill read as cleare d (a low lev el).
Pins configured as digit al inputs will not convert an ana-
log input. Analog levels on any pin that is defined as a
digital input (including the ANx pins), may cause the
input buffer to consume current that exceeds the
device specifications.
6.2.1 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 6-1: PORT WR ITE/READ
EXAMPLE
6.3 Input Change Notification
The input change notification function of the I/O ports
allows the dsPIC30F1010/202X devices to generate
interrupt requests to the processor in response to a
change-of-state on selected input pins. This feature is
capable of detecting input change-of-states even in
Sleep mode, when the clocks are disabled. There are
8 external signals (CN0 through CN7) that can be
selected (enabled) for generating an interrupt request
on a c hange-o f-state.
There are two control registers associated with the CN
module. The CNEN1 register contain the CN interrupt
enable (CNxIE) control bits for each of the CN input
pins. Setting any of these bits enables a CN interrupt
for the corresponding pins.
Each CN pin also has a weak pull-up connected to it.
The pull-ups act as a current source that is connected
to the pin and eliminate the need for external resistors
when push button or keypad devices are connected.
The pull-ups are enabled separately using the CNPU1
register, which contain the weak pull-up enable (CNx-
PUE) bits for each of the CN pins. Setting any of the
control bits enables the weak pull-ups for the
corresp onding pi ns.
MOV 0xFF00, W0; Configure PORTB<15:8>
; as inputs
MOV W0, TRISBB; and PORTB<7:0> as outputs
NOP ; Delay 1 cycle
BTSS PORTB, #13; Next Instruction
Note: Pull-ups on change notification pins should
always be disabled whenever the port pin is
configured as a digital output.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 79
dsPIC30F1010/202X
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 6-1: dsPIC30F1010/2020 PORT REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit
12 Bit
11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0 —TRISA9 0000 0010 0000 0000
PORTA 02C2 —RA9 0000 0000 0000 0000
LATA 02C4 —LAT9 0000 0000 0000 0000
TRISB 02C6 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0000 0011 1111
PORTB 02C8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CA LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISD 02D2 —TRISD00000 0000 0000 0001
PORTD 02D4 RD0 0000 0000 0000 0000
LATD 02D6 —LATD00000 0000 0000 0000
TRISE 02D8 TRSE7 TRSE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0000 1111 1111
PORTE 02DA RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02DE TRISF8 TRISF7 TRISF6 0000 0001 1100 0000
PORTF 02E0 RF8 RF7 RF6 0000 0000 0000 0000
LATF 02E2 LATF8 LATF7 LATF6 0000 0000 0000 0000
dsPIC30F1010/202X
DS70178C-page 80 Preliminary © 2006 Microchip Technology Inc.
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 6-2: dsPIC30F2023 PORT REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit
12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0
TRISA11 TRISA10
TRIS9 TRISA8 0000 1111 0000 0000
PORTA 02C2 RA11 RA10 RA9 RA8 0000 0000 0000 0000
LATA 02C4 LATA11 LATA10 LATA9 LATA8 0000 0000 0000 0000
TRISB 02C6
TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRIS6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
0000 1111 1111 1111
PORTB 02C8 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CA LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISD 02D2 TRISD1 TRISD0 0000 0000 0000 0011
PORTD 02D4 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD1 LATD0 0000 0000 0000 0000
TRISE 02D8
TRSE7 TRSE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0
0000 0000 1111 1111
PORTE 02DA —RE7RE6
RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC —LATE7LATE6
LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02DE TRISF15 TRISF14 —TRISF8
TRISF7 TRISF6
TRISF3
TRISF2 1100 0001 1100 1100
PORTF 02E0 RF15 RF14 RF8 RF7 RF6 RF3 RF2 0000 0000 0000 0000
LATF 02E2 LATF15 LATF14 LATF8 LATF7 LATF6 LATF3 LATF2 0000 0000 0000 0000
TRISG 02E4
TRISG3
TRISG2 0000 0000 0000 1100
PORTG 02E6 RG3 RG2 0000 0000 0000 0000
LATG 02E8 LATG3 LATG2 0000 0000 0000 0000
TABLE 6-3: dsPIC30F1010/202X INPUT CHANGE NOTIFICATION REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit
12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
CNEN1 0060
CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE
0000 0000 0000 0000
CNPU1 0064
CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE
0000 0000 0000 0000
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 81
dsPIC30F1010/202X
7.0 FLASH PR OGRAM MEMORY
The dsPIC30F family of devices contains internal
program Flash memory for executing user code. There
are two methods by which the user can program this
memory:
1. In-Circuit Serial Programming™ (ICSP™)
programming capability
2. Run-Time Self-Programming (RTSP)
7.1 In-Circui t Serial Programming
(ICSP)
dsPIC30F devices can be serially programmed while i n
the end ap plica tion ci rcuit. Th is is s imply do ne wit h two
lines for Programming Clock and Programming Data
(which are named PGC and PGD respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Cl ear (MCLR ). This allows customers to manu-
facture boards with unprogrammed devices, and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.
7.2 Run-Time Self-Programming
(RTSP)
RTSP is accomplished using TBLRD (table read) and
TBLWT (table wr ite) ins tru cti ons .
With RTSP, the user may erase program memory 32
instruc tions (96 by tes ) at a tim e an d c an wr it e pro gram
memory data 32 instructions (96 bytes) at a time.
7.3 Table Instruction Operation Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits <15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
The TBLRDH and TBLWTH instruc tions are us ed to read
or write to bits <23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
A 24-bit program memory address i s formed usin g bit s
<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 7-1.
FIGURE 7-1: ADDRESSING FOR TABLE AND NVM REGISTERS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
0Program Counter
24 bi ts
NVMADRU Reg
8 bit s 16 bit s
Program
Using
TBLPAG Reg
8 bits
Wor k i ng Re g EA
16 bits
Using
Byte
24-bit EA
1/0
0
1/0
Select
Table
Instruction
NVMADR
Addressing
Counter
Using
NVMADR Reg EA
User/Configuration
Space Select
dsPIC30F1010/202X
DS70178C-page 82 Preliminary © 2006 Microchip Technology Inc.
7.4 RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instruc-
tions, or 96 bytes. Each panel consists of 128 rows, or
4K x 24 instru ctions. RTSP allows the user to erase one
row (32 instructions) at a time and to program 32
instructions at one time. RTSP may be used to program
multiple program memory panels, but the table pointer
must be changed at each panel boundary.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction0’, instruction
1’, etc. The instruction words loaded must always be
from a group of 32 boundary.
The basi c sequence for R TSP programming is to set up
a table point er, then do a se ries o f TBLWT instructions
to load th e wri te latc hes. Program ming is perfo rmed by
setting the special bits in the NVMCON register. 32
TBLWTL and four TBLWTH instructions are required to
load the 32 instructions. If multiple panel programming
is required, the table pointer needs to be changed and
the next set of multiple write latches written.
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written. A programming cycle is required for
programming each row.
The Flash Program Memory is readable, writable and
erasable during normal operation over the entire VDD
range.
7.5 Control Registers
The four SFRs used to read and write the program
Flash memory are:
•NVMCON
NVMADR
NVMADRU
NVMKEY
7.5.1 NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
the start of the programming cycle.
7.5.2 NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the effective address. The NVMADR register
captures the EA<15 :0> of the last table instru ct ion that
has been executed and selects the row to write.
7.5.3 NVMADRU REGISTER
The NVMADRU register is used to hold the upper byte
of the effective address. The NVMADRU register cap-
tures the EA<23:16> of the last table instruction that
has been exec uted.
7.5. 4 NVMKEY REGISTER
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 7.6
“Programming Operations” for further details.
Note: The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 83
dsPIC30F1010/202X
7.6 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A progra mming operati on is nominally 2 ms ec in
duration and the processor stalls (waits) until the oper-
ation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
7.6.1 PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase and program one row of program
Flash memory at a time. The general process is:
1. Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
2. Update the data image with the desired new
data.
3. Erase pr ogram Flash row.
a) Setup NVMCON register for multi-word,
program Flash, erase and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘55’ to NVMKEY.
d) Writ e ‘AA to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
4. Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
5. Program 32 instruction words into program
Flash.
a) Setup NVMCON register for multi-word,
progra m Flash, program and set WREN bit.
b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
6. Repeat step s 1 through 5 as needed to program
desired amount of program Flash memory.
7.6.2 ERASING A ROW OF PROGRAM
MEMORY
Example 7-1 show s a code seque nce that can be used
to erase a row (32 instructions) of program memory.
EXAMPL E 7-1: ER ASIN G A ROW OF PROGRAM MEMO RY
; Setup NVMCON for erase operation, multi word write
; program memory selected, and writes enabled
MOV #0x4041,W0 ;
MOV W0,NVMCON ; Init NVMCON SFR
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR),W0 ;
MOV W0,NVMADRU ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA<15:0> pointer
MOV W0, NVMADR ; Intialize NVMADR SFR
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
dsPIC30F1010/202X
DS70178C-page 84 Preliminary © 2006 Microchip Technology Inc.
7.6.3 LOADING WRITE LATCHES
Example 7-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches. 32
TBLWTL and 32 TBLWTH instructions are needed to
load the writ e latches selected by the table pointer.
EXAMPLE 7-2: LOADING WRITE LATCHES
7.6.4 INITIATING THE PROGRAMMING
SEQUENCE
For protec tion, the w rite i nitiate sequenc e for N VMKEY
must be used to allow any erase or program operation
to procee d. After the prog ramming comm and has bee n
executed, the user must wait for the programming time
until programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
EXAMPLE 7-3: INITIATING A PROGRAMMIN G SEQUENCE
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000,W0 ;
MOV W0,TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000,W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0,W2 ;
MOV #HIGH_BYTE_0,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1,W2 ;
MOV #HIGH_BYTE_1,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2,W2 ;
MOV #HIGH_BYTE_2,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 31st_program_word
MOV #LOW_WORD_31,W2 ;
MOV #HIGH_BYTE_31,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
Note: In Example 7-2, the contents of the upper byte of W3 have no effect.
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 85
dsPIC30F1010/202X
TABLE 7-1: NVM REGISTER MAP
File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit
11 Bit
10 Bit 9 Bit 8 Bit 7 Bit 6 Bi t 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All RESETS
NVMCON 0760 WR WREN WRERR —TWRI PROGOP<6:0> 0000 0000 0000 0000
NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu
NVMADRU 0764 NVMADR<23:16> 0000 0000 uuuu uuuu
NVMKEY 0766 KEY<7:0> 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F1010/202X
DS70178C-page 86 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 87
dsPIC30F1010/202X
8.0 TIMER1 MODULE
This section describes the 16-bit General Purpose
Timer1 module and associated operational modes.
Figure 8-1 depicts the simplified block diagram of the
16-bit Timer1 Module.
The f ollowin g sec tions provid e a det ail ed descripti on of
the operational modes of the timers, including setup
and control registers along with associated block
diagrams.
The T imer1 mo dule is a 16-bit timer which can serv e as
the time count er for the rea l-time clo ck, o r operate as a
free runnin g interva l timer/c ounter . The 16-bit tim er has
the following modes:
16-bit Timer
16-bit Synchronous Counter
16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
Timer gate operation
Selectable prescaler set tings
Timer operation during CPU Idle and Sleep
modes
Interrupt on 16-bit period register match or falling
edge of external gate signal
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 8-1
presents a block diagram of the 16-bit timer module.
16-bit T imer Mode: In t he 16-bi t T imer m ode, the timer
increments on every instruction cycle up to a match
value, preloaded into the period register PR1, then
resets to 0 and continues to count.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, t he timer module log ic will resum e
the incrementing sequence upon termination of the
CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match v alue preloaded in PR1,
then resets to 0 and continues.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match v alue preloaded in PR1,
then reset s to ‘0’ and continues.
When the timer is configured fo r the Asynchronous mode
of operation and the CPU goes into the Idle mode, the
timer w ill s to p incremen ti ng if TSIDL = 1.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
Note: Timer1 is a ‘Ty pe A’ timer. Please refer to
the specifications for a Type A timer in
Section 21.0 “Electrical Characteris-
tics” of this document.
dsPIC30F1010/202X
DS70178C-page 88 Preliminary © 2006 Microchip Technology Inc.
FIGURE 8-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)
8.1 Timer Gate Operation
The 16-bi t timer can be pl aced in the Ga ted Ti me Accu-
mulation mode. This mode allows the internal TCY to
increm ent the respec tive timer when the gate input si g-
nal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source se t to interna l (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
8.2 Timer Prescaler
The input clock (FOSC/2 or external clock) to the 16-bit
Timer, has a prescale option of 1:1, 1:8, 1:64, and
1:256 selected by control bits TCKPS<1:0>
(T1CON< 5:4 >). T he pres ca le r counter i s c le are d whe n
any of the following occurs:
a write to the TMR1 register
cl earing of the TON bit (T1C ON<1 5>)
device Re set su ch as POR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writin g to the TMR1 register.
8.3 T imer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
The timer module is enabled (TON = 1) and
The timer clock s ource is selected as extern al
(TCS = 1) and
The TSYNC bit (T1CON<2>) is asser ted to a logic
0’, which defines the external clock source as
asynchronous
When all three conditions are true, the timer will
continu e to co unt up to th e perio d regist er and be res et
to 0x0000.
When a ma tch betwe en the ti me r and the period regis -
ter occurs, an interrupt can be generated, if the
respective timer interrupt enable bit is asserted.
TON
Sync
PR1
T1IF
Equal Comparator x 16
TMR1
Reset
Event Flag
1
0
TSYNC
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
T1CK
TCS
1 X
0 1
TGATE
0 0
Gate
Sync
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 89
dsPIC30F1010/202X
8.4 Timer Interrupt
The 16-bit tim er ha s the ab ili ty to ge nerate an interru pt
on period match. When the timer count matches the
period reg ister , th e T1IF bit is asserted and an interrupt
will be generated, if enabled. The T1IF bit must be
cleared in software. The timer interrupt flag T1IF is
located in the IFS0 control register in the Interrupt
Controller.
When the Gated Time Accumulation mode is enabled,
an interr upt will al so be generat ed on the f alling edge of
the gate signal (at the end of the accumulation cycle).
Enabling an interrupt is accomplished via the respec-
tive timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 control register in the
Interrupt Controller.
dsPIC30F1010/202X
DS70178C-page 90 Preliminary © 2006 Microchip Technology Inc.
TABLE 8-1: TIMER1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR1 0100 Timer 1 Registe r uuuu uuuu uuuu uuuu
PR1 0102 Period Register 1 1111 1111 1111 1111
T1CON 0104 TON —TSIDL TGATE TCKPS<1:0> —TSYNCTCS 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to thedsPIC30F Family Reference Manual” (DS70046) f or descriptions of register bit fields.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 91
dsPIC30F1010/202X
9.0 TIMER2/3 MODULE
This section describes the 32-bit General Purpose
Timer module (Timer2/3) and associated operational
modes. Figure 9-1 depic ts the simpli fie d block dia gram
of the 32-bi t Ti mer2/3 module. Fig ure 9-2 and Figure 9-
3 show Timer2/3 configured as two independent 16-bit
timers: Timer2 and Timer3, respectively.
The Timer2/3 module is a 32-bit timer, which can be
configu red as two 16-bit timers , with sele ct able oper at-
ing modes. These timers are utilized by other
peripheral modules such as:
Input Capture
Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and control registers, along with asso-
ciated bl oc k dia gram s for the ope rati ona l mod es of the
timers.
The 32-bit timer has the following modes:
Two independent 16-bit timers (Timer2 and
Timer3) wit h all 16-bit op erat ing modes (except
Asynchronous Counter mode)
Single 32-bit Timer operation
Single 32-bit Synchronous Counter
Further, the following operational characteristics are
supported:
ADC Event Trigger
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period Register Match
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
For 32-bit timer/counter operation, Timer2 is the least
signifi cant word and Tim er3 is the mos t significant wo rd
of the 32-bit timer.
16-bit Mode: In the 16-bit mode, Timer2 and Timer3
can be configured as two independent 16-bit timers.
Each time r can be set up in either 16-b it T imer mod e or
16-bit Synchronous Counter mode. See Section 8.0
“Timer1 Module” for details on these two operating
modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high-freque ncy
external clock inputs.
32-bit T imer Mode: In t he 32-bi t T imer m ode, the timer
increments on every instruction cycle up to a match
value, pre loade d into the combi ned 32-bi t period regis-
ter PR3/PR2, th en rese ts to ‘ 0 and conti nues to c ount.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the least significant word (TMR2 register)
will cause the most significant word to be read and
latched into a 16-bit holding register, termed
TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 re gister, the c ontents of TMR3H LD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combi ne d 32 -bi t per i od re gi st er, PR3/PR 2 , th en re se ts
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing, unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
Note: The dsPIC30F1010 device does not fea-
ture T ime r3. T imer2 is a ‘Type B’ ti mer and
Timer3 is a ‘Type C’ timer. Please refer to
the appro pri ate tim er typ e i n Section 21.0
“Electri cal Characteristics” of this
document.
Note: For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer 2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 interrupt flag
(T3IF) and th e interrupt is en abled with the
Timer3 interrupt enable bit (T3IE).
dsPIC30F1010/202X
DS70178C-page 92 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 9-1: 32-BI T T IM E R2 /3 B LOC K DI AG R AM
TMR3 TMR2
T3IF
Equal Comparator x 32
PR3 PR2
Reset
LSB
MSB
Event Flag
Note: Timer Configuration bit T32, (T2CON<3>) must be s et to ‘1’ fo r a 32-bit timer /coun ter operation. All control
bits are respective to the T2CON register.
Data Bus<15:0>
TMR3HLD
Read TMR2
Write TMR2 16
16
16
Q
QD
CK
TGATE(T2CON<6>)
(T2CON<6>)
TGATE
0
1
TON TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY
TCS
1 X
0 1
TGATE
0 0
Gate
T2CK
Sync
ADC Event Trigger
Sync
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 93
dsPIC30F1010/202X
FIGURE 9-2: 16-BIT TIMER2 BLOCK DIAGRAM
FIGURE 9-3: 16-BIT TIMER3 BLOCK DIAGRAM
TON
Sync
PR2
T2IF
Equal Comparator x 16
TMR2
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 X
0 1
TGATE
0 0
Gate
T2CK
Sync
TON
PR3
T3IF
Equal Comparator x 16
TMR3
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS(1)
1 X
0 1
TGATE(2)
0 0
ADC Event Trigger
Sync
Note: The dsPIC30F202X does not have an external pin input to TIMER3. The following modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
dsPIC30F1010/202X
DS70178C-page 94 Preliminary © 2006 Microchip Technology Inc.
9.1 Timer Gate Operation
The 32-bi t timer can be pl aced in the Ga ted Ti me Accu-
mulation mode. This mode allows the internal TCY to
increm ent the respec tive timer when the gate input si g-
nal (T2CK pin) is asserted high. Control bit TGATE
(T2CO N<6>) mus t be set to en able this mode . When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ign ored for T imer3. The tim er must be
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count ope rati on, bu t does not res et the time r. The user
must reset the timer in order to start counting from zero.
9.2 ADC Event Trigger
When a matc h occurs betwe en the 32-bit timer (TM R3/
TMR2) and the 32-bit combined period register (PR3/
PR2), a special ADC trigger event signal is generated
by Timer3.
9.3 Timer Prescaler
The in put cloc k (FOSC/2 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
origina ting clock so urce is Timer2. The prescaler oper-
ation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
a write to the TMR2/TMR3 register
clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0
device Re set su ch as POR
However, if the timer is disabled (TON = 0), then the
Timer 2 prescaler cannot be reset, since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
9.4 T imer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
9.5 T imer Interrupt
The 32-bit timer module can generate an interrupt on
period ma tch, or on the fa lling edge of the externa l gate
signal. When the 32-bit timer count matches the
respective 32-bit period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be gener-
ated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
be cleared in sof tw are.
Enabling an interrupt is accomplished via the
respective timer interrupt enable bit, T3IE (IEC0<7>).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 95
dsPIC30F1010/202X
TABLE 9-1: TIMER2/3 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit
10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu
TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu
TMR3 010A Timer3 Regist er uuuu uuuu uuuu uuuu
PR2 010C Period Register 2 1111 1111 1111 1111
PR3 010E Period Register 3 1111 1111 1111 1111
T2CON 0110 TON —TSIDL TGATE TCKPS<1:0> T32 —TCS 0000 0000 0000 0000
T3CON 0112 TON —TSIDL TGATE TCKPS<1:0> —TCS 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F1010/202X
DS70178C-page 96 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 97
dsPIC30F1010/202X
10.0 INPUT CAPTURE MODULE
This section describes the Input Capture module and
associated operational modes. The features provided
by this module are useful in applications requiring Fre-
quency (Period) and Pulse measurement. Figure 10-1
depicts a block diagram of the Input Capture module.
Input capture is useful for such modes as:
Frequency/Period/Pulse Measurements
Additional source s of External Interrupts
The key operational features of the Input Capture
module are:
Simple Capture Event mode
Timer2 and Timer3 mode selection
Interrupt on input capture event
These operating modes are determined by setting the
appropriate bits in the ICxCON register (where x =
1,2,...,N). The dsPIC DSC devices contain up to 8
capture channels, (i.e., the maximum value of N is 8).
FIGURE 10-1: INPUT CAPTURE MODE BLOCK DIAGRAM
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
Note: The dsPIC30F1010 devices does not fea-
ture a Input Capture module. The
dsPIC30F202X devices have one capture
input – IC1. The naming of this capture
channel is intentional and preserves soft-
ware compatibility with other dsPIC DSC
devices.
ICxBUF
Prescaler
ICx
ICM<2:0>
Mode Select
3
Note: Where x’ i s sh ow n, re fere nce is m ade to t he regis ters o r bits as soc ia ted to t he respe cti ve i npu t
capture ch annels 1 through N.
10
Set Flag
Pin
ICxIF
ICTMR
T2_CNT T3_CNT
Edge
Detection
Logic
Clock
Synchronizer
1, 4, 16
From General Purpose Timer Module
16 16
FIFO
R/W
Logic
ICI<1:0>
ICBNE, ICOV
ICxCON Interrupt
Logic
Set Flag
ICxIF
Data Bus
dsPIC30F1010/202X
DS70178C-page 98 Preliminary © 2006 Microchip Technology Inc.
10.1 Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
10.1.1 CAPTURE PRESCALER
There are four input capture prescaler settings, speci-
fied by bits ICM<2:0> (ICxCON<2:0>). Whenever the
capture c hanne l is turn ed of f, the pr escal er coun ter will
be cleared. In addition, any Reset will clear the
prescaler counter.
10.1.2 CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer,
which is four 16-bit words deep. There are two status
flags, which provide status on the FIFO buffer:
ICBFNE – Input Capture Buffer Not Empty
IC OV – Input Capture Ov erfl ow
The ICBFNE will be set on the fir st input ca ptu r e event
and remain set until all capture events have been read
from the FIF O. As each word is read fro m the FIFO, th e
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an Overflow condition will occur and the
ICOV bit will be s et to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured until all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
10.1.3 TIMER2 AND TIMER3 SELECTION
MODE
The inp ut capture modu le c onsist s of up to 8 input cap-
ture chann els. Each channel can select between on e of
two timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
10.1.4 HALL SENSOR MODE
When the input capture module is set for capture on
every ed ge, risi ng and fal ling, ICM <2:0> = 001, the fol-
lowing operations are performed by the input capture
logic:
The input capture interrupt flag is set on every
edge, rising and falling.
The Interrupt on Capture mode setting bits,
ICI<1:0>, are ignored, since every capture
generates an interrupt.
A Captur e Overflow condition is not generated in
this mode.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 99
dsPIC30F1010/202X
10.2 Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input
capture module will wake-up from the CPU Sleep or
Idle mode when a capture event occurs, if ICM<2:0> =
111 and the inte rrupt enab le bit is ass erte d. The same
wake-u p can gen erate an int errupt, if the conditi ons for
processing the interrupt have been satisfied. The
wake-up feature is useful as a method of adding extra
external pin interrupts.
10.2.1 INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module opera-
tion with reduced functionality. In the CPU Sleep
mode, the ICI<1:0> bits are not applicable, and the
input capture module can only function as an external
inter rupt so urc e.
The capture module must be configured for interrupt
only on the rising edge (ICM<2:0> = 111), in order for
the input capture module to be used while the device
is in Sleep m ode. Th e pre scale s etting s of 4:1 or 16: 1
are not applicable in this mode.
10.2.2 INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Inter-
rupt mode selected by the ICI<1:0> bits are applicable,
as well as the 4:1 and 16:1 capture prescale settings,
which are defined by control bits ICM<2:0>. This mode
requires the selected timer to be enabled. Moreover, the
ICSIDL bit must be asserted to a logic ‘0’.
If the input capture module is defined as ICM<2:0> =
111 in CPU Idle mode, the input capture pin will serve
only as an external interrupt pin.
10.3 Input Capture Interrupts
The inpu t captur e channe ls have the a bility to generate
an interrupt, based upon the selected number of cap-
ture even ts. Th e s ele cti on num be r is se t by c ontrol bits
ICI<1:0> (ICxCON<6:5>).
Each chan nel provide s an interrupt flag (ICxI F) bit. The
respective capture channel interrupt flag is located in
the corresponding IFSx STATUS register.
Enabling an interrupt is accomplished via the respec-
tive capture channel interrupt enable (ICxIE) bit. The
capture interrupt enable bit is located in the
corresponding IEC Control register.
dsPIC30F1010/202X
DS70178C-page 100 Preliminary © 2006 Microchip Technology Inc.
TABLE 10-1: INPUT CAPTURE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu
IC1CON 0142 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 101
dsPIC30F1010/202X
11.0 OUTPUT COMPARE MODULE
This section describes the Output Compare module
and associated operational modes. The features pro-
vided by this module are useful in applica tions requiring
operational modes such as:
Generation of Variable Width Output Pulses
Pow er Fact or Correction
Figure 11-1 depicts a block diagram of the Output
Compare module.
The key operational features of the Output Compare
module include:
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare during Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting
the appropriate bit s in the 16-b it OCxCO N SFR (where
x = 1 and 2).
OCxRS and OCxR in the figure represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the f irst comp are and O CxRS
is used for the second compare.
FIGU RE 11-1: OUTPUT COMPARE MO DE BLOC K DIAG RAM
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
OCxR
Comparator
Output
Logic QS
R
OCM<2:0>
Output Enable
OCx
Set Fla g bit
OCxIF
OCxRS
Mode Select
3
Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 and 2.
OCTSEL 01
T2P2_MATCH
TMR2<15:0 TMR3<15:0> T3P3_MATCH
From General Pupose
01
OCFLTA
Timer Module
dsPIC30F1010/202X
DS70178C-page 102 Preliminary © 2006 Microchip Technology Inc.
11.1 T imer2 and Timer3 Selecti on Mode
Each output compare channel can select between one
of two 16-bit timers: Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3> ). T im er2 is the de fault ti mer reso urce
for the Output Compare module.
11.2 Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple Output Compare
Match modes:
Compare forces I/O pin low
Compare forces I/O pin high
Compare toggles I/O pin
The OCxR reg is ter i s us ed in th es e m ode s. Th e O C xR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, o ne of these C ompare Match modes oc curs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
11.3 Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selec ted outp ut compare channel is co nfig-
ured for one of two Dual Output Compare modes,
which are:
Single Output Pulse mode
Conti nuous Output Pulse mode
11.3.1 SINGLE PULSE MODE
For the use r to confi gure the modul e for the ge ner ation
of a single output pulse, the following steps are
required (assuming the timer is off):
Determine instruction cycle time TCY.
Calcu la te d es ired pulse w id t h v al ue based on TCY.
Calcu late ti me to s tart pulse from ti mer st a rt valu e
of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS compare registers (x denotes
channel 1, 2).
Set timer period register to value equal to, or
greater than, value in OCxRS compare register.
Set OCM<2:0> = 100.
Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
11.3.2 CONTINUOUS PULSE MODE
For the use r to confi gure the modul e for the ge neratio n
of a continuous stream of output pulses, the following
steps are required:
Determine instruction cycle time TCY.
Calculate desired pulse value based on TCY.
Calcu late timer to st art pulse width from timer sta rt
value of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2) compare
registers, respectively.
Set timer period register to value equal to, or
greater than, value in OCxRS compare register.
Set OCM<2:0> = 101.
Enable timer, TON (TxCON<15>) = 1.
11.4 Sim p le PW M Mo d e
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the se lected output co mp are chan nel is co nfig-
ured for th e PWM mode of opera tion. When co nfigured
for the PWM mode of operation, OCxR is the Ma in latch
(read-only) and OCxRS is the secondary latch. This
enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1. Set the PWM pe riod by writing to the appropriate
period register.
2. Set the PWM duty cy cle by writ ing to the OCxRS
register.
3. Configure the output compare module for PWM
operation.
4. Set the TMRx prescale value and enable the
Timer, TON (TxCON<15>) = 1.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 103
dsPIC30F1010/202X
11.4.1 PWM PERIO D
The PWM peri od is spe cified by writing to the PRx reg-
ister. The PWM period can be calculated using
Equation 11-1.
EQUATION 11-1: PWM PERIOD
PWM frequency is defined as 1/[PWM period].
When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
the next increment cycle:
TMRx is cleared.
The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
- Exception 2: If duty cy cle is greater tha n PRx,
the pin will remain high.
The PWM duty cycle is latched from OCxRS into
OCxR.
The corresponding timer interrupt flag is set.
See Figure 11-1 for key PWM period comparisons.
Timer3 is referred to in the figure for clarity.
11.4.2 PWM WITH FAULT PROTECTION
INPUT PIN
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
Fault prote ction is enab led via the OCFLTA pin. If th e a
logic ‘ 0’ is detect ed on the OCF L TA pin, the outpu t pins
are placed in a high-impedance state. The state
remains until:
the external Fault condition has been removed
and
the PWM mode is reenabled by writing to the
appropriate control bits
As a result of the Fa ult condition, the OCxIF interrupt is
asserte d, and an interrupt will be genera ted, if enabled.
Upon detection of the Fault condition, the OCFLTx bit
in the OCxCON register is asserted high. This bit is a
read-only bit and will be cleared on ce the extern al Fault
condition has been removed, and the PWM mode is
reenabled by writing the appropriate mode bits,
OCM<2:0> in the OCx C ON register.
1 1.5 Output Compare Operation During
CPU Sleep Mode
When the CPU enters the Sleep mode, all internal
clocks are stopped. Therefore, when the CPU enters
the Sleep state, the output compare channel will drive
the pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU
entered the Sleep state, the pin will remain high. Like-
wise, if the pin was low when the CPU entered the
Sleep state, the pin will remain low. In either case, the
output compare module will resume operation when
the device wakes up.
1 1.6 Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic ‘ 0’ and th e selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is
set to logic ‘0’.
PWM period = [(PRx) + 1] • 4 • TOSC
(TMRx prescale value)
dsPIC30F1010/202X
DS70178C-page 104 Preliminary © 2006 Microchip Technology Inc.
FIGURE 11-1: PWM OUTPUT TIMING
11.7 Output Compare Interrupts
The outpu t compare channels ha ve the abilit y to gener-
ate an interrupt on a compare match, for whichever
Match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserte d an d an in terru pt w ill b e ge nerated, if e na ble d.
The OCxIF bit is located in the corresponding IFS
STA TUS re gister, and must be clea red in so ftware. The
interrupt is enabled via the respective compare inter-
rupt enable (OCxIE) bit, located in the corresponding
IEC Control registe r.
For the PWM mode, when an e vent occurs, the res pec-
tive timer interrupt flag (T2IF or T3IF) is asserted and
an interrupt will be generated, if enabled. The IF bit is
located in the IFS0 STATUS register, and must be
cleared in software. The interrupt is enabled via the
respective timer interrupt enable bit (T2IE or T3IE),
located in the IEC0 Control register. The output com-
pare i nterrupt flag is ne ver set durin g the PWM mode of
operation.
Period
Duty Cycle
TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR)
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = PR3
(Interrupt Flag)
OCxR = OCxRS
T3IF = 1
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 105
dsPIC30F1010/202X
TABLE 11-1: OUTPUT COMPARE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
OC1RS 0180 Output Compare 1 Slave Register 0000 0000 0000 0000
OC1R 0182 Output Compare 1 Master Register 0000 0000 0000 0000
OC1CON 0184 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC2RS 0186 Output Compare 2 Slave Register 0000 0000 0000 0000
OC2R 0188 Output Compare 2 Master Register 0000 0000 0000 0000
OC2CON 018A —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F1010/202X
DS70178C-page 106 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 107
dsPIC30F1010/202X
12.0 POWER SUPPLY PWM
The Power Supply PWM (PS PWM) module on the
dsPIC30F1010/202X device supports a wide variety of
PWM modes and output formats. This PWM module is
ideal for power conversion applications such as:
DC/DC converters
AC/DC power supplies
Uninterruptable Power Supply (UPS)
12.1 Features Overview
The PS PWM module incorporates these features:
Four PWM generators with eight I/O
Four Independent time bases
Duty cycle resolut ion of 1.1 nsec @ 30 MI PS
Dead-time resolution of 4.2 nsec @ 30 MIPS
Phase-shift resolution of 4.2 nsec @ 30 MIPS
Frequency resolution of 8.4 nsec @ 30 MIPS
Supported PWM modes:
- Standard Edge-Aligned PWM
- Complementary PWM
- Push-Pull PWM
- Multi-Phase PWM
- Variable Phase PWM
- Fixed Off-Time PWM
- Current Reset PWM
- Current-Limit PWM
- Independent Time Base PWM
On-the-Fly chang es to:
- PWM frequency
- PWM duty cycle
- PWM phase shift
Output ove rrid e cont rol
Independent current-limit and Fault inputs
Special event comparator for scheduling other
peripheral events
Each PWM generator has comparator for
triggering ADC conversions.
Figure 12-1 conceptualizes the PWM module in a sim-
plified block diagram. Figure 12-2 illustrates how the
module hardware is partitioned for each PWM output
pair for the Complementary PWM mode. Each func-
tional unit of the PWM module is discussed in
subsequent sections.
The PWM modu le contai ns four PWM generators . The
module has eight PWM output pins: PWM1H, PWM1L,
PWM2H, PWM2L, PWM3H, PWM3L, PWM4H and
PWM4L. For complementary outputs, these eight I/O
pins are grouped into H/L pairs.
12.2 Description
The PWM module is designed for applications that
require (a) high resolution at high PWM frequencies,
(b) the ability to drive standard push-pull or half bridge
convert ers o r (c) the ability to c r ea te m ul ti -p has e PWM
outputs.
Two commo n, me diu m-p ower converter topol og ies a re
Push-Pull and Half-Bridge. These designs require the
PWM output signal to be switched between alternate
pins, as provided by the Push-Pull PWM mode.
Phase-shifted PWM describes the situation where
each PWM generator provides outputs, but the phase
relationship between the generator outputs is
specifiable and changeable.
Multi-Phase PWM is often used to improve DC-DC
convert er lo ad tran sient res pon se , an d reduce th e s iz e
of output filter capacitors and inductors. Multiple DC/
DC converters are often operated in parallel but phase
shifted in time. A single PWM output operating at 250
KHz has a period of 4 µsec. But an array of four PWM
channel s, stag gered by 1 µsec each, y ields an effectiv e
switc hing f requenc y of 1 MH z. Mu lti-pha se PWM appli-
cations typically use a fixed-phase relationship.
Variable Phase PWM is useful in Zero Voltage Transi-
tion (ZVT) po wer conv erters. Here t he PWM duty cycl e
is always 50%, and the power flow is controlled by
varying the relative phase shift between the two PWM
generators.
Note: The PLL must be enabled for the PS PWM
module to function. This is achieved by using the
FNOSC<1:0> bits in the FOSCSEL Configuration
register.
dsPIC30F1010/202X
DS70178C-page 108 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 12-1: SIM PL I FI ED CO N CE PTU AL BL OCK D I AG RA M OF P OW ER SU P PL Y P WM
MUX
Latch
Comparator
Timer
PDC2
Phase
MUX
Latch
Comparator
Timer
PDC3
Phase
MUX
Latch
Comparator
Timer
PDC4
Phase
MUX
Latch
Comparator
Timer
PDC1
PWMCONx
LEBCONx
Channel 1
Dead-time Generator
PTCON
SEVTCMP
Comparator Special Event
IOCONx
PWM enable and mode control
Channel 3
Dead-time Generator
Channel 4
Dead-time Generator
ALTDTRx, DTRx Dead-time Control
Special Event
Postscaler
SFLTX
PWM3L
PWM3H
PWM2L
PWM2H
16-bit Data Bus
PWM1L
PWM1H
FLTCONx
Pin and mode control
MDC
ADC Trigger Control
Master Duty Cycle Reg
Fault mode and pin control
Pin override control
Special event
PTPER
T imer Period
PWM GEN #1
PWM GEN #2
PWM GEN #4
PTMR
Master Time Base
Phase
PWM GEN #3
Channel 2
Dead-time Generator
PWM4L
PWM4H
PWM User, Current Limit and Fault Override and Routing Logic
Fault CLMT Override Logic
Trigger
comparison value
IFLTX
Fault Control
Logic
TRGCONx
Control for blanking external input signals
External T ime Base
Synchronization SYNCO
SYNCI
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 109
dsPIC30F1010/202X
FIGURE 12-2: PARTITIONED OUTPUT PAIR, COMPLEMENTARY PWM MODE
12.3 Control Registers
The following registers control the operation of the
Power Supply PWM Module.
PTCON: P WM Time Base Control Register
PTPER: Primary Time Base Register
SEVTCMP: PWM Special Event Compare Regis-
ter
MDC: PWM Master Duty Cycle Register
PWMCONx: PWM Control Register
PDCx: PWM Generator Duty Cycle Register
PHASEx: PWM Phase-Shift Register
(PWM Period Register when module is
configured for individual period mode)
DTRx: PWM Dead-Time Register
ALTDTRx: PWM Alternate Dead-Time Register
TRGCONx: PWM TRIGGER Control Register
IOCONx: PWM I/O Control Register
FCLCONx: PWM Fault Current-Limit Control
Register
TRIGx: PWM Trigger Compare Value Register
LEBCONx: Leading Edge Blanking Control Register
PWM Duty Cycle Register
Duty Cycle Comparator
Fault Overri de Values
Channel override values
Fault Pin Assignment Logic
Fault Pin
PWMXH
PWMXL
TMR < PDC PWM
Override
Logic
Dead
Time
Logic
Fault Active
Phase Offset
M
U
X
M
U
X
Timer/Counter
dsPIC30F1010/202X
DS70178C-page 110 Preliminary © 2006 Microchip Technology Inc.
REGISTER 12-1: PTCON: PWM TIME BASE CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN PTSIDL SESTAT SEIEN EIPU SYNCPOL SYNCOEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SYNCEN SYNCSRC<2:0> SEVTPS<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PTEN: PWM Module Enable bit
1 = PWM module is enabled
0 = PWM module is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 PTSIDL: PWM Time Base Stop in Idle Mode bit
1 = PWM time base halts in CPU Idle mode
0 = PWM time base runs in CPU Idle mode
bit 12 SESTAT: Special Event Interrupt Status bit
1 = Special Event Interrupt is pending
0 = Special Event Interrupt is not pending
bit 11 SEIEN: Special Event Interrupt Enable bit
1 = Special Event Interrupt is enabled
0 = Special Event Interrupt is disabled
bit 10 EIPU: Enable Immediate Period Updates bit
1 = Active Period register is updated immediately
0 = Act ive P eriod register updat es occur on P WM cycle boundaries
bit 9 SYNCPOL: Synchronize Input Polarity bit
1 = SYNCIN polarity is inverted (low active)
0 = SYNCIN is high active
bit 8 SYNCOEN: Primary Time Base Sync Enable bit
1 = SYNCO output is enabled
0 = SYNCO output is disabled
bit 7 SYNCEN: External Time Base Synchronization Enable bit
1 = External synchronization of primary time base is enabled
0 = External synchronization of primary time base is disabled
bit 6-4 SYNCSRC<2:0>: Sync Source Selection bits
000 = SYNCI
001 = Reserved
.
.
111 = Reserved
bit 3-0 SEVTPS<3:0>: PWM Special Event Trigger Output Postscale Select bits
0000 = 1:1 Postscale
0001 = 1:2 Postscale
| |
| |
1111 = 1:16 Postscale
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 111
dsPIC30F1010/202X
REGISTER 12-2: PTPER: PRIMARY TIME BASE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PTPER <15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
PTPER <7:3>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Primary Time Base (PTMR) Period Value bits
bit 2-0 Unimplemented: Read as ‘0
REGISTER 12-3: SEVT CM P: PWM SPECIAL EVENT COMPARE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SEVTCMP <15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
SEVTCMP <7:3>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Special Event Compare Count Value bits
bit 2-0 Unimplemented: Read as ‘0
dsPIC30F1010/202X
DS70178C-page 112 Preliminary © 2006 Microchip Technology Inc.
REGISTER 12-4: MDC: PWM MASTER DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 Master PWM Duty Cycle Value bits(1)
Note 1: The minimum value for this register is 0x0008 and the maximum value is 0xFFEF.
REGISTER 12-5: PWMCONx: PWM CONTROL REGISTER
HS/HC-0 HS/HC-0 HS/HC-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS
bit 15 bit 8
R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
DTC<1:0> XPRES IUE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FLTSTAT: Fault Interrupt Status
1 = Fault Interrupt is pending
0 = No Fault Interrupt is pending
This bit is cleared by setting FLTIEN = 0.
Note: Software must clear the interrupt status here, and the corresponding IFS bit in Interrupt
Controller.
bit 14 CLSTAT: Current-Limit Interrupt Status bit
1 = Current-limit interrupt is pending
0 = No current-limit interrupt is pending
This bit is cleared by setting CLIEN = 0.
