R2
R1
+VSUPPLY
VINPUT
±VSUPPLY
VOUT
LM741-MIL
+
±
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intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM741-MIL
SNOSD62 –JUNE 2017
LM741-MIL Operational Amplifier
1
1 Features
1• Overload Protection on the Input and Output
• No Latch-Up When the Common-Mode Range is
Exceeded
2 Applications
• Comparators
• Multivibrators
• DC Amplifiers
• Summing Amplifiers
• Integrator or Differentiators
• Active Filters
3 Description
The LM741-MIL is a general-purpose operational
amplifier which features improved performance over
industry standards such as the LM709. It is a direct,
plug-in replacement for the 709C, LM201, MC1439,
and 748 in most applications.
The amplifier offers many features which make
applications nearly foolproof such as overload
protection on the input and output, no latch-up when
the common-mode range is exceeded, and freedom
from oscillations.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM741-MIL TO-99 (8) 9.08 mm × 9.08 mm
CDIP (8) 10.16 mm × 6.502 mm
PDIP (8) 9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Application
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
7 Detailed Description.............................................. 6
7.1 Overview................................................................... 6
7.2 Functional Block Diagram......................................... 6
7.3 Feature Description................................................... 6
7.4 Device Functional Modes.......................................... 7
8 Application and Implementation .......................... 8
8.1 Application Information.............................................. 8
8.2 Typical Application ................................................... 8
9 Power Supply Recommendations........................ 9
10 Layout..................................................................... 9
10.1 Layout Guidelines ................................................... 9
10.2 Layout Example ...................................................... 9
11 Device and Documentation Support................. 10
11.1 Receiving Notification of Documentation Updates 10
11.2 Community Resources.......................................... 10
11.3 Trademarks........................................................... 10
11.4 Electrostatic Discharge Caution............................ 10
11.5 Glossary................................................................ 10
12 Mechanical, Packaging, and Orderable
Information........................................................... 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
June 2017 * Initial release.
NC
V+
OUTPUT
OFFSET NULL
OFFSET NULL
INVERTING INPUT
NON-INVERTING INPUT
V±
+
8
1
2
345
6
7
1
2
3
4
8
7
6
5
NC
V+
OUTPUT
OFFSET NULL
OFFSET NULL
INVERTING INPUT
NON-INVERTING INPUT
V±
1
2
3
4
8
7
6
5
NC
V+
OUTPUT
OFFSET NULL
OFFSET NULL
INVERTING INPUT
NON-INVERTING INPUT
V±
3
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5 Pin Configuration and Functions
P Package
8-Pin PDIP
Top View NAB Package
8-Pin CDIP
Top View
LMC Package
8-Pin TO-99
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
INVERTING INPUT 2 I Inverting signal input
NC 8 N/A No Connect, leave floating
NONINVERTING INPUT 3 I Noninverting signal input
OFFSET NULL 1 I Offset null pin used to eliminate the offset voltage and balance the input voltages.
OFFSET NULL 5
OUTPUT 6 O Amplified signal output
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those specified in the Recommended
Operating Conditions table. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For military specifications see RETS741X for LM741-MIL and RETS741AX for LM741-MILA.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For operation at elevated temperatures, these devices must be derated based on thermal resistance, and TJ(max). (listed in the Absolute
Maximum Ratings table). Tj= TA+ (θJA × PD).
(5) For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Supply voltage ±22 V
Power dissipation (4) 500 mW
Differential input voltage ±30 V
Input voltage (5) ±15 V
Output short circuit duration Continuous
Operating temperature –50 125 °C
Junction temperature, TJ(max) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±400 V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Supply voltage (VDD-GND) ±10 ±15 ±22 V
Temperature –55 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM741-MIL
UNITLMC (TO-99) NAB (CDIP) P (PDIP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 170 100 100 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25 — — °C/W
5
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6.5 Electrical Characteristics
VS= ±15 V, −55°C ≤TA≤125°C (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input offset voltage RS≤10 kΩTA= 25°C 1 5 mV
6 mV
Input offset voltage
adjustment range TA= 25°C, VS= ±20 V ±15 mV
Input offset current TA= 25°C 20 200 nA
85 500
Input bias current TA= 25°C 80 500 nA
1.5 μA
Input resistance TA= 25°C, VS= ±20 V 0.3 2 MΩ
Input voltage range ±12 ±13 V
Large signal voltage gain VS= ±15 V, VO
= ±10 V, RL≥
2 kΩ
TA= 25°C 50 200 V/mV
25
Output voltage swing VS= ±15 V RL≥10 kΩ±12 ±14 V
RL≥2 kΩ±10 ±13
Output short circuit current TA= 25°C 25 mA
Common-mode rejection ratio RS≤10 Ω, VCM = ±12 V 80 95 dB
Supply voltage rejection ratio VS= ±20 V to VS= ±5 V, RS≤10 Ω86 96 dB
Transient response Rise time TA= 25°C, unity gain 0.3 μs
Overshoot 5%
Slew rate TA= 25°C, unity gain 0.5 V/μs
Supply current TA= 25°C 1.7 2.8 mA
Power consumption VS= ±15 V TA= 25°C 50 85 mWTA= TA(min) 60 100
TA= TA(min) 45 75
6
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7 Detailed Description
7.1 Overview
The LM741-MIL device is a general-purpose operational amplifier which features improved performance over
industry standards such as the LM709. It is intended for a wide range of analog applications. The high gain and
wide range of operating voltage provide superior performance in integrator, summing amplifier, and general
feedback applications. The LM741-MIL operates with either a single or dual power supply voltage. The LM741-
MIL device is a direct, plug-in replacement for the 709C, LM201, MC1439, and 748 in most applications.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Overload Protection
The LM741-MIL features overload protection circuitry on the input and output. This prevents possible circuit
damage to the device.