Note: Software must clear the interrupt status here, and the corresponding IFS bit in Interrupt
Controller.
bit 13 TRGSTAT: Trigger Interrupt Status bit
1 = Trigger interrupt is pending
0 = No trigger interrupt is pending
This bit is cleared by setting TRGIEN = 0.
bit 12 FLTIEN: Fault Interrupt Enable bit
1 = Fault interrupt enabled
0 = Fault interrupt disabled and FLTSTAT bit is cleared
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 113
dsPIC30F1010/202X
bit 11 CLIEN: Current-Limit Interrupt Enable bit
1 = Current-limit interrupt enabled
0 = Current-limit interrupt disabled and CLSTAT bit is cleared
bit 10 TRGIEN: Trigger Interrupt Enable bit
1 = A trig ger event generates an interru pt reque s t
0 = Trigger event interrupts are disabled and TRGSTAT bit is cleared
bit 9 ITB: Independent Time Base Mode bit
1 = Phasex register provides time base period for this PWM generator
0 = Primary time base provides timing for this PWM generator
bit 8 MDCS: Master Duty Cycle Register Select bit
1 = MDC register provides duty cycle information for this PWM generator
0 = DCx register provides duty cycle information for this PWM generator
bit 7-6 DTC<1:0>: Dead-time Control bits
00 = Positive dead time actively applied for all output modes
01 = Negative dead time actively applied for all output modes
10 = Dead-time function is disabled
11 = Reserved
bit 5-2 Unimplemented: Read as ‘0
bit 1 XPRES: External PWM Reset Control bit
1 = Current-limit source resets time base for this PWM generator if it is in independent time base
mode
0 = External pins do not affect PWM time base
bit 0 IUE: Immediate Update Enable bit
1 = Updates to the active PDC registers are immediate
0 = Updates to the active PDC registers are synchronized to the PWM time base
REGISTER 12-5: PWMCONx: PWM CONTROL REGISTER (CONTINUED)
REGISTER 12-6: PDCx: PWM GENERATOR DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PWM Generator #x Duty Cycle Value bits(1)
Note 1: The minimum value for this register is 0x0008 and the maximum value is 0xFFEF.
dsPIC30F1010/202X
DS70178C-page 114 Preliminary © 2006 Microchip Technology Inc.
REGISTER 12-7: PHASEx: PWM PHASE-SHIFT REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASEx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
PHASEx<7:2>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 PHASEx<15:2>: PWM Phase-Shift Value or Independent T ime Base Period for this PWM Generator bits
Note: If used as an independent time base, bits <3:2> are not used.
bit 1-0 Unimplemented: Read as ‘0
REGISTER 12-8: DTRx: PWM DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—DTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
DTRx<7:2>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-2 DTRx<13:2>: Unsigned 12-bit Dead-Time Value bits for PWMx Dead-Time Unit bits
bit 1-0 Unimplemented: Read as ‘0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 115
dsPIC30F1010/202X
REGISTER 12-9: ALTDTRx: PWM ALTERNATE DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALTDTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
ALTDTR <7:2>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-2 ALTDTRx<13:2>: Unsigned 12-bit Dead-Time Value bits for PWMx Dead-Time Unit
bits
bit 1-0 Unimplemented: Read as ‘0
REGISTER 12-10: TRGCONx: PWM TRIGGER CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TRGDIV<2:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—TRGSTRT<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 TRGDIV<2:0>: Trigger Output Divider bits
000 = Trigger output for every trigger event
001 = Trigger output for every 2nd trigger event
010 = Trigger output for every 3rd trigger event
011 = Trigger output for every 4th trigger event
100 = Trigger output for every 5th trigger event
101 = Trigger output for every 6th trigger event
110 = Trigger output for every 7th trigger event
111 = Trigger output for every 8th trigger event
bit 12-6 Unimplemented: Read as ‘0
bit 5-0 TRGSTRT<5:0>: Trigger Postscaler Start Enable Select bits
This value specifies the ROLL counter value needed for a match that will then enable the trigger
pos tscaler logic to begin counting trig ger events.
dsPIC30F1010/202X
DS70178C-page 116 Preliminary © 2006 Microchip Technology Inc.
REGISTER 12-11: IOCONx: PWM I/O CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> OSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PENH: PWMH Output Pin Ownership bit
1 = PWM module controls PWMxH pin
0 = GPIO module controls PWMxH pin
bit 14 PENL: PWML Output Pin Ownership bit
1 = PWM module controls PWMxL pin
0 = GPIO module controls PWMxL pin
bit 13 POLH: PWMH Output Pin Polarity bit
1 = PWMxH pin is low active
0 = PWMxH pin is high active
bit 12 POLL: PWML Output Pin Polarity bit
1 = PWMxL pin is low active
0 = PWMxL pin is high active
bit 11-10 PMOD<1:0>: PWM #x I/O Pin Mode bits
00 = PWM I/ O pin pair is in the Complementary Output mode
01 = PWM I/O pin pair is in the Independent Output mode
10 = PWM I/O pin pair is in the Push-Pull Output mode
11 = Reserved
bit 9 OVRENH: Override Enable for PWMxH Pin bit
1 = OVRDAT<1> provides data for output on PWMxH pin
0 = PWM generator provides data for PWMxH pin
bit 8 OVRENL: Overri de En able for PW MxL Pin bit
1 = OVRDAT<0> provides data for output on PWMxL pin
0 = PWM generator provides data for PWMxL pin
bit 7-6 OVRDAT<1:0>: Data for PWMxH,L Pins if Override is Enabled bits
If OVERENH = 1 then OVR DAT<1> provides data for PWMx H
If OVERENL = 1 then OVRDAT<0> provides data for PWMxL
bit 5-4 FLTDAT<1:0>: Data for PWMxH,L Pins if FLTM ODE is Enabled bits
If Fault active, then FLTDAT<1> provides data for PWMxH
If Fault active, then FLTDAT<0> provides data for PWMxL
bit 3-2 CLDAT<1:0>: Data for PWMxH,L Pins if CLMODE is Enabled bits
If current limit active, then CLDAT<1> provides data for PWMxH
If current limit active, then CLDAT<0> provides data for PWMxL
bit 1 Unimplemented: Read as ‘0
bit 0 OSYNC: Output Override Synchronization bit
1 = Output overrides via the OVRDAT<1:0> bits are synchronized to the PWM time base
0 = Output overrides via the OVDDAT<1:0> bits occur on next clock boundary
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 117
dsPIC30F1010/202X
REGISTER 12-12: FCLCONx: PWM FAULT CURRENT-LIMIT CONTROL REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CLSRC<3:0> CLPOL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CLMODE FLTSRC<3:0> FLTPOL FLTMOD<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0
bit 12-9 CLSRC<3:0>: Current-Limit Control Signal Source Select for PWM #X Generator bits
0000 = Analog Comparator #1
0001 = Analog Comparator #2
0010 = Analog Comparator #3
0011 = Analog Comparator #4
0100 = Reserved
0101 = Reserved
0110 = Reserved
0111 = Reserved
1000 = Shared Fault #1 (SFLT1)
1001 = Shared Fault #2 (SFLT2)
1020 = Shared Fault #3 (SFLT3)
1011 = Shared Fault #4 (SFLT4)
1100 = Reserved
1101 = Independent Fault #2 (IFLT2)
1110 = Reserved
1111 = Independent Fault #4 (IFLT4)
bit 8 CLPOL: Current-Limit Polarity for PWM Generator #X bit
1 = The selected current-limit source is low active
0 = The selected current-limit source is high active
bit 7 CLMODE: Current-Limit Mode Enable for PWM Generator #X bit
1 = Current-limit function is enabled
0 = Current-limit function is disabled
dsPIC30F1010/202X
DS70178C-page 118 Preliminary © 2006 Microchip Technology Inc.
bit 6-3 FLTSRC<3:0>: Fault Control Signal Source Select for PWM Generator #X bits
0000 = Analog Comparator #1
0001 = Analog Comparator #2
0010 = Analog Comparator #3
0011 = Analog Comparator #4
0100 = Reserved
0101 = Reserved
0110 = Reserved
0111 = Reserved
1000 = Shared Fault #1 (SFLT1)
1001 = Shared Fault #2 (SFLT2)
1020 = Shared Fault #3 (SFLT3)
1011 = Shared Fault #4 (SFLT4)
1100 = Reserved
1101 = Independent Fault #2 (IFLT2)
1110 = Reserved
1111 = Independent Fault #4 (IFLT4)
bit 2 FLTPOL: Fault Polarity for PWM Generator #X bit
1 = The selected Fault source is low active
0 = The selected Fault source is high active
bit 1-0 FLTMOD<1:0>: Fault Mo de for PWM Ge nerator #x bits
00 = The selected Fault source forces PWMxH, PWMxL pins to FLTDAT values (latched condition)
01 = The selected Fault source forces PWMxH, PWMxL pins to FLTDAT values (cycle)
10 = Reserved
11 = Fault input is disabled
REGISTER 12-12: FCLCONx: PWM FAULT CURRENT-LIMIT CONTROL REGISTER (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 119
dsPIC30F1010/202X
REGISTER 12-13: TRIGx: PWM TRIGGER COMPARE VALUE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TRGCMP<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
TRGCMP<7:3>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 TRGCMP<15:3>: Trigger Contro l Value bits(1)
Registe r co nt ai ns the com p a re v alu e for PWMx tim e b as e for g ene rati ng a trigger to th e ADC mod ule
for initiating a sample and conversion process, or generating a trigger interrupt.
bit 2-0 Unimplemented: Read as ‘0
Note 1: The minimum usable value for this register is 0x0008
A value of 0x0000 does not produce a trigger.
If the TRIG x v al ue i s b ein g c alc ul ated base d on duty c yc le va lue , y ou mus t e nsu re th at a mi nimum TRIGx
value is written into the register at all times.
dsPIC30F1010/202X
DS70178C-page 120 Preliminary © 2006 Microchip Technology Inc.
REGISTER 12-14: LEBCONx: LEADING EDGE BLANKING CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<9:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
LEB<7:3>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PHR: PWMH Rising Edge Trigger Enable bit
1 = Rising edge of PWMH will trigger LEB counter
0 = LEB ignores rising edge of PWMH
bit 14 PHL: PWMH Falling Edge Trigger Enable bit
1 = Falling edg e of PWMH will trig ger LE B counter
0 = LEB ignores falling edge of PWMH
bit 13 PLR: PWML Risi ng Edge Trigger Enable bit
1 = Rising edge of PWML will trigger LEB counter
0 = LEB ignores rising edge of PWML
bit 12 PLF: PWML Falling Edge Trigger Enable bit
1 = Falling edge of PWML will trigger LEB counter
0 = LEB ignores falling edge of PWML
bit 11 FLTLEBEN: Fault Input Leading Edge Blanking Enable bit
1 = Leading Edge Blanking is applied to selected Fault Input
0 = Leading Edge Blanking is not applied to selected Fault Input
bit 10 CLLEBEN: Current-Limit Leading Edge Blanking Enable bit
1 = Leading Edge Blanking is applied to selected Current-Limit Input
0 = Leading Edge Bl ankin g is no t appl ied to selec ted Curre nt-Lim it Input
bit 9-3 LEB: Leading Edge Blanking for Current-Limit and Fault Inputs bits
Value is 8 nsec increments
bit 2-0 Unimplemented: Read as ‘0
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 121
dsPIC30F1010/202X
12.4 Module Functionality
The PS PWM module is a very high-speed design that
provides capabilities not found in other PWM genera-
tors. The module supports these PWM modes:
Standard Edge-Aligned PWM mode
Complementary PWM mode
Push-Pull PWM mode
Multi-Phase PWM mode
Variable Phase PWM mode
Current-L im it PWM mode
Constant Off-time PWM mode
Current Reset PWM mode
Independent Time Base PWM mode
12.4.1 STANDARD EDGE-ALIGNED PWM
MODE
S tandard Edge-Aligned mode (Fi gure 12-3) is the basic
PWM mode used by many power converter topologies
such as “Buck”, “Boost” and “Forward”. To create the
edge-aligned PWM, a timer/counter circuit counts
upward from zero to a sp ecified m aximum v alue for the
Period. Another register contains the value for Duty
Cycle, which is constantly compared to the timer
(Period) value. While the timer/counter value is less
than or equal to the duty cycle value, the PWM output
signal is asserted. When the timer value exceeds the
duty cycle value, the PWM signal is deasserted. When
the timer is greater than the period value, the timer is
reset, and the process repeats.
FIGURE 12-3: EDGE-ALIGNED PWM
12.4.2 COMPLEMENTARY PWM MODE
Complem entary PWM is generat ed in a manner s imilar
to st andard Edge-Aligned PWM. Complementary mode
provides a second PWM output signal on the PWML
pin that is the complement of the primary PWM signal
(PWMH). Complementary mode PWM is shown in
Figure 12-4.
FIGURE 12-4: COMPLEMENT ARY PWM
12.4.3 PUSH-PULL PWM MODE
The Push-Pull mode sho wn in Figur e 12-5 is a vers ion
of the standard Edge-Aligned PWM mode where the
active PWM signal is alternately outputted on one of
two PWM pins. There is no complementary PWM out-
put avai lable. This mode is u seful in tra nsformer-ba sed
power converters. Transformer-based circuits must
avoid any direct currents that will cause their cores to
saturate. The Push-Pull mode ensures that the duty
cycle of the two phases is identical, thus yielding a net
DC bias of zero.
FIGURE 12-5: PUSH-PULL PWM
Period
Duty Cycle
0
Period
Timer
Value
Timer Resets
PWMH
Value
Duty Cycle Match
Period
Duty Cycle
0
Period
Timer
Value
Timer Rese ts
PWMH
Value
PWML (P eriod)-( Dut y Cycle)
Duty Cycle Match
Period
Duty Cycle
0
Period
Timer
Value
Timer Resets
PWMH
Value
PWML Duty Cycle
Duty Cycle Match
dsPIC30F1010/202X
DS70178C-page 122 Preliminary © 2006 Microchip Technology Inc.
12.4.4 MULTI-PHASE PWM MODE
Multi-Phase PWM, as shown in Figure 12-6, uses
phase-shift values in the Phase registers to shift the
PWM outputs relative to the primary time base.
Because the phase-shift values are added to the pri-
mary time base, the phase-shifted outputs occur earlier
than a PWM cha nnel that s pec if ies ze ro phase sh ift . In
Multi-Ph ase mod e, the spec ifi ed ph as e shi ft is fi xed by
the application’s design.
FIGURE 12-6: MULTI-PHASE PWM
12.4.5 VARIABLE PHASE PWM MODE
Figure 12-7 shows the waveforms for Variable Phase-
Shift PWM . Power-converte r circuits const antly chang e
the phase shift among PWM channels as a means to
control the flow of power, in contrast to most PWM cir-
cuit s that vary the duty cy c le o f PWM s ign al s to contro l
power flow. Often, in variable phase applications, the
PWM duty cycle is maintained at 50%. The phase-shift
value should be updated when the PWM signal is not
asserte d. Complement ary output s are availabl e in V ari-
able Phase-Shift mod e.
FIGURE 12-7: VARIABLE PHASE PWM
12.4.6 CURRENT-LIMIT PWM MODE
Figure 12-8 shows Cycle-by-Cycle Current-Limit
mode. This mode truncates the asserted PWM signal
when the selected external Fault signal is asserted.
The PWM output values are specified by the Fault
override bits (FLTDAT<1:0>) in the IOCONx register.
The override output remains in effect until the begin-
ning of the next PWM cycle. This mode is sometimes
used in Power Factor Correction (PFC) circuits where
the inductor current controls the PWM on time. This is
a constant frequency PWM mode.
FIGURE 12-8: CYCLE-BY-CYCLE
CURRENT-LIMIT PWM
MODE
Duty Cycle
PWM2H
Duty Cycle
PWM4H
Duty Cycle
PWM3H
Duty Cycle
PWM1H
Period
Phase4
Phase2
Phase3
PTMR=0
Duty CyclePWM1H
Period
Duty Cycle
Duty Cycle
Phase2 (old value)
Duty Cycle
PWM2H
Phase2 (new value)
Duty Cycle
0
Period
Timer
Value
PWMH
Value
FLTx Negates PWM
Duty Cycle
Programmed
Duty
Cycle
Programmed
Duty Cycle
PWMH Duty Cycle
Actual Actual
FLTx Negates PWM
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 123
dsPIC30F1010/202X
12.4.7 CONSTANT OFF-TIME PWM
Constant Off-Time mode is shown in Figure 12-9.
Constant Off-Time PWM is a variable-frequency mode
where the actual PWM period is less than or equal to
the specified period value. The PWM time base is
externally reset some time after the PWM signal duty
cycle value has been reached, and the PWM signal ha s
been deasserted. This mode is implemented by
enabling the On-Time PWM mode (Current Reset
mode) and using the complementary output.
FIGURE 12-9: CONSTANT OFF-TIM E
PWM
12.4.8 CURRENT RESET PWM MODE
Current Reset PWM is shown in Figure 12-10. Current
Reset PWM uses a Variable-Frequency mode where
the actual PWM period is less tha n or equal to the spec-
ified period value. The PWM time base is externally
reset some time after the PWM signal duty cycle value
has bee n reached and t he PWM si gnal h as been d eas-
serted. Current Reset PWM is a constant on-time PWM
mode.
FIGURE 12-10: CURRENT RESET PWM
Typically, in the converter application, an energy stor-
age inductor is charged with current while the PWM
signal is asserted, and the inductor current is dis-
charged by the load when the PWM signal is deas-
serted. In this application of current reset PWM, an
external c urre nt me asu r ement circ uit de term in es whe n
the induc tor is discha rged, and then generates a si gnal
that the PWM module uses to reset the time base
counter. In Curren t Reset mode, com pl em en t ary
outputs are available.
12.4.9 INDEPENDENT TIME BASE PWM
Independent Time Base PWM, as shown in
Figure 12-11, is often used when the dsPIC DSC is
controlling different power converter subcircuits such
as the Power Factor Correction circuit, which may use
100 kHz PWM, and the full-bridge forward converter
section may use 250 kHz PWM.
FIGURE 12-11: INDEPENDENT TIME
BASE PWM
Duty Cycle
0
Period
Timer
Value
Programmed Period
PWML
Value
External Timer Reset
Duty Cycle
Actual Period
External Timer Reset
Note: Duty Cycle represents off time
Duty Cycle
0
Period
Timer
Value
Programmed Per iod
PWMH
Value
External Timer Reset
Duty Cycle
Actual Period
External Timer Rese
t
Programmed Period
Duty Cycle
PWM2H
Duty Cycle
PWM4H
Duty Cycle
PWM3H
Duty Cycle
PWM1H
Period 4
Period 2
Period 3
Period 1
Note: With independent time bases,
PWM signals are no longer
phase related to each other.
dsPIC30F1010/202X
DS70178C-page 124 Preliminary © 2006 Microchip Technology Inc.
12.5 Primary PWM Time Base
There is a Primary Time Base (PTMR) counter for the
enti re P WM mo du le , In ad d it i on , ea ch P WM ge ne rat o r
has an individual time base counter.
The PTMR determines when the individual time base
counters are to update their duty cycle and phase-shift
registers. The master time base is also responsible for
generati ng the Specia l Even t Triggers a nd tim er-based
interrupts. Figure 12-12 shows a block diagram of the
primary time base logic.
FIGURE 12-12: PTMR BLOCK DIAGRAM
The primary time base may be reset by an external
signal specified via the SYNCSRC<2:0> bits in the
PTCON register. The external reset feature is enabled
via the SYNCEN bit in the PTCON register. The pri-
mary time base reset feature supports synchronization
of the primary time base with another SMPS dsPIC
DSC device or other circuitry in the user ’s application.
The primary time base logic also provides an output
signal w hen a per iod matc h o cc urs tha t c an be us ed to
synchronize an external device such as another
SMPS dsPIC DSC.
12.5.1 PTMR SYNCHRONIZATION
Because absolute synchronization is not possible, the
user should program the time base period of the sec-
ondary (slave) device to be slightly larger than the pri-
mary device time base to ensure that the two time
bases will reset at the same time.
12.6 Primary PWM Time Base Roll
Counter
The primary time base has an additional 6-bit counter
that counts the period matches of the primary time
base. This ROLL counter enables the PWM genera-
tors to stagger their trigger events in time to the ADC
module. This counter is not accessible for reading.
Each PWM generator has six bi ts (TRG STRT<5:0>) in
the TRGCONx registers. These bits are used to spec-
ify the start enable for each TRIGx postscaler con-
trolled by the TRGDIV<2:0> bits in the TRGCONx
registers.
The TRGDIV bits specify how frequently a trigger
pulse is generated, and the ROLL bits specify when
the sequence begins. Once the TRIG postscaler is
enabled, the ROLL bits and the TRGSTRT bits have
no further effect until the PWM module is disabled and
then reenabl ed.
The purpose of the ROLL counter and the TRGSTRT
bits is to all ow th e use r to s pre ad the s ys tem wo rk load
over a series of PWM cycles.
An additional use of the ROLL counter is to allow the
internal FRC oscillator to be varied on a PWM cycle
basis to reduce peak EMI emissions generated by
switching transistors in the power conversion
application.
The ROLL counter is cleared when the PWM module
is disabl ed (P TEN = 0), and the TRIGx posts ca ler s a r e
disabled, requiring a new ROLL versus TRGSTRT
match to begin counting again.
12.7 Individual PWM Time Base(s)
Each PWM generator also has its own PWM time
base. Figure 12-13 shows a block diagram for the indi-
vidual time base circuits. With a time base per PWM
generator, the PWM module can generate PWM out-
puts that are phase shifted relative to each other, or
totally independent of each other. The individual PWM
timers (TMRx) provide the time base values that are
compared to the duty cycle registers to create the
PWM signals. The user may initialize these individual
time base counters before or during operation via the
phase-shift registers. The primary (PTMR) and the
individual timers (TMRx) are not user readable.
PTMR
PERIOD
Equality Comparator
Clk
>
Reset
13
13
PR_MATCH
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 125
dsPIC30F1010/202X
FIGURE 12-13: TMRx BLOCK DIAGRAM
Normally, the Primary Time Base (PTMR) provides
synchronization control to the individual timer/counters
so they count in lock-step unison.
If the PWM phase-shi ft fea ture is us ed , t hen the PTMR
provides the synchronization signal to each individual
timer/counter that causes them to reinitialize with their
individual phase-shift values.
If a PWM generator is operating in Independent Time
Base mode, the individual timer/counters count
upward until their count values match the value stored
in their phase registers, then they reset and the cycle
repeats.
The primary time base and the individual time bases
are implemented as 13-bit counters. The timers/
counters are clocked at 120 MHz @ 30 MIPS, which
provides a frequency resolution of 8.4 nsec.
All of the timer/counters are enabled/disabled by set-
ting/clearing the PTEN bit in the PTCON SFR. The
timers are cleared when the PTEN bit is cleared in
software.
The PTPER register sets the counting period for
PTMR. The user must write a 13-bit value to
PTPER<15:3>. When the value in PTMR<15:3>
matches the value in PTPER<15:3>, the primary time
base is reset to ‘0’, and the individual time base
counters are reinitialized to their phase values (except
if in Independent Time Base mode).
12.8 PWM Period
PTPER holds the 13-bit value that specifies the count-
ing period for the primary PWM time base. The timer
period can be updated at any time by the user. The
PWM period can be determined from the following
formula:
Period Duration = (PTPER + 1)/120 MHz @ 30 MIPS
12.9 PWM Frequency and Duty Cycle
Resolution
The PWM Duty cycle resolution is 1.05 nsec per LSB
@ 30 MIPS. Th e PWM pe rio d res ol uti on i s 8. 4 n sec @
30 MIPS. Table 12-1 shows the duty cycle resolution
versus PWM frequencies for 30 MIPS execution speed.
TABLE 12-1: AVAILABLE PWM
FREQUENCIES AND
RESOLUTIONS @ 30 MIPS
TABLE 12-2: AVAILABLE PWM
FREQUENCIES AND
RESOLUTIONS @ 20 MIPS
Notice the reduction in available resolution for a given
PWM frequency is due to the reduced clock rate and
the fact that the LSB of duty cy cl e res olu tio n is deri ve d
from a fixed-delay element. At operating frequencies
below 30 MIPS, the contribution of the fixed-delay
element to the output resolution becomes less than
1 LSB.
For frequency resonant mode power conversion appli-
cations, it is desirable to know the available PWM fre-
quency resolution. The available frequency resolution
varies with the PWM frequency. The PWM time base
clock s at 120 MHz @ 30 MIPS . The follow i ng e qua tio n
provides the frequency resolution versus PWM period:
Frequency Resolution = 120 MHz/(Period)
where Period = PTPER<15:3>
TMRx
PTPER
Comparator
Clk
>
Reset
13
13
MUX
PHASEx
ITBx
01
15 3 15 3
15 3
MIPS PWM Duty
Cycle
Resolution PWM Frequency
30 16 bits 14.6 KHz
30 15 bits 29.3 KHz
30 14 bits 58.6 KHz
30 13 bits 117.2 KHz
30 12 bits 234.4 KHz
30 11 bits 468.9 KHz
30 10 bits 937.9 KHz
30 9 bits 1.87 MHz
30 8 bits 3.75 MHz
MIPS PWM Duty
Cycle
Resolution PWM Frequency
20 14 bits 39 KHz
20 12 bits 156 KHz
20 10 bits 624 KHz
20 8 bits 2.5 MHz
dsPIC30F1010/202X
DS70178C-page 126 Preliminary © 2006 Microchip Technology Inc.
12.10 PWM Duty Cycle Comparison
Units
The PWM module has two to four PWM duty cycle
generators. Three to five 16-bit special function regis-
ters are used to specify duty cycle values for the PWM
module:
MDC (Master Duty Cycle)
PDC1, ..., PDC4 (Duty Cycle)
Each PWM generator has its own duty cycle register
(PDCx), and there is a Master Duty Cycle (MDC) reg-
ister. The MDC register can be used instead of individ-
ual duty cycle registers. The MDC register enables
multiple PWM generators to share a common duty
cycle register to reduce the CPU overhead required in
updating multiple duty cycle registers. Multi-phase
power converters are an application where the use of
the MDC feature saves valuable processor time.
The value in each duty cycle register determines the
amount of time that the PWM output is in the active
state. The PWM time base counters are 13 bits wide
and increment twice per instruction cycle. The PWM
output is asserted when the timer/counter is less than
or equal to the Most Significant 13 bits of the duty
cycle register value. Each of the duty cycle registers
allows a 16-bit duty cycle to be specified. The Least
Significant 3 bits of the duty cycle registers are sent to
additional logic for further adjustment of the PWM
signal edge.
Figure 12-14 i s a block diagram of a duty cycle
comparison unit.
FIGURE 12-14: DUTY CYCLE
COMPARISON
The duty c ycle v alues can be updated at an y time. The
updat ed dut y cycle values option ally c an be hel d until
the next rollover of the primary time base before
becoming active.
12.11 Complementary PWM Outputs
Complementary PWM Output mode provides true and
inverted PWM output s on the pa ir of PWM output pins.
The com plem ent PWM signal is ge nerated by in vertin g
the active PWM signal. Complementary outputs are
normally available with all of the different PWM modes
except Push-Pull PWM and Independent PWM Output
modes.
12.12 Independent PWM Outputs
Independent PWM Output mode simply replicates the
active PWM output signal on both output pins
associated with a PWM generator.
12.13 Duty Cycle Limits
The duty cycle generators are limited to the range of
allowable values. A value of 0x0008 is the minimum
duty cyc le value that will produc e an output pulse. Thi s
value represents 8.4 nsec at 30 MIPS. This minimum
range limitation is not a problem in a real world appli-
cation because of the slew-rate limitation of the PWM
output buffers, external FET drivers, and the power
transis tors . Th e a ppl ic ati on co ntrol loop req uire s larg er
duty cycle values to achieve minimum transistor on
times.
The maximum duty cycle value is also limited to
0xFFEF.
The user is responsible for limiting the duty cycle
values to the allowable range of 0x0008 to 0xFFEF.
PDCx Register
TMRx
Compare Logic PWMx signal
0
15
15
MUX
MDC Register
MDCx select
01
Clk
15
0
0
<=
Note: A duty c ycle of 0x0000 w ill p roduce a zero
PWM output, and a 0xFFFF duty cycle
value will produce a high on the PWM
output.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 127
dsPIC30F1010/202X
12.14 Dead-Time Generation
Dead time refers to a programmable period of time,
specif ied by the Dead-T ime Reg ister (DTR) or th e ALT-
DTR register, which prevent a PWM output from being
asserted until its complementary PWM signal has been
deasserted for the s pecifie d time. Fi gure 12-15 shows
the insertion of dead time in a complementary pair of
PWM outputs. Figure 12-16 shows the four dead-time
units that each have their own dead-time value.
Dead-ti me genera tion can b e provide d when any of the
PWM I/O pin pairs are operating in any output mode.
Many power-converter circuits require dead time
because the power transistors cannot switch instanta-
neously. To prevent current “shoot-through” some
amount of time must be provided between the turn-off
event o f on e PWM o utpu t in a c om pl em entary pair and
the turn-on event of the other transistor.
The PWM m odule can also provide negative dead t ime.
Negati ve dea d tim e i s th e for ced ov erla p of the PWMH
and PWML signals. There are certain converter tech-
niques that require a limited amount of
current “shoot-through”.
The dead-time feature can be disabled for each PWM
generator. The dead-time functionality is controlled by
the DTC<1:0> bit s in the PWM CON regis te r.
FIGURE 12-15 : DEAD- TIME INSERTIO N
FOR COMPLEMENTARY
PWM
FIGURE 12-16: DEAD-TIME CONTROL
UNITS BLOCK DIAGRAM
12.14.1 DEAD-TIME GENERATORS
Each complementary output pair for the PWM module
has 12-bit down counters to produce the dead-time
insertion. Each dead-time unit has a rising and falling
edge detector connected to the duty cycle comparison
output.
Depend in g o n w h eth er t he edg e is ris in g o r fa lli ng, one
of the transitions on the complementary outputs is
delayed until the associated timer counts down to
zero. A timing diagram indicating the dead-time inser-
tion for one pair of PWM outputs is shown in
Figure 12-15.
12.14.2 AL TERNATE DEAD-TIME SOURCE
The alternate dead time refers to the dead time speci-
fied by the ALTDTR register that is applied to the com-
plementary PWM output. Figure 12-17 shows a dual
dead-time insertion using the ALTDTR register.
Note: If zer o dead time is required, the dead time
feature must be explicitly disabled in the
DTC<1:0> bit in the PWMCON register
PWM1H
PWM1L
tda tda
PWM
Generator #1
Output
DTR1 Dead-Ti me Unit
#1
PWM1 in
PWM1H
PWM1L
ALTDR1
DTR2 Dead-Ti me Unit
#2
PWM2 in
PWM2H
PWM2L
ALTDTR2
DTR3 Dead-Time Unit
#3
PWM3 in
PWM3H
PWM3L
ALTDTR3
DTR4 Dead-Time Unit
#4
PWM4 in
PWM4H
PWM4L
ALTDTR4
dsPIC30F1010/202X
DS70178C-page 128 Preliminary © 2006 Microchip Technology Inc.
FIGURE 12-17: DUAL DEAD-TIME
WAVEFORMS 12.14.3 DEAD-TIME RANGES
The amount of dead time provided by each dead-time
unit is se lected by specifyi ng a 12-bi t unsigned value in
the DTRx registers. The 12-bit dead-time counters
clock at four times the instruction execution rate. The
Least Significant one bit of the dead-time value are
processed by the Fine Adjust PWM module.
Table 12-3 shows example dead-time ranges as a
function of the device operating frequency.
TABLE 12-3: EXAMPLE DEAD-TIME
RANGES
12.14.4 DEAD-TIME INSERTION TIMING
Figure 12-18 shows how the dead-time insertion for
complementary signals is ac com pl is hed.
12.14.5 DEAD-TIME DISTORTION
For small PWM du ty cycles, the ratio of dead time to the
active PWM time may become large. In this case, the
inserted dead time introduces distortion into wave-
forms produced by the PWM module. The user can
ensure that dead-time distortion is minimized by keep-
ing the PWM du ty cycle at least three times larger tha n
the dead time.
A simila r effect oc c urs for duty cycl es at or nea r 100% .
The maximum du ty cycle used in the ap plication should
be chosen such that the minimum inactive time of the
signal is at least three times larger than the dead time.
FIGURE 12-18: DEAD-TIME INSERTION (PWM OUTPUT SIGNAL TIMING MAY BE DELAYED)
PWMH
PWML
PWML
PWML
PWMH
PWMH
No dead time
Positive dead time
Negative dead ti me
DTRx ALTDTRx
MIPS Resolution Dead-Time Range
30 4.16 ns 0-17. 03 µsec
20 6.25 ns 0-25.59 µsec
90 12345678
CLOCK
PTMR
DUTY CYCLE REG
4
RAW PWMH
RAW PWML
PWMH OUTPUT
PWML OUTPUT
DEAD-TIME VALUE
1<10:4>
<15:4>
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 129
dsPIC30F1010/202X
12.15 Configuring a PWM Channel
Example 12-1 is a code example for configuring PWM
channel 1 to operate in complementary mode at 400
kHz, with a dead-time value of approximately 64 nsec.
It is assumed that the dsPIC30F1010/202 X is operating
on the internal fast RC oscillator with PLL in the high-
frequency range (14.55 MHz input to the PLL,
assuming industrial temperature rated part).
12.16 Speed Limits of PWM Output
Circuitry
The PWM output I/O buffers, and any attached circuits
such as FET drivers and power FETs, have limited
slew-rate capability. For very small PWM duty cycles,
the PWM output signal is low-pass filtered; no pulse
makes it through all of the circuitry.
A similar effect happens for duty cycle values near
100%. Before 100% duty cycle is reached, the output
PWM signal appears to saturate at 100%.
Users need to take such behavior into account in their
applications. In normal power conversion applications,
duty cycle values near 0% or 100% are avoided
because to reach these values is to operate in a Dis-
continuous mode or a Saturated mode where the
control loop may be non functional.
12.17 PWM Special Event Trigger
The PWM module has a Special Event Trigger that
allows A/D conversions to be s ynchroni zed to the PWM
time base. The A/D sampling and conversion time can
be programmed to occur at any point within the PWM
period. The Special Event Trigger allows the user to
minim ize the delay b etween the time when A/D conver-
sion results are acquired and the time when the duty
cycle value is updated.
The Special Event Trigger is based on the primary
PWM time base.
The PWM Special Event Trigger has one register
(SEVTCMP) and four additional control bits
(SEVTPS<3:0> in PTCON) to control it s operation. The
PTMR value that causes a Special Event Trigger is
loaded into the SEVTCMP register.
12.17.1 SPECIAL EVENT TRIGGER ENABLE
The PWM module alway s produces Spe cial Event T ri g-
ger pulses. This signal can optionally be used by the
ADC module.
12.17.2 SPECIAL EVENT TRIGGER
POSTSCALER
The PWM Sp ecia l Ev ent Trigge r ha s a pos tscal er that
allows a 1:1 to 1:16 postscale ratio. The postscaler is
configured by writing the SEVTPS<3:0> control bits in
the PTCON register.
The special event output postscaler is cleared on the
following events:
Any write to the SEVTCMP register.
Any devi ce reset.
12.18 Individual PWM Triggers
The PWM m odule als o features an additi onal ADC tri g-
ger outpu t for each PWM generator . This feature is very
useful when the PWM generators are operating in
Independent Time Base mode.
A block diagram of a trigger circuit is shown in
Figure 12-19. The user specifies a match value in the
TRIGx register . When the local time base counter value
matches the TRIGx value, an ADC trigger signal is
generated.
Trigger signals are always gene rate d reg ardl es s of th e
TRIGx v alue a s lon g as t he TR IGx value is le ss th an or
equal to the PWM period value for the local time base.
If the TRG IEN bit is se t in the PWMCONx reg ister , then
an interrupt request is generated.
The individual trigger outputs can be divided per the
TRGDIV<2:0> bits in the TRGCONx registers, which
allows the trigger signals to the ADC to be generated
once for every 1, 2, 3 ..., 7 trigger events.
The trigger divider allows the user to tailor the ADC
sample rates to the requirements of the control loop.
dsPIC30F1010/202X
DS70178C-page 130 Preliminary © 2006 Microchip Technology Inc.
EXAMPLE 12-1: CODE EXAMP LE FOR CONFIGURING PWM CHANNEL 1
.
mov #0x0400, w0 ; PWM Module is disabled, continue operation in
mov w0, PTCON ; idle mode, special event interrupt disabled,
; immediate period updates enabled, no external
; synchronization
; Set the PWM Period
mov #0x094D, w0 ; Select period to be approximately 2.5usec
mov w0, PTPER ; PLL Frequency is ~480MHz. This equates to a
; clocke period of 2.1nsec. The PWM period and
; duty cycle registers are triggered on both +ve
; and -ve edges of the PLL clock. Therefore,
; one count of the PTPER and PDCx registers
; equals 1.05nsec.
; So, to achieve a PWM period of 2.5usec, we
; choose PTPER = 0x094D
mov #0x0000, w0 ; no phase shift for this PWM Channel
mov w0, PHASE1 ; This register is used for generating variable
; phase PWM
; Select individual Duty Cycle Control
mov #0x0001, w0 ; Fault interrupt disabled, Current Limit
mov w0, PWMCON1 ; interrupt disabled, trigger interrupt,
; disabled, Primary time base provides timing,
; DC1 provides duty cycle information, positive
; dead time applied, no external PWM reset,
; Enable immediate duty cycle updates
; Code for PWM Current Limit and Fault Inputs
mov #0x0003, w0
mov w0, FCLCON1 ; Disable current limit and fault inputs
; Code for PWM Output Control
mov #0xC000, w0 ; PWM1H and PWM1L is controlled by PWM module
mov w0, IOCON1 ; Output polarities are active high, override
; disabled
; Duty Cycle Setting
mov #0x04A6, w0 ; To achieve a duty cycle of 50%, we choose
mov w0, PDC1 ; the PDC1 value = 0.5*(PWM Period)
; The ON time for the PWM = 1.25usec
; The Duty Cycle Register will provide
; positive duty cycle to the PWMxH outputs
; when output polarities are active high
; (see IOCON1 register)
; Dead Time Setting
mov #0x0040, w0 ; Dead time ~ 67nsec
mov w0, DTR1 ; Hex(40) = decimal(64)
; So, Dead time = 64*1.05nsec = 67.2nsec
; Note that the last 2 bits are unimplemented,
; therefore the dead time register can achieve a
; a resolution of about 4nsec.
mov w0, ALTDTR1 ; Load the same value in ALTDTR1 register
bset PTCON, #15 ; turn ON PWM module
Note: This code example does not illustrate configuration of various fault modes for the PWM module.
It is intended as a quick start guide for setting up the PWM Module.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 131
dsPIC30F1010/202X
FIGURE 12-19: PWM TRIGGER BLOCK DIAGRAM
12.19 PWM Interrupts
The PWM module can generate interrupts based on
inter nal timing or based on exte rnal sig nals v ia the c ur-
rent-lim it and Fault input s. The primary time base mo d-
ule can generate an interrupt request when a special
event occurs. Each PWM generator module has its
own interrupt request signal to the interrupt controller.
The interrupt for each PWM generator is an OR of the
trigger event interrupt request, the current-limit input
event or the Fault input event for that module.
There are four interrupt request signals to the interrupt
control plus another interrupt request from the primary
time base on special events.
12.20 PWM Ti me Base Interrupts
The PWM module can generate interrupts based on
the primary time base and/or the individual time bases
in each PWM generator. The interrupt timing is speci-
fied by the Special Event Comparison Register
(SEVTCMP) for the primary time base, and by the
TRIGx registers for the individual time bases in the
PWM generator modules.
The primary time base special event interrupt is
enabl ed via t he SEI EN bit in the PTCON r egist er. The
indivi dual time bas e in terru pts generated by the trigger
logic in each PWM generator are controlled by the
TRGIEN bit in the PWMCONx registers.
12.21 PWM Fault and Current-Li m it Pins
The PWM modu le support s mult iple Fa ult pins for each
PWM generator. These pins are labeled SFLTx
(Shared Fault) or IFLTx (Individual Fault). The Shared
Fault pins can be seen and used by any of the PWM
generators. The Individual Fault pins are usable by
specific PWM generators.
Each PWM generator can have one pin for use as a
cycle-by-cycle current limit, and another pin for use as
either a c ycle-by-cycl e current limit or a latching curre nt
Fault disable function.
12.22 Leading Edge Blanking
Each PWM generator supports “Leading Edge Blank-
ing” of the current-limit and Fault inputs via the
LEB<9:3> bits and the PHR, PHF, PLR, PLF, FLTLE-
BEN and CLLEBEN bits in the LEBCONx registers.
The purpose of leading edge blanking is to mask the
transients that occur on the application printed circuit
board when the power transistors are turned on and off.
The LEB bi ts suppo rt the bl ankin g (igno ring) o f the c ur-
rent-lim it and Fau lt input s for a period of 0 to 102 4 nsec
in 8.4 nsec increments following any specified rising or
falling edge of the coarse PWMH and PWML signals.
The coarse PWM signal (signal prior to the PWM fine
tuning) has resolution of 8.4 nsec (at 30 MIPS), w hich
is the same time resolution as the LEB counters.
The PHR, PH F, PLR and PLF bit s sel ect w hich ed ge of
the PWMH and PLWL signals will start the blanking
timer. If a new selected edge triggers the LEB timer
while the timer is still active from a previously selected
PWM edge, the timer reinitializes and continues
counting.
PTMRx
Compare Logic
3
15
Clk
=
TRIGx Register
TRGDIV<2:0>
Pulse
Divider PWMx Trigger
15 3
PDI
PDI
TRIGx Write
dsPIC30F1010/202X
DS70178C-page 132 Preliminary © 2006 Microchip Technology Inc.
The FLTLEBEN and CLLEBEN b its en able the a pplica-
tion of the blanking period to the selected Fault and
current-limit inputs.
The LEB duration @ 30 MIPS =
(LEB<9:3> + 1)/120 MHz.
There is a blan king period of fse t of 8.4 nsec . Therefo re
a LEB<9:3> value of zero yields an effective blanking
period of 8.4 ns.
If a current-limit or Fault inputs are active at the end of
the previo us PWM c ycle, and they ar e sti ll active at the
start of the new PWM cycle and the dead time is non-
zero, the Fault or current limit will be detected
regardless of the LEB counter configuration.
12.23 PWM Fault Pins
Each PWM generator can select its own Fault input
source from a selection of up to 12 Fault/current-limit
pins. In the FCLCONx registers, each PWM generator
has control bits that specify the source for its Fault input
signal. These are the FLTSRC<3:0> bits. Additionally,
each PWM generator has a FLTIEN bit in the PWM-
CONx register that enables the generation of Fault
interrupt requests. Each PWM generator has an asso-
ciated F ault Polarity bit (FLTPOL) in the FC LCONx reg-
ister that selects the active level of the selected Fault
input.
The Fault pins actually serve two different purposes.
First is generation of Fault overrides for the PWM out-
puts. The action of overriding the PWM outputs and
generati ng an in terrupt i s perform ed as ynchro nousl y in
hardwa re so that Fault ev ents can be managed quic kly .
Second, th e Fault pin inpu t s c an b e us ed to imp le me nt
either Current-Limit PWM mode or Current Force
mode.
PWM Fault condition states are available on the FLT-
ST AT bit in the PWMCONx registers. The FL TSTA T bit s
displays the Fault IRQ latch if the FIE bit is set. If Fault
interrupts are not enabl ed, then the FSTA Tx bit s display
the status of the selected FLTx input in positive logic
format. Whe n the Fault input pi ns are not used in asso-
ciation with a PWM generator, these pins become
general purpose I/O or interrupt input pins.
The FLTx pins are normally active high. The FLTPOL
bit in FCLCONx registers, if set to one, invert the
selected Fault input signal so that it is an active low.
The Fault pi ns are also rea dable throug h the PORT I/O
logic when the PWM module is enabled. This allows
the user to poll the state of the Fault pins in software.
Figure 12-20 is a diagram of the PWM Fault control
logic.
FIGURE 12-20 : PWM FAULT CONTROL LOGIC DIAGRAM
PWMx
Generator
FLTDAT<1:0>
PWMxH,L
Signals 2
MUX
MUX
Analog C om parato r 1
Analog Comparator 2
Analog Comparator 3
Analog Comparator 4
FLTSRC<3:0>
CMP1x
CMP2x
CMP3x
CMP4x
SFLT1
SFLT2
SFLT3
SFLT4
IFLT2
IFLT4
PWMxH,L
2
2
Fault
Mode
Selection
Logic
Shared Fault # 1
Shared Fault # 2
Shared Fault # 3
Shared Fault # 4
Independent Fault # 2
Independent Fault # 4
FLTSTAT
FLTMOD<1:0>
PTMR
FLTMOD<1:0> = 00 – FLTSTAT signal is latched until Reset in software
FLTMOD<1:0> = 01 – FLTSTAT signal is Reset by PTMR every PWM cycle
FLTMOD<1:0> = 11 – FLTSTAT signal is disabled
Analog Comparator
Module
0
1
0000
0001
0010
1000
1001
1010
1011
1101
1111
0011
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 133
dsPIC30F1010/202X
12.23.1 FAULT INTERRUPTS
The FLTIENx bits in the PWMCONx registers deter-
mine if an interrupt will be generated when the FLTx
input is asserted high. The FLTMOD bits in the
FCLCONx register determines how the PWM genera-
tor and its outputs respond to the selected Fault input
pin. The FLTDAT<1:0> bits in the IOCONx registers
supply the da ta value s to be assi gned t o th e PWMx H,L
pins in the advent of a Fault.
The Fault pin logic can operate separately from the
PWM logic as an external interrupt pin. If the faults are
disabled from affecting the PWM generators in the
FCLCONx register , then the Fault pin can be used as a
general purp os e inter r upt pin .
12.23.2 FAULT STATES
The IOCONx register has two bits that determine the
state of each PWMx I/O pin when they are overridden
by a Fault input. When these bits are cleared, the
PWM I/O pin is driven to the inactive state. If the bit is
set, the PWM I /O pin i s driv en to t he acti ve stat e. The
active and ina ctive sta tes are re ferenc ed to the polarit y
defined for each PWM I/O pin (HPOL and LPOL
polarity control bits).
12.23.3 FAULT INPUT MODES
The Fault input pin has two modes of operation:
Latched Mode: When the Fault pi n is asserted,
the PWM outputs go to the states defined in the
FLTDAT bits in the IOCONx registers. The PWM
outputs remain in this state until the Fault pin is
deasserted AND the corresponding interrupt flag
has be en cleare d in soft ware. When both o f th ese
actions have occurred, the PWM outputs return to
normal operation at the beginning of the next
PWM cycle boundary. If the FLTSTAT bit is
cleared before t he F ault cond ition e nds, th e PWM
module waits until the Fault pin is no longer
asserted to restore the outputs. Software can
clear the FLTSTAT bit by writing a zero to the
FLTIEN bit.
Cycle-by-Cycle Mode: When the Fault inpu t pin
is asserted, the PWM outputs remain in the deas-
serted PWM state for as long as the Fault pin is
asserted. For Complementary Output modes,
PWMH is low (deasserted) and PWML is high
(asserted). After the Fault pin is driven high, the
PWM outputs return to normal operation at the
beginning of the following PWM cycle.
The oper ating mod e for each Fault input pin is selecte d
using the FLTMOD<1:0> control bits in the FCLCONx
register.
12.23.4 FAULT ENTRY
The response of the PWM pins to the Fault input pins
is always asynchronous with respect to the device
clock signals. That is, the PWM outputs should imme-
diately go to the states defined in the FLTDAT register
bits wit hout a ny in teracti on from the dsPIC D SC device
or software.
Refer to Section 12.28 “Fault and Current-Limit
Override Issu es with Dead-Time Logic” for informa-
tion regarding data sensiti vity and beh avior in response
to current-limit or Fault events.
12.23.5 FAULT EXIT
The restora tion of th e PWM si gnals after a Fau lt condi-
tion has e nded must occ ur at a PWM cycle bo undary to
ensure proper synchronization of PWM signal edges
and manual signal overrides. The next PWM cycle
begins when the PTMRx value is zero.
12.23.6 FAULT EXIT WITH PTMR DISABLED
There is a special case for exiting a Fault condition
when the PWM time base is disabled (PTEN = 0).
When a Fault input is programmed for Cycle-by-Cycle
mode, the PWM outputs are immediately restored to
normal operation when the Fault input pin is deas-
serted. The PWM outputs should return to their default
programmed values. (The time base is disabled, so
there is no reason to wait for the beginning of the next
PWM cycle.)
When a Fault input is programmed for Latched mode,
the PWM outputs are restored immediately when the
Fault input pin is deasserted AND the FSTAT bit has
been cleared in software.
12.23.7 FAULT PIN SOFTWARE CONTROL
The Fault pin can be controlled manually in software.
Since the Fault input is shar ed with a POR T I/O pin, th e
PORT pin can be configured as an output by clearing
the corres pondin g TRIS bit. Whe n the PORT bit for the
pin is cleared, the Fault input will be activated.
Note: The user should use caut ion when co ntrol-
ling the Fault inputs in software. If the
TRIS bi t for the Fau lt pin is cleared and the
PORT bit is set high, then the Fault input
cannot be driven externally.
dsPIC30F1010/202X
DS70178C-page 134 Preliminary © 2006 Microchip Technology Inc.
12.24 PWM Current-Limit Pins
Each PWM generator can select its own current-limit
input source from up to12 current-limit/Fault pins. In the
FCLCONx registers, each PWM generator has control
bits (CLSRC<3:0>) that specify the source for its cur-
rent-limit input signal. Additionally, each PWM genera-
tor has a CLIEN bit in the PWMCONx register that
enables the generation of current-limit interrupt
requests. Each PWM generator has an associated
Fault polarity bit CLPOL in the FCLCONx register.
Figure 12-21 is a diagram of the PWM Current-Limit
control log ic .
The current-limit pins actually serve two different pur-
poses. They can be used to implement either Current-
Limit PWM mode or Current Reset PWM mode.
1. When the CLIEN bit is set in the PWMCONx
registers, the PWMxH,L outputs are forced to
the values specified by the CLDAT<1:0> bits in
the IOCONx register, if the sel ected curre nt-limit
input signal is as serted.
2. When the CLMOD bit is zero AND the XPRES
bit in the PWMCONx register is ‘01’ AND the
PWM generator is in Independent Time Base
mode (ITB = 1), then a current-limit signal
resets the time base for the affected PWM gen-
erator. This behavior is called Current Reset
mode, which is used in some Power Factor
Correction (PFC) applications.
12.24.1 CURRENT-LIMIT INTERRUPTS
The state of the PWM current-limit conditions is avail-
able on the CLSTAT bits in the PWMCONx registers.
The CLSTAT bits display the current-limit IRQ flag if
the CLIEN bit is set. If current-limit interrupts are not
enabled , th en the CLSTAT bits displ ay the st atus o f the
selected current-limit inputs in positive logic format.
When the current-limit input pin associated with a
PWM generator is not used, these pins become
general purpose I/O or interrupt input pins.
The current-limit pins are normally active high. If set to
1’, the CLPOL bit in FCLCONx registers inverts the
selected current-limit input signal to active high.
The interrupts generated by the selected current-limit
signals are combined to create a single interrupt
request signal to the interrupt controller, which has its
own interrupt vector, interrupt flag bit, interrupt enable
bit and interrupt priority bits associated with it.
The Fault pi ns are also rea dable throug h the PORT I/O
logic when the PWM module is enabled. This allows
the user to poll the state of the Fault pins in software.
FIGURE 12-21: PWM CURRENT-LIMIT CONTROL LOGIC DIAGRAM
PWMx
Generator
CLDAT<1:0>
PWMxH,L
Signals 2
MUX
MUX
Analog C ompar ato r 1
Analog Comparator 2
Analog Comparator 3
Analog C om parato r 4
CLSRC<3:0>
CMP1x
CMP2x
CMP3x
CMP4x
SFLT1
SFLT2
SFLT3
SFLT4
IFLT2
IFLT4
PWMxH,L
2
2
Shared Fault # 1
Shared Fault # 2
Shared Fault # 3
Shared Fault # 4
Independent Fault # 2
Independent Fault # 4
CLSTATXPRES
PWM Period
Reset
EN
EN
Analog Comparator
Module
0000
0001
0010
1000
1001
1010
1011
1101
1111
0011
0
1
CLMOD
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 135
dsPIC30F1010/202X
12.25 Simultaneous PWM Faults and
Current Limits
The current-limit override function, if enabled and
active, forces the PWMxH,L pins to the values speci-
fied by the CLDAT<1:0> bits in the IOCONx registers
UNLESS the Fault fun ction is enabled and active. If the
selected Fault input is active, the PWMxH,L outputs
assume the values specified by the FLTDAT<1:0> bits
in the IOCONx registers.
12.26 PWM Fault and Current- Limit TRG
Outputs To ADC
The Fault an d current-limit source selection fields in the
FCLCON x registers (FLTSRC<3:0> and CL SRC<3:0>)
control multiplexers in each PWM generator module.
The control multiplexers select the desired Fault and
current-limit signals for their respective modules. The
selected Fault and current-limit signals are also avail-
able to the ADC module as trigger signals that initiate
ADC sampling and conversion operations.
12.27 PWM Output Override Prior ity
If the PWM mo dule is enable d, the priority of PWMx pi n
ownership is:
1. PWM Generator (lowest priority)
2. Output Overri de
3. Current-L imit Ov erri de
4. Fault Override
5. PENx (GPIO/PWM) ownership (highest priority)
If the PWM module is disabled, the GPIO module
controls the PWMx pins.
12.28 Fault and Current-Limit Override
Issues with Dead-Ti me Logic
The PWMxH and PWMxL outputs are immediately
driven low (deasserted) as specified by the
CLDAT<1:0> and the FLTDAT<1:0> bits when a
current-limit or a Fault event occurs.
The ove rrid e d ata is ga ted with the PWM sign al s g oin g
into the dead-time logic block, and at the output of the
PWM module, just ahead of the PWM pin output
buffers.
Many applications require fast response to current
shutdown for accurate current control and/or to limit
circuitry damage to Fault currents.
Some applications will set the complementary
PWM outputs high in synchronous rectifier
designs when a Fault or current-limit event
occurs. If the CLDAT or FLTDAT bits are set to ‘1’,
and their associated event occurs, then these
asserted outputs will be delayed by clocked logic
in the dead-time circuitry.
12.29 Asserting Outputs via Current
Limit
It is possible to use the CLDAT bits to assert the
PWMxH,L outputs in response to a current-limit event.
Such behavior could be used as a current “force” fea-
ture in resp ons e to an ex tern al curre nt or vol t ag e mea-
suremen t that indi cates a s udden sharp inc rease in th e
load on the power-converter output. Forcing the PWM
“ON” could be viewed as a “Feed-Forward” term that
allows quick system response to unexpected load
inc reases with out waiti ng for th e digital cont rol loo p to
respond.
12.30 PWM Immediate Update
For high-performance PWM control-loop applications,
the user may want to force the duty cycle updates to
occur immediately. Setting the IUE bit in the
PWMCONx register enables this feature.
In a clos ed-loop co ntrol appli catio n, any dela y between
the sensing of a system’s state and the subsequent
outputting of PWM control signals that drive the appli-
cation reduces the loop stability. Setting the IUE bit
minimi zes the d elay between w riting the d uty cycle re g-
isters and the response of the PWM generators to that
change.
12.31 PWM Output Override
All control bits associated with the PWM output
override function are cont ained in the IO CONx r egister.
If the PENH, PENL bits are set, the PWM module
controls the PWMx output pins.
The PWM output override bits allow the user to manu-
ally drive the PWM I/O pins to specified logic states
independent of the duty cycle comparison units.
The OVRDAT<1:0> bits in the IOCONx register deter-
mine the state of the PWM I/O pins when a particular
output is overridden via the OVRENH,L bits.
The OVRENH, OVRENL bits are active high control
bits. When the OVREN bits are set, the corresponding
OVRDAT bit overrides the PWM output from the PWM
generator.
12.31.1 COMPLEMENTARY OUTPUT MODE
When the PWM is in Co mplemen tary O utput mo de, the
dead-time generator is still active with overrides. The
output overrides and Fault overrides generate control
signal s used b y the dea d-time unit to set the outputs as
requested, including dead time.
Dead-time insertion can be performed when PWM
channel s are overridden manually.
dsPIC30F1010/202X
DS70178C-page 136 Preliminary © 2006 Microchip Technology Inc.
12.31.2 OVERRIDE SYNCHRONIZATION
If the O SYNC bit i n the IOCONx regist er is s et, th e out-
put overrides performed via the OVRENH,L and the
OVDDAT<1:0> bits are synchronized to the PWM time
base. Synchronous output overrides occur when the
time base is zero.
If PTEN = 0, meani ng the time r is no t runni ng, writes to
IOCON take effect on the next TCY boundary.
12.32 Functional Exceptions
12.32.1 PO W ER RESET C OND ITIO NS
All regist ers associated with the PWM module are reset
to the states given in Table 12-4 upon a Power-on
Reset. On a d evic e reset, the PWM output pi ns are
tri-stated.
12.32.2 SLEEP MODE
The selec ted Fault input pin has the abi li ty to w ake the
CPU from Sleep mode. The PWM module should gen-
erate an asynchronous interrupt if any of the selected
Fault pins is driven low while in Sleep.
It is recommended that the user disable the PWM out-
puts prior to entering Sleep mode. If the PWM module
is controlling a power convers ion applic ation, the action
of putting the device into Sleep will cause any control
loops to be disabled, and most applications will likely
experience issues unless they are explicitly designed
to operate in an Open-Loop mode.
12.32.3 CPU IDLE MODE
The dsP IC30F202X m odule has a PTSIDL control bi t in
the PTCON register. This bit determines if the PWM
module continues to operate or stops when the device
enters Idle mode. Stopped Idle mode functions like
Sleep mo de, and F ault pins a re asynch ronously active.
•PTSIDL = 1 (Stop module when in Idle mode)
•PTSIDL = 0 (Don't stop module when in Idle
mode)
It is recommended that the user disable the PWM out-
puts prior to entering Idle mode. If the PWM module is
controlling a power-conversion application, the action
of putting the device into Idle will cause any control
loops to be disabled, and most applications will likely
experience issues unless they are explicitly designed
to operate in an Open-Loop mode.
12.33 Register Bit Alignment
Table 12-4 on p a ge 142 show s th e reg ist ers for the PS
PWM module. All time-based data for the module is
always bit-aligned with respect to time. For example: bit
3 in the period register, the duty cycle registers, the
dead-time regi sters, the trigger reg isters and the phase
registers always represents a value of 8.4 nsec,
assuming 30 MIPS operation. Unused portions of reg-
isters always read as zeros.
The use o f dat a al ignm ent makes it easier t o w rite so ft-
ware be cause it eli minates the need to shif t time value s
to fit into registers. It also eases the computation and
understanding of time allotment within a PWM cycle.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 137
dsPIC30F1010/202X
12.34 APPLICATION EXAMPLES:
12.34.1 STANDARD PWM MODE
In standard PWM mode, the PWM output is typically
connected to a single transistor, which charges an
inductor, as shown in Figure 12-22. Buck and Boost
converters typically use standard PWM mode.
FIGURE 12 - 22: APPLIC ATI ONS OF
S T ANDA RD P WM MODE
12.34.2 APPLICATION OF COMPLEMENTARY
PWM MODE
Complementary mode PWM is often used in circuits
that use two tra nsistors in a bri dge co nfigura tio n where
transformers are not used, as shown in Figure 12-23.
If transformers are used, then some means must be
provided to ensure that no net DC currents flow
through the transformer to prevent core saturation.
FIGURE 12 -23: APPLICAT IONS OF
COMPLEMEN TARY PWM
MODE
Buck Converter
+VIN L1
PWM1H
+
VOUT
Boost Converter
+VIN
PWM1H
L1 VOUT
+
Period
PWM1H
T
ON
T
OFF
Inductor charges during T
ON
T
ON
versus Period controls power flow
VOUT
L1
+VIN
PWM1H
PWM1L
Synchronous Buck Converter
+
+
+V
IN
PWM1H
PWM1L
C
R
T1
Series Resonant H al f B ri dge Converte r
L
R
VOUT
PWM1L
PWM1H
Dead Time Dead Time Dead Ti m e
Period
dsPIC30F1010/202X
DS70178C-page 138 Preliminary © 2006 Microchip Technology Inc.
12.34.3 APPLICATION OF PUSH-PULL PWM
MODE
Push-Pull PWM mode is typically used in transformer
coupled circuits to ensure that no net DC currents flow
through the transformer. Push-Pull mode ensures that
the same duty cycle PWM pulse is applied to the
transformer windings in alternate directions, as shown
in Figure 12-24.
FIGURE 12-24: APPLIC ATIONS OF PUSH-
PULL PWM MODE
12.34.4 APPLICATION OF MULTI-PHASE PWM
MODE
Multi-Ph ase PWM mode is often used in DC/DC con-
verters that must handle very fast load current tran-
sient s and fi t into tig ht sp aces. A mu lti-pha se con verter
is essentially a parallel array of buck converters that
are operated slightly out of phase of each other, as
shown in Figure 12-25. The multiple phases create an
effective switching speed equal to the sum of the indi-
vidual converters. If a single phase is operating with a
333 KHz PWM frequency, then the effective switching
frequency for the circuit is 1 MHz. This high switching
frequency greatly reduces output capacitor size
requirem ents and improv es load tran sie nt res pon se.
FIGURE 12 -25: APPLICAT IONS OF MUL TI-
PHASE PWM MODE
+
T1
VOUT
Half Bridge Converter
+VIN
PWM1H
PWM1L
+
+
L1
PWM1H
PWM1L
TON TOFF
TON TOFF
Period Period
Dead Time Dead Time De ad Time
T1
+
+VIN
PWM1H
PWM1L
Push-Pull Buck Converter
L1 VOUT
PWH1H
PWH1L
PWH1L
PWH1H
+VIN
T1 L1 VOUT
Full Bridge Converter
+
+
+VIN
PWM1H PWM2H PWM3H
L1 L2 L3
PWM1L PWM1L PWM1L
VOUT
Converter
Multiphase DC/DC
PWM1H
PWM1L
PWM2H
PWM2L
PWM3H
PWM3L
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 139
dsPIC30F1010/202X
12.34.5 APPLICATION OF VARIABLE PHASE PWM
MODE
Variable phase PWM is used in newer power conver-
sion topologies that are designed to reduce switching
losses. In standard PWM methods, any time a transis-
tor switches between the conducting state and the
nonconducting state (and vice versa), the transistor is
exposed to the full current and voltage condition for
the period of time it takes the transistor to turn on or
off. The power loss (V * I * Tsw * FPWM) becomes
appreciable at high frequencies. The Zero Voltage
Switching (ZVS) and Ze ro Current Switching (ZVC) cir-
cuit topologies attempt to use quasi-resonant tech-
niques to shift either the voltage or current waveforms
relative to each other. This action either makes the
voltage or the current zero at the time the transistor
turns on or off. If either the current or the voltage is
zero, then there is no switching loss generated.
In variable phase PWM modes, the duty cycle is fixed
at 50%, and the po w er f low i s co ntrolled b y v ary in g th e
phase relationship between the PWM channels, as
shown in Figure 12-26.
FIGURE 12 - 26: APPLIC ATI ON O F
VARIABLE PHASE PWM
MODE
12.34.6 APPLICATION OF CURRENT RESET PWM
MODE
In Current Res et PWM mode, the PWM frequenc y var-
ies with the load current. This mode is different than
most PWM modes because the user sets the maxi-
mum PWM period, but an external circuit measures
the inductor current. When the inductor current falls
below a specified value, the external current compara-
tor circuit generates a signal that resets the PWM time
base counter. The user specifies a PWM “on” time,
and then some time after the PWM signal becomes
inactive, the inductor current falls below a specified
value and the PWM counter is reset earlier than the
programmed PWM period. This mode is sometimes
called Constant On-Time.
This mode should not be confused with cycle-by-cycle
current-limiting PWM, where the PWM is asserted, an
external circu it gene rates a current Fault an d the PWM
signal is turned off before its programmed duty cycle
would normally turn it off. In this mode, shown in
Figure 12-27, the PWM frequency is fixed per the time
base period.
FIGURE 12 -27: APPLICAT ION OF
CURRENT RESET PWM
MODE
PWM1H
PWM1L
PWM2H
PWM2L
Variable Phase Shift
+
Full Bridge ZVT Converter
T1 V
OUT
+V
IN
PWM1H
PWM1H PWM1HPWM1H
++
AC
IN
C
IN
L
I
L
PWM1H
DV
OUT
C
OUT
External current comparator resets PWM counter
PWM cycle restarts early
This is a variable frequency PWM mode
PWM1H
PWM1H
IL
TON
T
OFF
Actual Period
Programmed Period
dsPIC30F1010/202X
DS70178C-page 140 Preliminary © 2006 Microchip Technology Inc.
12.35 METHODS TO REDUCE EMI
The goal is to move the PWM edges around in time to
spread the EMI energy over a range of frequencies to
reduce the peak energy at any given frequency during
the EMI measurement process, which measures long
term averag es .
The EMI measurement process integrates the EMI
energy into 9 kHz wide frequency bins. Assuming that
the carrier (PWM) frequency is 150 kHz, a 6% dither
will yield a 9 kHz wide dither.
12.35.1 METHOD #1: PROGRAMMABLE FRC
DITHER
This method dithers all of the PWM outputs and the
system clock. The advantage of this method is that no
CPU resources are required. It is automatic once it is
setup . Th e us er c an pe r iod i ca ll y u p da t e th es e v al u es
to simulate a more random frequency pattern.
12.35.2 METHOD #2: SOFTWARE CONTROLLED
DITHER
This method uses software to dither individual PWM
channels by scaling the duty cycle and period. This
method co nsu me s CPU res ourc es :
Assume:
4 PWM channels updated @ 150 kHz rate:
600 kHz x (5 clocks (2 mul, 1 tblrdl, 1 mov))
= 3 MIPS additional work load
12.35.3 METHOD #3: SOFTWARE SCALING OF
TIME BASE PERIOD
This method used software to scale just the time base
period. Assuming that the dither rate is relatively slow
(about 250 Hz), the application control loop should be
able to compensate for the changes in PWM period
and adjust the duty cycle accordingly.
12.35.4 METHOD #4: FREQUENCY MODULATION
This method varies the frequency at which the PWM
cycle is varied (dithered). The frequency modulation
proc ess is si milar (m athem atical ly spea king) to Phase
Modulation when analyzed over a small time window.
The PWM module has the capability to phase modu-
late the PWM signals via the phase offset registers.
Phase mod ulatio n has the ad vant age tha t the softw are
is simpler and faster because multiple multiply opera-
tions (used for dithering frequency by scaling period
and duty cycles) are replaced with fewer additions or
simple updates of phase offset
values into the phase registers.
This method also has these advantages:
1. Multi-phase and variable phase PWM modes
could still be created.
2. The PWM generators can still use the common
time base, which simplifies determining when a
“quiet time” is available for measuring current.
This method has one disadvantage: the phase modu-
lation has to be at a relatively high update rate to
achieve usable frequency spreading.
12.35.5 INDEPENDENT PWM CHANNEL
DITHERING ISSUES:
Issues for mul t i-p ha se or v aria bl e ph as e de si gns us in g
independent output dithering must consider these
issues:
1. The phases are no longer phase aligned.
2. Control of current sharing among phases is
more difficult.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 141
dsPIC30F1010/202X
12.36 EXTERNAL SYNCHRONIZATION
FEATURES
In large power conversion systems, it is often desir-
able to be able to synchronize multiple power control-
lers to ensure that “beat frequencies” are not
generated within the system, or as a means to ensure
“quiet” periods during which current and voltage mea-
surements can be made.
dsPIC30F202X devices (excluding 28-pin packages)
have input and/or output pins that provide the capabil-
ity to either synchronize the SMPS dsPIC DSC device
with an external device or have external devices syn-
chronized to the SMPS dsPIC DSC. These synchro-
nizing features are enabled via the SYNCIEN and
SYNCOEN bits in the PTCON control register in the
PWM module.
The SYNCPOL bit in the PTCON register selects
whether the rising edge or the falling edge of the
SYNCI signal is the active edge. The SYNCPOL bit in
the PTCON register also selects whether the SYNCO
output pulse is low active or high active.
The SYNCSRC<2:0> bits in the PTCON register
specify the source for the SYNCI signal.
If the SYNCI feature is enabled, the primary time base
counter is reset when an active SYNCI edge is
detected. If the SYNCO feature is enabled, an output
pulse is generated when the primary time base
counter rolls over at the end of a PWM cycle.
The recom mende d SYNCI puls e wid th shoul d be more
than 100 nsec. The expected SYNCO output pulse
width will be approximately 100 nsec.
When using the SYNCI feature, it is recommended
that t h e us er pr og r am t he p e r io d r e gi ste r wi t h a pe ri od
value th at i s s lig htl y lo nge r tha n th e ex pec te d pe riod of
the external synchronization input signal. This pro-
vides protection in case the SYNCI signal is not
received due to noise or external component failure.
With a reasonable period value programmed into the
PTPER register, the local power conversion process
should remain operational even if the global
synchronization signal is not received.
12.37 CPU LOAD STAG GERING
The SMPS dsPIC DSC has the ability to stagger the
individual trigger comparison operations. This feature
helps to level the processor’s workload to minimize
situations where the processor is overloaded.
Assume a situation where there are four PWM chan-
nels controlling four independent voltage outputs.
Assume further that each PWM generator is operating
at 1000 kHz (1 µsec period) and each control loop is
operating at 125 kHz (8 µsec).
The TRGDIV<2:0> bits in each TRGCONx register will
be set to ‘111’, which selects that every 8th trigger
comparison match will generate a trigger signal to the
ADC to capture data and begin a conversion process.
If the stagger-in-time feature did not exist, all of the
requests from all of the PWM trigger registers might
occur at the same time. If this “pile-up” were to hap-
pen, some da ta sample might becom e s t al e (o utdated)
by the time the data for all four channels can be
processed.
With the st agge r-in-tim e feature, the trigger si gnals are
spaced out over time (during succeeding PWM peri-
ods) so that all of the data is processed in an orderly
manner.
The ROLL counter is a counter connected to the pri-
mary time base counter. The ROLL counter is incre-
mented each time the primary time base counter
reaches terminal count (period rollover).
The stagger-in-time feature is controlled by the
TRGSTRT<5:0> bits in the TRGCONx registers. The
TRGSTRT<5:0> bits specify the count value of the
ROLL counter that must be matched before an individ-
ual trigger comparison module in each of the PWM
generators can begin to count the trigger comparison
events as specified by the TRGDIV<2:0> bits in the
PWMCONx registers.
So, in our example with the four PWM generators, the
first PWM’s TRGSTRT<5:0> bits would be000’, the
second PWM’s TRGSTRT bits would be set to ‘010’,
the third PWM’s TRGSTRT bits would be set to ‘100
and the fourth PWM’s TRGSTRT bits would be set to
110’. Therefore, over a total of eight PWM cycles, the
four separate control loops could be run each with
their own 2-µsec time period.
12.38 EXTERNAL TRIGGER BLANKING
Using the LEB<9:3> bits in the LEBCONx registers,
the PWM module has the capability to blank (ignore)
the external current and Fault inputs for a period of 0
to 1024 nsec. This feature is useful if power transistor
turn-on induced transients make current sensing
diffi cult at the start of a PWM cycle.
dsPIC30F1010/202X
DS70178C-page 142 Preliminary © 2006 Microchip Technology Inc.
TABLE 12-4: POWER SUPPLY PWM REGISTER MAP
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PTCON 0400 PTEN PTSIDL SESTAT SEIEN EIPU SYNCPOL SYNCOEN SYNCEN SYNCSRC<2:0> SEVTPS<3:0> 0000
PTPER 0402 PTPER<15:3> —FFF0
MDC 0404 MDC<15:0> 0000
SEVTCMP 0406 SEVTCMP<15:3> —0000
PWMCON1 0408 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> XPRES IUE 0000
IOCON1 040A PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> OSYNC 0000
FCLCON1 040C CLSRC<3:0> CLPOL CLMOD FLTSRC<3:0> FLTPOL FLTMOD<1:0> 0000
PDC1 040E PDC1<15:0> 0000
PHASE1 0410 PHASE1<15:2> —0000
DTR1 0412 DTR1<13:2> —0000
ALTDTR1 0414 ALTDTR1<13:2> —0000
TRIG1 0416 TRIG<15:3> —0000
TRGCON1 0418 TRGDIV<2:0> —- —- —- —- —- —- —- TRGSTRT<5:0> 0000
LEBCON1 041A PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<9:3> —0000
PWMCON2 041C FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> XPRES IUE 0000
IOCON2 041E PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> OSYNC 0000
FCLCON2 0420 CLSRC<3:0> CLPOL CLMOD FLTSRC<3:0> FLTPOL FLTMOD<1:0> 0000
PDC2 0422 PDC2<15:0> 0000
PHASE2 0424 PHASE2<15:2> —0000
DTR2 0426 DTR2<13:2> —0000
ALTDTR2 0428 ALTDTR2<13:2> —0000
TRIG2 042A TRIG<15:3> —0000
TRGCON2 042C TRGDIV<2:0> —- —- —- —- —- —- —- TRGSTRT<5:0> 0000
LEBCON2 042E PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<9:3> —0000
PWMCON3 0430 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> XPRES IUE 0000
IOCON3 0432 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> OSYNC 0000
FCLCON3 0434 CLSRC<3:0> CLPOL CLMOD FLTSRC<3:0> FLTPOL FLTMOD<1:0> 0000
PDC3 0436 PDC3<15:0> 0000
PHASE3 0438 PHASE3<15:2> —0000
DTR3 043A DTR3<13:2> —0000
ALTDTR3 043C ALTDTR3<13:2> —0000
TRIG3 043E TRIG<15:3> —0000
TRGCON3 0440 TRGDIV<2:0> —- —- —- —- —- —- —- TRGSTRT<5:0> 0000
LEBCON3 0442 PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<9:3> —0000
PWMCON4 0444 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> XPRES IUE 0000
IOCON4 0446 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> OSYNC 0000
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 143
dsPIC30F1010/202X
FCLCON4 0448 CLSRC<3:0> CLPOL CLMODE FLTSRC<3:0> FLTPOL FLTMOD<1:0> 0000
PDC4 044A PDC4<15:0> 0000
PHASE4 044C PHASE4<15:2> —0000
DTR4 044E DTR4<13:2> —0000
ALTDTR4 0450 ALTDTR4<13:2> —0000
TRIG4 0452 TRIG<15:3> —0000
TRGCON4 0454 TRGDIV<2:0> —- —- —- —- —- —- —- TRGSTRT<5:0> 0000
LEBCON4 0456 PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<9:3> —0000
Reserved 0458-
47F —0000
TABLE 12-4: POWER SUPPLY PWM REGISTER MAP (CONTINUED)
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
dsPIC30F1010/202X
DS70178C-page 144 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 145
dsPIC30F1010/202X
13.0 SERIAL PER IPHERAL
INTERFACE (SPI)
The Serial Peripheral Interface (SPI) module is a syn-
chronous serial interface useful for communicating with
other peripheral or microcontroller devices. These
peripheral devices may be serial EEPROMs, shift regis-
ters, display drivers, ADC, etc. The SPI module is
comp ati bl e wit h SP I a nd SIO P fro m Moto rol a®.
The SPI module consists of a 16-bit shift register,
SPIxSR (w h ere x = 1 or 2), us ed f or sh if tin g da ta in a nd
out, and a buffer register , SPIxBUF. T wo control registers,
SPIxCON1 and SPIxCON2, configure the module. The
SPIxSR register is not accessible by user software. A sta-
tus register, SPIxSTAT, indicates various status
conditions.
The ser ial in terf ace con sists of 4 pins : SDIx (seria l data
input) , SDO x (s eri al d at a ou tp ut) , SCKx (s h ift cl oc k in pu t
or o utp ut ), and SSx (active-low s l av e se le ct ).
In Master mode operation, SCK is a clock output but in
Slave mode, it is a clock input.
A series of eight (8) or sixteen (16) clock pulses shift out
bits from the SPIxSR to SDOx pin and simultaneously
shift in data from SDIx pin. An interrupt is generated
when the transfer is complete and the corresponding
interrupt flag bit (SPI1IF or SPI2IF) is set. This interrupt
can be disabled through an interrupt enable bit (SPI1IE
or SPI2I E ).
The re ceive op eration is doub le-buff ered. Wh en a com-
plete byte is received, it is transferred from SPIxSR to
SPIxBUF.
If the receive buffer is full when new data is being trans-
ferred from SPIxSR to SPIxBUF, the module sets the
SPIROV bit (SPIxSTAT<6>) to indicate an overflow con-
dition. The transfer of the data from SPIxSR to SPIxBUF
is not co mpleted, and the ne w data is l ost. The mo dule
does not respond to transitions on the SCKx pin while
SPIROV (SPIxSTAT<6>) is ‘1, effectively disabling the
module un til SPIxBUF is read by u se r s o ftwa re.
Transmit writes are also double-buffered. The user soft-
ware wri tes to SPIxBUF. When the master or slave trans-
fer is completed, the contents of the shift register
(SPIxSR) are moved to the receive buffer . If any transmit
data has been written to the buffer register, the contents
of the transmit buffer are moved to SPIxSR. The received
data is thus placed in SPIxBUF and the transmit data in
SPIxS R is r ea dy fo r t he ne x t tr an sfer.
To set up the SPI module for the Master mode of
operation:
1. If using interrupts:
a) Clear the SPIxIF bit in the respective IFSn
register.
b) Set the SPIxIE bit in the respective IECn
register.
c) Write the SPIxIP bits in the respective IPCn
register to set the int errup t priori ty.
2. Write the desired settings to the SPIxCON1
register with MSTE N (SPIxCON 1< 5>) = 1.
3. Clear the SPIROV bit (SPIxSTAT<6>).
4. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
5. Write the data to be transmitted to the SPIxBUF
register. Transmission (and reception) start as
soon as d at a i s writte n to the SPIx BUF re gis te r.
To set up the SPI module for the Slave mode of operation:
1. Clear the SPIxBUF register.
2. If using interrupts:
a) Clear the SPIxIF bit in the respective IFSn
register.
b) Set the SPIxIE bit in the respective IECn
register.
c) Write the SPIxIP bits in the respective IPCn
register to set the int errup t priori ty.
3. Write the desire d settin gs to the SPIxCON 1 and
SPIxCON2 registers with MSTEN
(SPIxCON1<5>) = 0.
4. Clear the SMP bit (SPIxCON1<9>).
5. If the CKE (SPIxCON1<8>) bit is set, then the
SSEN bit (SPIxCON1<7>) must be set to enable
the SSx pin.
6. Clear the SPIROV bit (SPIxSTAT<6>).
7. Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
The SPI m odule genera tes an interru pt ind icatin g com-
pletion of a by te or word transfe r, as well as a sep arate
interrupt for all SPI error conditions.
Note: This data sheet summarizes the features
of this group of dsPIC30F1010/202X devices. It is not
inte nd ed t o be a c om pr ehe n si ve re f e re n ce so urc e. To
comple ment th e inform ation in this dat a sheet , refer to
the “dsPI C30F Family Refere nce Manual” (DS70046).
Note: The dsPIC30F101/202X family has only
one SPI. All references to x = 2 are
intended for software compatibility with
other dsPIC DSC devices.
Note: Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
Do not perform read-modify-write opera-
tions (such as bit-oriented instructions) on
the SPIxBUF register.
dsPIC30F1010/202X
DS70178C-page 146 Preliminary © 2006 Microchip Technology Inc.
FIGURE 13-1: SPI MODULE BLOCK DIAGRAM
Note: The ds PIC 30F 101 0/2 020 device s do not contain th e SS1 pin. There fore , th e Slav e Select an d Frame Sync
features cannot be used on these devices. These features are available on the dsPIC30F2023.
Inte rn al Da ta B u s
SDIx
SDOx
SSx
SCKx
SPIxSR
bit 0
Shift Control
Edge
Select
FCY
Primary
1:1/4/16/64
Enable
Prescaler
Sync
SPIxBUF
Control
Transfer
Transfer
Write SPIxBUF
Read SPIxBUF
16
SPIxCON1<1:0>
SPIxCON1<4:2>
Master Clock
Clock
Control
Secondary
Prescaler
1:1 to 1:8
SPIxRXB SPIxTXB
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 147
dsPIC30F1010/202X
FIGURE 13-2: SPI MASTER/SLAVE CONNECTION
FIGURE 13-3: SPI MASTER, FRAME MASTER CONNECTION DIAGRAM
FIGURE 13-4: SPI MASTER, FRAME SLAVE CONNECTION DIAGRAM
Serial Receive Buffer
(SPIxRXB)
LSb
MSb
SDIx
SDOx
PROCESSOR 2 (SPI Slave)
SCKx
SSx(1)
Serial Transmit Buffer
(SPIxTXB)
Serial Receive Buffer
(SPIxRXB)
Shift Regis ter
(SPIxSR)
MSb LSb
SDOx
SDIx
PROCESSOR 1 (SP I Master)
Serial Clock
(SSEN (SPI xCON 1<7> ) = 1 and MSTEN (SPIxCON1<5>) = 0)
Note 1: Using the SSx pin in Slave mode of operation is optional.
2: User must wr ite tra nsmi t data to/r ead rec eive d dat a from SP IxBUF. The SPIx TXB an d SPIxR XB reg ister s are m emory
mapped to SPIxBUF.
SCKx
Serial Transmit Buffer
(SPIxTXB)
(MSTEN (SPIxCON1<5>) = 1)
SPI Buffer
(SPIxBUF)(2)
SPI Buffer
(SPIxBUF)(2)
Shift Regis ter
(SPIxSR)
SDOx
SDIx
dsPIC33F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Slave, Frame S lav e)
SDOx
SDIx
dsPIC33F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Mas ter, Frame Sl ave)
dsPIC30F1010/202X
DS70178C-page 148 Preliminary © 2006 Microchip Technology Inc.
FIGURE 13-5: SPI SLAVE, FRAME MASTER CONNECTION DIAGRAM
FIGURE 13-6: SPI SLAVE, FRAME SLAVE CONNECTION DIAGRAM
EQUATION 13-1: RELATIONSHIP BETWEEN DEVICE AND SPI CLOCK SPEED
TABLE 13-1: SAMPLE SCKx FREQUENCIES
FCY = 40 MHz Secondary Prescaler Settings
1:1 2:1 4:1 6:1 8:1
Primary Prescaler Settings 1:1 Invalid Invalid 7500 5000 3750
4:1 7500 3750 1875 1250 937.5
16:1 1875 937.5 469 312.5 234.4
64:1 469 234.4 117 78.1 58.6
FCY = 5 MHz
Primary Prescaler Settings 1:1 5000 2500 1250 833 625
4:1 1250 625 313 208 156
16:1 313 156 78 52 39
64:17839201310
Note: SCKx frequencies shown in kHz.