7.3.2 Latch-up Prevention
The LM741-MIL is designed so that there is no latch-up occurrence when the common-mode range is exceeded.
This allows the device to function properly without having to power cycle the device.
7.3.3 Pin-to-Pin Capability
The LM741-MIL is a pin-to-pin direct replacement for the LM709C, LM201, MC1439, and LM748 in most
applications. Direct replacement capabilities allows flexibility in design for replacing obsolete parts.
7
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7.4 Device Functional Modes
7.4.1 Open-Loop Amplifier
The LM741-MIL can be operated in an open-loop configuration. The magnitude of the open-loop gain is typically
large thus for a small difference between the non-inverting input terminals and the inverting input terminals, the
amplifier output is driven near the supply voltage. Without negative feedback, the LM741-MIL can act as a
comparator. If the inverting input is held at 0 V, and the input voltage applied to the non-inverting input is
positive, the output will be positive. If the input voltage applied to the non-inverting input is negative, the output is
negative.
7.4.2 Closed-Loop Amplifier
In a closed-loop configuration, negative feedback is used by applying a portion of the output voltage to the
inverting input. Unlike the open-loop configuration, closed loop feedback reduces the gain of the circuit. The
overall gain and response of the circuit is determined by the feedback network rather than the operational
amplifier characteristics. The response of the operational amplifier circuit is characterized by the transfer function.
8
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM741-MIL is a general-purpose amplifier than can be used in a variety of applications and configurations.
One common configuration is in a non-inverting amplifier configuration. In this configuration, the output signal is
in phase with the input (not inverted as in the inverting amplifier configuration), the input impedance of the
amplifier is high, and the output impedance is low. The characteristics of the input and output impedance is
beneficial for applications that require isolation between the input and output. No significant loading will occur
from the previous stage before the amplifier. The gain of the system is set accordingly so the output signal is a
factor larger than the input signal.
8.2 Typical Application
Figure 1. LM741-MIL Noninverting Amplifier Circuit
8.2.1 Design Requirements
As shown in Figure 1, the signal is applied to the noninverting input of the LM741-MIL. The gain of the system is
determined by the feedback resistor and input resistor connected to the inverting input. The gain can be
calculated by Equation 1:
Gain = 1 + (R2/R1) (1)
The gain is set to 2 for this application. R1 and R2 are 4.7-kΩresistors with 5% tolerance.
8.2.2 Detailed Design Procedure
The LM741-MIL can be operated in either single supply or dual supply. This application is configured for dual
supply with the supply rails at ±15 V. The input signal is connected to a function generator. A 1-VPP, 10-kHz sine
wave was used as the signal input. 5% tolerance resistors were used, but if the application requires an accurate
gain response, use 1% tolerance resistors.
8.2.3 Application Curve
The waveforms in Figure 2 show the input and output signals of the LM741-MIL non-inverting amplifier circuit.
The blue waveform (top) shows the input signal, while the red waveform (bottom) shows the output signal. The
input signal is 1.06 VP-P and the output signal is 1.94 VP-P. With the 4.7-kΩresistors, the theoretical gain of the
system is 2. Due to the 5% tolerance, the gain of the system including the tolerance is 1.992. The gain of the
system when measured from the mean amplitude values on the oscilloscope was 1.83.
9
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Typical Application (continued)
Figure 2. Waveforms for LM741-MIL Non-inverting Amplifier Circuit
9 Power Supply Recommendations
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, a 0.1-µF
capacitor is recommended and should be placed as close as possible to the LM741-MIL power supply pins.
10 Layout
10.1 Layout Guidelines
As with most amplifiers, take care with lead dress, component placement, and supply decoupling in order to
ensure stability. For example, resistors from the output to an input should be placed with the body close to the
input to minimize pick-up and maximize the frequency of the feedback pole by minimizing the capacitance from
the input to ground. As shown in Figure 3, the feedback resistors and the decoupling capacitors are located close
to the device to ensure maximum stability and noise performance of the system.
10.2 Layout Example
Figure 3. LM741-MIL Layout
10
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM741CH ACTIVE TO-99 LMC 8 500 Non-RoHS &
Non-Green Call TI Call TI 0 to 70 ( LM741CH, LM741CH
)
LM741CH/NOPB ACTIVE TO-99 LMC 8 500 RoHS & Green Call TI Level-1-NA-UNLIM 0 to 70 ( LM741CH, LM741CH
)
LM741H ACTIVE TO-99 LMC 8 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 ( LM741H, LM741H)
LM741H/NOPB ACTIVE TO-99 LMC 8 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM741H, LM741H)
LM741J ACTIVE CDIP NAB 8 40 Non-RoHS
& Green Call TI Call TI -55 to 125 LM741J
U5B7741312 ACTIVE TO-99 LMC 8 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 125 ( LM741H, LM741H)
U5B7741393 ACTIVE TO-99 LMC 8 500 Non-RoHS &
Non-Green Call TI Call TI 0 to 70 ( LM741CH, LM741CH
)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
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