SDOx
SDIx
dsPIC33F
Serial Clock
SSx
SCKx
Frame Sync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Slave, Frame Slav e)
SDOx
SDIx
dsPIC33F
Serial Clock
SSx
SCKx
Frame S ync
Pulse
SDIx
SDOx
PROCESSOR 2
SSx
SCKx
(SPI Master, Frame Slave)
Primary Prescaler * Secondary Prescaler
FCY
FSCK =
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 149
dsPIC30F1010/202X
REGISTER 13-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
SPIEN SPISIDL
bit 15 bit 8
U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0
SPIROV SPITBF SPIRBF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SPIEN: SPIx Enable bit
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14 Unimplemented: Read as ‘0
bit 13 SPISIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0
bit 6 SPIROV: Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded. The user software has not read the
previous data in the SPIxBUF register.
0 = No overflow has occurred
bit 5-2 Unimplemented: Read as ‘0
bit 1 SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit not yet started, SPIxTXB is full
0 = Transmit started, SPIxTXB is empty
Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.
Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR.
bit 0 SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty
Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.
Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB.
dsPIC30F1010/202X
DS70178C-page 150 Preliminary © 2006 Microchip Technology Inc.
REGISTER 13-2: SPIXCON1: SPI x CONTROL RE GISTE R 1
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DISSCK DISSDO MODE16 SMP CKE(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SSEN CKP MSTEN SPRE<2:0> PPRE<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0
bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled, pin functions as I/O
0 = Internal SPI clock is enabled
bit 11 DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10 MODE16: Wo rd/By te Commu nic ati on Sele ct bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9 SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8 CKE: SPIx Clock Edge Select bit(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7 SSEN: Slave Select Enable bit (Slave mode)
1 = SSx pin used for Slave mode
0 = SSx pin not used by module. Pin cont rolled by port func tion.
bit 6 CKP: Clock Polarity Select bit
1 = Idle stat e for clock is a high level; active state is a lo w leve l
0 = Idle state for clock is a low level; active state is a high level
bit 5 MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
...
000 = Secondary prescale 8:1
bit 1-0 PPRE<1:0>: Primary Presca le bits (Master mode)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
Note 1: The CKE bit is not used in the Framed SPI modes. The user should program this bit to 0’ for the Framed
SPI modes (FRMEN = 1).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 151
dsPIC30F1010/202X
REGISTER 13-3: SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
FRMEN SPIFSD FRMPOL
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
FRMDLY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FRMEN: Framed SPIx Support bit
1 = Framed SPIx support enabled (SSx pin us ed as frame sync pulse input/output)
0 = Framed SPIx support disabled
bit 14 SPIFSD: Frame Sync Pulse Direction Control bit
1 = Frame sync pulse input (slave)
0 = Frame sync pulse output (master)
bit 13 FRMPOL: Frame Sync Pulse Polarity bit
1 = Frame sync pulse is active-high
0 = Frame sync pulse is active-low
bit 12-2 Unimplemented: Read as ‘0
bit 1 FRMDLY: Frame Sync Pulse Edge Select bit
1 = Frame sync pulse coincides with first bit clock
0 = Frame sync pulse precedes first bit clock
bit 0 Unimplemented: This bit must not be set to 1’ by the user applic ation.
dsPIC30F1010/202X
DS70178C-page 152 Preliminary © 2006 Microchip Technology Inc.
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 13-2: SPI1 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
SPI1STAT 0240 SPIEN SPISIDL —SPIROV SPITBF SPIRBF 0000 0000 0000 0000
SPI1CON 0242
DISSCK
DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0> 0000 0000 0000 0000
SPI1CON2
0244
FRMEN
SPIFSD FRMPOL
FRMDLY
0000 0000 0000 0000
SPI1BUF 0246 Transmit and Receive Buffer 0000 0000 0000 0000
Legend: u = uninitialized bit
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 153
dsPIC30F1010/202X
14.0 I2C™ MODULE
The Inter-Integrated Circuit (I2C) module provides
complete hardware support for both Slave and Multi-
Master modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
•I
2C interface supporting both Master and Slave
operation.
•I
2C Slave mode supports 7 and 10-bit address
•I
2C Master mode su pports 7 and 10-bit address
•I
2C port allows bidirectional transfers between
master and slav es.
Serial clock synchronization for I2C port can be
used as a ha ndshake mechanis m to suspen d and
resume serial transfer (SCLREL control).
•I
2C supports Multi-Master operation; detects bus
collision and will arbitrate accordingly.
14.1 Operating Function Description
The hardw are fully im plements all the maste r and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
14.1.1 VARIOUS I2C MODES
The following types of I2C operation are supported:
•I
2C Slave operation with 7 or 10-bit address
•I
2C Master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 14-1.
14.1.2 PIN CONFIGURATION IN I2C MODE
I2C has a 2- pin i nterfac e; pin SCL is clock and pin SD A
is data.
FIGURE 14 - 1: PROGRAMMER’S MO D EL
14.1.3 I2C REGISTERS
I2CCON and I2CSTAT are Control and Status regis-
ters, respectivel y . The I2CCON register is r eadable and
writable. The lower 6 bits of I2CSTAT are read-only.
The remaining bits of the I2CSTAT are read/write.
I2CRSR is the shift register used for shifting data,
whereas I2CRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer, as shown in Figure 16-1.
I2CTRN is the transmit register to which bytes are writ-
ten during a transmit operation, as s hown in Figure 16-2.
The I2CADD regis ter hol ds the s lave a ddress. A status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator (BRG)
reload value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR
receives a complete byte, it is transferred to I2CRCV
and an interrupt pulse is generated. During
transmission, the I2CTRN is not double-buffered.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
bit 7 bit 0 I2CRCV (8 bits)
bit 7 bit 0 I2CTRN (8 bits)
bit 8 bit 0 I2CBRG (9 bits)
bit 15 bit 0 I2CCON (16 bits)
bit 15 bit 0 I2CSTAT (16 bits)
bit 9 bit 0 I2CADD (10 bits)
Note: Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit addre ss.
dsPIC30F1010/202X
DS70178C-page 154 Preliminary © 2006 Microchip Technology Inc.
FIGURE 14-2: I2C™ BLOCK DIAGRAM
I2CRSR
I2CRCV
Internal
Data Bus
SCL
SDA
Shift
Mat ch Det ect
I2CADD
Start and
St op bit Detect
Clock
Addr_Match
Clock
Stretching
I2CTRN LSB
Shift
Clock
Write
Read
BRG Down I2CBRG
Reload
Control
FCY
Start, Restart,
Stop bit Generate
Write
Read
Acknowledge
Generation
Collision
Detect
Write
Read
Write
Read
I2CCON
Write
Read
I2CSTAT
Control Logic
Read
LSB
Counter
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 155
dsPIC30F1010/202X
14.2 I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
inter prete d by the mo dul e as a 7 - bit add ress . When an
address is received, it is compared to the 7 Least
Significant bits of the I2CADD register.
If the A10M bit is 1’, the address is assumed to be a
10-bit address. When an address is received, it will be
compared with the binary value ‘1 1 1 1 0 A9 A8
(where A9, A8 are two Most Significant bits of
I2CADD). If that value matches, the next address will
be compared with the Least Significant 8 bits of
I2CAD D, as speci fied in the 1 0-bit addres sing proto col.
14.3 I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a S t art bit to occur (i.e., the I2C module is ‘I dle’). Fol-
lowin g t he det ection of a Start bit , 8 bit s are s hifted into
I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the
rising edge of SCL.
If an address match occurs, an acknowledgement will
be sent, and the slave event interrupt flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
14.3.1 SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmi t mode. It wil l send AC K on the nint h bit
and then hold SCL to ‘0’ un til the CPU responds b y writ-
ing to I2C TRN. SCL is rele ased by settin g the SCLREL
bit, and 8 bits of data are shifted out. Data bits are
shifted out on the fa lling edge of SCL, s uch that SDA i s
valid during SCL high (see timing diagram). The inter-
rupt pulse is sent on the falling edge of the ninth clock
pulse, regardless of the status of the ACK received
from the master.
14.3.2 SLAVE RECEPTION
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a pre vious operati on (RBF = 1), the n
ACK is not sent; however, the interrupt pulse is gener-
ated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
14.4 I2C 10-bit Slave Mode Operation
In 10-bit mode, the basic receive and transmit opera-
tions are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
The I2C specification dictates that a slave must be
address ed for a write ope ration, with tw o address byte s
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a
7-bit address. The address detection protocol for the
first byte of a message address is identical for 7-bit
and 10-bit messages, but the bits being compared are
different.
I2CADD holds the entire 10-bit address. Upon receiv-
ing an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pu lse is sent. Th e ADD10 bit will be cleare d to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and com-
pared with I2CADD<7:0>. If an address match occurs,
the interrupt pulse is generated and the ADD10 bit is
set, indicating a complete 10-bit address match. If an
address match did not occur, the ADD10 bit is cleared
and the module returns to the Idle state.
14.4.1 10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion, with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MA TCH”), the master can begin send-
ing data bytes for a slave reception operation.
14.4.2 10-BIT MODE SLAVE RECEPTION
Once ad dresse d, the ma ster can gen erate a Repe ated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave trans mit opera tion.
Note: The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed, but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
dsPIC30F1010/202X
DS70178C-page 156 Preliminary © 2006 Microchip Technology Inc.
14.5 Automatic Clock Stretch
In the Slave mo des, the module ca n synchroniz e buf fer
reads and write to the master device by clock
stretching.
14.5.1 TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock if the TBF bit is cleared,
indicating the buffer is empty.
In Slave Transmit modes, clock stretching is always
performed, irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the fa lling edge o f the ni nth cl ock, a nd if th e
TBF bit is still clear, then the SCLREL bit is automati-
cally cleared. The SCLREL being cleared to ‘0’ will
assert the SCL line low. The user’s ISR must set the
SCLREL bit before transmission is allowed to con-
tinue. By ho ldi ng the SC L l ine lo w, the user has tim e to
service the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit
sequence.
14.5.2 RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at
the end of each data receive sequence.
14.5.3 CLOCK STRETCHING DURING
7-BIT AD DRES SIN G (S TR EN = 1)
When the STREN bit is set in Slave Receive mode,
the SCL line is held low when the buffer register is full.
The method for stretching the SCL output is the same
for both 7 and 10-bit Addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing the
SCL output to be held low. The user’s ISR must set the
SCLREL bit before reception is allowed to continue. By
holding the SCL line low, the user has time to service
the ISR and read the contents of the I2CRCV before the
master device can initiate another receive sequence.
This will prevent buffer overruns from occurring.
14.5.4 CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence
as was described earlier.
14.6 Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is 1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to
the SCLREL bit with the SCL clock. Clearing the
SCLREL bit will not assert the SCL output until the
module detects a falling edge on the SCL output and
SCL is sampled low. If the SCLREL bit is cleared by
the user while the SCL line has been sampled low, the
SCL output will be asserted (held low). The SCL out-
put will remain low until the SCLREL bit is set, and all
other devices on the I2C bus have deasserted SCL.
This ensures that a write to the SCLREL bit will not
violate the minimum high time requirement for SCL.
If the STREN bit is ‘0, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
14.7 Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master In terrupt Flag) and SI2 CIF (I2C Slave Inter-
rupt Flag). The MI2CIF interrupt flag is activated on
completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the fallin g edge
of the n int h c lo ck , th e SC LREL bit w il l n ot
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software,
regardles s of the state of the RBF bit. The
user should be car eful to clear the RBF bit
in the ISR before the next receive
sequenc e in order to preven t an Overflow
condition.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 157
dsPIC30F1010/202X
14.8 Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast mode (400 kHz). The control
bit, DISSLW , enab les the user to disa ble slew rate co n-
trol, if desired. It is necessary to disable the slew rate
control for 1 MHz mode.
14.9 IPMI Support
The control bit IPMIEN enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit i s s et, t he m od ule ac ce pts an d ac t s upo n
all addres ses .
14.10 General Call Address Support
The general call address can address all devices.
When this address is used, all devices should,
in theory, respond with an acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0s with R_W = 0.
The general call address is recognized when the Gen-
eral Call Enable (GCEN) bit is set (I2CCON<7> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD,
and is also compared with the general call address
which is fixed in hardware.
If a gen eral cal l addre ss matc h occurs, the I2CRS R is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set, and, on the falling edge of the ninth bit
(ACK bit), the master event interrupt flag (MI2CIF) is
set.
When the i nte rrupt is serviced, the source for the int er-
rupt can be checked by reading the contents of the
I2CRCV to determine if the address was device
specific, or a general call address.
14.11 I2C Master Support
As a Master device, six operations are supported.
Assert a Start condition on SDA and SCL.
Assert a Restart condition on SDA and SCL.
Write to the I2CTRN register initiating
transmission of data/address.
Generate a Stop condition on SDA and SCL.
Configure the I2C port to receive data.
Generate an ACK condition at the end of a
received byte of data.
14.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the begi nning of the next seria l transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this ca se, the da ta direc tion bit (R_ W) is logi c ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted , an ACK bit i s received . S t art and Stop con-
ditions are output to indicat e the beginn ing and the en d
of a serial transfer.
In Master Rec eive mode, the firs t byte transmitte d con-
tains the slave address of the transmitting device (7
bits) and the data direction bit. In this case, the data
directio n bi t ( R_W) is log ic 1. Thus, the first byte trans-
mitted is a 7-b it slave a ddress, followed b y a ‘ 1’ to ind i-
cate receive bit. Serial data is received via SDA, while
SCL outputs the serial clock. Serial data is received 8
bits at a tim e. After e ach by te is rece ived, a n ACK bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
14.12.1 I2C MASTER TRANSMISSION
T ransmission of a data byte, a 7-bit address, or the sec-
ond half of a 10-bit address is accomplished by simply
writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state . This actio n will set th e Buff er Full Fl ag (TBF ) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
14.12.2 I2C MASTER RECEPTION
Master mode recepti on is enabl ed by progra mmin g the
receive enable (RCEN) bit (I2CCON<3>). The I2C
module must be Idle before the RCEN bit is set, other-
wise the RCEN bit will be disregarded. The Baud Rate
Generator begins counting, and, on each rollover, the
state of the SCL pin toggles, and dat a is shifted in to the
I2CRSR on the rising edge of each clock.
dsPIC30F1010/202X
DS70178C-page 158 Preliminary © 2006 Microchip Technology Inc.
14.12.3 BAUD RATE GENERATOR
In I2C Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded w ith th is v alu e, the BRG c ou nt s d own to ‘0’ and
stops until another reload has taken place. If clock
arbitration is taking place, for instance, the BRG is
reloaded when the SCL pin is sampled high.
As per the I2C standard, FSCK may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of 0’ or 1’ are illegal.
EQUATION 14-1: I2CBRG VALUE
14.12.4 CLOCK ARBITRATION
Clock arbitration oc curs when the m aster deasse rts the
SCL pi n (SCL al lowe d to fl oat hi gh) duri ng an y rece ive,
transmi t or Restar t/S top conditio n. When the SCL pi n is
allowed to float high, the Baud Rate Generator is
suspended from counting until the SCL pin is actually
sampled high. When the SCL pin is sampled high, the
Baud Rate Generator is reloaded with the contents of
I2CBRG and begins counting. This ensures that the
SCL high time w il l al ways be a t lea st o ne BR G roll over
count in the event that the clock is held low by an
external device.
14.12.5 MULTI-MASTER COMMUNICATION,
BUS CO LLISION AND BUS
ARBITRATION
Multi-Master operation support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA, by letting SDA float high
whil e another mast er asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are deasserted, and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service
Routine, if the I2C bus is free (i.e., the P bit is set) the
user can resume communication by asserting a Start
condition.
If a Start, Restart, Stop or Acknowledge condition was
in progres s when the bus collisi on o cc urre d, th e c ond i-
tion is aborte d, the SDA an d SCL li nes a re deas serted,
and the respective control bits in the I2CCON register
are cleared to ‘0’. When th e u s er se r vi c es the bu s c ol -
lision Interrupt Service Routine, and if the I2C bus is
free, the user can resume co mm uni ca tion by asse rtin g
a Start condition .
The Master will continue to monitor the SDA and SCL
pins and, if a Stop condition occurs, the MI2CIF bit will
be set.
A write to the I2CTR N will start the trans mission of dat a
at the fi rst data bit, regardless of where the transmitter
left off when bus collision occurred.
In a Multi-Mas ter environment, th e i nte rrupt generation
on the d etecti on of Start a nd Stop co nditio ns al lows th e
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
14.13 I2C Module Operation During CPU
Sleep and Idle Modes
14.13.1 I2C OPERATION DURING CPU
SLEE P MOD E
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission, and the
state machine is partially into a transmission as the
clocks s top, the n the tra nsmiss ion is ab orted. Si milarl y,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
14.13.2 I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
I2CBRG Fcy
Fscl
-----------Fcy
1 111 111,,
---------------------------
⎝⎠
⎛⎞
1=
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 159
dsPIC30F1010/202X
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 14-1: I2C™ REGIS TER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
I2CRCV 0200 Receive R egist er 0000 0000 0000 0000
I2CTRN 0202 Transmit R egist er 0000 0000 1111 1111
I2CBRG 0204 Baud Rate Generator 0000 0000 0000 0000
I2CCON 0206 I2CEN I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000
I2CSTAT 0208 ACKSTAT TRSTAT BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000
I2CADD 020A Address Register 0000 0000 0000 0000
dsPIC30F1010/202X
DS70178C-page 160 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 161
dsPIC30F1010/202X
15.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC30F1010/202X device family.
The UART is a full-duplex asynchronous system that
can communicate with peripheral devices, such as
personal computers, LIN, RS-232 and RS-485 inter-
faces. The module also includes an IrDA encoder and
decoder.
The primary features of the UART module are:
Full-Duplex 8 or 9-bit Data Transmission through
the U1TX and U1RX pins
Even, Odd or No Parity Options (for 8-bit data)
One or Two Stop bits
Fully Integrated Baud Rate Generator with 16-bit
Prescaler
Baud Rates Ranging from 1 Mbps to 15 bps at
16 MIPS
4-Deep First-In-First-Out (FIFO) Transmit Data
Buffer
4-Deep FIFO Receive Data Buffer
Parity, Framing and Buffer Overrun Error Detection
Support for 9-bit mode with Address Detect
(9th bit = 1)
Transmit and Receive Interrupts
Loopback mode for Diagnostic Support
Support for Sync and Break Characters
Supports Automatic Baud Rate Detection
IrDA Encoder and Decoder Logic
16x Baud Clock Output for IrDA Support
A simplified block diagram of the UART is shown in
Figure 15-1. The UART module consists of these key
important hardware elements:
Baud Rate Generator
Asynchronous Transmitter
Asynchronous Receiver
FIGURE 15-1: UART SIMPLIFIED BLOCK DIAGRAM
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
U1RX
IrDA®
UAR T 1 Rece iv er
UART1 Transmitter U1TX
Baud Rate Generator
dsPIC30F1010/202X
DS70178C-page 162 Preliminary © 2006 Microchip Technology Inc.
15.1 UART Baud Rate Generator (BRG)
The UART module includes a dedicated 16-bit Baud
Rate Generator. The U1BRG register controls the
period of a free-running 16-bit timer. Equation 15-1
shows the formula for computation of the baud rate
with BRGH = 0.
EQUATION 15-1: UART BAUD RATE WITH
BRGH = 0(1,2,3)
Example 15-1 shows the calculation of the baud rate
error for the following conditions:
•F
CY = 7.5 MHz
Desired Baud Rate = 9600
The maximum baud rate (BRGH = 0) possible is
FCY/16 (for U1BRG = 0), and the minimum baud rate
possible is FCY/(16 * 65536).
Equation 15-2 shows the formula for computation of
the baud rate with BRGH = 1.
EQUATION 15-2: UART BAUD RATE WITH
BRGH = 1(1,2,3)
The maxim um bau d rate (BRGH = 1) pos si ble is F CY/4
(for U1BRG = 0) and the minimum baud rate possible
is FCY/(4 * 65536).
Writing a new value to the U1BRG register causes the
BRG timer to be reset (cleared). This ens ures the BRG
does not wai t for a timer overflow be fore generating the
new baud rate.
EXAMPLE 15-1: BAUD RATE ERROR CALCULATION (BRGH = 0)(1)
Note 1: FCY denotes the instruction cycle clock
frequency (FOSC/2).
2: Assuming external oscillator with fre-
quency of 15 MHz and PLL disabled,
FCY is 7.5 MHz.
3: Assuming external oscillator with fre-
quency of 15 MHz and PLL enabled,
FCY is 30 MHz.
Baud Rate = FCY
16 • (U1BRG + 1)
FCY
16 • Baud Rate
U1BRG = – 1
Baud Rate = FCY
4 • (U1BRG + 1)
FCY
4 • Baud Rate
U1BRG = 1
Note 1: FCY denotes the instruction cycle clock
frequency.
2: Assuming external oscillator with fre-
quency of 15 MHz and PLL disabled,
FCY is 7.5 MHz.
3: Assuming external oscillator with fre-
quency of 15 MHz and PLL enabled,
FCY is 30 MHz.
Desired B aud Rat e = Fcy/(16 (U1BR G + 1))
Solving for U1BR G va lue:
U1BRG = ((FCY/Des ired Baud Ra te)/16 ) – 1
U1BR G = ( (7500000/ 9600)/1 6) – 1
U1BRG = 48
Calcula te d Ba ud Rate = 7500 000/(16 (48 + 1))
= 9 566
Error = (Calculated Baud Rate – Desired Baud Rate)
Desire d Baud Ra te
= (9566 – 9600)/9600
=-0.35%
Note 1: Based on TCY = 2/FOSC, PL L are disabled.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 163
dsPIC30F1010/202X
15.2 Transmitting in 8-bit Data Mode
1. Set up the UART:
a) Write appropriate values for data, parity and
Stop bits.
b) Write appropriate baud rate value to the
U1BRG register.
c) Set up transmit and receive interru pt enable
and priority bits.
2. Enable the UART.
3. Set the UTXEN bit (causes a transmit interrupt).
4. Write d ata byt e to lo wer by te of T XxRE G word.
The value will be immediately transferred to the
Transmit Shift Register (TSR), and the serial bit
stream wi ll start sh ifting out with next rising edge
of the baud clock.
5. Alternately, the data byte may be transferred
while UTXEN = 0, and then the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
6. A transmit interrupt will be generated as per
interrupt control bit, UTXISELx.
15.3 Transmitting in 9-bit Data Mode
1. Set up the UART (as described in Section 15.2
“Transmitting in 8-bit Data Mode”).
2. Enable the UART.
3. Set the UTXEN bit (causes a transmit interrupt).
4. Write TXxREG as a 16-bit value only.
5. A word write to TXxREG triggers the transfer of
the 9-bit data to the TSR. Serial bit stream will
start shifting out with the first rising edge of the
baud clock.
6. A transmit interrupt will be generated as per the
setting of control bit, UTXISELx.
15.4 Break and Sync Transmit
Sequence
The following sequence will send a message frame
header made up of a Break, followed by an auto-baud
Sync byte.
1. Configure the UART for the desired mode.
2. Set UTXEN and UTXBRK – sets up the Break
character,
3. Load the TXxREG with a dummy character to
initiate transmission (value is ignored).
4. Write ‘55h’ to TXxREG – loads Sync character
into the transm it FIFO .
5. After the Break has been sent, the UTXBRK bit
is reset by hardware. The Sync character now
transmits.
15.5 Receiving in 8-bit or 9-bit Data
Mode
1. Set up the UART (as described in Section 15.2
“Transmitting in 8-bit Data Mode”).
2. Enable the UART.
3. A receive interrupt will be generated when one
or mor e da ta c har ac t ers ha ve be e n re ce iv ed as
per interrupt control bit, URXISELx.
4. Read the OERR bit to determine if an overrun
error has occ urred. The OERR bit mus t be reset
in software.
5. Read RXxREG.
The act of read ing the RXxREG character will move the
next character to the top of the rec eiv e FI FO , inc lu din g
a new set of PERR and FERR values.
15.6 Built-in IrDA Encoder and Deco der
The UART has full im pl em entation of the IrDA enc od er
and decoder as part of the UART module. The built-in
IrDA encoder and decoder functionality is enabled
using the IREN bit U1MODE<12>. When enabled
(IREN = 1), the receive pin (U1RX) acts as the input
from the infrared receiver. The transmit pin (U1 TX) acts
as the output to the infrared transmitter.
15.7 Alternate UART I/O Pins
An alternat e set of I/O pins, U1ATX and U1ARX can be
used for c ommunication s. The alternate UAR T pins are
useful when the primary UAR T pins are shared by other
peripherals. The alternate I/O pins are enabled by set-
ting the ALTIO bit in the UxMODE register. If ALTIO =
1, the U1ATX and U1ARX pins are used by the UART
module, instead of the U1TX and U1RX pins. If ALTIO
= 0, the U1TX and U1RX pins are used by the UART
module.
dsPIC30F1010/202X
DS70178C-page 164 Preliminary © 2006 Microchip Technology Inc.
REGISTER 15-1: U1MODE: UART1 MODE REGISTER
R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0
UARTEN USIDL IREN —ALTIO
bit 15 bit 8
R/W-0 HC R/W-0 R/W-0 HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAKE LPBACK ABAUD RXINV BRGH PDSEL1 PDSEL0 STSEL
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HC = Hardware Cleared HS = Hardware Select
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 UARTEN: UART1 Enable bit
1
= UART1 enabled; all UART1 pins are controlled by UART1 as defined by UEN<1:0>
0
= UAR T1 disabled; a ll UAR T1 pins are con trolled by PO R T latche s; UA R T1 p ower consu mp tion minimal
bit 14 Unimplemented: Read as ‘0
bit 13 USIDL: Sto p in Idle Mo de bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 IREN: IrDA Encoder and Decoder Enable bit
1 = IrDA encoder and decoder enabled
0 = IrDA encoder and decoder disabled
Note: This feature is only available for the 16x BRG mode (BRGH = 0).
bit 11 Unimplemented: Read as0
bit 10 ALTIO: UART Alternate I/O Selection bit
1 = UART communicates using U1ATX and U1ARX I/O pins
0 = UART communicates using U1TX and U1RX I/O pins.
bit 9-8 Unimplemented: Read as ‘0
bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UART1 will continue to sample the U1RX pin; interrupt generated on falling edge, bit cleared in
hardware on following rising edge
0 = No wake-up enabled
bit 6 LPBACK: UART1 Loopback Mode Select bit
1 = Enable Loopback mode
0 = Loopback mode is disabled
bit 5 ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h);
cleared in hard w are upo n comple tion
0 = Baud rate measurement disabled or completed
bit 4 RXINV: Receiv e Polarity Inv ers ion bit
1 = U1RX Idle state is0
0 = U1RX Idle state is1
bit 3 BRGH: High Baud Rate Enable bit
1 = BRG generates 4 clocks per bit period (4x Baud Clock, High-Speed mode)
0 = BRG generates 16 clocks per bit period (16x Baud Clock, Standard mode)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 165
dsPIC30F1010/202X
bit 2-1 PDSEL1:PDSEL0: Parity and Data Selection bits
11 = 9-bit data, n o parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, n o parity
bit 0 STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
REGISTER 15-1: U1MODE: UART1 MODE REGISTER (CONTINUED)
dsPIC30F1010/202X
DS70178C-page 166 Preliminary © 2006 Microchip Technology Inc.
REGISTER 15-2: U1STA: UART1 STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
UTXISEL1 UTXINV(1) UTXISEL0 UTXBRK UTXEN UTXBF TRMT
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HS =Hardware Set HC = Hardware Cleared
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15, 13 UTXISEL1:UTXISEL0: Transmission Interrupt Mode Selection bits
11 =Reser ved; do not us e
10 =Interrupt when a character is transferred to the Transmit Shift Register and as a result, the
transmit buffer becomes empty
01 =Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit
operation s are com pl ete d
00 =Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at
least one character open in the transmit buffer)
bit 14 UTXINV: IrDA Encoder Transmit Polarity Inversion bit(1)
1 = IrDA encoded U1TX idle state is ‘1
0 = IrDA encoded U1TX idle state is ‘0
Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is
enabled (IREN = 1).
bit 12 Unimplemented: Read as ‘0
bit 11 UTXBRK: Transmit Break bit
1 = Send Sync Break on next tran smissi on – S t art bit, foll owed by twe lve ‘0’ bit s, foll owed by Stop bit;
cleared by hardware upon completion
0 = Sync Break transmission disabled or completed
bit 10 UTXEN: Transmit Enable bit
1 = Transmit enabled, U1TX pin controlled by UART1
0 = Transmit disabled, any pending transmission is aborted and buffer is reset. U1TX pin controlled by
PORT.
bit 9 UTXBF: Transmit Buffer Full Status bit (Read-Only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8 TRMT: Transmit Shift Register Empty bit (Read-Only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has
completed)
0 = Transmit Shift Register is not empty, a transmission is in progress o r que ued
bit 7-6 URXISEL1:URXISEL0: Receive Interrupt Mode Selection bits
11 =Interrupt is set on RSR transfer, making the receive buffer full (i.e., has 4 data characters)
10 =Interrupt is set on RSR transfer, making the receive buffer 3/4 full (i.e., has 3 data characters)
0x =Interrupt is set wh en any chara cter is receive d and transferred from the RSR to the receive bu ffer .
Receive buffer has one or more characters.
bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect.
0 = Address Detect mode disabled
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 167
dsPIC30F1010/202X
bit 4 RIDLE: Receiver Idle bit (Read-Only)
1 = Receiver is Idle
0 = Receiver is active
bit 3 PERR: Parity Error Status bit (Read-Only)
1 = Parity error has been detec ted fo r the current chara cter (c haract er at t he top o f the receive FIFO)
0 = Parity error has not been detected
bit 2 FERR: Framing Error Status bit (Read-Only)
1 = Framing error has been detected for the current character (character at the top of the receive
FIFO)
0 = Framing error has not been detected
bit 1 OERR: Receive Buffer Overrun Error Status bit (Read/Clear-Only)
1 = Receive buffer has overflowed
0 = Receive bu ffer has not overfl owed (clearin g a previou sly set O ERR bit (10 transition) will reset
the receiver buffer and the RSR to the empty state)
bit 0 URXDA: Receive Buffer Data Available bit (Read-Only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
REGISTER 15-2: U1STA: UART1 STATUS AND CONTROL REGISTER (CONTINUED)
dsPIC30F1010/202X
DS70178C-page 168 Preliminary © 2006 Microchip Technology Inc.
TABLE 15-1: UART1 REGISTER MAP
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
U1MODE 0220 UARTEN —USIDLIREN—ALTIO WAKE LPBACK ABAUD RXINV BRGH PDSEL<1:0> STSEL
0000
U1STA 0222 UTXISEL1 UTXINV UTXISEL0 UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA
0110
U1TXREG 0224 UAR T Transmit R egi ster
xxxx
U1RXREG 0226 UAR T Receiv e Register
0000
U1BRG 0228 Ba ud R a te G en era to r P re sca le r
0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 169
dsPIC30F1010/202X
16.0 10-BIT 2 MSPS ANALOG-TO-
DIGITAL CONVERTER (ADC)
MODULE
The dsPIC30F1010/202X devices provide high-speed
successive approximatio n analog to digita l conversions
to support applications such as AC/DC and DC/DC
power convert ers.
16.1 Features
10-bit resolution
Uni-polar Inp uts
Up to 12 input channels
±1 LSB accuracy
Single supply operation
2000 ksps conversion rate at 5V
1000 ksps conversion rate at 3.0V
Low power CMOS technology
16.2 Description
This ADC module is designed for applications that
require l ow l atency b etwe en the reques t for con versio n
and the resultant output data. Typical applications
include:
AC/DC power supplies
DC/DC converters
Power factor correcti on
This ADC works with the Power Supply PWM module
in power control applications that require high-fre-
quency control loops. This module can sample and
convert two analog in puts in one microsecond. The one
micros econd con version de lay reduce s the “phase la g”
between measurement and control system response.
Up to 4 inputs may be sampled at a time, and up to 12
inputs may request conversion at a time. If multiple
input s request co nversion, the ADC will convert them in
a sequential manner starting with the lowest order
input.
This ADC design provides each pair of analog inputs
(AN1,AN0), (AN3,AN2 ), ... , the a bility to speci fy its own
trigger source out of a maximum of sixteen different
trigger sources. This capability allows this ADC to sam-
ple and convert analog inputs that are associated with
PWM generators operating on independent time
bases.
There is no operation during Sleep mode. The user
applications typically require synchronization between
analog data sampling and PWM output to the applica-
tion cir cuit. The v ery high s peed oper ation of thi s ADC
module allows “data on demand”.
In addition, several hardware features have been
added to the peripheral interface to improve real-time
performance in a typical DSP based application.
1. Result alignment options
2. Automated sampling
3. External con ver si on st a r t cont rol
A block diagram of the ADC module is shown in
Figure 16-1.
16.3 Module Functionality
The 10-bit 2 Msps ADC is designed to support power
conversion applications when used with the Power
Supply PWM m odule. The 1 0-bit 2 Msp s ADC sa mple s
up to N (N1 2) in puts at a time and the n co nv ert s tw o
sampled inputs at a time. The quantity of sample and
hold circuits is determined by a device’s requirements.
The10-Bit 2 Msp s ADC pr oduces t wo 10-bi t conversio n
results in 1 microsecond.
The ADC m od ule su ppo rts up to 12 anal og inp ut s . Th e
sampled inputs are connected, via multiplexers, to the
converter.
The analog reference voltage is defined as the device
supply voltage (AVDD / AVSS).
The ADC modul e us es the se Cont rol and Status regis -
ters:
A/D Control Register (ADCON)
A/D Status Register (ADSTAT)
A/D Base Register (ADBASE)
A/D Port Configuration Register (ADPCFG)
A/D Convert Pair Control Register #0 (ADCPC0)
A/D Convert Pair Control Register #1 (ADCPC1)
A/D Convert Pair Control Register #2 (ADCPC2)
The ADCON reg ister control s the operatio n of the ADC
module . The ADSTA T re gister dis plays the s tatus of the
conversion processes. The ADPCFG registers config-
ure the port pins as analog inputs or as digital I/O. The
CPC registe rs control the triggerin g of the ADC conver-
sions. (See Register 16-1 through Register 16-7 for
detailed bit configurations.)
Note: A uniq ue feat ure of th e ADC m odul e is i ts abil-
ity to sample inputs in an asynchronous manner.
Individual sample and hold circuits can be triggered
independently of each other.
Note: The PLL must be enabled for the ADC module
to function. This is achieved by using the
FNOSC<1:0> bits in the FOSCSEL Configuration
register.
dsPIC30F1010/202X
DS70178C-page 170 Preliminary © 2006 Microchip Technology Inc.
FIGURE 16-1: ADC BLOCK DIAGRAM
AVSS
AVDD
Data
Bus Interface
MUX/Sample/Sequence
Control
Format
DAC
12-word, 16-bit
Registers
Comparator
10-Bit SAR Conversion Logic
AN0
AN2
AN6
AN1
AN11
AN3
AN8
AN10
Even numbered inputs
without dedicated
Dedicated Sample & Holds
AN4
Common Sample and Hold
Sample and Hold
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 171
dsPIC30F1010/202X
REGISTER 16-1: A/D CONTROL REGISTER (ADCON)
R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 U-0 R/W-0
ADON —ADSIDL—GSWTRG—FORM
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-1 R/W-1
EIE ORDER SEQSAMP ADCS<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADON: A/D Operating Mode bit
1 = A/D converter module is ope rati ng
0 = A/D converter is off
bit 14 Unimplemented: Read as ‘0
bit 13 ADSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module oper ation in Idle mode
bit 12-11 Unimplemented: Read as 0
bit 10 GSWTRG: Global Software Trigger bit
When thi s bit is se t b y the us er, it will tri gge r c onv ers io ns if s ele ct ed by th e TRGSRC<4:0> bits in the
ADCPCx registers. This bit must be cleared by the user prior to initiating another global trigger (i.e.,
this bit is not auto-c lea ring ).
bit 9 Unimplemented: Read as 0
bit 8 FORM: Data Output Format bit
1 = Fractional (DOUT = dddd dddd dd00 0000)
0 = Integer (DOUT = 0000 00dd dddd dddd)
bit 7 EIE: Early Interrupt Enable bit
1 = Interrupt is generated after first conversion is completed
0 = Interrupt is generated after second conversion is completed
Note: This control bit can only be changed while ADC is disabled (ADON = 0).
bit 6 ORDER: Conversion Order bit
1 = Odd numbered analog input is converted first, followed by conversion of even numbered input
0 = Even numbered analog input is converted first, followed by conversion of odd numbered input
Note: This control bit can only be changed while ADC is disabled (ADON = 0).
bit 5 SEQSAMP: Sequential Sample Enable.
1 = Shared S&H is sampled at the start of the second conversion if ORDER = 0. If ORDER = 1, then
the shared S&H is sampled at the start of the first conversion.
0 = Shared S&H is sa mp led at the same time the dedi ca ted S&H i s sa mp le d if th e sh ared S&H is n ot
currently busy with an existing conversion process. If the shared S&H is busy at the time the
dedicated S&H is sampled, then the shared S&H will sample at the start of the new conversion
cycle
bit 4-3 Unimplemented: Read as ‘0
dsPIC30F1010/202X
DS70178C-page 172 Preliminary © 2006 Microchip Technology Inc.
bit 2-0 ADCS<2:0>: A/D Conversion Clock Divider Select bits
If PLL is enabled (assume 15 MHz external clock as clock source):
111 = FADC/18 = 13.3 MHz @ 30 MIPS
110 = FADC/16 = 15.0 MHz @ 30 MIPS
101 = FADC/14 = 17.1 MHz @ 30 MIPS
100 = FADC/12 = 20.0 MHz @ 30 MIPS
011 = FADC/10 = 24.0 MHz @ 30 MIPS
010 = FADC/8 = 30.0 MHz @ 30 MIPS
001 = FADC/6 = Reserved, defaults to 30 MHz @ 30 MIPS
000 = FADC/4 = Reserved, defaults to 30 MHz @ 30 MIPS
If PLL is disabled (assume 15 MHz external clock as clock source):
111 = FADC/18 = 0.83 MHz @ 7.5 MIPS
110 = FADC/16 = 0.93 MHz @ 7.5 MIPS
101 = FADC/14 = 1.07 MHz @ 7.5 MIPS
100 = FADC/12 = 1.25 MHz @ 7.5 MIPS
011 = FADC/10 = 1.5 MHz @ 7.5 MIPS
010 = FADC/8 = 1.87 MHz @ 7.5 MIPS
001 = FADC/6 = 2.5 MHz @ 7.5 MIPS
000 = FADC/4 = 3.75 MHz @ 7.5 MIPS
Note: See Figure 18-2 for AD C clock derivation.
REGISTER 16-1: A/D CONTROL REGISTER (ADCON) (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 173
dsPIC30F1010/202X
REGISTER 16-2: A/D STATUS REGISTER (ADSTAT)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/C-0
H-S R/C-0
H-S R/C-0
H-S R/C-0
H-S R/C-0
H-S R/C-0
H-S
P5RDY P4RDY P3RDY P2RDY P1RDY P0RDY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR
C = Clear in software ‘1’ = Bit is set
H-S = Set by hardware ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5 P5RDY: Conversion Data for Pair #5 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
bit 4 P4RDY: Conversion Data for Pair #4 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
bit 3 P3RDY: Conversion Data for Pair #3 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
bit 2 P2RDY: Conversion Data for Pair #2 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
bit 1 P1RDY: Conversion Data for Pair #1 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
bit 0 P0RDY: Conversion Data for Pair #0 Ready bit
Bit set when data is ready in buffer, cleared when a0’ is written to this bit.
dsPIC30F1010/202X
DS70178C-page 174 Preliminary © 2006 Microchip Technology Inc.
REGISTER 16-3: A/D BASE REGISTER (ADBASE)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADBASE<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
ADBASE<7:1>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-1 ADC Base Register: This register cont ains the base address of the user’s ADC Interrupt Service Rou-
tine jump table. This register, when read, contains the sum of the ADBASE register contents and the
encoded value of the PxRDY Status bits.
The encoder logic provides the bit number of the highest priority PxRDY bits where P0RDY is the
highest priority, and P5RDY is lowest priority.
Note: The encoding results are shifted left two bits so bits 1-0 of the result are always zero.
bit 0 Unimplemented: Read as ‘0
Note: As an alternative to using the ADBASE Register, the ADCP0-5 ADC Pair Conversion Complete Interrupts
(Interrupts 37-42) can be used to invoke A to D conversion completion routines for individual ADC input
pairs. Refer to Section 16.9 “Individual Pair Interrupts”.
REGISTER 16-4: A/D PORT CONFIGURATION REGISTER (ADPCFG)
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG11 PCFG10 PCFG9 PCFG8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11-0 PCFG<11:0>: A/D Port Configuration Control bits
1 = Port pin in Digital mode, port read input enabled, A/D input multiplexor connected to AVSS
0 = Port pin in Analog mode, port read input disabled, A/D samples pin voltage
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 175
dsPIC30F1010/202X
REGISTER 16-5: A/D CONVERT PAIR CONTROL REGISTER #0 (ADCPC0)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IRQEN1: Interrupt Request Enable 1 bit
1 = Enable IRQ generation when requested conversion of channels AN3 and AN2 is completed
0 = IRQ is not generated
bit 14 PEND1: Pending Conversion Status 1 bit
1 = Conversion of channels AN3 and AN2 is pending. Set when selected trigger is asserted
0 = Conversion is complete
bit 13 SWTRG1: Software Trigger 1 bit
1 = Start conversion of AN3 and AN2 (if selected in TRGSRC bits). If other conversions are in
progress, th en conversion w ill be perform ed when the conv ersion resources are available. Thi s bit will
be reset when the PEND bit is set.
bit 12-8 TRGSRC1<4:0>: Trigger 1 Source Selection bits
Selects trigger source for conversion of analog channels AN3 and AN2.
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
bit 7 IRQEN0: Interrupt Request Enable 0 bit
1 = Enable IRQ generation when requested conversion of channels AN1 and AN0 is completed
0 = IRQ is not generated
bit 6 PEND0: Pending Conversion Status 0 bit
1 = Conversion of channels AN1 and AN0 is pending. Set when selected trigger is asserted.
0 = Conversion is complete
bit 5 SWTRG0: Software Trigger 0 bit
1 = Start conversion of AN1 and AN0 (if selected by TRGSRC bits). If other conversions are in
progress, th en conversion w ill be perform ed when the conv ersion resources are available. Thi s bit will
be reset when the PEND bit is set
dsPIC30F1010/202X
DS70178C-page 176 Preliminary © 2006 Microchip Technology Inc.
bit 4-0 TRGSRC0<4:0>: Trigger 0 Source Selection bits
Selects trigger source for conversion of analog channels AN1 and AN0.
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
REGISTER 16-5: A/D CONVERT PAIR CONTROL REGISTER #0 (ADCPC0) (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 177
dsPIC30F1010/202X
REGISTER 16-6: A/D CONVERT PAIR CONTROL REGISTER #1 (ADCPC1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN3 PEND3 SWTRG3 TRGSRC3<4:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IRQEN3: Interrupt Request Enable 3 bit
1 = Enable IRQ generation when requested conversion of channels AN7 and AN6 is completed.
0 = IRQ is not generated
bit 14 PEND3: Pending Conversion Status 3 bit
1 = Conversion of channels AN7 and AN6 is pending. Set when selected trigger is asserted.
0 = Conversion is complete
bit 13 SWTRG3: Software Trigger 3 bit
1 = Start conversion of AN7 and AN6 (if selected by TRGSRC bits). If other conversions are in
progress, th en conversion w ill be perform ed when the conv ersion resources are available. Thi s bit will
be reset when the PEND bit is set.
bit 12-8 TRGSRC3<4:0>: T ri gg er 3 Source Selection bit s
Selects trigger source for conversion of analog channels A7 and A6.
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
bit 7 IRQEN2: Interrupt Request Enable 2 bit
1 = Enable IRQ generation when requested conversion of channels AN5 and AN4 is completed
0 = IRQ is not generated
bit 6 PEND2: Pending Conversion Status 2 bit
1 = Conversion of channels AN5 and AN4 is pending. Set when selected trigger is asserted
0 = Conversion is complete
bit 5 SWTRG2: Software Trigger 2 bit
1 = Start conversion of AN5 and AN4 (if selected by TRGSRC bits). If other conversions are in
progress, th en conversion w ill be perform ed when the conv ersion resources are available. Thi s bit will
be reset when the PEND bit is set
dsPIC30F1010/202X
DS70178C-page 178 Preliminary © 2006 Microchip Technology Inc.
bit 4-0 TRGSRC2<4:0>: Trigger 2 Source Selection bits
Selects trigger source for conversion of analog channels: AN5 and AN4
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
REGISTER 16-6: A/D CONVERT PAIR CONTROL REGISTER #1 (ADCPC1) (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 179
dsPIC30F1010/202X
REGISTER 16-7: A/D CONVERT PAIR CONTROL REGISTER #2 (ADCPC2)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN5 PEND5 SWTRG5 TRGSRC5<4:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN4 PEND4 SWTRG4 TRGSRC4<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
.
bit 15
IRQEN5:
Interrupt Request Enable 5 bit
1 = Enable IRQ generation when requested conversion of channels AN11 and AN10 is completed
0 = IRQ is not generated
bit 14 PEND5: Pending Conversion Status 5 bit
1 = Conversion of channels AN11 and AN10 is pending. Set when selected trigger is asserted
0 = Conversion is complete
bit 13 SWTRG5: Software Trigger 5 bit
1 = Start conversion of AN11 and AN10 (if selected by TRGSRC bits). If other conversions are in
progress, th en conversion w ill be perform ed when the conv ersion resources are available. Thi s bit will
be reset when the PEND bit is set.
bit 12-8 TRGSRC5<4:0>: Trigger Source Selection 5 bits
Selects trigger source for conversion of analog channels A11 and A10.
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
bit 7 IRQEN4: Interrupt Request Enable 4 bit
1 = Enable IRQ generation when requested conversion of channels AN9 and AN8 is completed
0 = IRQ is not generated
bit 6 PEND4: Pending Conversion Status 4 bit
1 = Conversion of channels AN9 and AN8 is pending. Set when selected trigger is asserted.
0 = Conversion is complete
bit 5 SWTRG4: Software Trigger 4 bit
1 = Start conversion of AN9 and AN8 (if selected by TRGSRC bits). If other conversions are in
progress, th en convers ion will be perfo rmed when the conversio n resources are availab le. This bit will
be reset when the PEND bit is set.
dsPIC30F1010/202X
DS70178C-page 180 Preliminary © 2006 Microchip Technology Inc.
bit 4-0 TRGSRC4<4:0>: Trigger Source Selection 4 bits
Selects trigger source for conversion of analog channels: AN9 and AN8
00000 = No conversion enabled
00001 = Individual software trigger selected
00010 = Global software trigger selected
00011 = PWM Special Event Trigger selected
00100 = PWM generator #1 trigger selected
00101 = PWM generator #2 trigger selected
00110 = PWM generator #3 trigger selected
00111 = PWM generator #4 trigger selected
01100 = Timer #1 period match
01101 = Timer #2 period match
01110 = PWM GEN #1 current-limit ADC trigger
01111 = PWM GEN #2 current-limit ADC trigger
10000 = PWM GEN #3 current-limit ADC trigger
10001 = PWM GEN #4 current-limit ADC trigger
10110 = PWM GEN #1 fault ADC trigger
10111 = PWM GEN #2 fault ADC trigger
11000 = PWM GEN #3 fault ADC trigger
11001 = PWM GEN #4 fault ADC trigger
REGISTER 16-7: A/D CONVERT PAIR CONTROL REGISTER #2 (ADCPC2) (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 181
dsPIC30F1010/202X
16.4 ADC Result Buffer
The ADC module contains up to 12 data output regis-
ters to store the A/D results called ADCBUF<11:0>.
The registers are 10 bits wide, but are read into differ-
ent format, 16-bit words. The buffers are read-only.
Each analog input has a corresponding data
output register.
This module DOES NOT include a circular data
buffer or FIFO. Because the conversion results may
be produced in any order, such schemes will not work
since there would be no means to determine which
data is in a specific location.
The SAR write to the buffers is synchronous to the
ADC clock. Reads from the buffers will always have
valid data assuming that the data-ready interrupt has
been processed.
If a buffer location has not been read by the software
and the SAR needs to overwrite that location, the
previous data is lost.
Reads from the result buffer pass through the data for-
matter. The 10 bi t s of the res ult data are form att ed in to
a 16-bit word.
16.5 Application Information
The ADC module implements a concept based on
“Conversion Pairs”. In power conversion applications,
there is a need to measure voltages and currents for
each PWM control loop. The ADC module enables the
sample and conversion process of each conversion
pair to be precisely timed relative to the PWM signals.
In a user’s application circuit, the PWM signal enables
a transisto r, which all ows an induc tor to charge up with
current to a desired value. The long er a PWM signal is
on, the longer the inductor is charging, and therefore
the inductor current is at its maximum at the end of the
PWM signal. Often, this is the point where the user
wants to ta ke the current and voltage measurements.
Figur e 16-2 shows a ty pic al power co nv ers ion appl ic a-
tion (a boost converter) where the current sensing of
the induc tor is don e by mon itorin g the vol tage acr oss a
resistor in series with the power transistor that
“charges” the inductor. The significant feature of this
figure is that if the sampling of the resistor voltage
occurs slightly later than the desired sample point, the
data read will be zero. This is not acceptable in most
applications. The ADC module always samples the
analog voltages at the appointed time regardless of
whether the ADC converter is busy or not.
The Power Supply PWM module supports 2-4 indepen-
dent PWM c hannels a s wel l as 2-4 t rigg er s ign als (on e
per PWM generator). The user can configure these
channels to initiate an ADC conversion of a selected
input pair at the proper time in the PWM cycle. The
Power Supply PWM module also provides an addi-
tional trigger signal (Special Event Trigger), which can
be programmed to occur at a specified time during the
primary ti me base count cycle.
FIGURE 16-2: APPLICATION EXAMPLE: IMPORTANCE OF PRECISE SA MPLI NG
X
PWM
IL
IR
X
X
Late sample yields
zero data
Desired sample point
Critical Edge
+VIN IL
L
PWM
VISENSE
VOUT
COUT
+
IR
R
Measuring peak inductor current is very important
Example Boost Converter
dsPIC30F1010/202X
DS70178C-page 182 Preliminary © 2006 Microchip Technology Inc.
16.6 Reverse Conversion Order
The ORDER control bit in the ADCON register, when
set, rever ses the order of the input pa ir conversion pro-
cess. Normally (ORDER = 0), the even numbered
input of an in put p air is converted first and then the od d
numbered input is converted. If ORDER = 1, the odd
numbered input pin of an input pair is converted first,
followed by the even numbered pin.
This feature is useful when using voltage control
modes and using the early interrupt capability
(EIE = 1). These features enable the user to minimize
the time period from actual acquisition of the feedback
(ADC) data to the update of the control output (PWM).
This time from input to output of the control system
determines the ov erall stab ility of the control system.
16.7 Simultaneous and Sequential
Sampling in a pair
The inputs that have dedicated Sample and Hold
(S&H) circui t s a re s amp le d w hen the ir s pecified trigger
events occur. The inputs that share the common sam-
ple and hold circuit are sampled in the following
manner:
1. If the SEQSAMP bit = 0, and the common
(shared) sample and hold circuit is NOT busy,
then the shared S&H will sample their specified
input at the same time as the dedicated S&H.
This action provides “Simul taneous” sample and
hold functionality.
2. If the SEQSAMP bit = 0, and the shared S&H is
currently busy with a conversion in progress,
then the shared S&H will sample as soon as
possible (at the start of the new conversion
process for the pair).
3. If the SEQSAMP bit = 1, then the shared S&H
will sample at the start of the conversion process
for that in put. For ex ample: If th e ORDER bit = 0
the shared S&H will sample at the start of the
conversion of the second input. If ORDER = 1,
then the shared S&H will sample at the start of
the conversion for the first input.
The SEQSAMP bit is useful for some applica-
tions that want to minimize the time from a
sample event to the conversion of the sample.
When SEQSAMP = 0, the logi c attem pt s to t ake
the samp les for both in put s of a pai r at the same
time if the reso urces are available. T he user can
often ensure that the ADC will not be busy with
a prior conversion by controlling the timing of the
trigger signals that initiate the conversion
processes.
16.8 Group Interrupt Generation
The ADC m odu le p rov ide s a com m on o r “G roup ” int er-
rupt requ est that is the OR o f all of th e enabled interrupt
sources within the module. Each CPC register has two
IRQENx bits, one for each analog input pair. If the
IRQEN bit is set, an interrupt request is made to the
interrupt controller when the requested conversion is
completed. When an interrupt is generated, an asso-
ciated PxRDY bit in the ADSTAT register is set. The
PxRDY bit is cleared by the user. The user’s software
can examine the ADSTAT register’s PxRDY bits to
determine if additional requested conversions have
been completed.
The group inte rrup t is use ful for applica tio ns that use a
common software routine to process ADC interrupts for
multiple analog input pairs. This method is more
tradit ion al in con ce pt.
Note: The us er must cle ar the IFS bit associ ated
with the ADC in the interrupt controller
before the PxRDY bit is cleare d. Failure to
do so m ay caus e i nte rrupts to be los t. Th e
reason is that the ADC will possibly have
another interrupt pending. If the user
clears the PxRDY bit first, the ADC may
generate another interrupt request, but if
the user then clears the IFS bit, the
interrupt request will be erased.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 183
dsPIC30F1010/202X
16.9 Individual Pair Interrupts
The ADC module also provides individual interrupts
output s for each a nalog input pai r. These i nterrupt s a re
always enabled within the module. The pair interrupts
can be individually enabled or disabled via the
associated interrupt enable bits in the IEC registers.
Using the group interrupts may require the interrupt
service routine to determine which interrupt source
generated the interrupt. For applications that use sep-
arat e software tasks to pro cess ADC da ta, a common
interrupt vector can cause performance bottlenecks.
The use of the indivi dual p ai r interrup ts c an save many
clock cycles compared to using the group interrupt to
process multiple interrupt sources. The individual pair
interrupts support the construction of application
software that is responsive and organized on a task
basis.
Regardless of whether an individual p air interrupt or the
global interrupt are used to respond to an interrupt
request from an ADC conversion, the PxRDY bit s in the
ADSTAT register function in the same manner.
The use of the individual pair interrupts also enables
the user to change the interrupt priority of individual
ADC channels (pairs) as compared to the fixed priority
structure of the group interrupt.
NOTE: The use of individual interrupts DOES NOT
affect the pr iority structur e of the ADC with respect
to the order of input pair conversion.
The us e of indi vidual interrup ts c an reduce the prob lem
of accidently “losing” a pending interrupt while
processing and clearing a current interrupt
16.10 Early Interrupt Generation
The EIE control bit in the ADCON register enables the
generation of the interrupts after completion of the first
convers ion instead of wai ting for the completio n of both
inputs of an input pair. Even though the second input
will still be in the conversion process, the software can
be written to perform some of the computations using
the first data value while the second conversion is
completed.
The use r softwa re can be written to acco unt for the 500
nsec conversion period of the second input before
using the second data, or the user can poll the PEND
bit in the ADCPCx register.
The PEND bit remains set until both conversions of a
pair h ave been compl eted. The PxRD Y bit for the ass o-
ciated interrupt is set in the ADSTAT register at the
comple tion of the first con version, and remain s set until
it is cleared by the user.
16.11 Conflict Resolution
If more than one conversion pair request is active at the
same time, the ADC control logic processes the
requests in a top-down manner, starting at analog pair
#0 (AN1/AN0) and ending at analog pair #5 (AN11/
AN10). This is not a “round-robin” process.
16.12 Deliber ate Conflicts
If the user specifies the same conversion trigger source
for multiple “conversion pairs”, then the ADC module
function s like o ther dsPIC3 0F ADC module s; i.e., it pro-
cesses the requested conversions sequentially (in
pairs) until the sequence has been completed.
16.13 ADC Clock Selection
The ADCS<2:0> bits in the ADCON register specify the
clock divisor value for the ADC clock generation logic.
The input to the ADC clock divisor is the system clock
(240 MHz @ 30 MIPS) when the PLL is operating. This
high-frequency clock provides the needed timing reso-
lution to generate a 24 MHz ADC clock signal required
to process two ADC conversions in 1 microsecond.
16.14 ADC Base Register
It is expected that the user application may have the
ADC module generate 500,000 interrupts per second.
To speed the evaluation of the PxRDY bits in the
ADSTAT register, the ADC module features the read/
write regis ter: ADBASE. Wh en read , th e ADBASE re g-
ister provides a sum of the contents of the ADBASE
register plus an encoding of the PxRDY bits set in the
ADSTAT register.
The Least Significant bit of the ADBASE register is
forced to zero, which ensures that all (ADBASE +
PxRDY) results are on instruction boundaries.
The PxRDY b it s are b ina ry pr iori ty e nc ode d; P0RD Y i s
the highest priority and P5RDY is the lowest priority.
The encoded priority result is shifted left two bit posi-
tions and added to the contents of the ADBASE regis-
ter. Thus the priority encoding yields addresses that
are on two instruction word boundaries.
The user will typically load the ADBASE register with
the base address of a “J ump ” table that contains either
the addresses of the appropriate ISRs or branches to
the appropriate ISR. The encoded PxRDY values are
set up to reserve two instruction words per entry in the
Jump table. It is expected that the user software will
use one instruction word to load an identifier into a W
register, and the other instruction will be a branch to
the appropriate ISR.
Note: The ADC module will NOT repeatedly loop
once triggered. Each sequence of
conversions requires a trigger or multiple
triggers.
dsPIC30F1010/202X
DS70178C-page 184 Preliminary © 2006 Microchip Technology Inc.
Example 16-1 shows a code sequence for using the
ADBASE register to implement ADC Input Pair Inter-
rupt Handling. When the ADBASE register is read, it
cont ains th e sum of the bas e addre ss of th e jump tabl e
and the encoded ADC channel pair number left shifted
by 2 bits.
For example, if ADBASE is initialized with a value of
0x0360, a channel pair 1 interrupt would cause an
ADBASE read value of 0x0364 (0x360 +
0b00000100). A channel pair 3 interrupt would cause
an ADBASE read value of 0x036C (0x360 +
0b00001100).
EXAMPLE 16-1: ADC BASE REGISTER CODE
; Initialize and enable the ADC interrupt
MOV #handle(JMP_TBL),W0 ; Load the base address of the ISR Jump
MOV WO, ADBASE ; table in ADBASE.
BSET IPC2,#12 ; Set up the interrupt priority
BSET IPC2,#13
BSET IPC2,#14
BCLR IFS0,#11 ; Clear any pending interrupts
BCLR ADSTAT ; Clear the ADC pair interrupts as well
BSET IEC0,#11 ; Enable the interrupt
; Code to Initialize the rest of the ADC registers
...
...
...
; ADC Interrupt Handler
__ADCInterrupt:
PUSH.S ; Save WO-W3 and SR registers
BCLR IFSO,#11 ; Clear the interrupt
MOV ADBASE, W0 ; ADBASE contains the encoded jump address
GOTO W0 ; within JMP_TBL
; Here's the Jump Table
; Note: It is important to clear the individual IRQ flags in the ADC AFTER the IRQ flags
in the interrupt controller. Failure to do so may cause interrupt requests to be lost
JMP_TBL:
BCLR ADSTAT,#0 ; Clear the IRQ flag in the ADC
BRA ADC_PAIR0_PROC ; Actual Pair 0 Conversion Interrupt Handler
BCLR ADSTAT,#1 ; Clear the IRQ flag in the ADC
BRA ADC_PAIR1_PROC ; Actual Pair 1 Conversion Interrupt Handler
BCLR ADSTAT,#2 ; Clear the IRQ flag in the ADC
BRA ADC_PAIR2_PROC ; Actual Pair 2 Conversion Interrupt Handler
BCLR ADSTAT,#3 ; Clear the IRQ flag in the ADC
BRA ADC_PAIR3_PROC ; Actual Pair 3 Conversion Interrupt Handler
BCLR ADSTAT,#4 ; Clear the IRQ flag in the ADC
BRA ADC_PAIR4_PROC ; Actual Pair 4 Conversion Interrupt Handler
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 185
dsPIC30F1010/202X
EXAMPLE 16-1: ADC BASE REGISTER CODE (CONTINUED)
16.15 Changing A/D Clock
In genera l, the ADC ca nnot accept c hanges to th e ADC
clock d ivisor whi le ADON = 1. If the user makes A/D
clock changes while ADON = 1, the results will be
indeterminate.
16.16 Sample and Conversion
The ADC module always assigns two ADC clock peri-
ods for the sampling process. When operating at the
maximum conversion rate of 2 Msps per channel, the
sampling period is:
2 x 41.6 nsec = 83.3 nsec.
Each ADC pair specified in the ADCPCx registers ini-
tiates a sample operation when the selected trigger
event occurs. The conversion of the sampled analog
data occurs as resources become available.
If a new trigger event occurs for a specific channel
before a previous sample and convert request for that
channel has been processed, the newer request is
ignored. It is the user’s responsibility not to exceed the
conversion rate capability for the module.
The actual conversion process requires 10 additional
ADC cloc ks. The conve rsion i s proce ssed seriall y, bit 9
first, then bit 8, down to bit 0. The re sul t i s st ored whe n
the conversion is completed.
; The actual pair conversion interrupt handler
; Don't forget to pop the stack when done and return from interrupt
ADC_PAIR0_PROC:
... ; The ADC pair 0 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
ADC_PAIR1_PROC:
... ; The ADC pair 1 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
ADC_PAIR2_PROC:
... ; The ADC pair 2 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
ADC_PAIR3_PROC:
... ; The ADC pair 3 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
ADC_PAIR4_PROC:
... ; The ADC pair 4 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
ADC_PAIR5_PROC:
... ; The ADC pair 5 conversion complete handler
POP.S ; Restore W0-W3 and SR registers
RETFIE ; Return from Interrupt
dsPIC30F1010/202X
DS70178C-page 186 Preliminary © 2006 Microchip Technology Inc.
16.17 A/D Sample and Convert T iming
The samp le and ho ld circuit s assig ned to the inpu t pins
have their own timing logic that is triggered when an
external sample and convert request (from PWM or
TMR) is made. The sample and hold circuits have a
fixed two clock data sample period. When the sample
has been acquired, then the ADC control logic is noti-
fied of a pending requ es t, then the con ve r si on is
performed as the conversion resources become
available.
The ADC mo dule al ways conv erts p airs of analog inp ut
chann els, s o a ty pical co nvers ion pr oces s requi res 24
clock cycles.
FIGURE 16-3: DETAILED CONVERSION SEQU ENCE TIMINGS, SEQSAMP = 0, NOT BUSY
10th 9th 8th 7th 6th 5th 4th 3rd 2nd 1st
TAD
adc_clk
sample_even
convert_en
capture_first_data
10th 9th 8th 7th 6th 5th 4th 3rd 2nd 1st
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 0 1
2
0 1 2 3
connect_second
connect_first
state counter
capture_second_data
sample_odd
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 187
dsPIC30F1010/202X
FIGURE 16-4: DETAILED CONVERSION SEQU ENCE TIMINGS, SEQSAMP = 1
10th 9th 8th 7th 6th 5th 4th 3rd 2nd 1st
TAD
adc_clk
sample_even
convert_en
capture_first_data
10th 9th 8th 7th 6th 5th 4th 3rd 2nd 1st
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 00 1 2 3
sample_odd(1)
connect_second
connectx_en
state counter
capture_second_data
connect_common
sample_odd(2)
Dependent on S&H availability
Note 1: For all analog input pairs that do not have dedicated sample and hold circuits, the common sample and hold circuit
samples the input at the start of the first and second conversions. Therefore, the s amples are sequential, not
simultaneous.
2: For all analog input p airs that have dedicated sample and hold circuits, the common sample and hold circuit samples
the input at the start of the first conversion so that both samples (odd and even) are near simultaneous.
dsPIC30F1010/202X
DS70178C-page 188 Preliminary © 2006 Microchip Technology Inc.
16.18 Module Power-Down Modes
The module has two internal power modes.
When the AD ON bit is 1’, the module is in Active mode
and is fully powered and functional.
When ADON is ‘0, the module is in Of f mode. The state
machine for the module is reset, as are all of the
pending conversion requests.
To return to the Active mode from Off mode, the user
must wait for the bias generators to stabilize. The
stabilization time is specified in the electrical specs.
16.19 Effects of a Reset
A device Reset forces all registers to their Reset state.
This forces the ADC module to be turned off, and any
conversion and sampling sequence is aborted. The
value that is in the ADCBUFx register is not modified.
The ADCBUFx registers contain unknown data after a
Power-on Reset.
16.20 Configuring Analog Port Pins
The use of the ADPC FG and TRIS registers control the
operation of the A/D port pins.
The port pins that are desired as analog inputs should
have their corresponding TRIS bit set (input). If the
TRIS bi t is cleared (ou tput), the dig ital outp ut level (V OH
or VOL) will be converted.
Port pins that are desired as analog inputs must have
the corresponding ADPCFG bit clear. This will config-
ure the port to disable the digital input buffer. Analog
levels on pins where ADPCFG<n> = 1, may cause the
digit al input buffer to consum e exc essi ve curren t.
If a pin is not configured as an analog input
ADPCFG<n> = 1, the analog input is forced to AVss,
and conversions of that input do not yield meaningful
results.
When r eading the POR T regist er , all pins co nfigured as
analog input ADPCFG<n> = 0 will read ‘0’.
The A/D operation is independent of the state of the
input sele cti on bits and the TRIS bit s.
16.21 Outp ut Formats
The A/D converts 10 bits. The data buffer RAM is 16
bits wi de . The A DC da ta ca n be re a d in on e of t w o dif -
ferent form ats , as sh own in Fig ure 16-5. The FOR M bit
selects the format. Each of the output formats
translates to a 16-bit result on the data bus.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 189
dsPIC30F1010/202X
FIGURE 16-5: A/D OUTPUT DATA FORMAT
RAM contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Fractional d09d08d07d06d05d04d03d02d01d0000000 0
Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
dsPIC30F1010/202X
DS70178C-page 190 Preliminary © 2006 Microchip Technology Inc.
TABLE 16-1: ADC REGISTER MAP
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets
ADCON 0300 ADON —ADSIDL—GSWTRG FORM EIE ORDER
SEQSAMP
ADCS<2:0> 0009
ADPCFG 0302
PCFG11
PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
Reserved 0304 0000
ADSTAT 0306 P5RDY P4RDY P3RDY P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A
IRQEN1
PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C
IRQEN3
PEND3 SWTRG3 TRGSRC3<4:0> IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCPC2 030E
IRQEN5
PEND5 SWTRG5 TRGSRC5<4:0> IRQEN4 PEND4 SWTRG4 TRGSRC4<4:0> 0000
Reserved 0310
031E
—- 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
ADCBUF6 032C ADC Data Buffer 6 xxxx
ADCBUF7 032E ADC Data Buffer 7 xxxx
ADCBUF8 0330 ADC Data Buffer 8 xxxx
ADCBUF9 0332 ADC Data Buffer 9 xxxx
ADCBUF10 0334 ADC Data Buffer 10 xxxx
ADCBUF11 0336 ADC Data Buffer 11 xxxx
Reserved 0338
– 037E 0000
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 191
dsPIC30F1010/202X
17.0 SMPS COMPARATOR MODULE
The dsPIC30F SMPS Comparator module monitors
current and/or voltage transients that may be too fast
for the CPU and ADC to capture.
17.1 Features Overview
16 comparator inputs
10-bit DAC provides reference
Programmable output polarity
Interrupt generation capability
Selectable Input sources
DAC has three ranges of operation:
-AV
DD / 2
- Internal Reference 1.2V 1%
- External Reference < (AVDD - 1.6V)
ADC sample and convert trigger capability
Can be disabled to reduce power consumption
Functional support for PWM Module:
- PWM Duty Cyc le Control
- PWM Period Control
- PWM Fault Detect
FIGURE 17-1: COMPARATOR MODULE BLOCK DIAGRAM
17.2 Module Applications
This module provides a means for the SMPS dsPIC
DSC devices to monitor voltage and currents in a
power conversion application. The ability to detect
tran si e nt co nd i tio ns an d s ti mu l ate th e dsPI C D SC pro -
cessor and/or p eripherals without re quirin g the pro ces-
sor and ADC to c onsta ntly m onito r volt ages or cu rrent s
frees the dsPIC DSC to perform other tasks.
The Com p a rator module has a hig h-s pee d co mparator
and an associated 10-bit DAC that provides a pro-
grammable reference voltage to one input of the com-
parator. The polarity of the comparator output is user
programmable. The output of the module can be used
in the following modes:
Generate an interrupt
Trigger an ADC sample and convert process
Truncate the PWM signal (current limit)
Truncate the PWM period (current minimum)
Disab le the PWM outputs (Fault-latch)
The output of the Comparator module may be used in
multiple modes at the same time, such as: (1) gener-
ate an interrupt, (2) have the ADC take a sample and
convert it and (3) truncate the PWM output in
response to a voltage being detected beyond its
expected value.
The Comparator module can also be used to wake-up
the system from Sleep or Idle mode when the analog
input voltage exceeds the programmed threshold
voltage.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
CMPxA*
CMPxC*
DAC
CMPPOL
0
1
AVDD/2
INTREF
AVSS
M
U
X
CMREF
CMP
x
*
RANGE
INSEL<1:0>
10
Trigger to PWM
Interrupt Request
CMPxB*
CMPxD*
Glitch Filter Pulse Generator
Status
EXTREF
M
U
X
* x=1, 2, 3 & 4
dsPIC30F1010/202X
DS70178C-page 192 Preliminary © 2006 Microchip Technology Inc.
17.3 Module Description
The Comparator module uses a 20 nsec comparator.
The comparator offset is ±5 mV typical. The negative
input of the comparator is always connected to the
DAC circuit. The positive input of the comparator is
connected to an analog multiplexer that selects the
des ired source pin.
17.4 DAC
The range of the DAC is controlled via an analog mul-
tiplexer that selects either AVDD/2, internal 1.2V 1%
reference, or an external reference source EXTREF.
The full range of the DAC (AVDD/2) will typically be
used when the chosen input source pin is shared with
the ADC. The reduced range option (INTREF) will
likely be used when monitoring current levels via a
CLx pin using a current sense resistor. Usually, the
measured voltages in such applications are small
(<1.25V), therefore the option of using a reduced ref-
erence range for the comparator extends the available
DAC resolution in these applications. The use of an
external reference enables the user to connect to a
reference that better suits their application.
17.5 Interaction with I/O Buff ers
If the comparator module is enabled and a pin has
been selected as the source for the comparator, then
the chos en I/O p a d m ust dis able the d igi tal input buffer
associated with the pad to prevent excessive currents
in the digital buffer due to analog input voltages.
17.6 Digital Logic
The CMPCONx register (see Register 17-1) provides
the control logic that configures the Comparator mod-
ule. The di gital logic provid es a gli tch filter for the com-
parator output to mask transient signals less than two
TCY (66 nsec) in duration. In Sleep or Idle mode, the
glitch filter is bypassed to enable an asynchronous
path from the comparator to the interrupt controller.
This asynchronous path can be used to wake-up the
processor from Sleep or Idle mode.
The comparator can be disabled while in Idle mode if
the CMPSIDL bit is set. If a device has multiple com-
parators, if any CMPSIDL bit is set, then the entire
group of comparators will be disabled while in Idle
mode. This behavior reduces complexity in the design
of the clock control logic for this module.
The digital logic also provides a one TCY width pulse
generator for triggering the ADC and generating
interrupt requests.
The CMPDACx (see Register 17-2) register provides
the digital input value to the reference DAC.
If the module is di sa ble d, th e D AC and comp arator are
disabled to reduce power consumption.
17.7 Comparator Input Range
The comparator has a limitation for the input Common
Mode Range (CMR) of about 3.5 volts (AVDD – 1.5
volts). This means that both inputs should not exceed
this value, or the comparator’s output will become
indeterminate. As long as one of the inputs is within
the C ommon M ode R ange, t he co mparator outpu t will
be correct. An input ex cu rsi on in to the C MR reg ion will
not corrupt the comparator output, but the comparator
input is saturated.
17.8 DAC Output Range
The DAC has a limitation for the maximum reference
voltage input of (AVDD - 1.6) volts. An external refer-
ence voltage input s ho uld not ex ceed this val ue o r the
reference DAC output will become indeterminate.
17.9 Comparator Registers
The Comparator module is controlled by the following
registers:
Compara tor Contr ol Re gisterx (CMPCONx)
Comparator DAC Control Registerx (CMPDACx)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 193
dsPIC30F1010/202X
REGISTER 17-1: COMPARATOR CONTROL REGISTERX (CMPCONx)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
CMPON CMPSIDL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CMPON: A/D Operating Mode bit
1 = Comparator module is enabled
0 = Comparator module is disabled (reduces power consumption)
bit 14 Unimplemented: Read as ‘0
bit 13 CMPSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode.
0 = Continue module operation in Idle mode.
If a device has multiple comparators, any CMPSIDL bit set to ‘1’ disables ALL comparators while in
Idle mode.
bit 12-8 Reserved: Read as ‘0
bit 7-6 INSEL<1:0>: Input Source Select for Comparator bits
00 = Select CMPxA input pin
01 = Select CMPxB input pin
10 = Select CMPxC input pin
11 = Select CMPxD input pin
bit 5 EXTREF: Enable External Reference bit
1 = External source provides reference to DAC
0 = Internal reference sources provide source to DAC
bit 4 Reserved: Read as ‘0
bit 3 CMPSTAT: Current State of Comparator Output Including CMPPOL Selection bit
bit 2 Reserved: Read as ‘0
bit 1 CMPPOL: Comparator Output Polarity Control bit
1 = Output is inverted
0 = Output is non inverted
bit 0 RANGE: Selects DAC Output Voltage Range bit
1 = High Range: Max DAC value = AVDD / 2, 2.5V @ 5 volt VDD
0 = Low Range: Max DAC val ue = IN TREF, 1.2V ±1%
dsPIC30F1010/202X
DS70178C-page 194 Preliminary © 2006 Microchip Technology Inc.
REGISTER 17-2: COMPARATOR DAC CONTROL REGISTERX (C MPDACx )
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
—CMREF<9:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CMREF<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Reserved: Read as ‘0
These bits are reserved for possible future expansion of the DAC from 10 bits to more bits.
bit 9-0 CMREF<9:0>: Comp arator Reference Voltage Select bits
1111111111 = (CMREF * INTREF/102 4) or (CMREF * (AVDD/2)/10 24) vo lt s dependi ng on Ran ge bi t
·····
0000000000 = 0.0 v o lts
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 195
dsPIC30F1010/202X
TABLE 17-1: ANALOG COMPARATOR CONTROL REGISTER MAP
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CMPCON1 04C0 CMPON CMPSIDL INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC1 04C2 CMREF<9:0> 0000
CMPCON2 04C4 CMPON CMPSIDL INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC2 04C6 CMREF<9:0> 0000
CMPCON3 04C8 CMPON CMPSIDL INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC3 04CA CMREF<9:0> 0000
CMPCON4 04CC CMPON CMPSIDL INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC4 04CE CMREF<9:0> 0000
dsPIC30F1010/202X
DS70178C-page 196 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 197
dsPIC30F1010/202X
18.0 SYSTEM INTEGRATION
There are several features intended to maximize sys-
tem reliability, minimize cost through elimination of
external components, provide power-saving operating
modes and of fer code protecti on:
Oscillator Selection
Reset:
- Power-on Reset (P OR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
Watchdog Timer (WDT)
Power-Saving modes (Sleep and Idle)
Code Protection
Unit ID Locations
In-Circuit Serial Programming (ICSP)
programming capability
dsPIC30F devices have a Watchdog Timer, which can
be permanently enabled via the Configuration bits or
can be soft w are co ntro ll ed. It run s off its own RC os ci l-
lator f or added reliabilit y . Ther e are two timers that of fer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT), which provides a delay
on power-up only, designed to keep the part in Reset
mode w hile th e power supply stab ilizes. With thes e two
timers on-chip, most applications need no external
Reset circuitry.
Sleep mode is designed to offer a very low-current
Power-Down mode. The us er ca n wake -up fro m Slee p
mode through external Reset, Watchdog Timer Wake-
up or through an interrupt. Several oscillator options
are also made available to allow the part to fit a wide
variety of applications. In the Idle mode, the clock
sources are st ill a ctive , but the CP U is shut of f. The RC
oscillator opt ion saves system cost, while the LP cryst al
option saves power.
18.1 Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
Various external and internal oscillator options as
clock sources
An on-chip PLL to boost internal operating
frequency
A clock switching mechanism between various
clock sources
Programm abl e c loc k pos t s ca ler for system po w er
savings
A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe meas ures
Clock Control register OSCCON
Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR). Thereafter, the clock source
can be changed between permissible clock sources.
The OSC CON re gister c ontrols th e clock swit ching an d
reflects system clock related status bits.
A simplified diagram of the oscillator system is shown
in Figure 18-1.
18.2 Oscillator Control Registers
The oscillators are controlled with these registers:
OSCCON: Oscillat or Control Register
OSCTUN2: Oscillator Tuning Register 2
LFSR: Linear Feedback Shift Register
FOSCSEL: Oscillator Selection Configuration Bits
FOSC: Osci lla tor Selection C onfi gu ratio n Bit s
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
For more information on the device instruction set and pro-
gramming, refer to the dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: 32 kHz crystal operation is not enabled on
dsPIC30F1010/202X devices.
dsPIC30F1010/202X
DS70178C-page 198 Preliminary © 2006 Microchip Technology Inc.
FIGURE 18-1: OSCILLATOR SYSTEM BLOCK DIAGRAM
Primary
OSC1
OSC2 Oscillator
Clock
and Control
Block
Switching
x32
PLL
Primary
Oscillator
Stability Detector
Oscillator
Start-up
Timer
Fail-Safe Clock
Monitor (FSCM )
Internal Fast RC
Oscillator (FRC)
Internal
Low-Power RC
Oscillator (LPRC)
PWRSAV Instruction
Wake-up Request
Oscillator Configuration Bits
System Cl ock FCY
Oscillator Trap
POR Done
Primary Osc
FPLL
FCKSM<1:0> 2
PLL Lock
COSC<2:0>
NOSC<2:0>
OSWEN
CF
TUN<3:0>
4
FPWM
Clock Dither
Circuit
x16
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 199
dsPIC30F1010/202X
REGISTER 18-1: OSCCON: OSCILLATOR CONTROL REGISTER
U-0 R-y
HS,HC R-y
HS,HC R-y
HS,HC U-0 R/W-y R/W-y R/W-y
—COSC<2:0>—NOSC<2:0>
bit 15 bit 8
R/W-0 U-0 R-0
HS,HC R/W-0 R/C-0
HS,HC R/W-0 U-0 R/W-0
HC
CLKLOCK LOCK PRCDEN CF TSEQEN OSWEN
bit 7 bit 0
Legend: x = Bit is unknown
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR
HC = Cleared by hardware ‘1’ = Bit is set
HS = Set by hardware ‘0’ = Bit is cleared
-y = Value set from Configuration bits on POR
bit 15 Unimplemented: Read as ‘0
bit 14-12 COSC<2:0>: Current Oscillator Group Selection bits (read-only)
000 = Fast RC Oscillator (FRC)
001 = Fast RC Oscillator (FRC) with PLL Module
010 = Primary Oscillator (HS, EC)
011 = Primary Oscillator (HS, EC) with PLL Module
100 = Reserved
101 = Reserved
110 = Reserved
111 = Reserved
This bit is Reset upon:
Set to FRC value (‘000’) on POR
Loaded with NOSC<2:0> at the completion of a successful clock switch
Set to FRC value (‘000’) when FSCM detects a failure and switches clock to FRC
bit 11 Unimplemented: Read as ‘0
bit 10-8 NOSC<2:0>: New Oscillator Group Selection bits
000 = Fast RC Oscillator (FRC)
001 = Fast RC Oscillator (FRC) with PLL Module
010 = Primary Oscillator (HS, EC)
011 = Primary Oscillator (HS, EC) with PLL Module
100 = Reserved
101 = Reserved
110 = Reserved
111 = Reserved
bit 7 CLKLOCK: Clock Lock Enab led bit
1 = If (FCKSM1 = 1), then clock and PLL configurations are locked
If (FCKSM1 = 0), then clock and PLL configurations may be modified
0 = Clock and PLL selection are not locked, configurations may be modified
Note: Once set, this bit can only be cleared via a Reset.
bit 6 Unimplemented: Read as ‘0
dsPIC30F1010/202X
DS70178C-page 200 Preliminary © 2006 Microchip Technology Inc.
bit 5 LOCK: PLL Lock Sta tus bit (read-o nly)
1 = Indicates that PLL is in lock
0 = Indicates that PLL is out of lock (or disabled)
This bit is Reset upon:
Reset on POR
Reset when a valid clock switching sequence is initiated by the clock switch state machine
Set when PLL lock is achieved after a PLL start
Reset when lock is lost
Read zero when PLL is not selected as a Group 1 system clock
bit 4 PRCDEN: Pseudo Random Clock Dither Enable bit
1 = Pseudo random clock dither is enabled
0 = Pseudo random clock dither is disabled
bit 3 CF: Clock Fail Detect bit (read/clearable by application)
1 = FSCM has detected clock failure
0 = FSCM has NOT detected clock failure
This bit is Reset upon:
Reset on POR
Reset when a valid clock switching sequence is initiated by the clock switch state machine
Set when clock fail detected
bit 2 TSEQEN: FRC Tune Sequencer Enable bit
1 = The TUN<3:0>, TSEQ1<3:0>, ... , TSEQ7<3:0> bits in the OSCTUN and the OSCTUN2 regis-
ters sequentially tune the FRC oscillator. Each field being sequentially selected via the
ROLL<2:0> signals from the PWM module.
0 = The TUN<3:0> bits in OSCTUN register tunes the FRC oscillator
bit 1 Unimplemented: Read as ‘0
bit 0 OSWEN: Oscillator Switch Enable bit
1 = Request oscillator switch to selection specified by NOSC<1:0> bits
0 = Oscillator switch is complete
This bit is Reset upon:
Reset on POR
Reset after a successful clock switch
Reset after a redundant clock switch
Reset after FSCM switches the oscillator to (Group 3) FRC
REGISTER 18-1: OSCCON: OSCILLATOR CONTROL REGISTER (CONTINUED)
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 201
dsPIC30F1010/202X
REGISTER 18-2: OSCTUN: OSCILLATOR TUNING REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TSEQ3<3:0> TSEQ2<3:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TSEQ1<3:0> TUN<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 TSEQ3<3:0>: Tune Sequence Value #3 bits
When PWM ROLL<2:0> = 011, this field is used to tune the FRC instead of TUN<3:0>
bit 11-8 TSEQ2<3:0>: Tune Sequence Value #2 bits
When PWM ROLL<2:0> = 010, this field is used to tune the FRC instead of TUN<3:0>
bit 7-4 TSEQ1<3:0>: Tune Sequence Value #1 bits
When PWM ROLL<2:0> = 001, this field is used to tune the FRC instead of TUN<3:0>
bit 3-0 TUN<3:0>: Specifies the user tuning capability for the internal fast RC oscillator . If the TSEQEN bit
in the OSC CON registe r is set, thi s field, along with bit s TSEQ1-TSEQ 7, will sequ entially tune the
FRC oscillator.
0111 = Maximu m frequency
0110 =
0101 =
0100 =
0011 =
0010 =
0001 =
0000 = Center frequency, oscillator is running at calibrated frequency
1111 =
1110 =
1101 =
1100 =
1011 =
1010 =
1001 =
1000 = Minimum fre quenc y
dsPIC30F1010/202X
DS70178C-page 202 Preliminary © 2006 Microchip Technology Inc.
REGISTER 18-3: OSCTUN2: OSCILLATOR TUNING REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TSEQ7<3:0> TSEQ6<3:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TSEQ5<3:0> TSEQ4<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 TSEQ7<3:0>: Tune Sequence value #7 bits
When PWM ROLL<2:0> = 111, this field is used to tune the FRC instead of TUN<3:0>
bit 11-8 TSEQ6<3:0>: Tune Sequence value #6 bits
When PWM ROLL<2:0> = 110, this field is used to tune the FRC instead of TUN<3:0>
bit 7-4 TSEQ5<3:0>: Tune Sequence value #5 bits
When PWM ROLL<2:0> = 101, this field is used to tune the FRC instead of TUN<3:0>
bit 3-0 TSEQ4<3:0>: Tune Sequence value #4 bits
When PWM ROLL<2:0> = 100, this field is used to tune the FRC instead of TUN<3:0>
REGISTER 18-4: LFSR: LINEAR FEEDBACK SHIFT REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—LFSR<14:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LFSR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
When PWM ROLL<2:0> = 111, this field is used to tune the FRC instead of TUN<3:0>
bit 14-8 LFSR <14:8>: Most Significant 7 bits of the pseudo random FRC trim value bits
bit 7-0 LFSR <7:0>: Least Significant 8 bits of the pseudo random FRC trim value bits
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 203
dsPIC30F1010/202X
REGISTER 18-5: FOSCSEL: OSCILLATOR SELECTION CONFIGURATION BITS
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 23 bit 16
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/P R/P
FNOSC1 FNOSC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 23-2 Unimplemented: Read as0
bit 1-0 FNOSC<1:0>: Initial Oscillator Group Selection on POR bits
00 = Fast RC Oscillator (FRC)
01 = Fast RC Oscillator (FRC) divided by N, with PLL module
10 = Primary Oscillator (HS,EC)
11 = Primary Oscillator (HS,EC) with PLL module
dsPIC30F1010/202X
DS70178C-page 204 Preliminary © 2006 Microchip Technology Inc.
REGISTER 18-6: FOSC: OSCILLATOR SELECTION CONFIGURATION BITS
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 23 bit 16
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
R/P R/P R/P U-0 U-0 R/P R/P R/P
FCKSM<1:0> FRANGE OSCIOFNC POSCMD<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 23-8 Unimplemented: Read as0
bit 7-6 FCKSM<1:0>: Clock Switching and Monitor Selection Configuration bits
1x = Clock switching is disabled, fail-safe clock monitor is disabled
01 = Clock switching is enabled, fail-safe clock monitor is disabled
00 = Clock switching is enabled, fail-safe clock monitor is enabled
bit 5 FRANGE: Frequency Range Select for FRC and PLL bit
Acts like a “Gear Shift” feature that enables the dsPIC DSC device to operate at reduced MIPS at a
reduced supply voltage (3.3V)
FRANGE
Bit Value
Temperature
Rating FRC Frequency
(Nominal) PLL VCO
(Nominal)
1 = High Range Industrial
Extended 14.55 MHz
9.7 MHz 466 MHz (480 MHz max.)
310 MHz (320 MHz max.)
0 = Low Range Industrial
Extended 9.7 MHz
6.4 MHz 310 MHz (320 MHz max.)
205 MHz (211 MHz max.)
bit 4-3 Unimplemented: Read as ‘0
bit 3 OSCIOFNC: OSC2 Pin I/O Enable bit
1 = CLKO output signal active on the OSCO pin
0 = CLKO output disabled
bit 1-0 POSCMD<1:0>: Primary Oscillator Mode
11 = Primary Oscillator Disabled
10 = HS oscillat or mode selected
01 = Reserved
00 = External clock mode selected
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 205
dsPIC30F1010/202X
18.2.1 ACCIDENTAL WRITE PROTECTION
Because the OSCCON register allows clock switching
and clock scaling, a write to OSCCON is intentionally
made difficult. To write to the OSCCON low byte, this
exact sequence must be executed without any other
instruc tions in betwe en:
Byte Write “46h” to OSCCON low
Byte Write “57h” to OSCCON low
Byte Write is allowed for one instruction cycle
mov.b W0,OSCCON
To write to the OSCCON high byte, this exact
sequence must be executed without any other instruc-
tions in between:
Byte Write “78h” to OSCCON high
Byte Write “9Ah” to OSCCON high
Byte Write is allowed for one instruction cycle
mov.b W0,OSCCON + 1
18.3 Oscillator Configurations
Figure 18-2 shows the derivation of the system clock
FCY. The PLL in Figure 18-1 outputs a maximum fre-
quency of 480MHz (high-range FRC option for
industrial temperature parts with PLL and TUN<3:0> =
0111 bit settings). This signal is used by the Power
Supply PW M modul e, and is 32 t imes the input PLL fre-
quency.
Assumi ng the h igh-ran ge F RC opti on is s elect ed on a n
industrial temperature rated part, the 480 MHz PLL
clock signal is divided by 2, providing a 240 MHz signal,
which drive s the ADC Mo dule. The same 480 M Hz si g-
nal is also divided by 8 to produce the 60 MHz signal,
which is one of the inputs to the FCY multiplexer. The
other input to this multiplexer is the FOSC input clock
source (either the Primary Oscillator or the FRC)
divide d by 2. W hen the PLL i s e na ble d, FCY = FPLL/16.
When the P LL is disabled, F CY = FOSC/2.
This method derives the 480 MHz clock:
FRC Clock with high-range Option and TUN<3: 0>
= 0111 is = 15 MHz
PLL enabled
PW M clock = 15 x 32 = 480 MHz
•F
CY = 480 MHz/16 = 30 MHz = 30 MIPS
If the PLL is disabled ,
FRC Clock (with high-range Option and
TUN<3:0> = 0111) is = 15 MHz
•FCY = 15 MHz/2 = 7.5 MHz = 7.5 MIPS
FIGURE 18-2: SYSTEM CLOCK AND FADC DERIVATION
Divide
By 2
Divide
By 2
Divide
By 8
FOSC
FRC
Primary Oscillator
Oscillator Configuration Bits
PLL – 192-480 MHZ24-60 MHZ
96-240 MHZ
FCY
PLL Enable
1
0
1
0
PLL Enable
FADC
FPLL
dsPIC30F1010/202X
DS70178C-page 206 Preliminary © 2006 Microchip Technology Inc.
18.3.1 INITIAL CLOCK SOURCE
SELECTION
While coming out of a Power-on Reset, the device
selects its clock source based on:
a) FNOSC<1:0> Configuration bits that select one
of three oscillator groups (HS, EC or FRC)
b) POSCMD1<1:0> Configuration bits that select
the Prima r y Os ci lla tor Mo de
c) OSCIOFNC selects if the OSC2 pin is an I/O or
clock output
The selection is as shown in Table 18-1.
TABLE 18-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
18.3.2 OSCILLATOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscil lator clock t o th e rest of the syste m. The t ime-ou t
period is designated as TOST. Th e TOST time is involve d
every time the oscillator has to restart (i.e., on POR and
wake-up from Sleep). The Oscillator Start-up Timer is
applied to the HS Oscillator mode (upon
wake-up from Sleep and POR) for the primary
oscillator.
18.3.3 PHASE LOCKED LOOP (PLL)
The PLL mul tiplies th e clock, w hich is gene rated by the
primary os ci llator. Th e PL L i s select abl e to have a gain
of x32 only. Input and output frequency ranges are
summa riz ed in Table 18-2.
TABLE 18-2: PLL FREQUENCY RANGE
The PLL fe atures a loc k output, which is asserted whe n
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g. , due to no ise), the lock signal will b e
rescinded. The state of this signal is reflected in the
read-only LOCK bit in the OSCCON register.
Oscillator
Mode Oscillator
Source
FNOSC<1:0> POSCMD<1:0> OSCIOFNC OSC2
Function OSC1
Function
Bit 1 Bit 0 Bit 1 Bit 0
HS w/PLL 32x PLL 11 1 0 N/A CLKO(1) CLKI
FRC w/PLL 32x PLL 01 1 1 1 CLKO I/O
FRC w/PLL 32x PLL 01 1 1 0 I/O I/O
EC w/PLL 32x PLL 11 0 0 1 CLKO CLKI
EC w/PLL 32x PLL 11 0 0 0 I/O CLKI
EC(2) External 10 0 0 1 CLKO CLKI
EC(2) External 10 0 0 0 I/O CLKI
HS(2) External 10 1 0 N/A CLKO(1) CLKI
FRC(2) Internal RC 00 1 1 0 I/O I/O
FRC(2) Internal RC 00 1 1 1 CLKO I/O
Note 1: CLKO is not recommended to drive external circuits.
2: This mode is not recommended for some applications; disabling 32x PLL will not allow operation of
high-speed ADC and PWM.
FIN PLL
Multiplier FOUT
6.4 MHz x32 205 MHz
9.7 MHz x32 310 MHz
14.55 MHz x32 466 MH z
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 207
dsPIC30F1010/202X
18.4 PRIMARY OSCILLATOR ON OSC1/
OSC2 PINS:
The primary oscillator uses is shown in Figure 18-3.
FIGURE 18-3: PRIMARY OSCILLATOR
18.5 EXTERNAL CLOCK INPUT
Two of the primary Oscillator modes use an external
clock. These modes are EC and EC with IO.
In the EC mode (Figure 18-4), the OSC1 pin can be
driven by CMOS driv ers. In thi s m od e, t he OSC 1 p i n i s
high-impedance and the OSC2 pin is the clock output
(FOSC/2). This output clock is useful for testing or
synchronization purpose s .
In the EC with IO mode (Figure 18-5), the OSC1 pin
can be driven by CMOS drivers. In this mode, the
OSC1 pin is high-impedance and the OSC2 pin
becomes a general purpose I/O pin. The feedback
device between OSC1 and OSC2 is turned off to save
current.
FIGURE 18-4: EXTERNAL CLOCK INPUT OPERATION (EC OSCILLATOR CONFIGURATION)
FIGU RE 18-5: EXTERNAL CLOCK INPUT OPERATION (ECIO OSCILLATOR CONFIGURATION)
C1
C2
XTAL
OSC2/CLKO
Rs (1)
OSC1/CLKI
RF (2)
Note 1: A serie s resistor, Rs, may be requir ed for AT strip cut crystals .
2: The feedback resistor, RF, is typically in the range of 2 to 10 MΩ.
To CLKGEN
CLKO/RC15
OSC1
OSC2
FOSC/2
dsPIC30F
Clock from Ext Syst em
OSC1
I/O (OSC2)
I/O
dsPIC30F
Clock from Ext System
dsPIC30F1010/202X
DS70178C-page 208 Preliminary © 2006 Microchip Technology Inc.
18.6 INTERNAL FAST RC OSCILLATOR
(FRC)
FRC is a fast, precise frequency internal RC oscillator.
The F RC oscillator is desig ned to run at a fre quency of
6.4/9.7/14.55 MHz (<±2% accuracy). The FRC oscilla-
tor optio n is in tended to be ac c urat e e nough to pro vid e
the clock frequency necessary to maintain baud rate
tolerance for serial data transmissions. The user has
the ability to tune the FRC frequency by +-3%.
The FRC oscillator is powered:
a) Any time the EC or HS Oscillator modes are
NOT selected.
b) When the fail-safe clock monitor is enabled and
a clock fail is detected, forcing a switch to FRC.
18.6.1 FREQUENCY RANGE SELECTION
The FRC module has a “Gear Shift” control signal that
selects low range (9.7 MHz for industrial temperature
rated parts and 6.4 MHz for extended temperature
rated parts) or high range (14.55 MHz for industrial
temperture rated parts and 9.7 MHz for extended tem-
perature rated parts) frequency of operation. This fea-
ture enables a dsPIC DSC device to operate up to a
maiximum speed of 20 MIPS at 3.3V or up to a maxi-
mum speed of 30 MIPS at 5.0V and remain with
system specifications.
18.6.2 NOMINAL FREQUENCY VALUES
The FRC module is calibrated to a nominal 9.7 MHz
for industrial temperature rated parts and 6.4 MHz for
extended temperature rated parts in low range and
14.55 MHz for industrial temperture rated parts and
9.7 MHz for extended temperature rated parts in high
range This feature enables a user to “tune” the dsPIC
DSC device frequency of operation by +-3% and still
remain within system specifications.
18.6.3 FRC FREQUENCY USER TUNING
The FRC is calibrated at the factory to give a nominal
6.4/9.7/14.55 MHz. The TUN<3:0> field in the OSC-
TUN register is available to the user for trimming the
FRC oscillator frequency in applications.
The 4-bit tuning control signals are supplied by the
OSCTUN or the OSCTUN2 registers depending on
the TSEQEN bit in the OSCCON register.
The tuning range of the 14.55 MHz oscillator is
±0.45 MHz (±3%) nominal.
The base frequency can be tuned in the user's appli-
cation. This fre qu enc y tuning c apability al lows the us er
to deviate from the factory calibrated frequency. The
user can tune the fr equ enc y by wri t ing to th e O SC TUN
register TUN<3:0> bits.
18.6.4 CLOCK DITHERING LOGIC
In power conversion applications, the primary electri-
cal nois e emis sion that the de signe rs wa nt to reduc e is
caused by the power transistors switching at the PWM
frequency. By changing the system clock frequency of
the SMPS dsPIC DSC, the resultant PWM frequency
will change and the peak EMI will be reduced at the
noise is spread over a wider frequency range.
Typically, the range of frequency variation is few
percent. The dsPIC30F1010/202X can provide two
ways to vary system clock frequency on a PWM cycle
basis. These are Frequency Sequencing mode and
Pseudo Random Clock Dithering mode. Table 18-8
shows the implementation details of both these
methods.
18.6.5 FREQUENCY SEQUENCING MODE
The Frequency Sequencing mode enables the PWM
module to select a sequence of eight different FRC
TUN values to vary the system frequency with each
rollover of the primary PWM time base. The OSCTUN
and the OSCTUN2 registers allow the user to specify
eight seq uentia l tune va lues if the TSEQ EN bit is set in
the OSCCON register. If the TSEQEN bit is zero, then
only the TUN bits affect the FRC frequency.
A 4-bit wide multiplexer with eight sets of inputs
selects the tuning value from the TUN and the TSEQx
bit fields. The multiplexer is controlled by the
ROLL<5:3> counter in the PWM module. The
ROLL<5:3> coun ter i nc rem ents every time the prim ar y
time base rolls over after reaching the period value.
18.6.6 PSEUDO RANDOM CLOCK
DITHERING MODE
The Pseudo Random Clock Dither (PRCD) logic is
implemented with a 15-bit LFSR (Linear Feedback
Shift Register), which is a shift register with a few
exclusive OR gates. The lower four bits of the LFSR
provides the FRC TUNE bits. The PRCD feature is
enabled by setting the PRCDEN bit in the OSCCON
register. The LSFR is “clocked” (enabled to clock)
once every time the ROLL<3> bit changes state,
which occurs once every 8 PWM cycles.
18.6.7 FAIL-SAFE CLOCK MONITOR
The Fail-Saf e Cl oc k Mo nito r (FSCM) all ow s the devic e
to conti nue to o pe rate eve n in th e even t of an oscil lator
failure. The FSC M f unc tio n i s e nab led by ap prop ria tel y
programming the FCKSM Configuration bits (Clock
Switch and Monitor Selection bits) in the FOSC
Configuration register.
In the event of an oscillator failure, the FSCM will
generate a clock failure trap event and will switch the
system clock over to the FRC oscillator. The user will
then have the option to either attempt to restart the
oscillator or execute a controlled shutdown. The user
may decide to treat the trap as a warm Reset by sim-
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 209
dsPIC30F1010/202X
ply loading the Reset address into the oscillator fail
trap vector. In this event, the CF (Clock Fail) status bit
(OSCCON<3>) is also set whenever a clock failure is
recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming
out of POR or Sle ep, it is possible that the PWRT timer
will expire before the oscillator has started. In such
cases, the FSCM will be activated and the FSCM will
initiate a clock failure trap, and the COSC<2:0> bits
are loaded with FRC oscillator selection. This will
effective ly shut of f th e orig ina l os ci lla tor th at was trying
to start.
The user may detect this situation and restart the
oscillator in the clock fail trap, ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1. The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value
2. CF bit is set (OSCCON<3>)
3. OSWEN control bit (OSCCON<0>) is cleared
For the purpose of clock switching, the clock sources
are sectioned into two gr oups:
1. Primary
2. Internal FRC
The user can switch between thes e functional groups,
but canno t switch between opt ions within a group. If the
primary group is selected, then the choice within the
group is always determined by the FNOSC<1:0>
Configuration bits.
The OSC CON register h olds the co ntrol and status bits
related to clock switching. If Configuration bits
FCKSM<1:0> = 1x, then the clock switching and Fail-
Safe Clock Monitor functions are disabled. This is the
default Configuration bit setting.
If clock switching is disabled, then the FNOSC<1:0>
and POSCMD<1:0> bits directly control the oscillator
selection and the COSC<2:0> bits do not control the
clock selection. However, these bits will reflect the
clock sour ce selection.
18.7 Reset
The PIC18F1220/1320 differentiates between
vari ous kinds of Reset:
a) Power-on Reset (POR)
b) MCLR Reset during normal operation
c) MCLR Reset during Sleep
d) Watchdog Timer (WDT) Reset (during normal
operation)
e) RESET Instruction
f) Reset cause by trap lock-up (TRAPR)
g) Reset caused by illegal opcode, or by using an
uninitialized W register as an Address Pointer
(IOPUWR)
Dif fer ent regi sters a re a ffe cted in dif fe rent w ays by var-
ious Reset conditions. Most registers are not affected
by a WD T wake-up, since this is viewed as the resump-
tion of normal operation. Status bits from the RCON
register are set or cleared differently in different Reset
situations, as indicated in Table 18-3. These bits are
used in s oftwa re to dete rmi ne th e na ture of the Reset.
A block di agram of the on-ch ip Reset circuit is shown in
Figure 18-7.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internall y generated Res ets do not drive M CLR pin low.
Note: The application should not attempt to
switc h t o a cl ock fre quency l ow er tha n 100
KHz when the Fail-Safe Clock Monitor is
enabled. If clock switching is performed,
the device may generate an oscillator fail
trap and switch to the Fast RC oscillator.
dsPIC30F1010/202X
DS70178C-page 210 Preliminary © 2006 Microchip Technology Inc.
FIGURE 18-6: FRC TUNE DITHER LOGIC BLOCK DIAGRAM
FIGURE 18-7: RESET SYSTEM BLOCK DIAGRAM
DQ
CLK
3
TUN E B It s to F R C
All Zero Det e c t
TSEQEN in OSCCON
15
ROLL<3>
0
1
TSEQ7
4
DQ0
CLK Q
DQ1
CLK Q
DQ2
CLK Q
DQ3
CLK Q
DQ4
CLK Q
DQ5
CLK Q
DQ6
CLK Q
DQ7
CLK Q
DQ8
CLK Q
DQ9
CLK Q
DQ10
CLK Q
DQ11
CLK Q
DQ12
CLK Q
DQ13
CLK Q
DQ14
CLK Q
LFSR
PWM PS
TSEQ6 TSEQ5 TSEQ4
0
15
OSCTUN2
TSEQ3 TSEQ2 TSEQ1 TUN
0
15
OSCTUN
34
3
12
12 11
711
0
1
2
3
4
5
6
8
4
MUX
ROLL Counter
ROLL<5:3> ROLL<2:0>
MUX
4
Shift Ena b le for L F S R
4
PRCDEN in OSCCON
S
RQ
MCLR
VDD
VDD Rise
Detect POR
SYSRST
Sleep or Idle
WDT
Module
Digital
Glitch Filter
Trap Conflict
Illegal Opcode/
Uninitialized W Register
RESET Instructio n
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 211
dsPIC30F1010/202X
18.7.1 POR: POWER-O N RESE T
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset puls e will occur
at the POR circuit threshold voltage (VPOR), which is
nominally 1.85V. The device supply voltage character-
istics mus t meet spec ified sta rting v olt ag e and rise ra te
requirements. The POR pulse will reset a POR timer
and place the device in the Reset state. The POR also
selects the device clock source identified by the
oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias
circuit s are stable. Furthermore, a user selected po wer-
up time-out (TPWRT) is applied. The TPWRT par am e te r
is based on Configuration bits and can be 0 ms (no
delay), 4 ms, 16 ms or 64 ms. The total delay is at
device power-up TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock, and the PC will jump to
the Reset vector.
The timing for the SYSRST signal is shown in
Figure 18-8 through Figure 18-10.
FIGURE 18-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
FIGURE 18-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIE D TO VDD): CASE 1
TPWRT
TOST
VDD
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
MCLR
TPWRT
TOST
VDD
Internal POR
PWRT T ime-out
OST Time-out
Internal Reset
MCLR
dsPIC30F1010/202X
DS70178C-page 212 Preliminary © 2006 Microchip Technology Inc.
FIGURE 18-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
18.7.1.1 POR with Long Crystal Start-up Time
(with FSCM Enabled)
The osci ll ator s tart- up c ircuitry is not linked to the P OR
circuitry. Some crystal circuits (especially low
frequency crystals) will have a relatively long start-up
time. Th erefore, one or more of the foll owing condit ions
is possible after the POR timer and the PWRT have
expired:
The oscillator circuit has not begun to oscillate.
The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used) .
The PLL has not achieved a L OCK (if PLL is
used).
If th e FSCM is enabled and one of th e above c onditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap, ISR.
18.7.1.2 Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rap-
idly fro m Reset o n power- up. If the clock sou rce is FRC
or EC, it will be active immediately.
If the FSCM is disabled and the system clock has not
start ed, the de vice w ill be in a frozen st ate at th e Res et
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
FIGURE 18-11: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
Note: Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
Note 1: External Power-on Reset circuit is
requ ir ed on ly if the VDD power-up slope
is too s low . Th e dio de D help s dis charge
the c apacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not vio late the devi ce’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any curren t flo wing into MCL R from
external capacitor C, in the event of
MCLR/VPP pin breakdown due to Elec-
trostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
dsPIC30F
MCLR
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 213
dsPIC30F1010/202X
Table 18-3 shows the Reset conditions for the RCON
register. Since the con trol bits with in the RCON reg ister
are R/W , the information in the table implies that all the
bits are negated prior to the action specified in the
conditi on column.
TABLE 18-3: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1
Table 18-4 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assu med th e use r has s et/ cle ared s peci fic bits pr ior to
action specified in the condition column.
TABLE 18-4: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR
Power-on Reset 0x000000 00000001
MCLR Reset during normal
operation 0x000000 00100000
Software Reset during
normal ope rati on 0x000000 00010000
MCLR Reset during Sleep 0x000000 00100010
MCLR Reset during Idle 0x000000 00100100
WDT Time-out Reset 0x000000 00001000
WDT Wake-up PC + 2 00001010
Interrupt Wake-up from
Sleep PC + 2(1) 00000010
Clock Failure Trap 0x000004 00000000
Trap Reset 0x000000 10000000
Illegal Operation Trap 0x000000 01000000
Note 1: When the wake-up is due to an enabled inte rrupt, the PC is load ed with the corres ponding in terrupt vector.
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR
Power-on Reset 0x0000 00 0000000 1
MCLR Reset during normal
operation 0x000000 uu10000 u
Software Reset during
normal ope rati on 0x000000 uu01000 u
MCLR Reset during Sleep 0x000000 uu1u001 u
MCLR Reset during Idle 0x000000 uu1u010 u
WDT Time-out Reset 0x000000 uu00100 u
WDT Wake-up PC + 2 uuuu1u1 u
Interrupt Wake-up from
Sleep PC + 2(1) uuuuuu1 u
Clock Failure Trap 0x000004 uuuuuuu u
Trap Reset 0x000000 1uuuuuu u
Illegal Operation Reset 0x000000 u1uuuuu u
Legend: u = unchanged
Note 1: When the wake-up is due to an enab led interrup t, the PC is loade d with the corre sponding interrupt vector.
dsPIC30F1010/202X
DS70178C-page 214 Preliminary © 2006 Microchip Technology Inc.
18.8 Watchdog Timer (WDT)
18.8.1 WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software
malfunction. The WDT is a free-running timer, which
runs off an on-chip RC oscillator, requiring no external
component. Therefore, the WDT timer will continue to
operate even if the main processor clock (e.g., the
crystal oscillator) fails.
18.8.2 ENABLING AND DISABLING THE
WDT
The Watchdog Timer can be “enabled” or “disabled”
only through a Configuration bit (FWDTEN) in the
Configuration register FWDT.
Setting FWDTEN = 1 enables the Watchdog Timer.
The enabling is done when programming the device.
By default, after chip-erase, FWDTEN bit = 1. Any
device programmer capable of programming
dsPIC30F devices allows programming of this and
other Configuration bits.
If enabled , the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If a WDT times out during Sleep, the device will wake-
up. The WDT O bit in the RCO N register wil l be cleare d
to indicate a wake-up resulting from a WDT time-out.
Setting FWDTEN = 0 allows user software to enable/
disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
18.9 Power-Saving Modes
There are tw o powe r-savi ng state s that c an be en tered
through the execution o f a spe ci al ins tru cti on, PWRSAV.
These are: Sleep and Idle.
The format of the PWRSAV instructi on is as fol lows :
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
18.9.1 SLEEP MODE
In Sleep m ode, t he clo ck to t he CPU a nd peri pheral s is
shutdown. If an on-chip oscillator is being used, it is
shutdown.
The Fail-Safe Clock Monitor is not functional during
Sleep, since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
any interrupt that is individually enabled and
meets the required priority level
any Reset (POR and MCLR)
WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry
into Sleep mode. When clock switching is enabled,
bits COSC<2:0> will determine the oscillator source
that will be used on wake-up. If clock switch is
disabled, then there is onl y one sy ste m cl ock .
If the clock source is an oscillator, the clock to the
device is held off until OST times out (indicating a sta-
ble oscillator). If PLL is used, the system clock is held
off until LOCK = 1 (indicating that the PLL is stable).
Eith er way, T
POR
, T
LOCK
and T
PWRT
delays are applied
.
If EC, FRC, oscillators are used, then a delay of TPOR
(~10 μs) is applied. This is the smallest delay possible
on wake-up from Sleep.
Moreover, if LP oscillator was active during Sleep, and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the small-
est poss ible sta rt-up delay when waking up fro m Sleep,
one of these faste r wake-up optio ns shoul d be selecte d
before entering Sleep.
Any interrupt that is individually enabled (using the
corresponding IE bit) and meets the prevailing priority
level will be able to wake-up the processor. The proces-
sor will process the interrupt and branch to the ISR. The
Sleep status bit in the RCON register is set upon
wake-up
.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
status bit. In a POR, the Sleep bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO status bits are both set.
Note: If a POR occurred, the selection of the
oscill ato r is bas ed on the FO SC <2:0 > an d
FOSCSEL<1:0> Configuration bits.
Note:
In spite of various delays applied (T
POR
,
T
LOCK
and T
PWRT
), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low frequency crys-
tals). In such cases, if FSCM is enabled, the
devic e w ill dete ct this as a cloc k fa ilure a nd
process the clock failure trap, the FRC
oscillator will be enabled, and the user will
have to re-enable the crystal oscillator. If
FSCM is not enabled, then the device will
simply suspend exec utio n of code unt il th e
clock is stable, an d will rema in in Sle ep until
the osc illato r clo ck has st a r ted .
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 215
dsPIC30F1010/202X
18.9.2 IDLE MODE
In Idle mode, the clock to the CPU is shutdown while
periphera ls keep running. Unlike Sleep mode, the clock
sour ce rem ains active .
Several peripherals have a control bit in each module
that allows them to operate during Idle.
LPRC fail-safe clock remains active if clock failure
detect is enabled.
The processor wakes up from Idle if at least one of the
following conditions is true:
on any interrupt that is individually enabled (IE bit
is ‘1’) and meets the required priority level
on any Reset (POR, MCLR)
on WDT time-out
Upon wake -up from Idle mode, the cloc k is reappli ed to
the CPU and inst ructio n executio n begin s imm ediate ly,
starting with the instruction following the PWRSAV
instruction.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-u p th e p roc es sor. The process or wi ll p r oces s the
interrupt and branch to the ISR. The Idle status bit in
RCON register is set upon wake-up.
Any Reset, other than POR, will set the Idle status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involv ed in wake -up from Idle.
18.10 Device Configuration Registers
The Configuration bits in each device Configuration
register specify some of the device modes and are
prog ramme d by a de vice prog ra mmer, or b y us ing t he
In-Circuit Serial Programming (ICSP) feature of the
device. Each device Configuration register is a 24-b it
register, but only the lower 16 bits of each register are
used to hold configuration data. There are six
Configuration registers available to the user:
1. FBS (0xF80000): Boot Code Segment
Configu ration Register
2. FGS (0xF80004): General Code Segment
Configu ration Register
3. FOSCEL (0xF80006): Oscillator Selection
Configu ration Register
4. FOSC (0xF80008): Oscillator Configuration
Register
5. FWDT (0xF8000A): Watchdog Timer
Configu ration Register
6. FPOR (0xF8000C): Power-On Reset
Configu ration Register
The placement of the Configuration bits is automati-
cally ha ndled when you sel ect the device in your device
programmer . The desired st ate of the Configuration bits
may be sp ecified i n the source code (depen dent on the
language tool used), or through the programming
interface. After the device has been programmed, the
application software may read the Configuration bit
values through the table read instructions. For addi-
tional information, please refer to the programming
specifications of the device.
Table 18-5 shows the bit descriptions of the FGS and
FBS registers for the dsPIC30F1010. Table 18-6
shows the bit descriptions of the FGS and FBS regis-
ters for dsPIC30F202x devices. Table 18-7 shows the
bit descriptions of FWDT and the FPOR registers for
dsPIC30F1010/202X devices.
Note: If the code protection configuration fuse
bits (GSS<1:0> and GWRP in the FGS
register) have been programmed, an
erase of the entire code-protected device
is only possible at voltages VDD 4.5V.
dsPIC30F1010/202X
DS70178C-page 216 Preliminary © 2006 Microchip Technology Inc.
TABLE 18-5: FGS AND FBS BIT DESCRIPTIONS FOR THE dsPIC30F1010
Bit Field Register Description
BWRP FBS Boot Segment Program Flash Write Protection
1 = Boot segment may be written
0 = Boot segment is write-protected
BSS<2:0> FBS Boot Segment Program Flash Code Protection Size
x11 = No boot program Flash segment
x00 = No boot program Flash segment
x01 = No boot program Flash segment
110 = Standard security; small boot segment; boot program Flash seg-
ment starts at the end of the Interrupt Vector Segment and ends
at 0003FFH
010 = High security ; small boot segment; boot pro gram Flash s egment
starts at the end of the Interrupt Vector Segment and ends at
0003FFH
GRWP FGS General Segment Program Flash Write Protection
1 = General segment may be written
0 = General segme nt is w rite - prot ect ed
GSS<1:0> FGS General Segment Program Flash Code Protection
11 = No Protection
10 = Standard security; general program Flash segment starts at the
end of the boot segment and ends at the end of program Flash
0x = Reserved
TABLE 18-6: FGS AND FBS BIT DESCRIPTIONS FOR THE dsPIC30F202X
Bit Field Register Description
BWRP FBS Boot Segment Program Flash Write Protection
1 = Boot segment may be written
0 = Boot segment is write-protected
BSS<2:0> FBS Boot Segment Program Flash Code Protection Size
x11 = No boot program Flash segment
x00 = No boot program Flash segment
110 = Standard security; small boot segment; boot program Flash seg-
ment st art s at the end of th e Int errup t Vector Segment and e nd s
at 0003FFH
010 = High security ; small boot segment; boot pro gram Flash s egment
starts at the end of the Interrupt Vector Segment and ends at
0003FFH
101 = Standard security; medium boot segment; boot program Flash
segment starts at the end of the Interrupt Vector Segment and
ends at 000FFFH
001 = High security; medium boot segment; boot program Flash seg-
ment st art s at the end of th e Int errup t Vector Segment and e nd s
at 000FFFH
GWRP FGS General Segment Program Flash Write Protection
1 = General segment may be written
0 = General segme nt is w rite - prot ect ed
GSS<1:0> FGS General Segment Program Flash Code Protection
11 = No Protection
10 = Standard security; general program Flash segment starts at the
end of the Boot Segment and ends at the end of program Flash
0x = Reserved
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 217
dsPIC30F1010/202X
18.11 In-Circuit Debugger
When MPLAB® ICD 2 is selected as a debugger, the
in-circuit debugging functionality is enabled. This func-
tion al lows simple debug ging functi ons whe n use d wi th
MPLAB IDE. When the device has thi s feature enable d,
some of the resources are not available for general
use. These resources include the first 80 bytes of data
RAM and two I/O pins.
One of four pairs of Debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC, EMUD1/
EMUC1 and EMUD2/EM UC2.
In each c as e, th e se le cte d EM UD p in i s th e Emulation/
Debug Data line, and the EMUC pin is the Emulation/
Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of Debug I/O pins is used by
MPLAB ICD 2 to send commands and receive
respons es, as well as to sen d and rec eive data . To use
the in-circuit debugging function of the device, the
design must implement ICSP connections to MCLR,
VDD, VSS, PGC , PGD and the selected
EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1. If EMUD/EMUC is selected as the debug I/O pi n
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are multi-
plexed with the PGD and PGC pin functions in
all dsPIC30F devices.
2. If EMUD1/EMUC1 or EMUD2/EMUC2 is
selected as the debug I/O pin pair, then a 7-pin
interfac e i s re qui red , as th e EM UD x/E MUC x pi n
function s (x = 1 or 2) are not m ultiplexed with the
PGD and PGC pin functions.
TABLE 18-7: FWDT AND FPOR BIT DESCRIPTIONS FOR dsPIC30F1010/202X
Bit Field Register Description
FWDTEN FWDT Watch dog T im er Enab le bit
1 = Watchdog Timer always enabled. (LPRC oscillator cannot be dis-
abled. C lea ring the SWDT EN b it i n the RC ON re gis te r w ill hav e n o
effect.)
0 = Watchdog Timer enabled/disabled by user software (LPRC can be
disabled by clearing the SWDTEN bit in the RCON register)
WWDTEN FWDT Watchdog Timer Window Enable bit
1 = Watchdog Timer in Non-Window mode
0 = Watchdog Timer in Window mode
WDTPRE FWDT Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
WDTPOST<3:0> FWDT Watchdog Timer Postscaler bits
1111 = 1:32, 768
1110 = 1:16, 384
.
.
.
0001 = 1:2
0000 = 1:1
FPWRT<2:0> FPOR Power-on Reset Timer Value Select bits
111 = PWRT = 128 ms
110 = PWRT = 64 ms
101 = PWRT = 32 ms
100 = PWRT = 16 ms
011 = PWRT = 8 ms
010 = PWRT = 4 ms
001 = PWRT = 2 ms
000 = PWRT = Disabled
dsPIC30F1010/202X
DS70178C-page 218 Preliminary © 2006 Microchip Technology Inc.
TABLE 18-8: SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F202X
SFR
Name Addr
.Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
RCON 0740 TRAPR IOPUWR EXTR SWR SWDTEN WDTO SLEEP IDLE POR Depends on type of Reset.
OSCCON 0742 COSC<2:0> NOSC<2:0> CLKLOCK LOCK PRCDEN CF TSEQEN OS WEN Depends on Configuration bits.
OSCTUN 0748 TSEQ3<3:0> TSEQ2<3:0> TSEQ1<3:0> TUN<3:0>
0000 0000 0000 0000
OSCTUN2 074A TSEQ7<3:0> TSEQ6<3:0> TSEQ5<3:0> TSEQ4<3:0>
0000 0000 0000 0000
LFSR 074C LFSR<14:0>
0000 0000 0000 0000
PMD1 0770 —T3MDT2MDT1MD PWMMD —I2CMD—U1MD SPI1MD —ADCMD
0000 0000 0000 0000
PMD2 0772 —IC1MD —OC2MDOC1MD
0000 0000 0000 0000
PMD3 0774 CMP_PSMD
0000 0000 0000 0000
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 18-9: DEVICE CONFIGURATION REGISTER MAP
File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
FBS F80000 BSS<2:0> BWRP
FGS F80004 GSS1 GSS0 GWRP
FOSCSEL F80006 —FNOSC<1:0>
FOSC F80008 FCKSM<1:0> FRANGE
OSCIOFNC
POSCMD<1:0>
FWDT F8000A FWDTEN WWDTEN
WDTPRE
WDTPOST<3:0>
FPOR F8000C —FPWRT<2:0>
Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 219
dsPIC30F1010/202X
19.0 INSTRUCTION SET SUMMARY
The dsPIC30F instruction set adds many
enhancements to the previous PIC® MCU instruction
sets, while maintaining an easy migration from PIC
MCU instruction sets.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthog onal and is grouped
into five bas ic ca tego ries:
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 19-1 shows the general symbols used in
des c ribing t he instructions.
The dsPIC30F instruction set summary in Table 19-2
lists all the instructions along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
The first source operand, which is typically a
register ‘Wb’ without any address modifier
The second source operand, which is t ypically a
register ‘Ws’ with or without an address modifier
The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However , word or byte-ori ented file register instructions
have two operands:
The file register specified by the value ‘f’
The destination, which could either be the file
register ‘f’ or the W0 reg is ter, wh ic h is denoted as
‘WREG’
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
The W register (with or without an address modi-
fier) or file register (specified by the value of ‘Ws’
or ‘f’)
The bit in the W register or file register
(specified by a literal value, or indirectly by the
contents of register ‘Wb’)
The litera l instruct ions that invo lve data m ovement ma y
use some of the following operands:
A lite ral value to be lo aded i nto a W regi ster or file
register (specified by the value of ‘k’)
The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
The first source operand, which is a register ‘Wb’
without any addre s s modifier
The second source operand, which is a literal
value
The dest ination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instruct ions may use some of the
following operands:
The accumulator (A or B) to be used (required
operand)
The W regis ters t o be used as the two operands
The X and Y address space prefetch operations
The X and Y address space prefetch destinations
The accum ula tor wr ite bac k destination
The other DSP instructions do not involve any
multipl ic ati on, and may include:
The accumul ator to be used (requ ired )
The source o r destin ation ope rand (des ignated as
Wso or Wdo, respectively) with or without an
address modifier
The amount of shift, specified by a W register
‘Wn’ or a literal value
The control instructions may use some of the following
operands:
A program memory address
The mode of the Table Read and Table Write
instructions
All instructions are a single word, except for certain
double word instructions, which were made double
word instructions so that all the required information is
available in these 48 bits. In the second word, the
8MSbs are0’s. I f t hi s se cond w o rd i s ex ec ut e d as an
instruction (by itself), it will execute as a NOP.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
dsPIC30F1010/202X
DS70178C-page 220 Preliminary © 2006 Microchip Technology Inc.
Most single-word instructions are executed in a single
instruc tion cyc le , u nle ss a conditio nal test is tru e o r th e
Program Counter is changed as a result of the instruc-
tion. In these cases, the executio n takes tw o instructio n
cycles with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (uncondi-
tional/computed branch), indirect CALL/GOTO, all
Table Reads and W rites and RETURN/RETFIE instru c-
tions, which are single-word instructions, but take two
or three cycles. Certain instructions that involve
skippi ng over the subs equent in struction , require e ither
two or three cycles if the skip is performed, depending
on whether the instruction being skipped is a single-
word or two-word instruction. Moreover, double word
moves require two cycles. The double word
ins truct ions execute in two instructi on cycles.
Note: For more details on the instruction set,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
TABLE 19-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Me ans literal defined by “text
(text) Mean s “content of text
[text] Means “the location addressed by text
{ } Optional field or operation
<n:m> Register bit field
.b Byte mode selection
.d Double Word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumula tor writ e back des tin ation addres s regis te r {W13, [W13] + = 2}
bit4 4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero
Expr Absolute address, label or expression (resolved by the linker)
fFile register address {0x0000...0x1FFF}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16384}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388608}; LSB must be ‘0
None Field does not require an entry, may be blank
OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 221
dsPIC30F1010/202X
Wb Base W register {W0..W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor working register pair (direct addressing)
Wm*Wm Multiplicand and Multiplier working register pair for Square instructions
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn One of 16 working registers {W0..W15}
Wnd One of 16 destination working registers {W0..W15}
Wns One of 16 source working registers {W0..W15}
WREG W0 (working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X data space prefetch address register for DSP instructions
{[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] – = 6, [W8] – = 4, [W8] – = 2,
[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] – = 6, [W9] – = 4, [W9] – = 2,
[W9 + W12],none}
Wxd X data space prefetch destination register for DSP instructions {W4..W7}
Wy Y data space prefetch address register for DSP instructions
{[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,
[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] – = 6, [W11] – = 4, [W11] – = 2,
[W11 + W12], none}
Wyd Y data space prefetch destination register for DSP instructions {W4..W7}
TABLE 19-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
dsPIC30F1010/202X
DS70178C-page 222 Preliminary © 2006 Microchip Technology Inc.
TABLE 19-2: INSTRUCTION SET OVERVIEW
Base
Instr
#
Assembly
Mnemonic Assemb ly Sy ntax Desc ri pt ion # of
word
s
# of
cycles Status Flags
Affected
1ADD ADD Acc Add Accumulators 1 1 OA,OB, SA,S B
ADD f f = f + WREG 1 1 C,DC,N,OV,Z
ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB
2ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3AND AND f f = f .AND. WREG 1 1 N,Z
AND f,WREG WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z
4ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd Wnd = Ari thmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
6BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if greater than or equal 1 1 (2) None
BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None
BRA GT,Expr Branch if greater than 1 1 (2) None
BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None
BRA LE,Expr Branch if less than or equal 1 1 (2) None
BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None
BRA LT,Expr Branch if less than 1 1 (2) None
BRA LTU,Expr Branch if unsigned less than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OA,Expr Branch if accumulator A overflow 1 1 (2) None
BRA OB,Expr Branch if accumulator B overflow 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA SA,Expr Branch if accumulator A saturated 1 1 (2) None
BRA SB,Expr Branch if accumulator B saturated 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Comput ed Br an ch 1 2 None
7BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None
9BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1
(2 or 3) None
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1
(2 or 3) None
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 223
dsPIC30F1010/202X
11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1
(2 or 3) None
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1
(2 or 3) None
12 BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z
13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
14 CALL CALL lit23 Call subroutine 2 2 None
CALL Wn Call indirect subroutine 1 2 None
15 CLR CLR f f = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB
16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep
17 COM COM f f = f 11N,Z
COM f,WREG WREG = f 11N,Z
COM Ws,Wd Wd = Ws 11N,Z
18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z
CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z
19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws Compare Wb with Ws, with Borrow
(Wb – Ws – C)1 1 C,DC,N,OV,Z
21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1
(2 or 3) None
22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1
(2 or 3) None
23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1
(2 or 3) None
24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 11
(2 or 3) None
25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C
26 DEC DEC f f = f –1 1 1 C,DC,N,OV,Z
DEC f,WREG WREG = f –1 1 1 C,DC,N,OV,Z
DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z
27 DEC2 DEC2 f f = f –2 1 1 C,DC,N,OV,Z
DEC2 f,WREG WREG = f – 2 1 1 C,DC,N,OV,Z
DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z
28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 Non e
29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C, OV
30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C, OV
31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None
DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None
32 ED ED Wm * Wm,Acc,Wx,Wy,Wxd Euclidean Dis tance (no accumu late ) 1 1 OA,OB, OA B,
SA,SB,SAB
33 EDAC EDAC Wm * Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
TABLE 19-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assemb ly Sy ntax Desc ri pt ion # of
word
s
# of
cycles Status Flags
Affected
dsPIC30F1010/202X
DS70178C-page 224 Preliminary © 2006 Microchip Technology Inc.
34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C
36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
38 GOTO GOTO Expr Go to address 2 2 Non e
GOTO Wn Go to indirect 1 2 None
39 INC INC f f = f + 1 1 1 C,DC,N,OV,Z
INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
40 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z
INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z
41 IOR IOR f f = f .IOR. WREG 1 1 N,Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z
42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
43 LNK LNK #lit14 Link frame pointer 1 1 None
44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
45 MAC MAC Wm *
Wn,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
MAC Wm *
Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
46 MOV MOV f,Wn Move f to Wn 1 1 None
MOV f Move f to f 1 1 N,Z
MOV f,WREG Move f to WREG 1 1 N,Z
MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None
MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 N,Z
MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None
47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store accumulator 1 1 None
48 MPY MPY Wm *
Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY Wm *
Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
49 MPY.N MPY.N Wm *
Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None
50 MSC MSC Wm *
Wm,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(Ws) 11None
MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(lit5) 11None
MUL f W3:W2 = f * WREG 1 1 None
TABLE 19-2: INSTRUCTION SET OVERVI EW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assemb ly Sy ntax Desc ri pt ion # of
word
s
# of
cycles Status Flags
Affected
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 225
dsPIC30F1010/202X
52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG f f = f + 1 1 1 C,DC,N,OV,Z
NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
53 NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
54 POP POP f Pop f from Top -of- Stack (TOS) 1 1 None
POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from Top-of-St ack (TOS) to
W(nd):W(nd + 1) 12None
POP.S Pop Shadow Registers 1 1 All
55 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None
PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack
(TOS) 12None
PUSH.S Push Shadow Registe rs 1 1 None
56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep
57 RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
58 REPEAT REPEAT #lit14 Repeat Next Instruct ion lit 14 + 1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None
59 RESET RESET Software device Reset 1 1 None
60 RETFIE RETFIE Return from interrupt 1 3 (2) None
61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None
62 RETURN RETURN Return from Subroutine 1 3 (2) None
63 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z
RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z
RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z
64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z
65 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z
66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z
67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None
68 SE SE Ws,Wnd Wnd = sign extended Ws 1 1 C,N,Z
69 SETM SETM f f = 0xFFFF 1 1 None
SETM WREG WREG = 0xFFFF 1 1 None
SETM Ws Ws = 0xFFFF 1 1 None
70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
71 SL SL f f = Left Shift f 1 1 C,N,OV,Z
SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z
TABLE 19-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assemb ly Sy ntax Desc ri pt ion # of
word
s
# of
cycles Status Flags
Affected
dsPIC30F1010/202X
DS70178C-page 226 Preliminary © 2006 Microchip Technology Inc.
72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB f f = f – WREG 1 1 C,DC,N,OV,Z
SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z
73 SUBB SUBB f f = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z
74 SUBR SUBR f f = WREG – f 1 1 C,DC,N,OV,Z
SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z
75 SUBBR SUBBR f f = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z
76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None
SWAP Wn Wn = byte swap Wn 1 1 None
77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
78 TBLRDL TBLRDL Ws,Wd Read Prog< 15:0> to Wd 1 2 None
79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
80 TBLWTL TBLWTL Ws,Wd W rite Ws to P rog<15:0> 1 2 None
81 ULNK ULNK Unlink frame pointer 1 1 None
82 XOR XOR f f = f .XOR. WREG 1 1 N,Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z
83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C,Z,N
TABLE 19-2: INSTRUCTION SET OVERVI EW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assemb ly Sy ntax Desc ri pt ion # of
word
s
# of
cycles Status Flags
Affected
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 227
dsPIC30F1010/202X
20.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
Integrated Development Environment
- MPLAB® IDE Software
Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Device Progra mmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
Low-Cost Demonstration and Development
Boards and Evaluation Kits
20.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separatel y)
- In-Circuit Deb ugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Visual device initializer for easy register
initialization
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Exten si ve on-l in e help
Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
Edit your source files (eithe r assembly or C)
One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
Debug us ing :
- Source files (assemb ly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
dsPIC30F1010/202X
DS70178C-page 228 Preliminary © 2006 Microchip Technology Inc.
20.2 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assemb ler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
sour ce fil es
Directives that allow complete control over the
assembly process
20.3 MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 family of microcontrollers and the
dsPIC30, dsPIC33 and PIC24 family of digital signal
controllers. These compilers provide powerful integra-
tion capabilities, superior code optimization and ease
of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
20.4 MPLINK Object Linker/
MPLIB Object Librari an
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manag es the cre ation an d
modification of library files of precompiled code. When
a routine from a library is called from a source file , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, de letion and extraction
20.5 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or lin ked with other relocatable ob ject files and
arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich dire cti ve set
Flexible macro language
MPLAB IDE compatibility
20.6 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most periph erals and inte rnal regi sters.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 229
dsPIC30F1010/202X
20.7 MPLAB ICE 2000
High-Performance
In-Circui t Emu lator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitor-
ing feat ures. Interc hangeabl e proces sor modul es allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
20.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash D SC® and MCU devic es. It debugs and
programs PIC® and dsPIC® Flash microcontrollers with
the easy-to-use, powerful graphical user interface of the
MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE pro be is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high speed, noise tolerant, low-
voltage differential signal (LVDS) interconnection
(CAT5).
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB ID E, new devic es w ill be supported,
and new features will be add ed, such as software break-
points and assembly code trace. MPLAB REAL ICE
offers significant advant ages over competitive emulators
including low-cost, full-speed emulation, real-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables .
20.9 MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers cost-
effective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug sou rce code by s etting bre akpoi nts , singl e step-
ping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
20.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for men us an d error m essages and a m odu-
lar, detachable socket assembly to support various
pack age types. The ICSP™ cable assembly is in cluded
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer ca n read, verif y and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 h as high-spe ed co mmunicat ions and
optimized algorithms for quick programming of large
memory devices and in corporates an SD/MMC card for
file storage and secure data applications.
dsPIC30F1010/202X
DS70178C-page 230 Preliminary © 2006 Microchip Technology Inc.
20.11 PICSTART Plus Development
Programmer
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Inte grated Dev elopmen t En vironme nt so ftware makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76 X, may be sup ported with an a dapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
20.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’ s baseline, mid-range and PIC18F families of
Flash m emory microcontrol lers. The PICkit 2 S tarter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler , and is desig ned to hel p get up to s peed
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
20.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards incl ude prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s suppo rt a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 231
dsPIC30F1010/202X
21.0 ELECTRICAL CHARACTERISTICS
This section provid es an overview of dsPIC30 F electrical charac teristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer todsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the device family are listed below. Exposure to these maximum rating conditions for
extende d peri ods may aff ec t devi ce re liabil ity. Functio nal o peratio n of t he devi ce at these or a ny other condi tions abov e
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature.............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR)(1)................................................-0.3V to (VDD + 0.3V)
Volta ge on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Volta ge on MCLR with respect to VSS(1).........................................................................................-0.3V to (VDD + 0.3V)
Maximum curr ent o ut of VSS pin ...........................................................................................................................300 mA
Maximum curr ent i nto VDD pin(2)...........................................................................................................................300 mA
Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports.......................................................................................................................200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: V olt age spik es below VSS at the MCLR/VPP pin, in ducin g curr ents gr eater than 8 0 mA, may caus e latc h-up.
Thus, a se ries resi sto r of 50-100Ω sho ul d b e u sed when appl yi ng a “low ” l ev el to the MC L R/VPP pin, rather
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 21-2.
21.1 DC Characteristics
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device . This is a stres s rating onl y and funct ional ope ration of the device at tho se or any other co nditio ns above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 21-1: OPERATING MIPS VS. VOLTAGE
VDD Range Temp Range Max MIPS
dsPIC30FXXX-30I dsPIC30FXXX-20E
4.5-5.5V -40°C to 85°C 30
4.5-5.5V -40°C to 125°C 20
3.0-3.6V -40°C to 85°C 20
3.0-3.6V -40°C to 125°C 15
dsPIC30F1010/202X
DS70178C-page 232 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC30F1010/202X-30I
Operating Junction Temperature Range TJ-40 +125 °C
Operating Ambient Temperature Range TA-40 +85 °C
dsPIC30F1010/202X-20E
Operati ng Junction Temperature Range TJ-40 +150 °C
Operating Ambient Temperature Range TA-40 +125 °C
Power Dissipation:
Internal ch ip pow er dis sip ation:
PDPINT + PI/OW
I/O Pin power dissipation:
Maximum Allowed Power Dissipation PDMAX (TJ - TA) / θJA W
TABLE 21-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SO IC (SO) θJA 48.3 °C/W 1, 2
Package Thermal Resistance, 28-pin QFN θJA 33.7 °C/W 1, 2
Package Thermal Resistance, 28-pin SPDIP (SP) θJA 42 °C/W 1, 2
Package Thermal Resistance, 44-pin QFN θJA 28 °C/W 1, 2
Package Thermal Resistance, 44-pin TQFP θJA 39.3 °C/W 1, 2
Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
2: Depending on operating conditions, air flow may be required for improved thermal performance.
TABLE 21-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Operating Voltage(2)
DC10 VDD Supply Voltage 3.0 5.5 V Industrial tem pera ture
DC11 VDD Supply Voltage 3.0 5.5 V Extended temperature
DC12 VDR RAM Data Retention Voltag e(3) —1.5V
DC16 VPOR VDD Start Voltage
to ensure internal
Power-on Rese t signal
—VSS —V
DC17 SVDD VDD Rise Rate
to ensure internal
Power-on Rese t signal
0.05 V/ms 0-5V in 0.1 sec
0-3.3V in 60 ms
Note 1: Data in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: This is the limit to which VDD can be lowered without losing RAM data.
PINT VDD IDD IOH
()×=
I/O
DD
OH
{}
OH
×()
VOL IOL
×
()
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 233
dsPIC30F1010/202X
TABLE 21-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC20a 13 16 mA 25°C 3.3V
FRC 3.2 MIPS, PLL disabled
DC20b 14 16 mA 85°C
DC20c 14 17 mA 125°C
DC20d 22 26 mA 25°C 5VDC20e 22 26 mA 85°C
DC20f 22 27 mA 125°C
DC22a 19 22 mA 25°C 3.3V
FRC, 4.9 MIPS, PLL disabled
DC22b 19 23 mA 85°C
DC22c 19 23 mA 125°C
DC22d 30 36 mA 25°C 5VDC22e 30 37 mA 85°C
DC22f 31 37 mA 125°C
DC23a 27 33 mA 25°C 3.3V
FRC, 7.3 MIPS, PLL disabled
DC23b 28 33 mA 85°C
DC23c 28 34 mA 125°C
DC23d 44 53 mA 25°C 5VDC23e 45 53 mA 85°C
DC23f 45 54 mA 125°C
DC24a 66 79 mA 25°C 3.3V
FRC 13 MIPS, PLL enabled
DC24b 67 80 mA 85°C
DC24c 68 81 mA 125°C
DC24d 108 129 mA 25°C 5VDC24e 109 130 mA 85°C
DC24f 110 131 mA 125°C
DC26a 98 118 mA 25°C 3.3V
FRC 20 MIPS, PLL enabled
DC26b 99 118 mA 85°C
DC26d 159 191 mA 25°C 5VDC26e 160 192 mA 85°C
DC26f 161 193 mA 125°C
DC27d 222 267 mA 25°C 5V FRC, 30 MIPS, PLL enabled
DC27e 223 267 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows:
- All I/O pins are configured as Outputs and pulled to VSS.
- MCLR = VDD, WDT and FSCM are disab led .
- CPU, SRAM, Program Memory and Data Memory are operational.
- No peripheral modules are operating.
dsPIC30F1010/202X
DS70178C-page 234 Preliminary © 2006 Microchip Technology Inc.
DC28a 96 116 mA 25°C 3.3V
EC, 20 MIPS, PLL enabled
DC28b 97 116 mA 85°C
DC28d 157 188 mA 25°C 5VDC28e 158 189 mA 85°C
DE28f 159 191 mA 125°C
DC29d 227 273 mA 25°C 5V EC, 30 MIPS, PLL enabled
DC29e 228 273 mA 85°C
TABLE 21-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CON TI N U ED)
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temp erature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows:
- All I/O pins are configured as Outputs and pulled to VSS.
- MCLR = VDD, WDT and FSCM are disab led .
- CPU, SRAM, Program Memory and Data Memory are operational.
- No peripheral modules are operating.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 235
dsPIC30F1010/202X
TABLE 21-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC40a 8 9 mA 25°C 3.3V
FRC, 3.2 MIPS, PLL disabled
DC40b 8 9 mA 85°C
DC40c 8 10 mA 125°C
DC40d 12 15 mA 25°C 5VDC40e 13 15 mA 85°C
DC40f 13 16 mA 125°C
DC42a 10 12 mA 25°C 3.3V
FRC, 4.9 MIPS, PLL disabled
DC42b 11 13 mA 85°C
DC42c 11 13 mA 125°C
DC42d 17 20 mA 25°C 5VDC42e 17 21 mA 85°C
DC42f 18 21 mA 125°C
DC43a 15 18 mA 25°C 3.3V
FRC, 7.3 MIPS, PLL disabled
DC43b 15 18 mA 85°C
DC43c 15 18 mA 125°C
DC43d 24 29 mA 25°C 5VDC43e 24 29 mA 85°C
DC43f 25 30 mA 125°C
DC44a 44 53 mA 25°C 3.3V
FRC, 13 MIPS, PLL enabled
DC44b 45 54 mA 85°C
DC44c 46 55 mA 125°C
DC44d 72 87 mA 25°C 5VDC44e 73 88 mA 85°C
DC44f 74 89 mA 125°C
DC46a 66 79 mA 25°C 3.3V
FRC 20 MIPS, PLL enabled
DC46b 67 80 mA 85°C
DC46d 108 129 mA 25°C 5VDC46e 109 131 mA 85°C
DC45f 110 132 mA 125°C
DC47d 152 182 mA 25°C 5V FRC, 30 MIPS, PLL enabled
DC47e 153 183 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off. All I/Os are configured
as inputs and pulled high. WDT, etc. are all switched off.
dsPIC30F1010/202X
DS70178C-page 236 Preliminary © 2006 Microchip Technology Inc.
DC48a 65 78 mA 25°C 3.3V
EC, 20 MIPS, PLL enabled
DC48b 66 79 mA 85°C
DC48d 105 127 mA 25°C 5VDC48e 107 128 mA 85°C
DC48f 108 130 mA 125°C
DC49d 155 186 mA 25°C 5V EC, 30 MIPS, PLL enabled
DC49e 156 187 mA 85°C
TABLE 21-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temp erature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off. All I/Os are configured
as inputs and pulled high. WDT, etc. are all switched off.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 237
dsPIC30F1010/202X
TABLE 21-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Power-Down Current (IPD)
DC60a 1.2 2.4 mA 25°C 3.3V
Base Power-Down Current(2)
DC60b 1.2 2.4 mA 85°C
DC60c 1.3 2.6 mA 125°C
DC60e 2.1 4.2 mA 25°C 5VDC60f 2.1 4.2 mA 85°C
DC60g 2.3 4.6 mA 125°C
DC61a 15 30 μA 25°C 3.3V
Watchdog Timer Current: ΔIWDT(3)
DC61b 14 30 μA 85°C
DC61c 14 30 μA 125°C
DC61e 30 60 μA 25°C 5VDC61f 29 60 μA 85°C
DC61g 30 60 μA 125°C
Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IPD is measured with all peripherals and clocks shutdown. All I/Os are configured as inputs and
pulled high. WDT, etc. are all switched off.
3: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
dsPIC30F1010/202X
DS70178C-page 238 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extende d
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VIL Input Low Voltage(2)
DI10 I/O pins:
with Schmitt Trigger buffer VSS —0.2VDD V
DI15 MCLR VSS —0.2VDD V
DI16 OSC1 (in HS mode) VSS —0.2VDD V
DI18 SDA, SCL VSS —0.3VDD V SMbus disabled
DI19 SDA, SCL VSS —0.2VDD V SMbus enabled
VIH Input High Voltage(2)
DI20 I/O pins:
with Schmitt Trigger buffer 0.8 VDD —VDD V
DI25 MCLR 0.8 VDD —VDD V
DI26 OSC1 (in HS mode) 0.7 VDD —VDD V
DI28 SDA, SCL 0.7 VDD —VDD V SMbus disabled
DI29 SDA, SCL 0.8 VDD —VDD V SMbus enabled
IIL Input Leakage Current(2)(3)(4)
DI50 I/O ports 0.01 ±1 μAVSS VPIN VDD,
Pin at high-impedance
DI51 Analog input pins 0.50 μAV
SS VPIN VDD,
Pin at high-impedance
DI55 MCLR —0.05±5μAVSS VPIN VDD
DI56 OSC1 0.05 ±5 μAVSS VPIN VDD, HS
Osc mode
Note 1: Data in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
4: Negative current is defined as current sourced by the pin.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 239
dsPIC30F1010/202X
TABLE 21-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VOL Output Low Voltage(2)
DO10 I/O ports 0.6 V IOL = 8.5 mA, VDD = 5V
——TBDVIOL = 2.0 mA, VDD = 3.3V
DO16 OSC2/CLKO 0.6 V IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode) TBD V IOL = 2.0 mA, VDD = 3.3V
VOH Output High Voltage(2)
DO20 I/O ports VDD – 0.7 V IOH = -3.0 mA, VDD = 5V
TBD V IOH = -2.0 mA, VDD = 3.3V
DO26 OSC2/CLKO VDD – 0.7 V IOH = -1.3 mA, VDD = 5V
(RC or EC Osc mode) TBD V IOH = -2.0 mA, VDD = 3.3V
Capacitive Loading Specs
on Output Pins(2)
DO50 COSC2 OSC2 pin 1 5 pF In HS mode when external
clock is used to drive OSC1.
DO56 CIO All I/O pins and OSC2 50 pF RC or EC Osc mode
DO58 CBSCL, SDA 400 pF In I2C mode
Legend: TBD = To Be Determined
Note 1: Data i n “Typ” column is at 5V, 25°C unless o the rw is e s t ate d. Pa ram ete rs ar e for design guidanc e on ly and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
TABLE 21-10: DC CHARACTERISTICS: PROGRAM AND EEPROM
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Ex tended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Program Flash Memory(2)
D130 EPCell Endurance 10 K 100K E/W
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VEB VDD for Bulk Erase 4.5 5.5 V
D133 VPEW VDD for Erase/Wr ite 3.0 5.5 V
D134 TPEW Erase/Write Cycle Time 2 ms
D135 TRETD Characteristic Retention 40 100 Year Provided no other specifications
are violated
D136 TEB ICSP Block Erase Time 4 ms
D137 IPEW IDD During Programming 10 30 mA Row Erase
D138 IEB IDD During Programming 10 30 mA Bulk Erase
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
2: These parameters are characterized but not tested in manufacturing.
dsPIC30F1010/202X
DS70178C-page 240 Preliminary © 2006 Microchip Technology Inc.
21.2 AC Characteri stics and Ti ming Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
TABLE 21-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGU RE 21-1: LOAD C O ND ITIONS FOR D E VI CE TIMING SP E CI FI CA T IO N S
FIGU RE 21-2: EXTERNA L C LOC K TIMING
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Operati ng voltage VDD range as described in DC Spec Section 21.0.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL= 464 Ω
CL= 50 pF for all pins except OSC2
5 pF for OSC2 output
Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2
OSC1
CLKO
Q1 Q2 Q3 Q4
OS20
OS25 OS30 OS30
OS40 OS41
OS31 OS31
Q1 Q2 Q3 Q4
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 241
dsPIC30F1010/202X
TABLE 21-12: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temp erature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
OS10 FIN External CLKI Frequency(2)
(External clocks allowed only
in EC mode)
6
6
15.00
15.00 MHz
MHz EC
EC with 32x PLL
Oscillator Frequency(2) 6
6
15.00
15.00 MHz
MHz HS
FRC internal
OS20 TOSC TOSC = 1/FOSC(3) 16.5 DC ns
OS25 TCY Instruction Cycle Time(2)(4) 33 DC ns
OS30 TosL,
TosH External C lock(2) in (OSC1 )
High or Low Time .45 x
TOSC ——nsEC
OS31 TosR,
TosF External C lock(2) in (OSC1 )
Rise or Fall Time 20 ns EC
OS40 TckR CLKO Rise Time(2)(5) 6 10 ns
OS41 TckF CLKO Fall Time(2)(5) 6 10 ns
Note 1: Data in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: The oscillator frequency (FOSC) is equal to FIN when the PLL is disabled. FOSC is equal to 4 x FIN when
the PLL is enabled.
4: Instruction cycle period (TCY) equals two times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “Min.”
values with an external clock applied to the OSC1/CLK1 pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
5: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
dsPIC30F1010/202X
DS70178C-page 242 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-13: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0 AND 5.0V )
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OS50 FPLLI PLL Input Frequency Range(2) 6 15 MHz EC, HS modes with PLL
x32
OS51 FSYS On-chip PLL Output(2) 192 480 MHz EC, HS modes with PLL
x32
OS52 TLOC PLL Start-up Time (Lock Time) 20 50 μs
OS53 DCLK CLKO Stability (Jitter) 1 % Measured over 100 ms
period
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data i n “Typ” column is at 5V, 25°C unless o the rwis e s t ated. Param ete rs ar e for design guidanc e on ly and
are not tested.
TABLE 21-14: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode FIN (MHz)(1) TCY (μsec)(2) MIPS(3)
w/o PLL MIPS(4)
w/PLL x32
EC 10 0.2 5.0 20
15 0.133 7.5 30
HS 10 0.2 5.0 20
15 0.133 7.5 30
Note 1: Assumption: Oscillator Postscaler is divide by 1.
2: Ins truction Execut ion Cycle Time: TCY = 1/MIPS.
3: Ins truction Execution Frequency with out PLL: MIPS = FIN/2 (since there are 2 Q clocks per instruction
cycle).
4: Instruction Execution Fr equency with PLL: MIPS = (FIN * 2).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 243
dsPIC30F1010/202X
TABLE 21-15: AC CHARACTERISTICS: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Accuracy @ FRC Freq = 6.4 MHz(1)
FRC -0.06 +0.06 % +25°C VDD = 3.0-3.6V
-0.06 +0.06 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Internal FRC Accuracy @ FRC Freq = 9.7 MHz(1)
FRC -0.06 +0.06 % +25°C VDD = 3.0-3.6V
-0.06 +0.06 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Internal FRC Accuracy @ FRC Freq = 14.55 MHz(1)
FRC -0.06 +0.06 % +25°C VDD = 3.0-3.6V
-0.06 +0.06 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
dsPIC30F1010/202X
DS70178C-page 244 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-16: AC CHARACTERISTICS: INTERNAL RC JITTER
AC CHARACTERISTICS
Standard Operating Conditions:
3.3V and 5.0V (±10% )
(unless otherwise stated)
Operating temperature -40°C TA +85° C for industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Jitter @ FRC Freq = 6.4 MHz(1)
FRC -1 +1 % +25°C VDD = 3. 0-3.6V
-1 +1 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Internal FRC Jitter @ FRC Freq = 9.7 MHz(1)
FRC -1 +1 % +25°C VDD = 3. 0-3.6V
-1 +1 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Internal FRC Jitter @ FR C Freq = 14.55 MHz(1)
FRC -1 +1 % +25°C VDD = 3. 0-3.6V
-1 +1 % +25°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +85°C VDD = 3.0-3.6V
-1 +1 % -40°C TA +85°C VDD = 4.5-5.5V
-1 +1 % -40°C TA +125°C VDD = 4.5-5.5V
Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 245
dsPIC30F1010/202X
FIGURE 21-3: CLKO AND I/O TIMING CHARACTERISTICS
TABLE 21-17: CLKO AND I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions
DO31 TIOR Port output rise time 10 25 ns
DO32 TIOF Port output fall time 10 25 ns
DI35 TINP INTx pin high or low ti me (output) 20 ns
DI40 TRBP CNx high or low time (input) 2 TCY ——ns
Note 1: These parameters are asynchronous events not related to any internal clock edges.
2: These parameters are characterized but not tested in manufacturing.
3: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Note: Refer to Figur e 21-1 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
dsPIC30F1010/202X
DS70178C-page 246 Preliminary © 2006 Microchip Technology Inc.
FIGURE 21-4: RESET, W ATCHDOG T I MER, OSCILLATOR START-UP T IMER AND POWER -UP
TIMER TIMING CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
SY11
SY10
SY20
SY13
I/O Pins
SY13
Note: Refer to Figure 21-1 for load conditions.
FSCM
Delay
SY35
SY30
SY12
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 247
dsPIC30F1010/202X
TABLE 21-18: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TI MER, POWER-UP TIMER
AND TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SY10 TmcL MCLR Pulse Width (low) 2 μs -40°C to +125°C
SY11 TPWRT Power-up Timer Period 0. 75
1.5
3
6
12
24
48
96
1
2
4
8
16
32
64
128
1.25
2.5
5
10
20
40
80
160
ms -40°C to +125°C
User program ma ble
SY12 TPOR Power-On Reset Delay 3 10 30 μs -40°C to +125°C
SY13 TIOZ I/O High-impedance from MCLR
Low or Watchdog Timer Reset —0.81.0μs
SY20 TWDT1 Watchdog T imer T ime-out Period
(No Prescaler) 1.4 2.1 2.8 ms VDD = 5V, -40°C to
+125°C
TWDT2 1.4 2.1 2.8 ms VDD = 3.3V, -40°C to
+125°C
SY30 TOST Oscillation St art-u p Timer Period 1024 TOSC ——TOSC = OSC1 period
SY35 TFSCM Fail-Safe Clock Monitor Delay 500 μs -40°C to +125°C
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
dsPIC30F1010/202X
DS70178C-page 248 Preliminary © 2006 Microchip Technology Inc.
FIGURE 21-5: BAND GAP START-UP T IME CHARACTERISTICS
TABLE 21-19: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SY40 TBGAP Band Gap Start-up Time 40 65 µs Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stabl e.
RCON<13> status bit.
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
VBGAP
Enable Band Gap
Band Gap
0V
(see Note)
Stable
SY40
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 249
dsPIC30F1010/202X
FIGU RE 21-6: TIMER E XTE RNAL CL OC K T IMIN G CHA RACTE RIST ICS
TABLE 21-20: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V 10%)
(unless otherwise stated)
Operati ng tem pe rature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TA10 TTXH TxCK High Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler 10 ns
Asynchronous 10 ns
TA11 TTXL TxCK Low Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler 10 ns
Asynchronous 10 ns
TA15 TTXP TxCK Input Period Synchronous,
no prescaler TCY + 10 ns
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40)/N
——N = prescale
value
(1, 8, 64, 256)
Asynchronous 20 ns
OS60 Ft1 SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
DC 50 kHz
TA20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY 1.5 TCY
Tx11
Tx15
Tx10
Tx20
TMRX OS60
TxCK
Note: “x” refers to Timer Ty pe A or Timer Type B.
Refer to Figure 21-1 for load conditions.
dsPIC30F1010/202X
DS70178C-page 250 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-21: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TB10 TtxH Tx CK High Time S ync hronous,
no prescaler 0.5 TCY + 20 ns Must also meet
param eter TB15
Synchronous,
with prescaler 10 — ns
TB11 TtxL TxCK Low Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
param eter TB15
Synchronous,
with prescaler 10 ns
TB15 TtxP TxCK Input Period Synchronous,
no prescaler TCY + 10 ns N = prescale
value (1, 8, 64, 256)
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40)/N
TB20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY 1.5 TCY
TABLE 21-22: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC15 TtxP TxCK Inpu t Period S ync hronous,
no prescale r TCY + 10 ns N = prescale
value (1, 8, 64,
256)
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40) /
N
TC20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY —1.5
TCY
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 251
dsPIC30F1010/202X
FIGU RE 21-7: INPUT CAPT URE ( CAPx) TIMI NG CH ARACT ERI STIC S
FIGURE 21-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
TABLE 21-23: INPUT CAPTURE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC15 TccP ICx Input Period (2 TCY + 40) / N ns N = prescale
value (1, 4, 16)
Note 1: These parameters are characterized but not te sted in manufacturing.
TABLE 21-24: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC10 TccF OCx Output Fall Time ns See parameter D0 32
OC11 TccR OCx Outpu t Rise Time ns See parameter D031
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is at 5V, 25°C unless otherwi se st ated. Para meters are for desi gn guida nce onl y and
are not t ested.
ICX
IC10 IC11
IC15
Note: Refer to Figure 21-1 for load conditions.
OCx
OC11 OC10
(Output Compare
Note: Refer to Figure 21-1 for load conditions.
or PWM Mode)
dsPIC30F1010/202X
DS70178C-page 252 Preliminary © 2006 Microchip Technology Inc.
FIGURE 21-9: OC/PWM MODULE TIMING CHARACTERISTICS
TABLE 21-25: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC15 TFD Fault Input to PWM I/O
Change ——25nsVDD = 3.3V -40°C to +85°C
TBD ns VDD = 5V
OC20 TFLT Fault Input Pulse Width 50 ns VDD = .33V -40°C to +85°C
TBD ns VDD = 5V
Legend: TBD = To Be Determined
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
OCFA/OCFB
OCx
OC20
OC15
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 253
dsPIC30F1010/202X
FIGURE 21-10: POWER SUPPLY PWM MODULE FAULT TIMING CHARACTERISTICS
FIGURE 21-11: POWER SUPPLY PWM MODULE T I MING CHARAC TERISTICS
TABLE 21-26: POWER SUPPLY PWM MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
MP10 TFPWM PWM Output Fall Time 10 25 ns VDD = 5V
MP11 TRPWM PWM Output Rise Time 10 25 ns VDD = 5V
MP12 TFPWM PWM Output Fall Time TBD TBD ns VDD = 3.3V
MP13 TRPWM PWM Output Rise Time TBD TBD ns VDD = 3.3V
MP20 TFD Fault Input to PWM
I/O Chan ge ——TBDns VDD = 3.3V
25 ns VDD = 5V
MP30 TFH Mi nimum P ulse Width TBD ns VDD = 3.3V
50 ns VDD = 5V
Legend: TBD = To Be Determined
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
FLTA/B
PWMx
MP30
MP20
PWMx
MP11 MP10
Note: Refer to Figure 21-1 for load cond iti ons .
dsPIC30F1010/202X
DS70178C-page 254 Preliminary © 2006 Microchip Technology Inc.
FIGURE 21-12: SPI MO DULE MA STER MOD E (CKE = 0) TIMING CHARACTERISTICS
TABLE 21-27: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10% )
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Para
m
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX Output Low Time(3) TCY/2 ns
SP11 TscH SCKX Output High Time(3) TCY/2 ns
SP20 TscF SCKX Output Fall Time(4) n s See parameter D032
SP21 TscR SCKX Output Rise Time(4) ns See parameter D031
SP30 TdoF SDOX Data Output Fall Time(4) ns See parameter D032
SP31 TdoR SDOX Data Output Rise Time(4) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX Data Output Valid after
SCKX Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Ti me of SDIX Data Input
to SCKX Edge 20 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIX Data Input
to SCKX Edge 20 ns
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C u nless ot herwi se st ated . Pa rameters a re f or desi gn gu idanc e only and
are not t ested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP11 SP10
SP40 SP41
SP21
SP20
SP35
SP20
SP21
MSb LSb
BIT14 - - - - - -1
MSb IN LSb IN
BIT14 - - - -1
SP30
SP31
Note: Refer to Figur e 21-1 for load conditio ns.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 255
dsPIC30F1010/202X
FIGURE 21-13: SPI MO DULE MA STER MOD E (CKE = 1) TIMING CHARACTERISTICS
TABLE 21-28: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX output low time(3) TCY / 2 ns
SP11 TscH SCKX output high time (3) TCY / 2 ns
SP20 TscF SCKX output fall time(4) ns See parameter D032
SP21 TscR SCKX output rise time(4) ns See parameter D031
SP30 TdoF SDOX data output fall time(4) ns See parameter D032
SP31 TdoR SDOX data output rise time(4) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX data output valid after
SCKX edge 30 ns
SP36 TdoV2sc,
TdoV2scL SDOX data output setup to
first SCKX edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup time of SDIX dat a input
to SCKX edge 20 ns
SP41 TscH2diL,
TscL2diL Hold time of SDIX data input
to SCKX edge 20 ns
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDIX
SP36
SP30,SP31
SP35
MSb
MSb IN
BIT14 - - - - - -1
LSb IN
BIT14 - - - -1
LSb
Note: Refer to Figure 21-1 for load conditions.
SP11 SP10 SP20
SP21
SP21
SP20
SP40
SP41
dsPIC30F1010/202X
DS70178C-page 256 Preliminary © 2006 Microchip Technology Inc.
FIGU RE 21-14: SPI M O DU LE SL AV E MOD E (C KE = 0) TIMING CHARACTERISTICS
TABLE 21-29: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C fo r Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Ti me 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) —1025 ns
SP73 TscR SCKX Input Rise Time(3) —1025 ns
SP30 TdoF SDOX Data Output Fall Time(3) ns See parameter D032
SP31 TdoR SDOX Data Output Rise Time(3) ns See parameter D031
SP35
TscH2doV
TscL2doV
SDOX Data Output Valid after
SCKX Edge ——30ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge 20 ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge 20 ns
SP50
TssL2scH ,
TssL2scL
SSX to SCKX or SCK X Inp ut 120 ns
SP51
TssH2doZ
SSX to SDOX Output
High-impedance(3) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSX after SCK Edge 1.5 TCY
+ 40 ——ns
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
3: Assumes 50 pF load on all SPI pins.
SS
X
SCK
X
(CKP =
0
)
SCK
X
(CKP =
1
)
SDO
X
SDI
SP50
SP40 SP41
SP30,SP31 SP51
SP35
SDI
X
MSb LSb
BIT14 - - - - - -1
MSb IN BIT14 - - - -1 LSb IN
SP52
SP73
SP72
SP72
SP73
SP71 SP70
Note: Refer to Figure 21-1 for load conditions.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 257
dsPIC30F1010/202X
FIGU RE 21-15: SPI M O DU LE SL AV E MOD E (C KE = 1) TIMING CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDI
SP50
SP60
SDIX
SP30,SP31
MSb BIT14 - - - - - -1 LSb
SP51
MSb IN BIT14 - - - -1 LSb IN
SP35
SP52
SP52
SP73
SP72
SP72
SP73
SP71 SP70
SP40 SP41
Note: Refer to Figure 21- 1 for l oad conditions.
dsPIC30F1010/202X
DS70178C-page 258 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-30: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Time 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) —1025ns
SP73 TscR SCKX Input Rise Time(3) —1025ns
SP30 TdoF SDOX Data Output Fall Ti me(3) ns See parameter D0 32
SP31 TdoR SDOX Data Output Rise Time(3) ns See parame ter D031
SP35 TscH2doV,
TscL2doV SDOX Data Output Valid after
SCKX Edge ——30ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIX Data Input
to SCKX Edge 20 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIX Data Input
to SCKX Edge 20 ns
SP50 TssL2scH,
TssL2scL SSX to SCKX or SCKX inpu t 120 ns
SP51 TssH2doZ SS to SDOX Output
High-impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSX after SCKX Edge 1.5 TCY
+ 40 ——ns
SP60 TssL2doV SDOX Data Output Valid after
SSX Edge ——50ns
Note 1: These parameters are characterized but not te sted in manufacturing.
2: Dat a in “Typ” colu mn is a t 5V, 25°C unless othe rwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 259
dsPIC30F1010/202X
FIGURE 21-16: I2C™ BUS ST ART/STOP BITS T IMING CHARACTERISTICS (MASTER MODE)
FIGURE 21-17: I2C™ BUS DATA TIMING CH AR AC T ERI ST IC S ( M AST ER MO D E)
IM31 IM34
SCL
SDA
Start
Condition Stop
Condition
IM30 IM33
Note: Refer to Figure 21-1 for load conditions.
IM11 IM10 IM33
IM11 IM10
IM20
IM26 IM25
IM40 IM40 IM45
IM21
SCL
SDA
In
SDA
Out
Note: Refer to Figure 21-1 for load conditions.
dsPIC30F1010/202X
DS70178C-page 260 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-31: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Max Units Conditions
IM10 TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) µs
400 kHz mode TCY / 2 (BRG + 1) µs
1 MHz mode(2) TCY / 2 (BRG + 1) µs
IM11 THI:SCL Clock High Time 100 kHz mode TCY / 2 (BRG + 1) µs
400 kHz mode TCY / 2 (BRG + 1) µs
1 MHz mode(2) TCY / 2 (BRG + 1) µs
IM20 TF:SCL SDA and SCL
Fall Time 100 kHz mode 300 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 100 ns
IM21 TR:SCL SDA and SCL
Rise Time 100 kHz mode 1000 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 300 ns
IM25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(2) TBD — ns
IM26 THD:DAT Data Input
Hold Time 100 kHz mode 0 ns
400 kHz mode 0 0.9 µs
1 MHz mode(2) TBD — ns
IM30 TSU:STA Start Condition
Setup Time 100 kHz mode TCY / 2 (BRG + 1) µs Only relevant for
repeated Sta rt
condition
400 kHz mode TCY / 2 (BRG + 1) µs
1 MHz mode(2) TCY / 2 (BRG + 1) µs
IM31 THD:STA Start Condition
Hold Time 100 kHz mode TCY / 2 (BRG + 1) µs After this period the
first clock pulse is
generated
400 kHz mode TCY / 2 (BRG + 1) µs
1 MHz mode(2) TCY / 2 (BRG + 1) µs
IM33 TSU:STO Stop Condition
Setup Time 100 kHz mode TCY / 2 (BRG + 1) µs
400 kHz mode TCY / 2 (BRG + 1) µs
1 MHz mode(2) TCY / 2 (BRG + 1) µs
IM34 THD:STO Stop Condition 100 kHz mode TCY / 2 (BRG + 1) ns
Hold Time 400 kHz mode TCY / 2 (BRG + 1) ns
1 MHz mode(2) TCY / 2 (BRG + 1) ns
IM40 TAA:SCL Output Valid
From Clock 100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode(2) ——ns
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 µ s Time the bus must be
free before a new
transmission can start
400 kHz mode 1.3 µs
1 MHz mode(2) TBD µs
Legend: TBD = To Be Determined
Note 1: BRG is the value of the I2C™ Baud Rate Generator. Refer to the “Inter-Integrated Circuit™ (I2C)”
section in the “ds PIC30F Family Reference M anual(DS70046).
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 261
dsPIC30F1010/202X
FIGURE 21-18: I2C™ BUS ST ART/STOP BITS T IMING CHARACTERISTICS (SLAVE MODE)
FIGURE 21-19: I2C™ BUS DATA TIMING CH AR AC T ERI ST IC S ( SL AV E MO DE)
IM50 CBBus Capacitive Loading 400 pF
TABLE 21-31: I2C™ BUS DATA TI MING REQUIREMENTS (MASTER MODE) (CONTINUED)
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Max Units Conditions
Legend: TBD = To Be Determined
Note 1: BRG is the value of the I2C™ Baud Rate Generator. Refer to the “Inter-Integrated Circuit™ (I2C)”
section in the “dsPIC30F Family Reference Manual” (DS70046).
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
IS31 IS34
SCL
SDA
Start
Condition Stop
Condition
IS30 IS33
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCL
SDA
In
SDA
Out
dsPIC30F1010/202X
DS70178C-page 262 Preliminary © 2006 Microchip Technology Inc.
TABLE 21-32: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Max Units Conditions
IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 μs Device must operate at a
minimum of 10 MHz.
1 MHz mode(1) 0.5 μs—
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 μs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs—
IS20 TF:SCL SDA and SCL
Fall Time 100 kHz mode 300 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 100 ns
IS21 TR:SCL SDA and SCL
Rise Time 100 kHz mode 1000 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 300 ns
IS25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(1) 100 ns
IS26 THD:DAT Data Input
Hold Time 100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
1 MHz mode(1) 00.3μs
IS30 TSU:STA Start Condition
Setup Time 100 kHz mode 4.7 μs Only relevant for repeated
Start condition
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS31 THD:STA Start Condition
Hold Time 100 kHz mode 4.0 μs After this period the first
clock pulse is generated
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS33 TSU:STO Stop Condition
Setup Time 100 kHz mode 4.7 μs—
400 kHz mode 0.6 μs
1 MHz mode(1) 0.6 μs
IS34 THD:STO Stop Condition 100 kHz mode 4000 ns
Hold Time 400 kHz mode 600 ns
1 MHz mode(1) 250 ns
IS40 TAA:SCL Output V alid From
Clock 100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode(1) 0 350 ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 μs
1 MHz mode(1) 0.5 μs
IS50 CBBus Capacitive
Loading — 400pF
Note 1: Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only).
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 263
dsPIC30F1010/202X
TABLE 21-33: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Device Supply
AD01 AVDD Module VDD Supply Greater of
VDD – 0.3
or 2.7
Lesser of
VDD + 0.3
or 5.5
V—
AD02 AVSS Module VSS Supply Vss – 0.3 VSS + 0.3 V
Analog Input
AD10 VINH-VINL Full -Scale Input Sp an VSS VDD V—
AD11 VIN Absolute Input Voltage AVSS – 0.3 AVDD + 0.3 V
AD12 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = 0V,
AVDD = 5V
Source Impedance = 1 kΩ
AD13 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = 0V,
AVDD = 3.3V
Source Impedance = 1 kΩ
AD17 RIN Recom m end ed Impedanc e
Of Analog Voltage Source —1KΩ
DC Accuracy
AD20 Nr Resolution 10 data bits bits
AD21 INL Integral Nonline ari ty ± 0.5 < ±1 LSb V INL = AVSS = 0V
AVDD = 5V
AD21A INL Integral Nonl ine ari ty ±0.5 < ± 1 LSb V INL = AVSS = 0V
AVDD = 3.3V
AD22 DNL Differential Nonlinearity ±0.5 < ±1 LSb VINL = AVSS = 0V
AVDD = 5V
AD22A DNL Differential Nonlinearity ±0.5 < ±1 LSb VINL = AVSS = 0V
AVDD = 3.3V
AD23 GERR Gain Error ±0.75 4.0 LSb VINL = AVSS = 0V
AVDD = 5V
AD23A GERR Gain Error ±0.75 <±3.0 LSb VINL = AVSS = 0V
AVDD = 3.3V
Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
2: The A/D conversio n resul t neve r decre as es w ith an inc rea se in the inp ut vol t ag e, and has no miss in g
codes.
dsPIC30F1010/202X
DS70178C-page 264 Preliminary © 2006 Microchip Technology Inc.
FIGURE 21-20: A/D CONVERSI ON TIMING PER INPUT
AD24 EOFF Offset Error ±0.75 2.0 LSb VINL = AVSS = VSS = 0V,
AVDD = VDD = 5V
AD24A EOFF Offset Error ±0.75 2 .0 LSb VINL = AVSS = VSS = 0V,
AVDD = VDD = 3.3V
AD25 Monotonicity(2) Guaranteed
Dynamic Performance
AD30 THD Total Harmonic Distortion -77 -73 -68 dB
AD31 SINAD Signal to Noise and
Distortion —58dB
AD32 SFDR Spurious Free Dynamic
Range —-73dB
AD33 FNYQ Input Signal Bandwidth 0.5 MHz
AD34 ENOB Effective Number of Bits 9.4 bits
TABLE 21-33: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED)
AC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (± 10% )
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
2: The A/D conversio n resul t neve r decre as es w ith an inc rea se in the inp ut vol t ag e, and has no miss in g
codes.
TAD
A/D Data
ADBUFxx
90 210
Old Data New Data
CONV
A/D Clock
Trigger Pulse
Tconv
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 265
dsPIC30F1010/202X
TABLE 21-34: COMPARATOR OPERATING CONDITIONS
Symbol Characteristic Min Typ Max Units Comments
VDD Voltage Range 3.0 3.6 V Operating range of 3.0 V-3.6V
VDD Voltage Range 4.5 5.5 V Operating range of 4.5 V-5.5 V
TEMP Temperature Range -40 105 °C Note that junction temperature can
exceed 125°C under these ambient
conditions.
TABLE 21-35: COMPARATOR AC AND DC SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C TA +105°C
Symbol Characteristic Min Typ Max Units Comments
VIOFF Input offset voltage ±5 ±15 mV
VICM Input common mode
voltage range 0VDD
1.5 V
VGAIN Open loop gain 90 db
CMRR Common mode rejection
ratio 70 db
TRESP Larg e signal response 20 30 ns V+ input st ep o f 100mv while V- input held
at AVDD/2. Delay measured from analog
input pin to PWM output pin.
TABLE 21-36: DAC DC SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C TA +105°C
Symbol Characteristic Min Typ Max Units Comments
CVRSRC Input reference voltage 0 AVDD
1.6 V
CVRES Resolution 10 Bits
INL
DNL
Transfer Function Accuracy
Integral Non-Linearity Error
Differential Non-Linearity
Error
Offset Error
Gain Error
±1
±0.8
±2
±2.0
LSB
LSB
LSB
LSB
AVDD = 5 V,
DACREF = (AVDD/2) V
Legend: TBD = To Be Determined
TABLE 21-37: DAC AC SPECIFICATIONS
Standard Operating Conditions (unle ss otherw is e stated)
Operating temperature: -40°C TA +125°C
Symbol Characteristic Min Typ Max Units Comments
TSET Settling Time 2.0 µs Measured when range = 1 (High
Range), and cmref<9:0> transitions
from 0x1FF to 0x300.
dsPIC30F1010/202X
DS70178C-page 266 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 267
dsPIC30F1010/202X
22.0 PACKAGE MARKING INFORMATION
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead PDIP (Skinny DIP) Example
XXXXXXXXXXXXXXXXX
0348017
dsPIC30F202X-30I/SP
28-Lead SOIC
YYWWNNN
Example
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX 0348017
dsPIC30F202X-30I/SO
28-Lead QFN-S
XXXXXXX
XXXXXXX
YYWWNNN
Example
dsPIC30F1010
-30I/MM
040700U
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC30F202X
-I/PT0510017
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC30F202X
Example
-I/ML
0510017
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01 ’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
3
e
3
e
3
e
3
e
3
e
3
e
3
e
dsPIC30F1010/202X
DS70178C-page 268 Preliminary © 2006 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1 BOTTOM VIEW
TOP VIEW
N
2
1
2
1
E
E2
EXPOSED
PAD
D2
e
b
K
N
D
A
A1
L
A3
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
E
E2
D
D2
b
L
K
0.80
0.00
3.65
3.65
0.23
0.30
0.20
28
0.65 BSC
0.90
0.02
0.20 REF
6.00 BSC
3.70
6.00 BSC
3.70
0.38
0.40
1.00
0.05
4.70
4.70
0.43
0.50
MIN NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 269
dsPIC30F1010/202X
28-Lead Skinny Plasti c Dual In-line (SP) – 300 mil Body (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1510515105
β
Mold D raft An gl e Bottom 1510515105
α
Mold D raft An gl e Top 10.928.898.13.430.350.320
eB
Overall Row Spacing
§
0.560.480.41.022.019.016BLower Lead Width 1.651.331.02.065.053.040B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thicknes s 3.433.303.18.135.130.125LTip to Seating Plane 35.1834.6734.161.3851.3651.345DOvera ll Length 7.497.246.99.295.285.275E1Molded Package Width 8.267.877.62.325.310.300EShoulder to Shoulder Width 0.38.015A1Base to Seat ing Plane 3.433.303.18.135.130.125A2Molded Package Thickness 4.063.813.56.160.150.140ATop to Se ating Plan e 2.54.100
p
Pitch 2828
n
Num ber of Pin s MAXNOMMINMAXNOMMINDime nsion Limits MILLIMETERSINCHES
*
Units
2
1
D
n
E1
c
eB
β
E
α
p
L
A2
B
B1
A
A1
Notes:
JEDEC Equivalent: MO-095
Drawing No. C04-070
*
Controlling Para meter
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
§
Significant C haracteris tic
dsPIC30F1010/202X
DS70178C-page 270 Preliminary © 2006 Microchip Technology Inc.
28-Lead Plasti c Small Outline (SO) – Wide, 300 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Foot Angle Top φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.330.280.23.013.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 18.0817.8717.65.712.704.695DOverall Length 7.597.497.32.299.295.288E1Molded Package Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088A2Molded Package Thickness 2.642.502.36.104.099.093AOverall Height 1.27
.050
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimensi on Limit s MILLIMETERSINCHES*Units
2
1
D
p
n
B
E
E1
L
c
β
45°
h
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
§ Significant Characteristic
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 271
dsPIC30F1010/202X
44-Lead Plastic Thin Quad Flatp ack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
A
A1 A2
α
E
E1
#leads=n1
p
B
D1 D
n
1
2
φ
c
β
L
CH x 45°
1.140.890.64.045.035.025CH
Pin 1 Corner Chamfer
1.00 REF..039 REF.F
Footprint (Reference)
Units INCHES MILLIMETERS
*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n44 44
Pitch p.031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle
φ
03.5 7 03.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Pins per Side n1 11 11
Lead Thickness c.004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Mold Draft Angle Top
α
5 10 15 5 10 15
Mold Dra ft An g le Bottom
β
5 10 15 5 10 15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MS-026 Revised 07-22-05
*
Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-076
dsPIC30F1010/202X
DS70178C-page 272 Preliminary © 2006 Microchip Technology Inc.
44-Lead Plasti c Quad Flat, No Lead Package (ML) - 8x8 mm Body (QFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
E
E2
D
D2
b
L
K
0.80
0.00
6.30
6.30
0.25
0.30
0.20
44
0.65 BSC
0.90
0.02
0.20 REF
8.00 BSC
6.45
8.00 BSC
6.45
0.30
0.40
1.00
0.05
6.80
6.80
0.38
0.50
MIN NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
A3A1
A
TOP VIEW BOTTOM VIEW
NN
NOTE 1
11
22
E
E2
D
K
L
b
e
EXPOSED
PAD
D2
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 273
dsPIC30F1010/202X
THE MICROCHIP WEB SITE
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dsPIC30F1010/202X
DS70178C-page 274 Preliminary © 2006 Microchip Technology Inc.
READER RESPONSE
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DS70178CdsPIC30F1010/202X
1. What are the best f eatures of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
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© 2006 Microchip Technology Inc. Preliminary DS70178C-page 275
dsPIC30F1010/202X
APPENDIX A: REVISION HISTORY
Revision A (June 2006)
Initial release of this document.
Revision B (August 2006)
This r evision includes:
Updated Section 5.0 “Interrupts” to include
INTTR EG regi ster .
Updated device configuration registers to include FBS
Boot Code Segment and FOSCEL O scillator Selectio n
configuration registers (see Section 18.10 “Device
Configuration Registers”).
Updated Electrical Characteristics:
•I
IDLE Parameter DC43f Max Value revised to
87 ma (see Table 21-6)
Typographical corrections:
dsPIC30F1010/2020 Port Registers
(see Table 6-1)
- TRISA SFR bit 9 corrected to “TRISA9”
- TRISD SFR Reset State correct ed to
0000 0000 0000 0011
dsPIC3 0F2 023 Port Registe r s (see Table 6-2)
- TRISA SFR bit 0 corrected to “unused”
- PORTA SFR bit 0 corrected to “unused”
- LATA SFR bit 0 corrected to “unused”
- TRISD SFR bit 0 corrected to “TRISD0”
- PORTD SFR bit 0 correc ted to “RD0”
- LATD SFR bit 0 corrected to “LATD0”
- TRISD SFR reset state corrected to
0000 0000 0000 0011
dsPIC30F1010/202X CNEN1 SFR reset state
corrected to “0000 0000 0000 0000
(see Table 6-3)
PWMCONx (see Register 12-5)
- Bit 13 description corrected to “TRGSTAT”
- Bit 10 description corrected to “TRGIEN”
ALTDTRx (see Register 12-9)
- Bits 15-14 corrected to “unused”
ADCPC1 (see Register 16-6)
- TRGSRC2<4:0 > correc ted to inclu de bit 4
Revision C (November 2006)
This revision includes:
Update d RC, EC an d HS Cr ystal operatin g frequencie s
for Industrial and Ex tended Temperatures.
Revised SPI section to reflect updated operating fre-
quencies (see Section 13.0 “Serial Peripheral Inter-
face (SPI)”).
Revised oscillator configurations (see Section 18.3
“Oscillator Configurations”).
Updated Electrial Characteristics:
Supply voltage parameter DC11 minimum value
changed to 3.0V (see Table 21-4)
Operating current (IDD) (see Table 21-5)
Idle cur rent (IIDLE) (see Table 21-6)
I/O Pin Input specifications (see Table 21-8)
I/O Pin Output specifications (see Table 21-9)
External Clock Timing (see Figure 21-2 and
Table 21-12)
PLL Clock Timing (see Table 21-13)
Internal RC Accuracy (see Table 21-15)
Power-up Timer Period (see Table 2 1-18)
dsPIC30F1010/202X
DS70178C-page 276 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 277
dsPIC30F1010/202X
INDEX
A
A/D....................................................................................169
Configuring Analog Port............................................188
A/D Control Regis ter (ADCON)..... ....... .......... ........... ........171
A/D Convert Pair Control Register #0 (ADCPC0).............175
A/D Convert Pair Control Register #1 (ADCPC1).............177
A/D Convert Pair Control Register #2 (ADCPC2).............179
A/D Port Config u ration Regis te r (ADPCFG).....................174
A/D Statu s Register (A DSTAT)............ ................... ..........1 7 3
AC Characteristics............................................................240
Load Conditions...................... ....... .. .. .. .. .. .. ....... .. .. .. ..240
AC Temperature and Voltage Specifications....................240
ADC Register Map............................................................190
Address Generator Units ....................................................41
Alternate Vector Table........................................................51
Analog Comparator Control Register Map........................195
Assembler
MPASM Assembler...................................................228
Automatic Clock Stretc h....................................................156
During 10-bit Addressing (STREN = 1).....................156
During 7-bit Addressing (STREN = 1).......................156
Receive Mode...........................................................156
Transmit Mode... .............................. ....................... ..156
B
Band Gap Start-up Time
Requirements............................................................248
Timing Cha racteris tics .. .......... ........... .......................248
Barrel Shifter.......................................................................27
Baud Rate Error Calculation (BRGH = 0) .........................162
Bit-Reversed Add ressing.... ............... ......................... ........45
Example......................................................................45
Implementation ...........................................................45
Modifier Values (table )........ ................... .....................46
Sequence Table (16-Entry)....................................... ..46
Block Diagrams
16-bit Timer1 Module..................................................88
DSP Engine............ ................................. ...................24
dsPIC30F1010............................................................10
dsPIC30F2020............................................................13
dsPIC30F2023............................................................16
External Power-on Reset Circuit...............................212
I2C.............................................................................154
Input Capture Mode.............. .. ....... .. .... .. .. .... ..... .... .. .. ..97
Oscillator System......................................................198
Output Co mpa re Mode ....... ............... ................... ....1 0 1
Reset System..... .............................. ................... ......210
Shared Po rt Structure........................ .........................7 7
SPI............................................................................146
UART........................................................................161
C
C Compilers
MPLAB C18. ............... ................... ...........................22 8
MPLAB C30. ............... ................... ...........................22 8
CLKO and I/O Timing
Characteristics..........................................................245
Requirements............................................................245
Code Examples
Erasing a Row of Program Memory............................83
Initiating a Programming Sequence..... .... .... ......... .... ..84
Loading Write Latches............................. .. .. ....... .. .. .. ..84
Code Protection ................................................................197
Comparat or Con tr o l Register (CMPCONx)............. .......... 193
Comparator DAC Control Registerx (CMPDACx)............. 194
Config u ring Analog Port Pins........... ............................. ...... 78
Control Reg i s te rs................ ........... .............. ..................... .. 82
NVMADR.................................................................... 82
NVMADRU ................................................................. 82
NVMCON.................................................................... 82
NVMKEY .................................................................... 82
Core Architecture
Overview..................................................................... 19
Core Register Map........................................................ 37, 38
Customer Change Notification Service............................. 273
Custome r Notification Se rvice ........................ .............. .... 273
Customer Support............................ ...... .... ........... .... .... .... 273
D
Data Access from Program Memory Using
Program Space Visibility............................................. 32
Data Accumulators and Adder/Subtracter.......................... 25
Data Space Write Saturation............ .......................... 27
Overflow and Saturation......................................... .... 25
Round Logic ............................................................... 26
Write Back.................................................................. 26
Data Addre ss Space............. .............................. ................ 33
Alignment.................................................................... 36
Alignment (Figure)...................................................... 36
MCU and DSP (MAC Class) Instructions . .................. 35
Memory Map......................................................... 33, 34
Near Data Space........................................................ 37
Softwar e Stack ... ............... ......................................... 37
Spaces........................................................................ 36
Width .......................................................................... 36
DC Characteristics
I/O Pin Input Specifications ........................ .... .. .... .. .. 238
I/O Pin Outpu t Specification s......... ........... ................ 239
Idle Current (IIDLE).................................................... 235
Operating Current (IDD) ............................................ 233
Power-Down Current (IPD)........................................ 237
Program and EEPROM ............................................ 239
Development Support....................................................... 227
Device Configuration Register Map.................................. 218
Device Configuration Registers........................................ 215
Device Overview................................................................... 9
Divide Support.................. .... .. ....... .... .. .... .. ....... .... .. .... .. .... .. 22
DSP Engine..... .................................. ....................... .......... 23
Multiplier..................................................................... 25
dsPIC30F2020 Block Diagram ........................................... 13
Dual Output Compare Match Mod e....... ............... ............ 102
Contin u ous Pu lse Mode ........ ............................. ...... 102
Single Pulse Mode.................................................... 102
dsPIC30F1010/202X
DS70178C-page 278 Preliminary © 2006 Microchip Technology Inc.
E
Electrical Characteristics...................................................231
AC.............................................................................240
Equations
I2C.............................................................................158
Relationship Between Device and SPI
Clock Speed......................................................148
UART Baud Rate with BRGH = 0 .............................162
UART Baud Rate with BRGH = 1 .............................162
Errata ....................................................................................8
External Clock Input..........................................................207
External Clock Timing Characteristics
Type A, B and C Timer .............................................249
External Clock Timing Requirements. ...............................241
Type A Time r .................. ................................. .........249
Type B Time r .................. ................................. .........250
Type C Timer..... ............... ............................. ...........250
External Interrupt Requests ................................................51
F
Fast Context Saving............................................................51
Firmware Instructions........................................................219
Flash Pr o g ram Memory..................... ..................................81
In-Circuit Serial Programming (ICSP).........................81
Run-Time Self-Programming (RTSP).........................81
Table Instruction Operation Summary........................81
I
I/O Pin Specifications
Input..........................................................................239
Output .......................................................................239
I/O Ports........ .................................. ....................... .............77
Paral l e l I/O (PIO)................. ................... .....................77
I2C.....................................................................................153
I2C 10-bit Slave Mode Operation......................................155
Reception..................................................................155
Transmission.............................................................155
I2C 7-bit Slave Mode Operation........................................155
Reception..................................................................155
Transmission.............................................................155
I2C Master Mode
Baud Rate Generator................................................158
Clock Arbitration........................................................158
Multi-Master Communication, Bus Collision
and Bus Arbitration .................................. .........158
Reception..................................................................157
Transmission.............................................................157
I2C Module
Addresses.................................................................155
Bus Data Timing Characteristics
Master Mode.....................................................259
Slave Mode.......................................................261
Bus Data Timing Requirements
Master Mode.....................................................260
Slave Mode.......................................................262
Bus Start/Stop Bits Timing Characteristics
Master Mode.....................................................259
Slave Mode.......................................................261
General Call Address Support ..................................157
Interrupts...................................................................156
IPMI Support............................................ ...... .... .......157
Master Operation......................................................157
Master Support .........................................................157
Operating Function Description ................................153
Operation During CPU Sleep and Idle Modes..........158
Pin Configuration...................................................... 153
Programm er’s Model ................................................ 153
Registers .................................................................. 153
Slope Control............................................................ 157
Software Controlled Clock Stretching (STREN = 1). 156
Various Modes...................... .. ....... .... .. .. .... .. ....... .... .. 153
I2C Registe r Map.............................................................. 159
Idle Current (IIDLE)............................................................ 235
In-Circuit Debugger ........................................................... 217
In-Circuit Serial Programming (ICSP)...............................197
Initialization Condition for RCON Register Case 1 ........... 213
Initialization Condition for RCON Register Case 2 ........... 213
Input Capture (CAPX) Timing Characteristics ................ .. 251
Input Capture Interrupts...................................................... 99
Input Capture Module......................................................... 97
Simple Capture Event Mode ....................................... 98
Sleep and Idle Modes......... .... ..... .. .... .. .. .. .... ..... .. .... .. .. 99
Input Capture Register Map.............................................. 100
Input Capture Timing Requirements................................. 251
Input Change Notification ................................................... 78
Input Change Notification Register Map............................. 80
Instruction Addressing Modes ............................................ 41
File Register Instructions............................................ 41
Fundamental Modes Supported .............. .... ....... .. .... .. 41
MAC Instru ctions................ ................... ............... ...... 42
MCU Instru ction s................ .............................. .......... 4 2
Move and Accumulator Instructions ............................ 42
Other Ins tructions .................................... ................... 42
Instruction Set................................................................... 219
Instruction Set Overview................................................... 222
Inter-Integrated Circuit. See I2C
Internal Clock Timing Examples....................................... 242
Inter n e t Ad d ress .. .................................. ....................... .... 273
Interrupt Control and Status Register (INTTREG).............. 74
Interrupt Control Register 1 (INTCON1)............................. 52
Interrupt Control Register 2 (INTCON2)............................. 54
Interrupt Controller Register Map ....................................... 75
Interrupt Enable Control Register 1 (IEC1)......................... 61
Interrupt Enable Control Register 2 (IEC2)......................... 62
Interrupt Flag Status Register 0 (IFS0)............................... 55
Interrupt Flag Status Register 1 (IFS1)............................... 57
Interrupt Flag Status Register 2 (IFS2)............................... 58
Interrupt Priority.................................................................. 48
Interrupt Priority Control Register 0 (IPC0)......................... 63
Interrupt Priority Control Register 1 (IPC1)......................... 64
Interrupt Priority Control Register 10 (IPC10)..................... 73
Interrupt Priority Control Register 2 (IPC2)......................... 65
Interrupt Priority Control Register 3 (IPC3)......................... 66
Interrupt Priority Control Register 4 (IPC4)......................... 67
Interrupt Priority Control Register 5 (IPC5)......................... 68
Interrupt Priority Control Register 6 (IPC6)......................... 69
Interrupt Priority Control Register 7 (IPC7)......................... 70
Interrupt Priority Control Register 8 (IPC8)......................... 71
Interrupt Priority Control Register 9 (IPC9)......................... 72
Interrupt Sequence ............................................................. 51
Interrupt Stack Frame................................................. 51
Interrupts............................................................................. 47
Traps .......................................................................... 49
L
Leading Edge Blanking Control Register (LEBCONx). ..... 120
Linear Feedback Register (LFSR).................................... 202
Load Conditions................................................................ 240
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 279
dsPIC30F1010/202X
M
Memory Organization..........................................................29
Microc h i p In ternet Web Site........ .............................. ........2 7 3
Modulo Addressing .............................................................43
Applicability.................................................................45
Operation Example.....................................................44
Start and End Address................................................43
W Addres s Reg ister Selec tio n... .............. ............... ....43
MPLAB ASM30 Assembler, Linker, Librarian ...................228
MPLAB ICD 2 In-Circuit Debugger ...................................229
MPLAB ICE 2000 High-Perform ance Universal
In-Circuit Emulator....................................................229
MPLAB Integrated Development Environment Software..227
MPLAB PM3 Device Programmer ....................................229
MPLAB REA L IC E In -Circuit Emula to r System.................229
MPLINK Object Linker/MPLIB Object Librarian...... ..........228
N
NVM Registe r Map........ .............. ............... .........................85
O
OC/PWM Module Timing Characteristics..........................252
Operating Current (IDD).....................................................233
Oscillator
Syste m Over view.... ................... ............................. ..197
Oscillator Configurations...................................................205
Fail-Safe Clock Monitor.............................................208
Initial Clock Source Selection...................................206
Phase Locked Loop (PLL) .................................... .. ..206
Start- u p Timer (OST )...... ....................... ...................2 0 6
Oscillator Control Register (OSCCON).............................199
Oscillator Selection...........................................................197
Oscillator Selection Configuration Bits (FOSC) ................204
Oscillator Selection Configuration Bits (FOSCSEL)..........203
Oscillator Start-up Timer
Timing Cha racteris tics .. .......... ........... .......................246
Timing Requirements............................... .. ....... .. .. ....247
Oscillator Tuning Register (OSCTUN)..............................201
Oscillator Tuning Register 2 (OSCTUN2).........................202
Output Co mpa re Interrupts.................... .............. .............104
Output Compare Module.............................. .. .. .... ....... .. ....101
Timing Cha racteris tics .. .......... ........... .......................251
Timing Requirements............................... .. ....... .. .. ....251
Output Compare Operation During CPU Idle Mode..........103
Output Co mpa re Register Map.................... .....................105
Output Compare Sleep Mode Operation ..........................103
P
Packaging Information
Marking.....................................................................267
PICSTART Plus Development Programmer.....................230
Pinout Descriptions..................... .. ....... .... .. .... .. .. .....11, 14, 17
PLL Clock Timing Specifications .......................................242
POR. See Power-on Reset
Port Register Map (dsPIC30F1010/2020)...........................79
Port Register Map (dsPIC30F2023)....................................80
Port Write/Read Example ...................................................78
Power Supply PWM................ .... .... ......... .... .... ........... .... ..107
Power Supply PWM Module
Timing Requirements............................... .. ....... .. .. ....253
Power Supply PWM Register Map....................................142
Power-Down Current (IPD)................................................237
Power-on Res e t (POR)............. ................... ................... ..197
Oscillator Start-up Timer (OST)................................197
Power-up Timer (PWRT) .. ............... ............... ..........1 9 7
Power-Saving Modes.................................................... .... 214
Idle............................................................................ 215
Sleep ........................................................................ 214
Power-Saving Modes (Sleep and Idle)............................. 197
Power-up Timer
Timing Ch a rac te rist ics.... ............... ............... ............ 246
Timing Re q uirements ..... ................... ................... .... 247
Primary Time Base Register (PTPER) ............................. 111
Product Identification System........................................... 283
Program Address Space..................................................... 29
Construction ............................................................... 30
Data Access from Program Memory Using
Table Ins tructions........................... .................... 31
Data Acce ss fr o m, Address Gener a tion..... .............. .. 30
Memory Map............................................................... 29
Table Instructions
TBLRDH............................................................. 31
TBLRDL.............................................................. 31
TBLWTH............................................................. 31
TBLWTL ............................................................. 31
Program and EEPRO M Charac terist ics ............................ 239
Program Counter................................................................ 20
Program Data Table Access.......... ................... .................. 32
Program Space Visibility
Window into Program Space Operation ....... .. .... .. .. .... 33
Programm er’s Model .......................................................... 20
Diagram...................................................................... 21
Programming Opera tio n s.... ......................... ................... .... 83
Algor ith m for Progr a m Flash..................... .................. 83
Erasing a Row of Program Memory ........................... 83
Initiating the Programming Sequence ........................ 84
Loading Write Latches............. .. .. .... .. .. ..... .. .... .. .. .. .. .. .. 84
Programming, Device Instructions.................................... 219
PWM Alternate Dead-Time Register (ALTDTRx)............. 115
PWM Control Register (PWMCONx).................. .......... .... 112
PWM Dead-Time Register (DTRx)............................. ...... 114
PWM Fault Current-Limit Control Register (FCLCONx)... 117
PWM I/O Control Register (IOCONx)............................... 116
PWM Master Duty Cycle Register (MDC)......................... 112
PWM Phase-Shift Re g i s te r (PHASEx)..... ................... ...... 114
PWM Time Base Control Register (PTCON).................... 110
PWM Trigger Compare Value Register (TRIGx) .............. 119
PWM Trigger Control Register (TRGCONx)..................... 115
R
Reader Response............................................................. 274
Register Map
ADC Registe r........ ................... ................... .............. 190
Analog Compara tor Control Register ........... .......... .. 195
Core Registers............................................................ 38
Device Configuration Register.................................. 218
I2C Registe r.............................................................. 159
Input Capture Registers............................................ 100
Input Change Notification Registers........................... 80
Interrupt Controller Registers ..................................... 75
NVM Regist e rs . .............. ................... ............... .......... 85
Output Com p a re Register s................ ............... ........ 105
Port Registers (dsPIC30F1010/2020) ........................ 79
Port Registers (dsPIC30F2023) . ................................ 80
Power Supply PWM Registers ................................. 142
SPI1 Register ........................................................... 152
System Integration Register (dsPIC30F202X ) ......... 218
Timer 1 Registers....................................................... 90
Timer2 /3 Re g i sters...................... ................... ............ 95
UART1 Register ....................................................... 168
dsPIC30F1010/202X
DS70178C-page 280 Preliminary © 2006 Microchip Technology Inc.
Registers
ADCON.....................................................................171
ADCPC@..................................................................179
ADCPC0 ...................................................................175
ADCPC1 ...................................................................177
ADPCFG...................................................................174
ADSTAT....................................................................173
ALTDTRx ..................................................................115
CMPCONx ................................................................193
CMPDACx.................................................................194
DTRx.........................................................................114
FCLCONx .................................................................117
FOSC........................................................................204
FOSCSEL.................................................................203
IEC1............................................................................61
IEC2............................................................................62
IFS1 ............................................................................57
IFS2 ............................................................................58
IFSO............................................................................55
INTCON1 ....................................................................52
INTCON2 ....................................................................54
INTTREG ....................................................................74
IOCONx ....................................................................116
IPC0............................................................................63
IPC1............................................................................64
IPC10..........................................................................73
IPC2............................................................................65
IPC3............................................................................66
IPC4............................................................................67
IPC5............................................................................68
IPC6............................................................................69
IPC7............................................................................70
IPC8............................................................................71
IPC9............................................................................72
LEBCONx .................................................................120
LFSR.........................................................................202
MDC..........................................................................112
OSCCON ..................................................................199
OSCTUN...................................................................201
OSCTUN2.................................................................202
PHASEx....................................................................114
PTCON .....................................................................110
PTPER......................................................................111
PWMCONx ...............................................................112
SEVTCMP.................................................................111
SPIxCON1 (SPIx Control 1)......................................150
SPIxCON2 (SPIx Control 2)......................................151
SPIxSTAT (SPIx Status and Control) .......................149
TRGCONx.................................................................115
TRIGx........................................................................119
U1MODE...................................................................164
U1STA ......................................................................166
Reset.........................................................................197, 209
Reset Sequence.............................. .. .... ....... .... .... .. .... .........49
Reset Sources ..... ................... ................... .................49
Reset Timin g Char acteris tic s...... ...... ........... .............. .......246
Reset Timing Requirements................................... .. .... .....247
Resets
POR..........................................................................211
POR with Long Crystal Start-up Time.......................212
POR, Operating without FSCM and PWRT ......... .....212
RTSP Operation..................................................................82
S
Sales and Support........................ .. ....... .... .. .... .. .. ......... .. .. 282
Serial Peripheral Interface (SPI)....................................... 145
Simple Capture Event Mode
Capture Bu ffer Operation.. .............................. ............ 98
Capture Prescaler....... ............................. ................... 98
Hall Sensor Mode............... ........... .............. ............... 98
Input Capture in CPU Idle Mode................................. 99
Timer2 and Timer3 Selection Mode...................... .... .. 98
Simple OC/PWM Mode Timing Requirements ................. 252
Simp le Outp ut Co mp a re Ma tc h Mo d e ........ ...... ..... .......... . 102
Simple PWM Mode........................................................... 102
Period ....................................................................... 103
Softwar e Simulat or ( MP L AB SIM) ............... ................... ..228
Softwar e Stack Poin ter, Fram e Poin te r ......... ..................... 2 0
CALL Stack Fr a me.................... .............. ................... 37
Special Event Compare Register (SEVTCMP)................. 111
SPI Master, Frame Mast er Connection........................... 147
Master/Slave Connection.................................. .... .. .. 147
Slave, Frame Master Connection............................. 148
Slave, Frame Slave Connection............................... 148
SPI Mode
SPI1 Register Map.................................................... 152
SPI Module
Timing Characteristics
Master Mode (CKE = 0). ................................... 254
Master Mode (CKE = 1). ................................... 255
Slave Mode (CKE = 1).............................. 256, 257
Timing Requirements
Master Mode (CKE = 0). ................................... 254
Master Mode (CKE = 1). ................................... 255
Slave Mode (CKE = 0)..................... ............... .. 256
Slave Mode (CKE = 1)..................... ............... .. 258
SPI1 Register Map............................................................ 152
STATUS Regi ster.... .............................. ................... .......... 2 0
Symbols used in Opcode Descriptions............................. 220
System Integration............................................................ 197
System Integration Register Map (dsPIC30F202X ).......... 218
T
Temperature and Voltage Specifications
AC............................................................................. 240
Timer1 Module.................................................................... 87
16-bit Asynchronous Counter Mode........................... 87
16-bit Synchronous Counter Mode............................. 87
16-bit Timer Mode.......................... ............................. 87
Gate Operation........................................................... 88
Interrupt ...................................................................... 89
Operation During Sleep Mode.................................... 88
Prescaler .................................................................... 88
Timer1 Register Map.......................................................... 90
Timer2 and Timer3 Selection Mode............................ .. ....102
Timer2/3 Module................... .. .... .. ....... .... .. .. .... .. .. ....... .... .. .. 91
16-bit Timer Mode.......................... ............................. 91
32-bit Synchronous Counter Mode............................. 91
32-bit Timer Mode.......................... ............................. 91
ADC Event Trigger.................................................... .. 94
Gate Operation........................................................... 94
Interrupt ...................................................................... 94
Operation During Sleep Mode.................................... 94
Timer Prescaler .......................................................... 94
Timer2 /3 Re g i ster Map............. ................... ................... .... 95
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 281
dsPIC30F1010/202X
Timing Characteristics
A/D Conversion
10-Bit High-speed (CHPS = 01,
SIMSAM = 0, ASAM = 0, SSRC = 000)....264
Band Gap Start-up Time...........................................248
CLKO and I/O ...........................................................245
External Clock...........................................................240
I2C Bus Data
Master Mode.....................................................259
Slave Mode.......................................................261
I2C Bus Start/Stop Bits
Master Mode.....................................................259
Slave Mode.......................................................261
Input Capture (CAPX)............................ .... .. ....... .... ..251
Motor Control PWM Module......................................253
Motor Control PWM Module Falult............................253
OC/PWM Module. .....................................................252
Oscillator Start-up Timer...........................................246
Output Co mpa re Module.................. ................... ......251
Power-up Timer ........ .............. .......................... ........24 6
Reset.........................................................................246
SPI Module
Master Mode (CKE = 0)....................................254
Master Mode (CKE = 1)....................................255
Slave Mode (CKE = 0)......................................256
Slave Mode (CKE = 1)......................................257
Type A, B and C Timer External Clock.....................249
Watchdog Timer...................... ....... .. .. .... .. .... ..... .... .. ..246
Timing Diagrams
PWM Output......... ............................. .......................104
Time-out Sequence on Power-up (MCLR
Not Tied to VDD), Case 1..................................211
Time-out Sequence on Power-up (MCLR
Not Tied to VDD), Case 2..................................212
Time-out Sequence on Power-up (MCLR Tied
to VDD)..............................................................211
Timing Diagrams and Specifications
DC Characteristics - Internal RC Accuracy...............242
Timing Diagrams.See Timing Characteristics
Timing Requirements
Band Gap Start-up Time...........................................248
Brown-out Reset.......................................................247
CLKO and I/O ...........................................................245
External Clock...........................................................241
I2C Bus Data (Master Mode) .....................................260
I2C Bus Data (Slave Mode).......................................262
Input Capture.......................... ....... .... .. .... .. .. ....... .... ..251
Motor Control PWM Module......................................253
Oscillator Start-up Timer...........................................247
Output Co mpa re Module.................. ................... ......251
Power-up Timer ........ .............. .......................... ........24 7
Reset.........................................................................247
Simple OC/PWM Mode.............................................252
SPI Module
Master Mode (CKE = 0)....................................254
Master Mode (CKE = 1)....................................255
Slave Mode (CKE = 0)......................................256
Slave Mode (CKE = 1)......................................258
Type A Time r Ex ternal Clo c k................. ...................249
Type B Time r Ex ternal Clo c k................. ...................250
Type C Timer Ext e rnal Clock............... ............... ......250
Watchdog Timer...................... ....... .. .. .... .. .... ..... .... .. ..247
Timing Specifications
PLL Clock..................................................................242
Traps
Trap Sources . .................................. ....................... ....4 9
U
UART
Baud Rate Generator (BRG) .................................... 162
Enabling and Setting Up UART................ .. .. .... .. .. .. .. 162
IrDA Built-in Encoder and Decoder........................... 163
Receiving
8-bit or 9-bit Data Mode .................................... 163
Transmitting
8-bit Data Mode................................................ 163
9-bit Data Mode................................................ 163
Break and Sync Sequence............................... 163
UART1 Mode Register (U1MODE )................................... 164
UART1 Register Map........................................................ 168
UART1 Status and Control Register (U1STA).................. 166
Unit ID Locations.............................................................. 197
Universal Asynchronous Receiver Transmitter. See UART
W
Wake-up from Sleep......................................................... 197
Wake-up from Sleep and Idle............................................. 51
Watchdog Timer
Timing Ch a rac te rist ics.... ............... ............... ............ 246
Timing Re q uirements ..... ................... ................... .... 247
Watchdog Timer (WDT)..................... .. .... .... ....... .. .... 197, 214
Enabling and Disabling............................................. 214
Operation.................................................................. 214
WWW Addres s..................... .................................. .......... 273
WWW, On-Line Support....................................................... 8
dsPIC30F1010/202X
DS70178C-page 282 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS70178C-page 283
dsPIC30F1010/202X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC30F2020AT-30 I/ SO-ES
Example:
dsPIC30F2020AT-30I/SO = 30 MIPS, Industrial temp., SOIC package, Rev. A
Trademark
Architecture
Flash
E = Extended High Tem p -40°C to +125°C
I = Industrial -40°C to +85°C
Temperature
Device ID
Package
MM = QFN
PT = TQFP
SP = SPDIP
SO = SOIC
S = Die (Waf fl e Pack)
W = Die (Wafers)
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Custom ID (3 digits) or
T = Tape and Reel
A,B,C… = Revision Level
Engineering Sample (ES)
Speed
20 = 20 MIPS
DS70178C-page 284 Preliminary © 2006 Microchip Technology Inc.
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WORLDWIDE SALES AND SERVICE
10/19/06
Mouser Electronics
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dsPIC30F1010-20E/MM dsPIC30F1010-20E/SO dsPIC30F1010-20E/SP dsPIC30F1010-30I/MM dsPIC30F1010-
30I/SO dsPIC30F1010-30I/SP dsPIC30F1010T-30I/MM dsPIC30F1010T-30I/SO dsPIC30F2020-20E/MM
dsPIC30F2020-20E/SO dsPIC30F2020-20E/SP dsPIC30F2020-30I/MM dsPIC30F2020-30I/SO dsPIC30F2020-
30I/SP dsPIC30F2020T-30I/MM dsPIC30F2020T-30I/SO dsPIC30F2023-20E/ML dsPIC30F2023-20E/PT
dsPIC30F2023-30I/ML dsPIC30F2023-30I/PT dsPIC30F2023T-30I/ML dsPIC30F2023T-30I/PT AC164335
AC164336 AC164337 DSPIC30F1010-20E/MM DSPIC30F1010-20E/SO DSPIC30F1010-20E/SP DSPIC30F1010-
30I/MM DSPIC30F1010-30I/SO DSPIC30F1010-30I/SP DSPIC30F1010T-30I/MM DSPIC30F2020-20E/MM
DSPIC30F2020-20E/SO DSPIC30F2020-20E/SP DSPIC30F2020-30I/MM DSPIC30F2020-30I/SO DSPIC30F2020-
30I/SP DSPIC30F2020T-30I/MM DSPIC30F2020T-30I/SO DSPIC30F2023-20E/ML DSPIC30F2023-20E/PT
DSPIC30F2023-30I/ML DSPIC30F2023-30I/PT DSPIC30F2023T-30I/ML DSPIC30F2023T-30I/PT